JP3076215B2 - Ceramic multilayer substrate and method of manufacturing the same - Google Patents

Ceramic multilayer substrate and method of manufacturing the same

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Publication number
JP3076215B2
JP3076215B2 JP6231295A JP6231295A JP3076215B2 JP 3076215 B2 JP3076215 B2 JP 3076215B2 JP 6231295 A JP6231295 A JP 6231295A JP 6231295 A JP6231295 A JP 6231295A JP 3076215 B2 JP3076215 B2 JP 3076215B2
Authority
JP
Japan
Prior art keywords
substrate
layer
notch
alignment
green sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6231295A
Other languages
Japanese (ja)
Other versions
JPH08264946A (en
Inventor
英明 荒木
俊博 中居
昌志 深谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal SMI Electronics Device Inc
Original Assignee
Sumitomo Metal SMI Electronics Device Inc
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Filing date
Publication date
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Application filed by Sumitomo Metal SMI Electronics Device Inc filed Critical Sumitomo Metal SMI Electronics Device Inc
Priority to JP6231295A priority Critical patent/JP3076215B2/en
Publication of JPH08264946A publication Critical patent/JPH08264946A/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、焼成後の基板に印刷等
の後工程を行う際の位置合せ精度を向上したセラミック
多層基板及びその製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic multilayer substrate having improved alignment accuracy when a post-process such as printing is performed on a fired substrate, and a method of manufacturing the same.

【0002】[0002]

【従来の技術】従来より、複数枚のグリーンシートを積
層・焼成して製造されるセラミック多層基板において
は、基板表面の導体パターン等をグリーンシート積層体
と同時に焼成する同時焼成タイプもあるが、グリーンシ
ート積層体の焼成後の後工程で、基板表面に導体・抵抗
体等を印刷・焼成したり、抵抗体等のトリミングやショ
ートオープン検査等の電気的品質検査を行う後付けタイ
プもある。この後付けタイプでは、基板表面に印刷等の
後工程を行う際に、基板を正確に位置合せする必要があ
り、そのために、一般に、図5に示すように、基板1の
隣接する2辺の端縁を位置合せ用の基準とし、これを位
置合せ台2上で3本の位置合せピン3に当接させること
で、基板を位置合せするようにしている。
2. Description of the Related Art Conventionally, in a ceramic multilayer substrate manufactured by laminating and firing a plurality of green sheets, there is a co-firing type in which a conductor pattern on the substrate surface is fired simultaneously with a green sheet laminate. There is also a post-installation type in which a conductor, a resistor, or the like is printed and fired on the substrate surface, or an electrical quality inspection such as a trimming of the resistor or the like or a short-open inspection is performed in a post-process after the firing of the green sheet laminate. In this post-installation type, when performing a post-process such as printing on the substrate surface, it is necessary to accurately align the substrate, and therefore, generally, as shown in FIG. The edge is used as a reference for positioning, and this is brought into contact with three positioning pins 3 on the positioning table 2 to position the substrate.

【0003】[0003]

【発明が解決しようとする課題】ところで、図6に示す
ように、焼成後の基板1に導体パターン4を印刷する場
合、基板1の各層(グリーンシート5)を上下に導通さ
せるビア6と導体パターン4とが(a)のように正確に
重なり合う必要がある。しかし、焼成前のグリーンシー
ト5は柔らかく可塑性があるので、積層時に(b)に示
すように積層ずれが生じてしまったり、或は、(c)に
示すように外周切断線(スナップライン)がずれてしま
まうことがある。また、スナップラインがずれていなく
ても、(d)に示すように、焼成後にスナップラインで
切断する際にバリ7が出来てしまうことがある。これら
(b)〜(d)のいずれの場合でも、正常な場合(a)
と比較して、基板位置合せ時に位置合せピン3(基板端
縁)とビア6との間の距離Bがずれるため、位置合せピ
ン(基板端縁)を基準にしてそこから一定距離Aの位置
に印刷する導体パターン4がビア6からずれた位置に印
刷されてしまい、接続不良品となることがある。
As shown in FIG. 6, when a conductor pattern 4 is printed on a fired substrate 1, a via 6 and a conductor for electrically connecting each layer (green sheet 5) of the substrate 1 up and down are formed. It is necessary that the pattern 4 overlaps exactly as shown in FIG. However, since the green sheet 5 before firing is soft and plastic, a lamination misalignment occurs during lamination as shown in (b), or an outer peripheral cutting line (snap line) as shown in (c) is formed. It may be shifted. Even if the snap lines are not shifted, burrs 7 may be formed when cutting with the snap lines after firing, as shown in FIG. In any of these cases (b) to (d), a normal case (a)
When the substrate is aligned, the distance B between the alignment pin 3 (the edge of the substrate) and the via 6 is shifted, so that the position A is a fixed distance A from the alignment pin (the edge of the substrate). The conductor pattern 4 to be printed is printed at a position shifted from the via 6, resulting in a defective connection.

【0004】特に、近年のように小型・高密度実装が進
むと、益々高い位置合せ精度が要求され、現在では、高
精度CCDカメラを用いて基板の位置を画像処理により
認識して位置合わせする装置も実用化されているが、こ
の装置は非常に高価であり、コストアップ要因となる欠
点がある。
In particular, as small and high-density mounting has progressed in recent years, higher alignment accuracy is required. At present, the position of a substrate is recognized by image processing using a high-precision CCD camera to perform alignment. Although the apparatus has been put to practical use, this apparatus is very expensive and has a drawback that causes a cost increase.

