JPH04241401A - Manufacture of electronic parts equipped with ceramic insulating substrate - Google Patents

Abstract

PURPOSE:To reduce the fraction defective when manufacturing electronic parts which are constituted by baking a resistor, etc., at the surface of a ceramic insulating substrate. CONSTITUTION:A resistor, etc., are made in the order of manufacturing a ceramic material board 2, making a resistor film 5, etc., at the ceramic material board 2, making nicks 3 and 4 for breaking at the ceramic material board 2, and breaking it into every insulating board 1 along the nicks 3 and 4. There never occurs breaking of cracks in the ceramic material board 2 during the baking of the resistor film 5, etc., and also by deepening the dimensions of the depths of the nicks 3 and 4 and making the end face of an insulating substrate 1 in the condition that it crosses the topside of the insulating substrate 1 at approximately right angles, the dimension accuracy of the insulating substrate 1 can be improved.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention is applicable to chip resistors, chip capacitors, thermal heads, or hybrid I
The present invention relates to a method of manufacturing an electronic component in which elements such as resistors, circuits, etc. are formed on the surface of a ceramic insulating substrate by coating and firing, as shown in FIG.

0002

BACKGROUND OF THE INVENTION Among these electronic components equipped with a ceramic insulating substrate, a chip resistor R is conventionally described in, for example, Japanese Unexamined Patent Publication No. 2-222103, and is manufactured by a process as shown in FIG. It was later mass-produced. That is, a ceramic material plate 2 in which a large number of insulating substrates 1 are arranged and connected in the vertical and horizontal directions is separated by a vertical line 3 and a horizontal line 4 for breaking the ceramic material plate 2 for each insulating substrate 1. Each insulating substrate 1 in this ceramic material plate 2 is manufactured by firing in a pre-formed state.
Each resistor film 5 is formed by applying a paste-like resistor on the upper surface by screen printing and firing it in a furnace.Then, the ceramic material plate 2 is attached to each bar-shaped ceramic plate along each horizontal line 4. Each raw ceramic material plate 2a is broken, and side electrodes 6 for each resistive film 5 are applied and formed on both edges along the longitudinal direction of each of these rod-shaped ceramic material plates 2a. A break was made for each insulating substrate 1 along the vertical line 3.

However, in this method of firing the ceramic material plate 2 with the vertical grain lines 3 and the horizontal grain lines 4 formed in advance, shrinkage occurs when the ceramic material plate 2 is fired. Since the planar shape of each insulating substrate is deformed and the dimensional accuracy is significantly reduced, the resistive film 5
When printing, there is a problem in that the position of the resistive film 5 frequently shifts.

Therefore, recently, as shown in FIG. 5, a ceramic material plate 2 is produced by firing without vertical and horizontal lines 3 and 4, and the surface of the ceramic material plate 2 after firing is By irradiating the laser continuously or intermittently, vertical and horizontal lines 3 and 4 extending linearly or perforated are formed, and then a resistive film is formed on each insulating substrate 1 in the ceramic material plate 2. 5 painting process, baking process of resistive film 5, forming process of side electrode 6, each insulating substrate 1
I try to perform the process of breaking to .

[0005]

[Problems to be Solved by the Invention] With the manufacturing method shown in FIG. 5, each insulating substrate 1 can be accurately formed to have a predetermined planar shape and predetermined dimensions, so that the position of the resistive film 5 can be easily determined when printing the resistive film 5. Although it is possible to prevent misalignment, on the other hand, since the ceramic material plate 2 is also heated at a high temperature when the resistive film 5 is fired and formed, the depth dimension H of the vertical and horizontal lines 3 and 4 must be set deep. When formed, there is a problem in that cracks and cracks occur frequently in the ceramic material plate 2 along the vertical and horizontal lines 3 and 4 due to thermal stress during firing of the resistive film 5. Depth dimension H at line of sight 3 and 4
had to be formed to have a shallow dimension of about one-third of the thickness T of the ceramic material plate 2.

However, if the depth dimension H of the vertical and horizontal lines 3 and 4 is shallow, when breaking the ceramic material plate 2 into each rod-shaped ceramic material plate 2a, and when breaking each rod-shaped ceramic material plate 2a into each insulating substrate 1. When breaking each time, the ceramic material plate 2 and the rod-shaped ceramic material plate 2a do not break along the direction perpendicular to the surface of each insulating substrate 1, and as shown in FIG. The phenomenon of cracking along the inclined direction occurs frequently, and as a result, the shape of the end surface 1a of each insulating substrate 1 after breaking becomes irregular, in other words, the dimensional accuracy of the insulating substrate 1 decreases, This causes problems in the formation of the side electrodes 6 and makes it impossible to attach them to the printed circuit board, resulting in a high rate of defective products.

A similar problem arises when manufacturing chip-type capacitors, thermal heads, hybrid ICs, etc. using a ceramic material plate with a large area, firing elements and circuits on it, and then breaking it. This occurred in the general manufacturing of electronic components. SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing an electronic component including a ceramic insulating substrate with a significantly reduced defect rate.

[0008]

[Means for Solving the Problems] In order to achieve this object, the present invention manufactures a ceramic material plate in which a large number of insulating substrates are aligned and connected, and the upper surface of each insulating substrate in this ceramic material plate is , elements such as resistors, circuits, etc. are formed by coating and firing, and then, the ceramic material plate is formed with lines for breaking each insulating substrate by laser irradiation. , the structure is such that each insulating substrate is broken along each of the above-mentioned lines.

