JPH05121855A - Manufacture of ceramic insulating board for electronic parts component - Google Patents

Abstract

PURPOSE:To improve the accuracy in the length dimension and the width dimension of an insulating board in the case of manufacturing the ceramic insulating board by breaking a ceramic raw material along a plurality of scribe grooves. CONSTITUTION:When carving a plurality of scribe grooves 3 and 4 in a ceramic raw material board 2, each scribe groove 3 and 4 is carved leaving scribe free parts 5 and 6 with narrow dimensions S's at the sections contiguous to each side face 2a, 2b, 2c, and 2d of the ceramic raw material board 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a thermal print head or a hybrid integrated circuit, in which a glaze layer or various wiring circuits or resistive elements are formed on the surface by applying and firing a paste. The present invention relates to a method for manufacturing an insulating substrate.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 5, an insulating substrate made of ceramics used for electronic parts such as a thermal print head or a hybrid integrated circuit has been used.
Of the ceramic material board 2 are manufactured by arranging a plurality of the same and connecting them, and the back surface of the ceramic material board 2 is intermittently or continuously irradiated with a laser beam, so that the ceramic material board 2 is connected to each insulating substrate 1 As shown in FIG. 6 and FIG. 7, the scribe grooves 3 and 4 for breaking each of the side end surfaces 2a, 2b, 2c of the ceramic material plate 2 are formed.
It is engraved so as to extend from 2d, and then a glaze layer or a paste for various wiring circuits or various elements is applied to the surface of the ceramic material plate 2 and then fired at a high temperature in a furnace, then, As shown in FIG. 8, the ceramic material plate 2 is manufactured by breaking each insulating substrate 1 along the scribe grooves 3 and 4.

[0003]

By the way, in the conventional manufacturing method, when the groove depth H of each of the scribe grooves 3, 4 engraved on the back surface of the ceramic material plate 2 is increased, the ceramic material plate 2 is formed. When breaking along the scribe grooves 3 and 4, the ceramic material plate 2 is
Since it is possible to break the ceramic material plate 2 into a state close to a right angle with respect to both front and back surfaces, it is possible to reduce variations in the length dimension L and the width dimension W of the insulating substrate 1 and to reduce the size of each insulating substrate 1. The dimensional accuracy of the length dimension L and the width dimension W can be improved.

However, on the other hand, on the other hand, each scribe groove 3, 4
When the groove depth H is increased, when the glaze layer or the conductive paste for various wiring circuits is applied and then fired at a high temperature in the furnace, the ceramic material plate 2 expands and contracts due to heat, Each of the scribe grooves 3 and 4 has a respective side end surface 2a, 2 of the ceramic material plate 2.
Since it extends from b, 2c, and 2d, the ceramic material plate 2 has a problem that cracks or cracks frequently occur along the scribe grooves 3 and 4.

Further, when the groove depth H of each of the scribe grooves 3 and 4 is made shallow, cracks or cracks along the scribe grooves 3 and 4 are prevented from occurring in the ceramic material plate 2 during the firing of the paste. However, on the other hand, when the ceramic material plate 2 is broken along the scribe grooves 3 and 4, the ceramic material plate 2 is shown in FIG. Alternatively, as indicated by the chain double-dashed line B, the ceramic material plate 2 is broken in a state of being inclined with respect to both the front and back surfaces, so that the dimensions of the length dimension L and the width dimension W of each insulating substrate 1 There is a problem that the variation becomes large and the dimensional accuracy of the length dimension L and the width dimension W in each insulating substrate 1 is reduced.

An object of the present invention is to provide a manufacturing method which does not cause such a problem in manufacturing an insulating substrate.

[0007]

In order to achieve this technical object, the present invention produces a ceramic material plate in which a plurality of insulating substrates are connected to each other, and the ceramic material plate is provided with the ceramic material plate. A plurality of scribe grooves that break for each insulating substrate are engraved by irradiation with a laser beam, and then the ceramic material plate is coated with a paste for glaze layer or various wiring circuits or various elements and then baked, and then In the method for manufacturing an insulating substrate in which the ceramic material plate is broken along each scribe groove for each insulating substrate, each scribe groove is formed in a portion adjacent to each side end surface of the ceramic material plate. , I decided to engrave with a narrow scribed groove-free part.

[0008]

[Operation] When engraving a plurality of scribe grooves on the surface of the ceramic material plate for breaking the ceramic material plate for each insulating substrate, each scribe groove is formed on the surface of the ceramic material plate as described above. Since the portion adjacent to the side end surface is engraved with a narrow scribe groove-free portion left, the portion of the ceramic material plate adjacent to each side end surface thereof is not divided by the scribe grooves. Since the scribe groove-less portion is integrally continuous, even if the groove depth of each scribe groove is increased, baking is performed after applying a glaze layer or a paste for various wiring circuits or various elements. At this time, it is possible to reliably prevent the ceramic material plate from being cracked or cracked along the scribe grooves.