【0005】本発明はこのような事情を考慮してなされ
たものであり、従ってその目的は、位置合せピンを用い
て基板の位置合せを精度良く行うことができて、品質向
上・歩留り向上を達成することができるセラミック多層
基板及びその製造方法を提供することにある。
SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and accordingly, it is an object of the present invention to accurately align a substrate using alignment pins, and to improve quality and yield. An object of the present invention is to provide a ceramic multilayer substrate which can be achieved and a method for manufacturing the same.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に、本発明の請求項1は、複数枚のグリーンシートを積
層・焼成して成る、表面に配線を有するセラミック多層
基板において、基板端縁に、位置合せピンを嵌合するた
めの複数の表面位置合せ用の切欠部を形成し、各表面位
置合せ用の切欠部を、表面層の凹みより他の層の方が深
く凹んだ段差状に形成している。
In order to achieve the above object, a first object of the present invention is to provide a ceramic multilayer substrate having a wiring on a surface, which is formed by laminating and firing a plurality of green sheets. At the edge, fit the alignment pin
A plurality of notches for surface alignment are formed, and the notches for each surface alignment are formed in a stepped shape in which the other layer is more deeply recessed than the surface layer.

【0007】また、本発明を両面配線のセラミック多層
基板に適用する場合には、請求項2のように、基板端縁
に複数の表面位置合せ用の切欠部と複数の裏面位置合せ
用の切欠部とを形成し、各表面位置合せ用の切欠部を、
表面層の凹みより他の層の方が深く凹んだ段差状に形成
し、各裏面位置合せ用の切欠部を、裏面層の凹みより他
の層の方が深く凹んだ段差状に形成すれば良い。
Further, when the present invention is applied to a ceramic multilayer substrate having double-sided wiring, a plurality of notches for aligning the front surface and a plurality of notches for aligning the back surface are provided at the edge of the substrate. And a notch for each surface alignment,
If the other layer is formed in a stepped shape in which the other layer is deeper than the recess in the surface layer, the notch for each back surface alignment is formed in a stepped shape in which the other layer is more deeply recessed than the backside layer. good.

【0008】このようなセラミック多層基板を製造する
場合には、請求項3のように、前記各切欠部を形成する
ための穴を、グリーンシートにビアホール等を形成する
際に同時に形成し、且つ、表面層又は裏面層に積層され
るグリーンシートの切欠部形成用の穴を他の層に積層さ
れるグリーンシートの切欠部形成用の穴よりも切断線か
ら基板内側への奥行きが小さくなるように形成し、該グ
リーンシートの積層後又は焼成後に、該積層体を前記穴
を分割するように切断することで、前記各切欠部を形成
し、焼成された基板の複数の切欠部を複数の位置合せピ
ンに嵌合させることで、該基板を位置合せして印刷等の
後工程を行うようにすれば良い。
In the case of manufacturing such a ceramic multi-layer substrate, a hole for forming each of the notches is formed simultaneously with forming a via hole or the like in the green sheet. The depth of the notch forming hole of the green sheet laminated on the front surface layer or the back surface layer from the cutting line to the inside of the substrate is smaller than the notch forming hole of the green sheet laminated on another layer. After laminating or firing the green sheet, the laminate is cut so as to divide the holes, thereby forming the respective cutouts, and forming a plurality of cutouts of the fired substrate into a plurality of cutouts. A post-process such as printing may be performed by aligning the substrate with the alignment pins.

【0009】[0009]

【作用】上述した請求項1の構成によれば、基板の位置
合せ時には、基板端縁に形成された複数の表面位置合せ
用の切欠部を位置合せピンに嵌合させることにより基板
の位置合せを行う。この際、各表面位置合せ用の切欠部
は、表面層の凹みより他の層の方が深く凹んだ段差状に
形成されているので、基板位置合せ時には基板の表面層
の切欠部内縁が位置合せピンに必ず当接した状態となっ
て、常に表面層の切欠部内縁を基準にした位置合せが可
能となり、前述した積層ずれ、外周切断線(スナップラ
イン)のずれやバリの影響を受けずに済む。更に、切欠
部を、グリーンシートにビアホール等を形成する際に同
時に形成すれば、基板焼成後の後工程の位置合せで最も
必要な位置精度である表面層のビアと位置合せピン(切
欠部)との間の位置精度を正確に確保できると共に、工
程数も増えずに済む。
According to the first aspect of the present invention, at the time of positioning the substrate, the plurality of cutouts for aligning the surface formed at the edge of the substrate are fitted to the positioning pins, thereby positioning the substrate. I do. At this time, the notch for each surface alignment is formed in a stepped shape in which the other layer is deeper than the depression in the surface layer, so that the inner edge of the notch in the surface layer of the substrate is positioned at the time of substrate alignment. Being always in contact with the dowel pin, it is possible to always perform alignment with reference to the inner edge of the cutout of the surface layer, without being affected by the above-mentioned lamination displacement, displacement of the outer peripheral cutting line (snap line) and burrs. Only Furthermore, if the notch portion is formed simultaneously with the formation of the via hole or the like in the green sheet, the via hole of the surface layer and the alignment pin (notch portion), which are the most necessary positional accuracy in the post-process alignment after firing the substrate. And the position accuracy between them can be accurately secured, and the number of processes does not need to be increased.

