JPS59204201A - Thick film resistor array and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Technical Field) The present invention relates to a thick film resistor play and a method for manufacturing the same, and more particularly, a thick film resistor play that allows resistors to be arranged in high density and a method for manufacturing the same. It is related to.

(Prior Art) FIG. 1 is a plan view illustrating the configuration of a conventional thick film resistor array, in which 1 is a ceramic substrate, 2 is an electrode, and 3 is a thick film resistor. As shown in the figure, a single layer structure is formed on the ceramic substrate 1 using the thick film printing method so that the electrodes 2, 2 are connected at both ends 2', 2' of the thick film resistor 3. It had a structure in which a plurality of them were adhered and arranged in a horizontal direction.

However, in such a configuration using the thick film printing method, the pitch between adjacent conductors, as shown in 4 in the figure, can only be achieved at around 0.2 Inm, which is difficult to achieve in order to miniaturize electronic devices. The drawback is that it is difficult to further increase the density of the resistor array due to the thick film.

(Object of the invention) The object of the present invention is to solve the above-mentioned drawbacks,
To obtain a thick film resistor array and a method for manufacturing the same, characterized in that both electrodes of the thick film resistor are constructed so as to have a two-layer structure, the electrodes of each layer are drawn out, and the arrangement is made denser. This will be explained in detail below with reference to the drawings.

(Structure of the Invention) A JY film resistor and its electrodes are formed on a substrate by a thick film printing method, and a first layer conductor provided on the substrate and the first layer conductor are formed on the substrate by a thick film printing method.
A thick film resistor formed by connecting a second layer conductor provided on the substrate/ζ insulating layer on the vertical extension line of the layer conductor and a second layer conductor provided on the insulating layer provided on the substrate and a first layer conductor provided on the substrate on the vertical extension line of the second layer conductor, and a plurality of second thick film resistors are arranged adjacent to each other in the horizontal direction. The present invention is composed of a thick film resistor array constructed as shown in FIG.

(Embodiment) FIG. 2 is a plan view illustrating the configuration of an embodiment of the present invention. FIG. 3 is a cutaway view taken along line A-A' in FIG. Fourth
The figure is an explanatory diagram of a manufacturing method according to an embodiment of the present invention.

In the figure, 11 is a ceramic substrate, 12 is a first layer conductor,
13 is an insulating layer, 14 is a second layer conductor, 15 is a thick film resistor,
16 is a first thick film resistor, and Noah is a second thick film resistor.

After forming a first layer conductor 12 as an electrode on one side of a thick film resistor 15 on a ceramic substrate 12 in a staggered manner by a thick film printing method, as shown in the first step of FIG. As shown in the second step, an insulating layer 13 of crystallized glass is integrally formed on the first layer conductor J2 by a thick film printing method. At this time, the electrode portion 12' of the first layer conductor 12 is exposed. Next, by using a thick film printing method, as an electrode on the other side of the thick film resistor 15, an electrode is formed on the vertical extension line of the first layer conductor 12 so as to correspond to the first layer conductor 12, as shown in the third step. A second layer conductor 14 is formed on the insulating layer 13.

Next, as shown in the fourth step, the thick film resistor 15 is integrally connected to the electrode portion of the first layer conductor 12 and the electrode portion of the second layer conductor 14 by a thick film printing method. Cover the entire surface.

Next, as shown in the fifth step, the thick film resistor 15 that has been integrally adhered to the entire surface is separated into individual resistors using a laser beam or cutting tool cutting method, and then the thick film resistor 15 is separated into individual resistors and placed on the substrate. A first thick film resistor 16 formed by connecting the provided first layer conductor 12 and the second layer conductor 13 on the insulating layer 13 provided on the substrate on the vertical extension line of the first layer conductor 12. And the board.”
A second thick film resistor 17 is formed by connecting a second layer conductor on the insulating layer provided on the second layer and a first layer conductor provided on the substrate on the vertical extension line of the second layer conductor. By arranging several bales adjacent to each other, a thick film resistor array could be manufactured.

In addition, in the above cutting method, the cutting width at the center 16 between each individual resistor is approximately 20μ for both laser beam and Guisingon. n
It was about. Further, if the resistance value needs to be adjusted, trimming can be performed using a laser trimming device.

Thus, since this embodiment has the above configuration, the pitch 4 between adjacent conductors was approximately 0.2% in the conventional thick film resistor array shown in FIG. Since pitch 2o is about 0.2%, pitch 21
is about half of 0.01%, making it possible to achieve high density thick film resistor arrays.

(Effect of the invention) As explained in detail above, the electrodes of the thick film resistor array are
By forming a layered structure, the pitch of the thick film resistors can be reduced to about half that of a conventional one, so that a high-density thick film resistor array can be formed.

The way the trench electrodes are taken out is that the first layer conductor is arranged in a staggered manner and the second layer conductor is placed on the insulating layer, so the electrode of any thick film resistor has the first layer conductor on one side and the second layer conductor on the other side. Therefore, there is an effect that the variation in resistance value can be reduced.

In addition, the present invention has a two-layer structure for the electrodes of the thick film resistor array, with the first layer conductors arranged in a staggered manner and the second layer conductors placed on the insulating layer. Since it can be formed, it has the advantage that it can be used for chip resistors, thick film hybrid ICs, and the like.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a conventional thick film resistor array, FIG. 2 is a plan view of an embodiment of the present invention, and FIG. 3 is A-A' in FIG.
FIG. 4 is an explanatory diagram of a manufacturing method according to an embodiment of the present invention. 1. Ceramic substrate, 2: Electrode, 3: Thick film resistor, 11
: Ceramic, substrate, 12. 1st layer conductor, 13: insulation layer,
14: Second layer conductor, l 5: I! j membrane resistor, 16:
1st thick film resistor, 17: second thick film resistor. Figure 1 Figure 2 11 Figure 3

Claims (1)

[Claims] ``A thick film resistor array in which thick film resistors and their electrodes are formed on a substrate using a thick film printing method, comprising: a first layer conductor provided on a substrate; A first thick film resistor formed by connecting a second layer conductor on an insulating layer provided on a substrate on a vertical extension line of the layer conductor, and a second layer conductor on an insulating layer provided on the substrate. A plurality of second thick film resistors provided on the substrate on the vertical extension line of the second layer conductor and connected to the first layer conductor are arranged in a horizontal direction adjacent to each other. A thick film resistor array characterized in that it is configured as follows. 2. Substrate" In a method for manufacturing a thick film resistor array in which thick-film resistors and their electrodes are formed on a substrate by thick film printing, a plurality of first layer conductors are formed on a substrate in a predetermined manner. A first step of arranging the plurality of first layer panels adjacent to each other in a staggered manner at intervals equal to the distance; a second step of integrally depositing an insulating layer; and then a second step of depositing a second layer on the insulating layer at a predetermined distance on the vertical extension line of each of the plurality of first layer conductors. A third step of providing a conductor, and then connecting the ends of the plurality of first layer conductors and the second
The fourth step is to integrally apply the thick film resistor so that the ends of the layer conductor are connected to each other, and then the thick film resistor is individually attached using a cutting method using a laser beam or a cutting tool. A method for manufacturing a thick-film resistor asoy, which comprises a fifth step of forming a resistor into sections 1.