JP2002260906A - Substrate for chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip substrate which can be divided into discrete chips. all having normal shapes as products. SOLUTION: Primary dividing grooves 12 are provided with proper intervals on a chip substrate, and then unit dividing grooves 13 are provided with proper intervals on the chip substrate so as to cross the grooves 12 nearly at right angels. The chip substrate is divided along the unit dividing grooves 13 into chips 14 as products, first dummy parts 15 of dimension E larger than a dividing dimension F divided along the unit dividing grooves 13 of the chips 14 are provided outside the outermost ones of the chips 14, and second dummy parts 16 are provided outside the first dummy parts 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component substrate used for chip components used in various electronic devices.

[0002]

2. Description of the Related Art A conventional chip component substrate of this type will be described with reference to the drawings, taking a rectangular chip resistor as an example.

FIG. 4 shows a substrate for chip components used in a conventional square chip resistor. In FIG. 4, reference numeral 1 denotes a substrate for chip components.
In this example, the division grooves 2 for the primary division are formed at appropriate intervals, and the division grooves 3 for the individual division substantially orthogonal to the division grooves 2 for the primary division are formed at appropriate intervals. Reference numeral 4 denotes a chip component to be a product, and the chip component 4 is an example of a chip resistor. Reference numeral 5 denotes a dummy portion provided on the chip component substrate 1 outside the chip component 4 to be a product. The dummy portion 5 is a portion not used as a product.

FIG. 5 shows a conventional chip dividing device for a strip-shaped substrate in a chip component substrate. In FIG. 5, reference numeral 6 denotes a strip formed by forming division grooves 3 for dividing individual pieces at appropriate intervals. A plurality of substrate-like substrates 7 are transported in a state of being arranged in parallel in the longitudinal direction thereof. A large-diameter roller 8 and a small-diameter roller 8 Rollers 9 are arranged parallel to each other, and both rollers 8, 9 are marked with arrows A, B
By rotating in the opposite directions as shown by,
A plurality of strip-shaped substrates 7 transferred by the transfer conveyor 6 can be simultaneously fed between the rollers 8 and 9.

In the above configuration, a plurality of strip-shaped substrates 7 are arranged in parallel on the upper surface of the transfer conveyor 6, and when the transfer conveyor 6 is transferred toward both rollers 8 and 9, the plurality of strip-shaped substrates 7 become , Which is drawn between the rollers 8 and 9 from the tip thereof, and the large-diameter roller 8 and the small-diameter
Therefore, each chip component 4 is divided at the location of the dividing groove 3 for dividing an individual piece. In this case, the setting conditions for the division by the large-diameter roller 8 and the small-diameter roller 9 are as follows.
Is normally split.

[0006]

However, as shown in FIG. 4, in the conventional chip component substrate, as shown in FIG. 4, the dimension C of the dummy portion 5 provided for handling or the like is the same as the dimension of the chip component 4 to be a product. Because it is much larger than D,
When using the chip component substrate shown in FIG. 4 to divide individual pieces under the conditions set so that the chip component 4 to be a product is normally divided, as shown in FIG. The divided shape between the chip component 4 and the product does not become a normal divided shape having a substantially rectangular cross section as between the chip components 4 and 4 as the product, but an abnormal division having large burrs. As a result, there is a problem that the chip component 4 located on the side of the dummy portion 5 has a shape that cannot be used as a product.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a chip component substrate in which all divided shapes of a chip component to be a product have a normal divided shape.

[0008]

In order to achieve the above object, the present invention has the following arrangement.

According to the first aspect of the present invention, the primary dividing grooves are formed at appropriate intervals, and the individual dividing grooves which are substantially orthogonal to the primary dividing grooves are formed. In the chip component substrate formed at an appropriate interval, the chip component is located outside the outermost chip component in a plurality of chip components which are divided by the division grooves for dividing into individual pieces and are products. A first dummy portion having a dimension larger than the division dimension divided by the one-way division groove is provided, and a second dummy portion is provided outside the first dummy portion. According to this, the division is performed by the division groove for dividing the chip component, which is located outside the outermost chip component of the plurality of chip components divided into the product by the division groove for dividing the chip component. A first having a dimension greater than the dimension Provided with Mie portion, the first
Since the second dummy portion is provided outside the dummy portion of
An abnormally divided shape is formed between the first dummy portion and the second dummy portion provided outside the first dummy portion, but a normally divided shape is formed between the first dummy portion and a chip component to be a product. This has the effect of being able to achieve

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the first embodiment of the present invention will be described with reference to an embodiment.

FIG. 1 is a front view of a chip component substrate according to an embodiment of the present invention. In FIG. 1, 11
Is a substrate for chip components. The substrate 11 for chip components has division grooves 12 for primary division formed at appropriate intervals, and divisions for individual division substantially orthogonal to the division grooves 12 for primary division. The grooves 13 are formed at appropriate intervals. A chip component 14 is a product, and the chip component 14 is an example of a chip resistor. 15 is a dividing groove 1 for dividing the individual pieces.
The first dummy part 15 which is not used as a product provided outside the outermost chip part 14 among the plurality of chip parts 14 which are divided into three and becomes a product, has a dimension E of the first dummy part 15. The dimension is larger than the division dimension F divided by the division groove 13 for dividing the chip component 14 as a product into individual pieces. In this case, it is desirable that the dimension E of the first dummy portion 15 be larger than the product dimension intersection of the chip component 14 in consideration of the number of steps after the individual division, and when the division shape is considered, It is desirable that the dimension be smaller than 1.4 times the product dimension intersection of the chip component 14. Reference numeral 16 denotes a second dummy section provided outside the first dummy section 15 and not used as a product. The dimension G of the second dummy section 16 is equal to the dimension E of the first dummy section 15.
The size is larger than

FIG. 2 is a front view of an apparatus for dividing a strip-shaped substrate in a chip component substrate according to an embodiment of the present invention.

