JP2003340793A - Board dividing apparatus - Google Patents

Board dividing apparatus

Info

Publication number
JP2003340793A
JP2003340793A JP2002143069A JP2002143069A JP2003340793A JP 2003340793 A JP2003340793 A JP 2003340793A JP 2002143069 A JP2002143069 A JP 2002143069A JP 2002143069 A JP2002143069 A JP 2002143069A JP 2003340793 A JP2003340793 A JP 2003340793A
Authority
JP
Japan
Prior art keywords
substrate
dividing
board
force
pressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002143069A
Other languages
Japanese (ja)
Inventor
Toru Ezaki
徹 江崎
Nobuyuki Minami
信之 南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiheiyo Cement Corp
Original Assignee
Taiheiyo Cement Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiheiyo Cement Corp filed Critical Taiheiyo Cement Corp
Priority to JP2002143069A priority Critical patent/JP2003340793A/en
Publication of JP2003340793A publication Critical patent/JP2003340793A/en
Withdrawn legal-status Critical Current

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  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a board dividing apparatus capable of vertically and sharply dividing a board along a cutting line without breaking and cracking. <P>SOLUTION: The board dividing apparatus comprises a dividing force giving member 23 for giving a dividing force to the entire width of the board 33, a guiding plate 29 for guiding the board to the dividing force giving member and having a bearing part 31 for supporting the board along the cutting line S when the board is divided, a stopper member 25 for restricting the position of the board so that the cutting line matches with the bearing part when the board is guided, and a pressing member 27 for cooperating with the guiding plate, pressing the entire width of the board and having a pressing end 41 located along the cutting line when the board is divided. <P>COPYRIGHT: (C)2004,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、予め分割線を有す
る基板を、当該分割線に沿って所定の大きさに分割する
ための基板分割装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate dividing device for dividing a substrate having a dividing line in advance into a predetermined size along the dividing line.

【0002】[0002]

【従来の技術】従来より、分割線を有するセラミック基
板を各分割線に沿って割り、セラミック電子部品用など
の板状部品を得るための基板分割装置が存在している。
例えば、その一つに、特開平5−124031号公報に
開示されたものがある。この基板分割装置は、図6に示
されるように、一対の平行に延びるマスター側搬送ガイ
ド1を備え、分割対象であるセラミック基板2は、かか
る搬送ガイド1の上にスライド可能に載置される。搬送
ガイド1の下流側には、基板2のスライド量を規制する
ためのストッパ3が設けられている。また、ストッパ3
の上流側には、マスター側チャック4及びモジュール側
チャック5が設けられている。なお、基板2には、所定
の大きさに分割が促されるよう、溝からなる分割線Sが
予め形成されている。
2. Description of the Related Art Conventionally, there is a substrate dividing device for dividing a ceramic substrate having a dividing line along each dividing line to obtain a plate-shaped component for ceramic electronic components.
For example, one of them is disclosed in Japanese Patent Laid-Open No. 5-124031. As shown in FIG. 6, this substrate dividing apparatus includes a pair of master-side conveyance guides 1 extending in parallel, and a ceramic substrate 2 to be divided is slidably placed on the conveyance guide 1. . A stopper 3 for restricting the amount of slide of the substrate 2 is provided on the downstream side of the transport guide 1. In addition, the stopper 3
A master-side chuck 4 and a module-side chuck 5 are provided on the upstream side of. A dividing line S formed of a groove is formed in advance on the substrate 2 so as to promote the division into a predetermined size.

【0003】かかる基板分割装置においては、まず、基
板2がストッパ3に突き当たるまでスライドされ、それ
により基板2の所定の分割線Sがマスター側チャック4
及びモジュール側チャック5の間に位置する。その状態
で、両チャック4及び5を閉じることにより、基板2を
上下から挟んで固定する。さらに、マスター側チャック
4及びモジュール側チャック5を相互に反対方向に揺動
せることによって、基板2における両チャック4及び5
の間の部分に分割力を付与し、その分割力が分割線Sに
集中することで基板2を分割させていた。
In such a substrate dividing apparatus, first, the substrate 2 is slid until it abuts on the stopper 3, whereby the predetermined dividing line S of the substrate 2 is moved to the master side chuck 4.
And between the module-side chucks 5. In that state, by closing both chucks 4 and 5, the substrate 2 is sandwiched and fixed from above and below. Further, by swinging the master side chuck 4 and the module side chuck 5 in mutually opposite directions, both chucks 4 and 5 on the substrate 2 are moved.
The dividing force is applied to the portion between the two, and the dividing force is concentrated on the dividing line S to divide the substrate 2.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上述し
た従来の基板分割装置においては、マスター側チャック
4及びモジュール側チャック5はそれぞれ、基板2にお
ける幅方向外側端部のみを把持していたため、必ずしも
分割力が基板2の分割線Sに均一に作用するとは限らな
い。このため、基板2が分割線Sに沿って精度よく割れ
ず、かけやクラックが生じたり、あるいは、基板2の上
面と下面との間で垂直に割れず斜めに割れるなどの場合
があった。
However, in the above-described conventional substrate dividing apparatus, the master-side chuck 4 and the module-side chuck 5 each hold only the outer end in the width direction of the substrate 2, so that the division is not always performed. The force does not always act on the dividing line S of the substrate 2 uniformly. For this reason, the substrate 2 may not be accurately cracked along the dividing line S, and may be cracked or cracked, or may be split between the upper surface and the lower surface of the substrate 2 obliquely without being vertically cracked.