【0010】また、請求項2のように、両面配線のセラ
ミック多層基板の場合には、基板端縁に、表面位置合せ
用の切欠部と、これとは表裏反対の関係になる裏面位置
合せ用の切欠部とを形成し、基板表面に印刷等を行う場
合には、請求項1の場合と同じく、表面位置合せ用の切
欠部を位置合せピンに嵌合し、基板裏面に印刷等を行う
場合には、裏面位置合せ用の切欠部を位置合せピンに嵌
合する。この裏面位置合せ用の切欠部は、裏面層の凹み
より他の層の方が深く凹んだ段差状になっているので、
裏面位置合せ時には基板の裏面層の切欠部の内縁が位置
合せピンに必ず当接した状態となり、常に裏面層の切欠
部を基準にした正確な位置合せが可能となる。
In the case of a ceramic multilayer substrate having double-sided wiring, a notch for aligning the front surface is provided at the edge of the substrate, and a notch for aligning the rear surface is formed in an opposite relationship to the front and back. When printing or the like is performed on the front surface of the substrate by forming a notch portion of the above, the notch portion for aligning the front surface is fitted to the positioning pin, and printing or the like is performed on the back surface of the substrate. In this case, the notch for positioning the back surface is fitted to the positioning pin. Since the notch for alignment of the back surface has a stepped shape in which the other layer is more deeply recessed than the recess in the back surface layer,
At the time of back surface alignment, the inner edge of the notch of the back layer of the substrate always comes into contact with the alignment pin, and accurate positioning can always be performed based on the notch of the back layer.

【0011】以上のようなセラミック多層基板を製造す
る場合、請求項3の製造方法では、各切欠部を形成する
ための穴を、グリーンシートにビアホール等を形成する
際に同時に形成することで、ビアホールと切欠部形成用
の穴とを常に一定の位置関係で形成する。この際、表面
層又は裏面層に積層されるグリーンシートの切欠部形成
用の穴を他の層に積層されるグリーンシートの切欠部形
成用の穴よりも切断線から基板内側への奥行きが小さく
なるように形成し、これらのグリーンシートを積層した
ときに、表面層又は裏面層の切欠部形成用の小さな穴が
他の層の大きな穴に重なり合うようにする。そして、グ
リーンシートの積層後又は焼成後に、該積層体を前記穴
を分割するように切断することで、各切欠部を形成す
る。この際、焼成後に基板の切断を行う場合には、焼成
前にグリーンシート積層体に切欠部形成用の穴を通るス
ナップライン(切断線)をプレス成形し、焼成後にスナ
ップラインに沿って折り割れば良い。このようにして製
造されたセラミック多層基板は、前述した請求項1又は
2の構成となり、基板の切欠部を位置合せピンに嵌合さ
せることで、基板を精度良く位置合せして印刷等の後工
程を行う。
In the case of manufacturing the above-described ceramic multi-layer substrate, in the manufacturing method according to the third aspect, holes for forming the respective notches are formed at the same time when the via holes are formed in the green sheet. The via hole and the hole for forming the cutout are always formed in a fixed positional relationship. At this time, the depth from the cutting line to the inside of the substrate is smaller than the cutout forming hole of the green sheet laminated on the other layer, the cutout forming hole of the green sheet laminated on the surface layer or the backside layer. When these green sheets are laminated, a small hole for forming a cutout in the surface layer or the rear surface layer is made to overlap with a large hole in another layer. Then, after laminating or firing the green sheets, the cutout is cut so as to divide the holes, thereby forming each notch. At this time, when the substrate is cut after firing, a snap line (cutting line) passing through a hole for forming a notch is press-formed in the green sheet laminate before firing, and after the firing, the snap line is cut along the snap line. Good. The ceramic multilayer substrate manufactured in this manner has the configuration of claim 1 or 2 described above, and the notch of the substrate is fitted to the alignment pin, thereby accurately aligning the substrate and performing printing or the like. Perform the process.

【0012】[0012]

【実施例】以下、本発明の一実施例を図1乃至図4に基
づいて説明する。まず、図1及び図2に基づいてセラミ
ック多層基板(以下「基板」と略称する)11の構成を
説明する。図1に示すように、基板11の隣接する2辺
の端縁には表面位置合せ用の切欠部12が合計3個形成
され、残りの2辺の端縁には、表面位置合せ用の切欠部
12と表裏反対の関係になる裏面位置合せ用の切欠部1
3が合計3個形成されている。表面位置合せ用の切欠部
12は、表面層の凹みより他の層の方が例えば0.1m
m以上深く凹んだ段差状に形成され、位置合せピン14
に嵌合したときに、表面層の切欠部12内縁が位置合せ
ピン14に必ず当接した状態となるようになっている。
一方、裏面位置合せ用の切欠部13は、裏面層の凹みよ
り他の層の方が例えば0.1mm以上深く凹んだ段差状
に形成され、裏面位置合せ時には裏面層の切欠部13内
縁が位置合せピン14に必ず当接した状態となるように
なっている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. First, the configuration of a ceramic multilayer substrate (hereinafter, abbreviated as “substrate”) 11 will be described with reference to FIGS. 1 and 2. As shown in FIG. 1, a total of three notch portions 12 for surface alignment are formed at the edges of two adjacent sides of the substrate 11, and the notches for surface alignment are formed at the remaining two edges. Notch 1 for backside positioning, which has the opposite relationship to part 12
3 are formed in total. The notch 12 for surface alignment is, for example, 0.1 m in the other layer than the recess in the surface layer.
m.
, The inner edge of the notch 12 of the surface layer always comes into contact with the positioning pin 14.
On the other hand, the notch 13 for alignment of the back surface is formed in a stepped shape in which the other layer is deeper than the recess of the back layer by, for example, 0.1 mm or more. When aligning the back surface, the inner edge of the notch 13 of the back layer is positioned. The contact pin 14 is always in contact with the dowel pin 14.