In FIG. 2, reference numeral 17 denotes a transfer for transferring a plurality of strip-shaped substrates 18 in which division grooves 13 for dividing the individual pieces are formed at appropriate intervals in a state of being arranged in parallel in the longitudinal direction. On the conveyor, a large-diameter roller 19 and a small-diameter roller 20 are disposed in parallel with each other at a position in front of the transfer conveyor 17 in the transfer direction. The two rollers 1 are driven by rotating in opposite directions as shown in FIG.
A plurality of strip-shaped substrates 18 transferred by the transfer conveyor 17 can be sent at a time between 9 and 20.

In the above configuration, a plurality of strip-shaped substrates 18 are arranged in parallel on the upper surface of the transfer conveyor 17, and when the transfer conveyor 17 is transferred toward both the rollers 19 and 20, the plurality of strip-shaped substrates 18 become Is drawn from the leading end between the two rollers 19 and 20 and is nipped by the large-diameter roller 19 and the small-diameter roller 20. It is divided for each chip component 14. In this case, the setting condition of division by the large-diameter roller 19 and the small-diameter roller 20 is such that the chip component 14 as a product is normally divided.

The chip component substrate 11 shown in FIG.
When the chip division device shown in FIG. 2 divides an individual piece under the conditions set so that the chip component 14 as a product is normally divided by using the first dummy, as shown in FIG. The division shape between the portion 15 and the second dummy portion 16 is an abnormal division shape having large burrs, but the division shape between the first dummy portion 15 and the chip component 14 which is a product is Although the dimension E of the dummy portion 15 is larger than the division dimension F of the chip component 14 to be a product, the difference between the two is small, so that a substantially normal division shape having a substantially rectangular cross section is required. You can do it.

In the above-described embodiment of the present invention, the dimension E of the first dummy section 15 is larger than the division dimension F of the chip component 14 as a product. Is not configured as a product, the same effect as in the embodiment of the present invention can be obtained even if the dimension E of the first dummy portion 15 and the division size F of the chip component 14 to be a product are the same. . However, in this case, the first dummy portion 15 and the chip component
Can be selected only by measuring the resistance value in the step after the division into individual pieces, and at least one of the strip-shaped substrates 18 divided by the division groove 13 for the primary division does not become a product. Since the same shape will be configured,
This increases the number of sorting steps. Also, the first dummy unit 1
The same effect as in the embodiment of the present invention can be obtained by making the dimension E of 5 smaller than the division dimension F of the chip component 14 to be a product, but also in this case, the number of sorting steps is increased. is there.

On the other hand, in one embodiment of the present invention, the size E of the first dummy portion 15 is larger than the division size F of the chip component 14 to be a product, and the product of the chip component 14 is Since the size is set to be larger than the dimensional tolerance, there is an effect that a dummy can be easily selected by a sieve or the like.

The dimension G of the second dummy portion 16 is not particularly limited as long as it is a dimension that can be divided. For the same reason as the relationship between the dimension E of the first dummy portion 15 and the division dimension F of the chip component 14 as a product, the dimension is larger than the division dimension F of the chip component 14 and the product dimension of the chip component 14. Preferably, the dimension is larger than the tolerance. On the other hand, in relation to the dimension E of the first dummy portion 15, the dimension G of the second dummy portion 16 is larger than the dimension E of the first dummy 15 in one embodiment of the present invention. But this second
Are provided for handling and the like, and are not used as products.
The dimension may be the same as the dimension E of the first dummy section 15, or may be smaller than the dimension E of the first dummy section 15.

[0019]

As described above, the chip component substrate of the present invention is positioned outside the outermost chip component among a plurality of chip components which are divided by the dividing groove for dividing into individual pieces and are products. Since the first dummy portion having a dimension larger than the division dimension of the chip component divided by the division groove for dividing into individual pieces is provided, and the second dummy portion is provided outside the first dummy portion. An abnormally divided shape is formed between the first dummy portion and the second dummy portion provided outside the first dummy portion, but a normal divided shape is formed between the first dummy portion and a chip component as a product. As a result, the divisional shapes of the chip components to be products are all excellent in that a normal divisional shape can be obtained.

[Brief description of the drawings]

FIG. 1 is a front view of a chip component substrate according to an embodiment of the present invention.

FIG. 2 is a front view of a chip dividing device for strip-shaped substrates in the chip component substrate.

FIG. 3 is a cross-sectional view illustrating a divided shape of a chip component divided into individual pieces by the chip dividing apparatus.

FIG. 4 is a front view of a conventional chip component substrate.

FIG. 5 is a front view of a chip dividing device for strip-shaped substrates in the chip component substrate.

FIG. 6 is a cross-sectional view showing a divided shape of a chip component divided by the chip dividing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Substrate for chip components 12 Divided groove for primary division 13 Divided groove for division into 14 pieces 14 Chip component 15 First dummy part 16 Second dummy part

Claims (1)

[Claims] 1. A chip component comprising: dividing grooves for primary division formed at appropriate intervals; and dividing grooves for dividing individual pieces substantially orthogonal to the dividing grooves for primary division formed at appropriate intervals. In the substrate, the plurality of chip components that are divided by the division grooves for dividing the individual pieces are located outside the outermost chip components of the plurality of chip components, and are divided by the division grooves for dividing the chip components into individual pieces. A first having a dimension greater than the split dimension
And a chip component substrate provided with a second dummy portion outside the first dummy portion.