JPH09115706A - Manufacture of chip resistor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a methode for manufacturing a chip resistor having a structure not affected by the displacement between electrodes and resistor elements. SOLUTION: First, plural surface-mount electrode arrays 2 are formed on a large-sized insulating substrate 1. Secondly, plural resistor elements 3 are so formed that they bridges the plural surface-mount electrode arrays 2. And lastly, scribed grooves 4 are formed in the plural surface-mount electrode arrays 2 so that they may scribe unit areas 5 which correspond to the resistor elements 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip resistor, and more particularly to a method for forming a surface electrode of a chip resistor.

[0002]

2. Description of the Related Art A conventional chip resistor is manufactured by a manufacturing method whose process is shown in FIG. First, an insulating substrate 12 is obtained by firing a substrate made of alumina or the like on the surface of which vertical and horizontal scribe grooves 11 for braking are formed in a lattice shape by embossing or the like. (Fig. 3
(A)) Next, a conductive paste containing silver and palladium is printed and fired on each of the plurality of unit regions 13 defined by the grid-shaped scribe grooves 11 formed on the surface of the insulating substrate 12, and the surface electrode 14 is then printed. Is formed. The surface electrodes 14 face each other in each unit area 13 so that the scribe groove 11 is formed.
Of these, it is formed so as not to cross the lateral groove and to cross the longitudinal groove. (FIG. 3B) Further, an electrode (not shown) on the back surface is similarly formed by printing and firing at a position on the back surface of the substrate corresponding to the front surface electrode 14. Next, the resistors 15 are formed between the surface electrodes 14 of the respective unit regions 13 by printing and firing so as to be electrically insulated from the resistors of the unit regions 13 adjacent in the vertical direction. . (FIG. 3C) Then, after printing and baking a glass protective film so as to cover each resistor 15 in each unit region 13, the resistance value of each resistor 15 formed is adjusted by trimming or the like, and 6
The insulating substrate 12 is pressed along the scribed groove 11 by using a substrate dividing device as described in Japanese Utility Model Publication No. 3-32602 or Japanese Utility Model Publication No. 3-56004.
The resistance element substrates are individually broken into chips by braking every three. After that, side surface electrodes are formed so as to connect the electrodes 14 on the front surface and the electrodes on the back surface to each of the chipped insulating substrates to manufacture a chip resistor.

[0003]

In recent years, as electronic technology has advanced, a chip resistor having a high resistance value has been required. However, in the above-described method for manufacturing the chip resistor, the surface electrode 14 is formed so as not to straddle the lateral scribe groove, and then the resistor 15 is formed.
Is formed in a separate step, the surface electrode 14 and the resistor 15 may be misaligned due to an error in the screen used for printing in the step of forming the surface electrode 14 and the resistor 15 and a misalignment of the screen with respect to the insulating substrate. Is likely to cause relative displacement.

As a result, as shown in FIG. 4, the surface electrode 1
4 and the resistor 15 vary in the overlapping area, and the resistance value of the resistor 15 in each unit region 13 varies greatly, which not only increases the time and effort required for trimming, but also increases the surface electrode on the insulating substrate 12. If a shift occurs in the width direction between the resistor 14 and the resistor 15, there is a possibility that the resistance value cannot be adjusted to a desired range even if trimming is performed.

In view of the above problems, it is an object of the present invention to provide a method of manufacturing a chip resistor having a structure that is less susceptible to the positional deviation between the surface electrode and the resistor.

[0006]

In order to solve the above-mentioned problems, the invention described in claim 1 of the present application relates to a method of manufacturing a chip type resistor, and a plurality of surface electrodes are provided on the surface of a large-sized insulating substrate. Forming a row, forming a plurality of resistors so as to bridge between the plurality of surface electrode rows, and the plurality of surface electrodes so as to define a unit region corresponding to the resistors It is characterized by having a step of forming scribed grooves in the rows.

[0007]

DETAILED DESCRIPTION OF THE INVENTION A method of manufacturing a chip resistor according to the present invention will be described below with reference to FIG. A plurality of front surface electrode rows 2 are formed by printing and firing a paste containing silver and palladium on one surface of a large-sized insulating substrate 1 made of alumina in which scribed grooves are not formed. (FIG. 1A) The surface electrode array 2 is formed in a strip shape (longitudinal in the figure) in plan view in order to connect a plurality of resistors as described later. Next, a paste containing ruthenium oxide is printed and fired so as to bridge between the front surface electrode rows 2 facing each other (in the horizontal direction in the drawing) to form a plurality of resistors 3 in a rectangular shape.
(FIG. 1B) Next, the scribe grooves 4 are formed in a lattice pattern on the surface of the insulating substrate 1 by a dicing device having a diamond blade to separate the surface electrode rows 2 and define a plurality of unit regions 5. To do.