On the other hand, since the scribe groove-less portion adjacent to each side end surface of the ceramic material plate has a narrow dimension, when the ceramic material plate is broken along each scribe groove for each insulating substrate, You can easily break at the same time.

[0010]

Therefore, according to the present invention, it is possible to surely prevent cracks or cracks along the scribed grooves from being formed in the ceramic material plate during firing of the glaze layer or various wiring circuits or various element pastes. Since the groove depth of each of the scribe grooves can be increased under the condition that the above-mentioned can be achieved, it is possible to reduce the variation in the length dimension and the width dimension of each insulating substrate, and to reduce the length of each insulating substrate. It has an effect that the dimensional accuracy of the dimension and the width dimension can be significantly improved as compared with the case of the conventional manufacturing method.

[0011]

Embodiments of the present invention will now be described with reference to the drawings (FIGS. 1 to 4).
Will be described. In this figure, reference numeral 2 indicates a ceramic material plate manufactured by connecting a plurality of insulating substrates 1 to each other.
When engraving the scribe grooves 3 and 4 for breaking the ceramic material substrate 2 for each insulating substrate 1 by irradiating the laser beam intermittently or continuously, the scribe grooves 3 and 4 are As shown in FIGS. 1 and 2, each side end surface 2a, 2b, 2c, 2d of the ceramic material plate 2 is reached without reaching each side end surface 2a, 2b, 2c, 2d of the ceramic material plate 2.
The scribed groove-free portions 5 and 6 having a narrow dimension S are left in the portion adjacent to the above.

Next, a glaze layer or a paste for various wiring circuits or various elements is applied to the surface of the ceramic material plate 2 and then fired at a high temperature in a furnace,
Next, the ceramic material plate 2 is broken for each insulating substrate 1 along the scribe grooves 3 and 4 as shown in FIG. When firing the glaze layer or the various wiring circuits or the paste for various elements, each side end surface 2a of the ceramic material plate 2 is
The portions adjacent to 2b, 2c, and 2d are not divided by the scribing grooves 3 and 4 and are integrally continuous in the scribing groove-less portions 5 and 6, respectively. Even if the groove depth H of 4 is increased, it is possible to reliably prevent the ceramic material plate 2 from cracking or cracking along the scribe grooves 3 and 4.
Each side end surface 2a, 2b of the ceramic material plate 2,
Since the scribed groove-free portions 5 and 6 adjacent to 2c and 2d have a narrow dimension S, when the ceramic material plate 2 is broken along the scribed grooves 3 and 4 for each insulating substrate 1, at the same time, You can break.

According to experiments conducted by the present inventor, it is preferable that the dimension S of each of the scribed grooveless portions 5 and 6 is within 2 mm, and the groove depth H of each scribed groove 3 and 4 is The thickness of the ceramic material plate 2 can be set to two fifths or more, and the accuracy of the length dimension L and the width dimension W of the insulating substrate 1 can be significantly improved.

[Brief description of drawings]

FIG. 1 is a perspective view of a ceramic material plate according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective view of a main part in FIG.

FIG. 3 is an enlarged sectional view taken along line III-III of FIG.

FIG. 4 is a perspective view showing a state in which the ceramic material plate of FIG. 1 is broken for each insulating substrate.

FIG. 5 is a perspective view of a ceramic material plate according to a conventional example.

FIG. 6 is an enlarged perspective view of a main part in FIG.

7 is an enlarged sectional view taken along line VII-VII of FIG.

FIG. 8 is a perspective view showing a state where the ceramic material plate of FIG. 5 is broken for each insulating substrate.

[Explanation of symbols]

 1 Insulating substrate 2 Ceramic material plate 3,4 Scribing groove 5,6 No scribing groove

Claims (1)

[Claims] 1. A ceramic material plate in which a plurality of insulating substrates are connected to each other is produced, and a plurality of scribe grooves for breaking the ceramic material plate for each insulating substrate is irradiated with a laser beam. Engraved, then apply glaze layer or paste for various wiring circuits or various elements to the ceramic material plate, and then burn, and then insulate the ceramic material plate along each scribe groove with each insulation. In the method of manufacturing an insulating substrate that breaks for each substrate, it is possible to engrave each scribe groove in a portion adjacent to each side end surface of the ceramic material plate, leaving a scribe groove-less portion having a narrow size. A method of manufacturing a ceramic insulating substrate for electronic parts, which is characterized.