JPH0430161B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a thick film resistor array and a method for manufacturing the same, and particularly relates to a thick film resistor array in which resistors can be arranged in high density and a method for manufacturing the same. It is something.

(Prior Art) FIG. 1 is a plan view illustrating the configuration of a conventional thick film resistor array. 1 is a ceramic substrate, 2 is an electrode, and 3 is a thick film resistor. As shown in the figure, the thick film resistor 3 is coated in a single layer structure on the ceramic substrate 1 by a thick film printing method so that the electrodes 2, 2 are connected at both ends 2', 2' of the thick film resistor 3. It had a configuration in which a plurality of them were arranged in the horizontal direction. However, in such a configuration using the thick film printing method, the pitch between adjacent conductors, as shown in 4 in the diagram, can only be achieved at around 0.2 mm, and as electronic devices become smaller, A drawback is that it is difficult to further increase the density of the thick film resistor array.

(Objective of the Invention) The object of the present invention is to solve the above-mentioned drawbacks, by configuring both electrodes of a thick-film resistor to have a two-layer structure, leading out from the electrodes of each layer, and A thick film resistor array characterized by a high density array and a method for manufacturing the same are obtained, and will be described in detail below with reference to the drawings.

(Structure of the Invention) The thick film resistor array of the present invention includes two rows of first layer conductors formed by forming a plurality of electrode conductors in a staggered manner at predetermined intervals on a substrate by a thick film printing method; 1st
an insulating layer formed on a predetermined portion of the layer conductor surface and a substrate surface adjacent to the conductor; and a plurality of insulating layers formed on the predetermined portion of the substrate surface facing the first layer conductor at a predetermined distance. It is composed of a second layer conductor in which electrode conductors are formed in a staggered pattern, and a plurality of thick film resistors connected to the respective ends of the first and second layer conductors, and the manufacturing method thereof is as follows. A first step of forming two rows of first layer conductors in a staggered manner on the substrate by a thick film printing method, and on the surface of the first layer conductors,
a second step of forming an insulating layer on the surface of the substrate adjacent thereto; a third step of forming a second layer conductor on a predetermined portion of the insulating layer; a fourth step of forming a thick film resistor whose ends are integrally connected; and cutting the thick film resistor;
and a fifth step of separating into individual thick film resistors.

(Embodiment) FIG. 2 is a plan view illustrating the configuration of an embodiment of the present invention. FIG. 3 is a cutaway view taken along line A-A' in FIG. FIG. 4 is an explanatory diagram of a manufacturing method according to an embodiment of the present invention, in which a shows the first step, and a shows B-
B' is a sectional view, and B is a C-C' sectional view. Hereinafter, b is the second step and its sectional view, c is the third step and its sectional view, d is the fourth step and its sectional view, and the fifth step is the thick film resistor 15 along 18 of d.
This is a step of cutting and separating the thick film resistors 15' into individual thick film resistors 15'.

2, 3, and 4, 11 is a ceramic substrate, 12 is a first layer conductor, 12' is an electrode portion of the first layer conductor, 13 is an insulating layer, 14 is a second layer conductor, and 15 is a Thick film resistor, 15' is individual thick film resistor,
18 is the center between individual thick film resistors.

After forming the first layer conductor 12 as an electrode on one side of the thick film resistor 15 on the ceramic substrate 11 in a staggered manner by a thick film printing method as in the first step shown in FIG. 4a, The fourth insulating layer 13 of crystallized glass
As shown in the second step of FIG. b, it is integrally formed on the first layer conductor 12 by a thick film printing method. At this time, the electrode portion 12' of the first layer conductor 12 is exposed. Next, as shown in the third step of FIG. 4c, a first layer conductor is printed on the vertical extension line of the first layer conductor 12 as an electrode on the other side of the thick film resistor 15 by a thick film printing method. A second layer conductor 14 is formed on the insulating layer 13 so as to correspond to the second layer conductor 12 .

Next, as shown in the fourth step in FIG.
The second layer conductor 14 is integrally coated on the entire surface so as to be connected to the second electrode portion 12' and the second layer conductor 14.