[0009]

[Function/Effect] In this way, if the configuration is such that elements such as resistors, circuits, etc. are formed on the ceramic material plate by coating and firing, and then the lines for breaking are formed, each insulating substrate on the ceramic material plate is In the process of firing elements, circuits, etc., it is possible to reliably prevent cracks and cracks from occurring in the ceramic material plate, and also to prevent large thermal stress from occurring in the ceramic material plate after forming each line. Therefore, make the depth of each line sufficiently deep, and break the ceramic material board for each insulating board with the end face of each insulating board approximately perpendicular to the top surface of the insulating board. This makes it possible to significantly improve the dimensional accuracy of each insulating substrate after breaking. Further, since the laser used as a means for forming the lines on the ceramic material plate is extremely narrow, elements such as resistors, circuits, etc. are not damaged by the heat of the laser.

Therefore, according to the present invention, it is possible to reliably prevent the occurrence of cracks or cracks in the ceramic material board when forming elements, circuits, etc. on the ceramic material board by firing, and the size of the insulating substrate after the breakage can be reduced. The combination of three factors: the ability to significantly improve accuracy and the ability to form a line of sight for breaking without damaging resistors, etc., is achieved by firing resistors and other elements and circuits on an insulating substrate. It has the effect of mass producing electronic components with a significantly reduced defective rate.

[0011]

[Embodiment] Next, an embodiment in which the present invention is applied to the manufacture of a chip type resistor will be described based on the drawings (FIGS. 1 and 2). In the present invention, first, a ceramic material plate 2 in which insulating substrates 1 are arranged vertically and horizontally and connected is manufactured by molding and firing in a furnace, and each insulating substrate in the ceramic material plate 2 after firing is formed. A resistive film 5 is formed by applying a paste-like resistor to the upper surface of the resistor 1 by screen printing or the like and then firing it in a furnace.

Next, vertical lines 3 and horizontal lines 4 for breaking each insulating substrate 1 are formed on the surface of the ceramic material plate 2 by continuous irradiation with a laser such as a carbon dioxide laser to form straight lines. Alternatively, it may be formed into perforations by intermittent laser irradiation. In this case, the depth dimension of the vertical and horizontal lines 3 and 4 is a deep dimension that is more than half the thickness dimension T of the ceramic material plate 2 (for example, about 9/10 of the thickness dimension T of the ceramic material plate 2). and also,
When forming the vertical and horizontal lines 3 and 4 in the form of perforations, the laser irradiation interval is set to 150 microns or less.

Then, the ceramic material plate 2 is placed upside down on an elastic plate made of rubber or the like, and this is pressed with a roller whose axis is parallel to the horizontal line 4, or
The ceramic material plate 2 was inserted between two parallel rollers whose outer peripheral surfaces were stretched with an elastic material such as rubber, with the horizontal line 4 parallel to the axes of both rollers, and the ceramic material plate 2 was sandwiched between the rollers. By rotating both rollers in this state, the ceramic material plate 2 is broken along each horizontal line 4 into each bar-shaped ceramic material plate 2a. Then, paste-like electrodes are coated on both edges along the longitudinal direction of each rod-shaped ceramic material plate 2a and dried to form side electrodes 6. Next, each rod-shaped ceramic material plate 2a is
By breaking each insulating substrate 1 along each vertical line 4, a single chip resistor R is obtained.

In this manufacturing process, the resistive film 5 is formed by firing so that the ceramic material plate 2 has vertical and horizontal lines 3,
Since this is carried out before forming the resistive film 4, no cracks or cracks will occur in the ceramic material plate 2 when the resistive film 5 is fired and formed.
Since no large thermal stress is generated in the ceramic material plate 2 after forming the vertical and horizontal lines 3 and 4, the depth of the vertical and horizontal lines 3 and 4 can be formed deep. The end surface 1a of each insulating substrate 1 can be formed to be substantially perpendicular to the upper surface of the insulating substrate 1, and the dimensional accuracy of each insulating substrate 1 after breaking can be significantly improved.

The above embodiment was applied to the manufacture of a chip type resistor, but the present invention can be applied to the manufacture of a chip type resistor, but the present invention can be applied to a chip type capacitor, a thermal head, or a hybrid IC, in which a resistor or the like is formed on the surface of an insulating substrate. Needless to say, the present invention can be applied to the production of electronic components in general, such as firing elements and circuits.

[Brief explanation of the drawing]

FIG. 1 is a diagram schematically showing the steps for manufacturing a chip resistor according to the present invention.

FIG. 2 is an enlarged sectional view taken along line II-II in FIG. 1;

FIG. 3 is a sectional view taken along line III-III in FIG. 5;

FIG. 4 is a diagram schematically showing a conventional manufacturing process of a chip resistor.

FIG. 5 is a schematic diagram illustrating an improved version of the conventional manufacturing process for chip resistors.

[Explanation of symbols]

R Chip resistor as an example of electronic component 1 Insulating substrate 2 Ceramic material plate 3 Vertical line 4 Horizontal line 5 Resistive film 6 Side electrode

Claims (1)

[Claims] Claim 1: A ceramic material plate is produced in which a large number of insulating substrates are arranged and connected, and elements such as resistors, circuits, etc. are coated and fired on the top surface of each insulating substrate in this ceramic material plate. forming the ceramic material plate, and then forming the ceramic material plate,
A ceramic product characterized in that the ceramic material plate is formed with a laser irradiation to form lines for breaking each insulating substrate, and then breaks are made for each insulating substrate along each of the lines. A method for manufacturing electronic components with an insulating substrate.