【0013】上記基板11は、図2(a)に示すよう
に、従来同様、複数枚のグリーンシート15を積層・焼
成して製造され、各グリーンシート15には、多数のビ
アホール16が打抜き型やパンチングマシーン等で打ち
抜き形成され、このビアホール16の内部に導体材料を
充填してビア17が形成されている。また、基板11の
内層には、積層前にグリーンシート15に印刷された導
体,誘電体等の内層パターン18(図4参照)が設けら
れている。基板11の表面層及び裏面層には、基板焼成
後に導体パターン19(図2に表面層の導体のみ図示、
裏面層の導体は図6に符号「4」で図示)が印刷・焼成
され、その印刷時の位置合せは、位置合せ台25上で3
箇所の切欠部12(又は13)を3本の位置合せピン1
4に嵌合することによって行われる。
As shown in FIG. 2A, the substrate 11 is manufactured by laminating and firing a plurality of green sheets 15 as in the prior art. The via hole 16 is formed by punching with a punching machine or the like, and the via hole 16 is filled with a conductive material to form a via 17. The inner layer of the substrate 11 is provided with an inner layer pattern 18 (see FIG. 4) such as a conductor or a dielectric printed on the green sheet 15 before lamination. After the substrate is baked, a conductor pattern 19 (only the conductor of the surface layer is shown in FIG.
The conductor of the back layer is indicated by reference numeral “4” in FIG. 6) and printed and baked.
The notch 12 (or 13) at the position is
4.

【0014】次に、上記構成の基板11を低温焼成(1
000℃以下で焼成)する場合の製造方法の一例を図3
及び図4を用いて説明する。ここで使用するグリーンシ
ート15の作り方は、CaO−Al2 3 −SiO2
2 3 系のガラス粉末60wt%とアルミナ粉末40
wt%とを混合した粉体に、可塑剤(例えばDOP)、
バインダー(例えばアクリル樹脂)、溶剤(トルエン、
キシレン、アルコール類)を加え、十分に混練して粘度
2000〜40000cpsのスラリーを作成し、ドク
ターブレード法によって例えば0.3mm厚の低温焼成
用のグリーンシートを形成する。
Next, the substrate 11 having the above structure is fired at a low temperature (1.
FIG. 3 shows an example of a manufacturing method in the case of firing at 000 ° C. or less.
This will be described with reference to FIG. The method of producing the green sheet 15 used here is CaO—Al 2 O 3 —SiO 2
B 2 O 3 based glass powder 60 wt% alumina powder 40
and a plasticizer (for example, DOP),
Binder (for example, acrylic resin), solvent (toluene,
(Xylene, alcohols) are added and sufficiently kneaded to prepare a slurry having a viscosity of 2000 to 40000 cps, and a 0.3 mm thick green sheet for low temperature firing is formed by a doctor blade method.

【0015】この後、打抜き型やパンチングマシーン等
を用いて、グリーンシート15の所定位置に0.05〜
1.00mmφ程度の多数のビアホール16と、4個の
ガイド穴20及び6個の切欠部形成用の角穴21,22
を同時に打ち抜き形成する。ここで、ガイド穴20は、
グリーンシート15の四隅部にそれぞれ形成され、グリ
ーンシート15上のパターン印刷や積層の際に、このガ
イド穴20にガイドピン(図示せず)を挿通することで
各層のグリーンシート15が位置決めされる。また、切
欠部形成用の角穴21,22は、積層後に切断される線
23上に位置し、最終的に切欠部12,13となる。図
3(a)及び(d)に示すように、表面層と裏面層とな
るグリーンシート15には、小さな角穴21とこれより
例えば0.1mm以上大きな角穴22がそれぞれ対称位
置に3個ずつ形成され、表面層と裏面層とでは大小の角
穴22,21の位置関係が反対になっている。また、図
3(b)及び(c)に示すように、内層となるグリーン
シート15には、大きな角穴22のみが合計6個形成さ
れている。各グリーンシート15に形成する合計6個の
角穴21,22は同じ位置に形成され、各グリーンシー
ト15を積層したときに、角穴21,22で上下に貫通
する貫通孔を形成すると共に、表面層と裏面層ではそれ
ぞれ3個の小さな角穴21が他の層の大きな角穴22に
重なり合った状態となる。
After that, the green sheet 15 is placed at a predetermined position on the green sheet 15 by using a punching die or a punching machine.
Many via holes 16 of about 1.00 mmφ, four guide holes 20 and six square holes 21 and 22 for forming notches
At the same time. Here, the guide hole 20 is
The guide sheet (not shown) is inserted into the guide hole 20 when the pattern is printed or laminated on the green sheet 15 at the four corners of the green sheet 15 to position the green sheet 15 of each layer. . Further, the square holes 21 and 22 for forming the cutout portions are located on the line 23 that is cut after lamination, and finally become the cutout portions 12 and 13. As shown in FIGS. 3A and 3D, the green sheet 15 serving as the front surface layer and the back surface layer has three small square holes 21 and three square holes 22 larger by 0.1 mm or more than the small square holes 21 respectively. The large and small square holes 22 and 21 have opposite positions in the front layer and the rear layer. As shown in FIGS. 3B and 3C, the green sheet 15 serving as the inner layer is formed with only six large square holes 22 in total. A total of six square holes 21 and 22 formed in each green sheet 15 are formed at the same position, and when the green sheets 15 are stacked, a through hole vertically penetrating with the square holes 21 and 22 is formed. In each of the front layer and the back layer, three small square holes 21 overlap the large square holes 22 of the other layers.