Next, as a fifth step, the thick film of the part that is integrally adhered to the entire surface is cut along the center 18 between the individual thick film resistors shown in FIG. The resistor 15 is separated into individual thick film resistors 15', and the first layer conductor 12 provided on the substrate and the insulating layer 13 provided on the substrate on the vertical extension line of the first layer conductor 12 are separated. An individual thick film resistor 15' formed by connecting the second layer conductor 14 of
It was possible to manufacture a thick film resistor array in which a plurality of thick film resistors were arranged adjacent to each other.

In addition, the cutting width at the center 18 between each individual thick film resistor in the above cutting method was about 20 μm for both the laser beam and the dicing saw. Further, if the resistance value needs to be adjusted, trimming can be performed using a laser trimming device.

Thus, since this embodiment has the above configuration, the pitch 4 between adjacent conductors was approximately 0.2 mm in the conventional thick film resistor array shown in FIG. Since the pitch 20 shown in Fig. 2 is about 0.2 mm, the pitch 21 is about 0.1 mm.
mm, which is about half of the conventional value, making it possible to construct a high-density thick film resistor array.

(Effects of the Invention) As explained in detail above, by forming the electrodes of the thick film resistor array into a two-layer structure, the pitch of the thick film resistors can be formed to about half that of the conventional one. This has the advantage that a resistor array can be formed.

In addition, the method of taking out the electrodes is such that the first layer conductor is arranged in a staggered manner and the second layer conductor is placed on the insulating layer, so that the electrode of any thick film resistor has the first layer conductor on one side and the second layer conductor on the other side.
Since it becomes a layered conductor, it has the effect of reducing variations in resistance value.

In addition, the present invention has a two-layer structure for the electrodes of the thick film resistor array, with the first layer conductors arranged in a staggered manner and the second layer conductors placed on the insulating layer. Since it can be formed, it has the advantage that it can be used for chip resistors, thick film hybrid ICs, etc.

[Brief explanation of drawings]

Fig. 1 is a plan view of a conventional thick film resistor array, Fig. 2 is a plan view of an embodiment of the present invention, and Fig. 3 is a plan view of a conventional thick film resistor array.
FIG. 4, which is a cutaway view taken along line A-A' in the figure, is an explanatory diagram of a manufacturing method according to an embodiment of the present invention. 1: Ceramic substrate, 2: Electrode, 3: Thick film resistor, 11: Ceramic substrate, 12: First layer conductor,
12': electrode part of first layer conductor, 13: insulating layer,
14: Second layer conductor, 15: Thick film resistor, 15':
Individual thick film resistor, 18: Center between individual thick film resistors.

Claims (1)

[Claims] 1. A thick film resistor array in which thick film resistors and their electrode conductors are formed on a substrate by a thick film printing method, including a plurality of first layers provided in two rows on the substrate. Provided at least on the conductor and other parts other than the ends of the first layer conductor, and on a predetermined portion of the substrate surface adjacent to each of the first layer conductors along the column direction of each of the first layer conductors. a plurality of second layer conductors provided on the insulating layer on the predetermined portion of the substrate surface and facing each of the first layer conductors at a predetermined distance; and a plurality of thick film resistors provided to connect each of the first layer conductors facing each other and each of the second layer conductors on an insulating layer, and the first layer conductor and the insulating layer. The second layer conductors on the top are both arranged in a staggered manner, and the first layer conductors and the second layer conductors on the insulating layer are arranged adjacent to each other and alternately in the lateral direction. Features a thick film resistor array. 2. In a method for manufacturing a thick film resistor array in which thick film resistors and their electrodes are formed on a substrate by a thick film printing method, a plurality of first layer conductors are arranged in two staggered rows on the substrate. a first step in which exposed portions are provided at the ends of the plurality of first layer conductors, and an insulating layer is deposited on the upper surfaces of the other portions; a third step of providing a second layer conductor on the insulating layer at a predetermined distance on the vertical extension line of each of the plurality of first layer conductors; A fourth step of integrally depositing a thick film resistor so that the end of the first layer conductor and the end of the second layer conductor are connected; and then laser beam or dicing. 3. Method 3 of manufacturing a thick film resistor array, comprising a fifth step of separating and forming the thick film resistor into individual resistors by cutting with a saw. The insulating layer corresponds to each column of the first layer conductor. 3. The method of manufacturing a thick film resistor array according to claim 2, wherein the thick film resistor array is deposited in a strip shape.