Each unit region 5 thus defined has one resistor formed in the center thereof and a surface electrode 2'connected so as to face each other with the resistor 3 interposed therebetween.
These surface electrodes 2'are separated from each other by the scribe grooves 4 formed on the surface of the insulating substrate 1 in a grid pattern on the surface of the insulating substrate 1 so as to oppose each unit region 5 in the longitudinal and lateral directions and to be independent from each other in the width direction. Is formed. (FIG. 1C) The formation depth of these scribed grooves 4 is obtained by cutting one of the vertical and horizontal directions that define the unit region 5 to about half the thickness of the insulating substrate 1 and cutting the other one. You may form so that the whole thickness dimension of may be cut. That is, the scribe may be performed so that the slits are partially formed in the insulating substrate 1.

Further, since the width of the scribe groove 4 also serves as a braking groove when chips are formed for each unit area 5 in a process described later, it is similar to the width of the braking groove formed on the conventional substrate. It should be formed. Next, the first protective layer 6 is printed and fired with a glass glaze paste containing lead borosilicate glass so that the regions to be trimmed are covered on the resistors 3 separated into the unit regions 5. To form. (FIG. 1D) Next, the resistor 3 is laser-trimmed through the first protective layer 6 to form a trimming groove 7 to adjust the resistance value. (FIG. 1E) Next, a second protective layer is formed by printing an epoxy resin and heating and curing it so as to cover the resistor 3 and the first protective layer 6 together with the trimming groove 7. After that, the insulating substrate is divided into the unit regions 5 by the scribe groove 4 as in the conventional case, and the side surface electrodes that connect the opposed front and back electrodes are formed to manufacture the chip resistor. (Not shown) In this embodiment, the plurality of front surface electrode rows 2 are separated into front surface electrodes 2 ′ before forming the first protective layer 6, but if the resistance value of each resistor 3 is not measured. Always well especially first
It is not limited before forming the protective layer 6,
The process of (c) follows the process of FIG. 1 (a), and FIG.
You can go anywhere before.

Further, in this embodiment, the scribing for separating the front surface electrode array 2 is performed by the dicing device having the diamond blade, but it is not particularly limited to the diamond blade as long as the width dimension of the trimming groove can be secured. A dicing device using a wire or a laser cutter may be used. still,
The present invention is not particularly limited to the materials, structures, etc. described in the above embodiments.

[0011]

By adopting the configuration as in the present invention,
A chip-type resistor is manufactured in which surface electrodes are formed so as to face each other so as to entirely cover the surface of the edge portion of the insulating substrate in the width direction, and the chip resistor is connected to the resistor. As a result, the overlapping area of the resistor and the surface electrode becomes constant even if the position where the resistor is formed is deviated, and it is possible to prevent variations in the resistance value of the chip-type resistors that are divided and formed. Not only can the efficiency of the chip be improved, but the substrate surface must be exposed at the edge of the insulating substrate even if there is an extreme misalignment in the longitudinal direction of the chip resistor (X direction shown in FIG. 2). Since the resistor does not overlap the front surface electrode, it is possible to prevent the resistance value of the resistor from becoming impossible to adjust even after trimming.

Further, in the chip resistor manufactured by the manufacturing method of the present invention, the opposing surface electrodes connected to the resistor cover the entire width direction of the surface of the edge portion of the insulating substrate. Is formed in. As a result, even when the resistor is formed in the width direction (Y direction shown in FIG. 2) with respect to the surface electrode in the manufacturing process, the overlapping area of the resistor and the surface electrode does not change, Therefore, there is an effect that the resistance value of the chip type resistor is always almost constant.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a method for manufacturing a chip resistor according to the present invention.

FIG. 2 is a plan view showing a positional relationship between a surface electrode and a resistor of the chip resistor of the present invention.

FIG. 3 is an explanatory view showing a method of manufacturing a conventional chip resistor.

FIG. 4 is a plan view showing a deviation between a surface electrode and a resistor of a conventional chip resistor.

[Explanation of symbols]

 1 ... Insulating substrate 2 ... Surface electrode array 3 ... Resistor 4 ... Scribing groove 5 ... Unit area 6 ... First protective layer 7 ... Trimming groove

Claims (1)

[Claims] 1. A step of forming a plurality of front surface electrode rows on the surface of a large-sized insulating substrate, a step of forming a plurality of resistor bodies so as to bridge the plurality of front surface electrode rows, and the resistor body. And a step of forming scribed grooves in the plurality of front surface electrode rows so as to define a unit area corresponding to.