【0016】上述したようにして各層のグリーンシート
15にビアホール16、ガイド穴20及び切欠部形成用
の角穴21,22を同時に打ち抜き形成した後、層間を
電気的に接続できるように、各グリーンシート15のビ
アホール16にAg系導体材料を充填する。この後、図
4(a)に示すように、内層及び裏面層の各グリーンシ
ート15上に、内層パターン18をAg、Ag−Pd、
Ag−Pt、Ag−Pd−Pt等の導体材料ペーストを
使用してスクリーン印刷した後、各グリーンシート15
を積層し、この積層体を、例えば80〜150℃、50
〜250kg/cm2 の条件で熱圧着して一体化する。
上述した内層パターン18の印刷と積層の際のグリーン
シート15の位置決めは、グリーンシート15の四隅部
のガイド穴20にガイドピン(図示せず)を挿通するこ
とで行われる。上述のようにして熱圧着された積層体を
切断線23に沿って切断する。この切断により、各角穴
21,22が分割され、切欠部12,13となる。この
積層体を電気式連続ベルト炉を使用して、空気中で90
0℃、20分の保持条件で焼成し、セラミック多層基板
11を作成する。
After the via holes 16, the guide holes 20, and the square holes 21 and 22 for forming the cutouts are simultaneously punched and formed in the green sheet 15 of each layer as described above, the green sheets are electrically connected between the layers. The via hole 16 of the sheet 15 is filled with an Ag-based conductor material. Thereafter, as shown in FIG. 4A, an inner layer pattern 18 is formed on each green sheet 15 of the inner layer and the back layer by using Ag, Ag-Pd,
After screen printing using a conductive material paste such as Ag-Pt or Ag-Pd-Pt, each green sheet 15 is printed.
Are laminated, for example, at a temperature of 80 to 150 ° C. and 50 ° C.
It is integrated by thermocompression bonding under the condition of 250250 kg / cm 2 .
The positioning of the green sheet 15 at the time of printing and laminating the inner layer pattern 18 is performed by inserting guide pins (not shown) into the guide holes 20 at the four corners of the green sheet 15. The laminated body thermocompression-bonded as described above is cut along the cutting line 23. By this cutting, each of the square holes 21 and 22 is divided into notches 12 and 13. This laminate was placed in air for 90 hours using an electric continuous belt furnace.
By firing at 0 ° C. for 20 minutes, a ceramic multilayer substrate 11 is formed.

【0017】この後、基板11の表面に導体パターン1
9を印刷する場合には、図1及び図2に示すように、位
置合せ台25上で表面位置合せ用の切欠部12を位置合
せピン14に嵌合して基板11を該切欠部12を基準に
して位置合せする。この場合、表面位置合せ用の切欠部
12は、表面層の凹みより他の層の方が例えば0.1m
m以上深く凹んだ段差状になっているので、位置合せピ
ン14に嵌合したときに、表面層の切欠部12の内縁が
位置合せピン14に必ず当接した状態となる。仮に、積
層ずれや切断線23のずれが生じたり、或は切断部にバ
リがあったとしても、これらは表面層の切欠部12の内
縁と位置合せピン14との当接状態に何ら影響を与える
ことはなく、常に表面層の切欠部12の内縁を基準にし
た位置合せが可能となる。しかも、切欠部12となる角
穴21を、グリーンシート15にビアホール16等を形
成する際に同時に打ち抜き形成するので、表面層のビア
17と位置合せピン14(表面層の切欠部12の内縁)
との間の距離A(図2参照)を常に一定にできて、基板
焼成後の後工程の位置合せで最も必要な表面層のビア1
7の位置合せ精度を極めて正確に確保できる。
Thereafter, the conductor pattern 1 is formed on the surface of the substrate 11.
When printing 9, as shown in FIGS. 1 and 2, a notch 12 for surface alignment is fitted on an alignment pin 14 on an alignment table 25, and the substrate 11 is attached to the notch 12. Align with reference. In this case, the notch 12 for aligning the surface has a thickness of 0.1 m for the other layer than the recess of the surface layer.
Since it is a stepped shape that is deeply recessed by m or more, the inner edge of the notch 12 of the surface layer always comes into contact with the positioning pin 14 when fitted to the positioning pin 14. Even if the stacking shift, the shift of the cutting line 23, or the cut portion has burrs, these have no effect on the contact state between the inner edge of the cutout 12 of the surface layer and the positioning pin 14. This is not provided, and positioning based on the inner edge of the notch 12 of the surface layer can always be performed. Moreover, since the square holes 21 serving as the cutouts 12 are punched and formed at the same time when the via holes 16 and the like are formed in the green sheet 15, the vias 17 of the surface layer and the alignment pins 14 (the inner edges of the cutouts 12 of the surface layer) are formed.
A (see FIG. 2) can always be constant, and the via 1 of the surface layer which is most necessary for the alignment in the post-process after the substrate baking.
The alignment accuracy of No. 7 can be secured extremely accurately.

【0018】このようにして正確に位置合せされた基板
11の表面に、Au系導体を使用して導体パターン19
を印刷して焼成する。一方、基板11の裏面に導体パタ
ーン19を印刷する場合には、基板11を裏返して、裏
面位置合せ用の切欠部13を位置合せピン14に嵌合し
て位置合せを行えば良い。つまり、裏面位置合せ用の切
欠部13は、裏面層の凹みより他の層の方が例えば0.
1mm以上深く凹んだ段差状になっているので、裏面位
置合せ時には基板11の裏面層の切欠部13の内縁が位
置合せピン14に必ず当接した状態となり、常に裏面層
の切欠部13を基準にした正確な位置合せが可能とな
る。
The conductor pattern 19 is formed on the surface of the substrate 11 accurately aligned in this manner by using an Au-based conductor.
Is printed and fired. On the other hand, when printing the conductor pattern 19 on the back surface of the substrate 11, the substrate 11 may be turned upside down, and the notch 13 for positioning the back surface may be fitted to the positioning pin 14 for positioning. In other words, the notch 13 for alignment of the back surface is, for example, 0.1.
Since the stepped shape is recessed by 1 mm or more, the inner edge of the cutout portion 13 of the backside layer of the substrate 11 always comes into contact with the positioning pin 14 at the time of backside alignment. And accurate positioning can be achieved.

【0019】本発明者らは以上説明した製造方法により
基板11を作製し、その基板11の表面に導体パターン
19を印刷・焼成して、導体パターン19とビア17と
の位置ずれによる不良発生率を評価した結果、図2
(b)に示すように、常に導体パターン19とビア17
とが完全に重なり合った状態となり、不良発生率は0%
であった。
The present inventors manufacture the substrate 11 by the manufacturing method described above, print and bake a conductor pattern 19 on the surface of the substrate 11, and obtain a defect occurrence rate due to a displacement between the conductor pattern 19 and the via 17. As a result of evaluating
As shown in (b), the conductor pattern 19 and the via 17
Are completely overlapped with each other, and the defect occurrence rate is 0%.
Met.

【0020】これに対し、比較例として位置合せ用の切
欠部12,13の無い図5の形態の基板を製造し、その
基板の表面に導体パターンを印刷・焼成して、導体パタ
ーンとビアとの位置ずれによる不良発生率を評価した結
果、導体パターンがビアからずれたものがかなり出来て
しまい、不良発生率は16%にもなった。
On the other hand, as a comparative example, a substrate in the form shown in FIG. 5 having no notches 12 and 13 for alignment was manufactured, and a conductor pattern was printed and fired on the surface of the substrate to form a conductor pattern, a via and a via. As a result of evaluation of the defect occurrence rate due to the positional deviation, the conductor pattern was considerably deviated from the via, and the defect occurrence rate was as high as 16%.

【0021】以上の試験結果から明らかなように、本実
施例によれば、基板11の端縁に位置合せ用の切欠部1
2,13を段差状に形成することで、基板11の位置合
せ精度を飛躍的に向上することができ、品質向上・歩留
り向上の要求を十分に満たすことができる。しかも、位
置合せピン14を用いて基板11の位置合せを行うこと
ができるため、基板11の位置合せに高精度CCDカメ
ラ等を用いた高価な位置合せ装置を必要とせず、設備コ
スト低減の要求も満たすことができる。更に、位置合せ
用の切欠部12,13(角穴21,22)を、グリーン
シート15にビアホール16等を形成すると同時に形成
するようにしたので、製造工数も従来と同じであり、製
造能率も低下せずに済む。
As is apparent from the above test results, according to the present embodiment, the notch 1 for positioning is formed at the edge of the substrate 11.
By forming the steps 2 and 13 in the form of steps, the alignment accuracy of the substrate 11 can be remarkably improved, and the requirements for quality improvement and yield improvement can be sufficiently satisfied. Moreover, since the positioning of the substrate 11 can be performed using the positioning pins 14, an expensive positioning device using a high-precision CCD camera or the like is not required for the positioning of the substrate 11, and a reduction in equipment cost is required. Can also be satisfied. Further, the notches 12 and 13 (square holes 21 and 22) for alignment are formed at the same time when the via holes 16 and the like are formed in the green sheet 15, so that the number of manufacturing steps is the same as the conventional one, and the manufacturing efficiency is also high. It does not have to fall.

【0022】ところで、位置合せ用の切欠部12,13
に代えて、位置合せ穴を基板11に形成した場合、上記
実施例と比較して、位置合せピンを位置合せ穴に真上か
ら挿入する作業が面倒であるばかりか、位置合せピンの
挿入時に位置合せ穴の周縁が欠けてしまうおそれがあ
り、これが歩留りを悪くする原因となる。この点、上記
実施例では、穴ではなく、外側方に開放された切欠部1
2,13であるので、位置合せピン14との嵌合を外側
方から容易に行うことができて、切欠部12,13の周
縁が欠ける可能性は穴の場合と比較して遥かに小さくて
済む。
By the way, the notches 12 and 13 for positioning are provided.
When the positioning hole is formed in the substrate 11 instead of the above, not only is the operation of inserting the positioning pin into the positioning hole from directly above than in the above-described embodiment complicated, but also when the positioning pin is inserted. There is a possibility that the periphery of the alignment hole may be chipped, which may cause a decrease in yield. In this regard, in the above-described embodiment, the notch 1 opened to the outside instead of the hole is used.
2 and 13, the fitting with the positioning pin 14 can be easily performed from the outside, and the possibility of the peripheral edges of the notches 12 and 13 being chipped is much smaller than that of the hole. I'm done.

【0023】尚、上記実施例では、グリーンシート15
の積層体から基板11を切断する工程を焼成前に行うよ
うにしたが、これに限定されず、従来同様、焼成後の積
層体から基板11を切断するようにしても良い。具体的
には、グリーンシート15の積層後に、その積層体の表
面にスナップライン(切断用の溝)をプレス成形し、こ
れを焼成した後、該積層体をスナップラインで折り割る
ことにより、焼成後の積層体から基板11を切断するも
のである。
In the above embodiment, the green sheet 15
Although the step of cutting the substrate 11 from the laminate is performed before firing, the present invention is not limited to this. The substrate 11 may be cut from the fired laminate as in the related art. Specifically, after laminating the green sheets 15, a snap line (cutting groove) is press-formed on the surface of the laminate, and the laminate is fired by firing. The substrate 11 is cut from the later laminated body.

【0024】また、上記実施例は、本発明を基板両面に
導体パターン等を後付けする両面配線のセラミック多層
基板に適用したものであるが、片面のみに導体パターン
等を後付けするセラミック多層基板に適用しても良く、
この場合には、上記実施例から裏面位置合せ用の切欠部
13を無くせば良い。
In the above embodiment, the present invention is applied to a ceramic multilayer substrate having a double-sided wiring in which conductor patterns and the like are retrofitted on both sides of the substrate. May be
In this case, the notch 13 for back surface alignment may be eliminated from the above embodiment.

【0025】また、上記実施例は、本発明を低温焼成の
セラミック多層基板に適用したものであるが、アルミナ
多層基板等、他のセラミック材料で形成した多層基板に
も適用可能であることは言うまでもない。その他、本発
明は、位置合せ用の切欠部12,13の個数や位置或は
形状を必要に応じて適宜変更しても良い等、要旨を逸脱
しない範囲内で種々変更して実施できることは言うまで
もない。
In the above embodiment, the present invention is applied to a ceramic multilayer substrate fired at a low temperature. However, it is needless to say that the present invention can be applied to a multilayer substrate formed of another ceramic material such as an alumina multilayer substrate. No. In addition, it goes without saying that the present invention can be implemented with various changes within a range not departing from the gist, such as the number, position, or shape of the alignment notches 12, 13 may be appropriately changed as necessary. No.

【0026】[0026]

【発明の効果】以上の説明から明らかなように、本発明
の請求項1のセラミック多層基板によれば、基板の端縁
に形成された表面位置合せ用の切欠部は、表面層の凹み
より他の層の方が深く凹んだ段差状になっているので、
基板位置合せ時には基板の表面層の切欠部内縁が位置合
せピンに必ず当接した状態となり、常に表面層の切欠部
内縁を位置合せの基準にして、積層ずれ、外周切断線の
ずれやバリの影響を受けない高精度な位置合せを行うこ
とができ、品質向上・歩留り向上の要求を満たすことが
できる。しかも、位置合せピンを用いて基板の位置合せ
を行うことができるため、基板の位置合せに高精度CC
Dカメラ等を用いた高価な位置合せ装置を必要とせず、
設備コスト低減の要求も満たすことができる。
As is apparent from the above description, according to the ceramic multi-layer substrate of the first aspect of the present invention, the notch for aligning the surface formed at the edge of the substrate is more than the notch of the surface layer. Since the other layers are deeply concave,
At the time of substrate alignment, the inner edge of the notch of the surface layer of the substrate always comes into contact with the alignment pin, and the alignment of the inner edge of the notch of the surface layer is always used as a reference for alignment. It is possible to perform high-precision positioning without being affected by the influence, and it is possible to satisfy requirements for quality improvement and yield improvement. In addition, the positioning of the substrate can be performed using the positioning pins.
It does not require an expensive alignment device using a D camera, etc.
It can also meet the demand for equipment cost reduction.

【0027】また、請求項2の構成では、基板端縁に、
表面位置合せ用の切欠部と、これとは表裏反対の関係に
なる裏面位置合せ用の切欠部とを形成したので、基板の
表裏両面に対して高い位置合せ精度で印刷等の後工程を
行うことができる。
[0027] According to the second aspect of the present invention, at the edge of the substrate,
Since the notch for the front surface alignment and the notch for the back surface alignment having the opposite relationship to the front and back are formed, the post-process such as printing is performed on both the front and back surfaces of the substrate with high alignment accuracy. be able to.

【0028】更に、請求項3の製造方法では、各切欠部
を形成するための穴を、グリーンシートにビアホール等
を形成する際に同時に形成するようにしたので、ビアホ
ールと切欠部形成用の穴とを常に一定の位置関係で形成
することができて、基板焼成後の後工程の位置合せで最
も必要な表面層のビアの位置合せ精度を極めて正確に確
保できると共に、製造工数が全く増加せず、製造能率も
低下せずに済む利点がある。
Further, in the manufacturing method according to the third aspect, the holes for forming the notches are formed at the same time when the via holes are formed in the green sheet, so that the holes for forming the via holes and the notches are formed. Can always be formed in a fixed positional relationship, and the alignment accuracy of the via of the surface layer, which is the most necessary in the post-process alignment after the substrate baking, can be secured extremely accurately, and the number of manufacturing steps is greatly increased. Therefore, there is an advantage that the production efficiency does not decrease.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例を示すもので、(a)はセラ
ミック多層基板の平面図、(b)は(a)のA−A’線
に沿って示す縦断面図である。
FIGS. 1A and 1B show an embodiment of the present invention, wherein FIG. 1A is a plan view of a ceramic multilayer substrate, and FIG. 1B is a longitudinal sectional view taken along line AA ′ of FIG.

【図2】(a)は切欠部と位置合せピンとの関係を示す
主要部の拡大縦断面図、(b)は同平面図である。
FIG. 2A is an enlarged longitudinal sectional view of a main part showing a relationship between a notch and an alignment pin, and FIG. 2B is a plan view of the same.

【図3】各層に積層されるグリーンシートのパンチング
工程後の状態を示す平面図である。
FIG. 3 is a plan view showing a state after a punching step of a green sheet laminated on each layer.

【図4】印刷工程から焼成工程までの工程を説明する工
程図である。
FIG. 4 is a process diagram illustrating a process from a printing process to a firing process.

【図5】(a)は従来の基板の位置合せ方法を説明する
ための基板の平面図、(b)は同側面図である。
FIG. 5A is a plan view of a substrate for explaining a conventional method of aligning the substrate, and FIG. 5B is a side view of the same.

【図6】ビアと導体パターンとの間の位置ずれの原因を
説明する図である。
FIG. 6 is a diagram illustrating a cause of a displacement between a via and a conductor pattern.

【符号の説明】[Explanation of symbols]

11…基板、12…表面位置合せ用の切欠部、13…裏
面位置合せ用の切欠部、14…位置合せピン、15…グ
リーンシート、16…ビアホール、17…ビア、19…
導体パターン、20…ガイド穴、21,22…角穴、2
3…切断線。
11 ... substrate, 12 ... notch for front surface alignment, 13 ... notch for rear surface alignment, 14 ... alignment pin, 15 ... green sheet, 16 ... via hole, 17 ... via, 19 ...
Conductor pattern, 20: guide hole, 21, 22, square hole, 2
3: Cutting line.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭62−27144(JP,A) 特開 平5−283868(JP,A) 特開 昭59−181598(JP,A) 特開 平2−138786(JP,A) (58)調査した分野(Int.Cl.7,DB名) H05K 3/46 H05K 1/02 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-62-27144 (JP, A) JP-A-5-283868 (JP, A) JP-A-59-181598 (JP, A) JP-A-2- 138786 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) H05K 3/46 H05K 1/02

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 複数枚のグリーンシートを積層・焼成し
て成る、表面に配線を有するセラミック多層基板におい
て、基板端縁に、位置合せピンを嵌合するための複数の
表面位置合せ用の切欠部が形成され、各前記表面位置合
せ用の切欠部は、表面層の凹みより他の層の方が深く凹
んだ段差状に形成されていることを特徴とするセラミッ
ク多層基板。
1. A ceramic multi-layer substrate having a wiring on a surface formed by laminating and firing a plurality of green sheets, a plurality of surface alignment notches for fitting alignment pins at an edge of the substrate. A ceramic multi-layer substrate, wherein each of the notch portions for surface alignment is formed in a stepped shape in which the other layer is deeper than the recess in the surface layer.
【請求項2】 複数枚のグリーンシートを積層・焼成し
て成る両面配線のセラミック多層基板において、基板端
縁に複数の表面位置合せ用の切欠部と複数の裏面位置合
せ用の切欠部とが形成され、各前記表面位置合せ用の切
欠部は、表面層の凹みより他の層の方が深く凹んだ段差
状に形成され、各前記裏面位置合せ用の切欠部は、裏面
層の凹みより他の層の方が深く凹んだ段差状に形成され
ていることを特徴とするセラミック多層基板。
2. A double-sided ceramic multi-layer substrate formed by laminating and firing a plurality of green sheets, a plurality of notches for aligning the front surface and a plurality of notches for aligning the back surface are provided at the edge of the substrate. The notch for each surface alignment is formed in a stepped shape in which the other layer is more deeply recessed than the depression in the surface layer, and the notch for each back surface alignment is formed by a recess in the back layer. A ceramic multilayer substrate, wherein another layer is formed in a stepped shape with a deeper depression.
【請求項3】 請求項1又は2のセラミック多層基板を
製造する方法であって、前記各切欠部を形成するための
穴を、前記グリーンシートにビアホール等を形成する際
に同時に形成し、且つ、表面層又は裏面層のグリーンシ
ートの切欠部形成用の穴を他の層に積層されるグリーン
シートの切欠部形成用の穴よりも切断線から基板内側へ
の奥行きが小さくなるように形成し、該グリーンシート
の積層後又は焼成後に、該積層体を前記穴を分割するよ
うに切断することで、前記各切欠部を形成し、焼成され
た基板の複数の切欠部を複数の位置合せピンに嵌合させ
ることで、該基板を位置合せして印刷等の後工程を行う
ようにしたことを特徴とするセラミック多層基板の製造
方法。
3. The method for manufacturing a ceramic multilayer substrate according to claim 1, wherein holes for forming the respective notches are formed simultaneously when forming via holes or the like in the green sheet, and The hole for forming the notch of the green sheet of the surface layer or the back layer is formed so that the depth from the cutting line toward the inside of the substrate is smaller than the hole for forming the notch of the green sheet laminated on another layer. After laminating or firing the green sheets, the laminate is cut so as to divide the holes, thereby forming the cutouts, and connecting the cutouts of the fired substrate to a plurality of alignment pins. A method of manufacturing a ceramic multilayer substrate, wherein the post-process such as printing is performed by aligning the substrate by fitting into the substrate.
JP6231295A 1995-03-22 1995-03-22 Ceramic multilayer substrate and method of manufacturing the same Expired - Lifetime JP3076215B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6231295A JP3076215B2 (en) 1995-03-22 1995-03-22 Ceramic multilayer substrate and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6231295A JP3076215B2 (en) 1995-03-22 1995-03-22 Ceramic multilayer substrate and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JPH08264946A JPH08264946A (en) 1996-10-11
JP3076215B2 true JP3076215B2 (en) 2000-08-14

Family

ID=13196499

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3076215B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3416580B2 (en) 1999-07-13 2003-06-16 松下電器産業株式会社 Solid-state imaging device, camera using the same, and method of manufacturing solid-state imaging device
JP4172789B2 (en) * 2003-11-27 2008-10-29 京セラ株式会社 Wiring board
JP2007123786A (en) * 2005-10-31 2007-05-17 Kyocera Kinseki Corp Sheet substrate
JP5103460B2 (en) * 2009-10-30 2012-12-19 日本碍子株式会社 Green sheet processing method and printed material arrangement state determination method
JP5592311B2 (en) * 2011-06-13 2014-09-17 日本特殊陶業株式会社 Ceramic multilayer substrate
JP6154154B2 (en) * 2013-02-14 2017-06-28 京セラ株式会社 Laminated board
JP2016106035A (en) * 2013-03-19 2016-06-16 日産自動車株式会社 Positioning method and positioning device

Also Published As

Publication number Publication date
JPH08264946A (en) 1996-10-11

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