【0005】従って、本発明は、このような従来の問題
点に鑑みてなされたものであり、かけやクラックが生じ
ることなく基板を分割線に沿って垂直に割ることができ
る基板分割装置を提供することを目的とする。
Therefore, the present invention has been made in view of the above conventional problems, and provides a substrate dividing device capable of vertically dividing a substrate along a dividing line without causing cracks or cracks. The purpose is to do.

【0006】[0006]

【課題を解決するための手段】上述の目的を達成するた
め、本発明は、少なくとも一つの分割線を有する基板を
該分割線に沿って分割する基板分割装置において、前記
基板にその全幅に亙って分割力を付与する分割力付与部
材と、前記分割力付与部材に向けて前記基板を案内し、
分割時に前記分割線に沿って該基板を支持するための支
点部を備えた案内板と、前記基板の案内時に前記分割線
と前記支点部とが揃うように該基板の位置を規定するス
トッパ部材と、前記案内板と協働して前記基板をその全
幅に亙って押え、分割時に前記分割線に沿って位置する
押え端部を有する押え部材と、を備えたことを特徴とす
る。
In order to achieve the above-mentioned object, the present invention provides a substrate dividing apparatus for dividing a substrate having at least one dividing line along the dividing line, wherein the substrate has a full width. A dividing force giving member for giving a dividing force, and guiding the substrate toward the dividing force giving member,
A guide plate having a fulcrum portion for supporting the substrate along the dividing line at the time of division, and a stopper member for defining the position of the substrate so that the dividing line and the fulcrum portion are aligned when guiding the substrate. And a pressing member that cooperates with the guide plate to press the substrate over its entire width and that has a pressing end portion that is located along the dividing line at the time of division.

【0007】好適には、前記分割力付与部材及び前記ス
トッパ部材は、前記基板の表面及び案内方向前端面と当
接した状態で一体的に揺動することにより前記基板に分
割力を付与する。また、好適には、前記ストッパ部材
は、前記案内方向前端面と対向する側で且つ分割時の揺
動方向側において、分割された基板部分の排出を促進す
る逃がし面を有する。さらに、前記分割力付与部材及び
前記ストッパ部材はそれぞれ、前記基板の案内方向に垂
直及び平行に位置変更が可能であると好適である。
Preferably, the dividing force applying member and the stopper member apply a dividing force to the substrate by integrally swinging while being in contact with the surface of the substrate and the front end face in the guide direction. Further, preferably, the stopper member has a relief surface that promotes discharge of the divided substrate portion on the side facing the front end surface in the guide direction and on the swinging direction side during division. Furthermore, it is preferable that the dividing force applying member and the stopper member can be changed in position in a direction perpendicular to and parallel to the guiding direction of the substrate.

【0008】[0008]

【発明の実施の形態】以下、この発明の実施の形態に係
る基板分割装置を添付図面に基づいて説明する。図1
に、基板分割装置の概要を示す。基板分割装置11は、
装置の下部に設けられた固定台13と、固定台13の上
に設けられた筐体15とを備える。固定台13は、その
上部が水平方向から傾斜しており、それにより、筐体1
5を水平方向に対して傾けた状態で支持している。
BEST MODE FOR CARRYING OUT THE INVENTION A substrate dividing apparatus according to an embodiment of the present invention will be described below with reference to the accompanying drawings. Figure 1
An outline of the substrate dividing device is shown in FIG. The board dividing device 11
A fixed base 13 provided on the lower part of the apparatus and a housing 15 provided on the fixed base 13 are provided. The upper portion of the fixed base 13 is inclined from the horizontal direction, whereby the housing 1
5 is supported in a state of being inclined with respect to the horizontal direction.

【0009】筐体15内には、主に、駆動力を発生させ
る手段である電動モータ17と、基板の押えや分割など
を行なう各種可動部品を含んだ作用部19と、電動モー
タ17の駆動力を作用部19に所定のタイミングで伝達
するタイミング制御部21とが設けられている。
In the housing 15, an electric motor 17, which is a means for generating a driving force, an action portion 19 including various movable parts for holding and dividing the substrate, and a drive of the electric motor 17 are mainly provided. A timing control unit 21 that transmits the force to the action unit 19 at a predetermined timing is provided.

【0010】次に、図1、図2、図3に基づいて作用部
19の詳細について説明する。作用部19には、基板に
分割力を付与する分割力付与部材23と、基板の位置を
規定するストッパ部材25と、分割に際して基板を所定
位置に固定しておくための押え部材27と、基板を分割
力付与部材23へと案内・供給する案内板29とを備え
る。案内板29は、板状の部材であって、表面29a側
中央部に長手方向に沿って延びる案内溝29bを有す
る。この案内溝29bは、基板33を収容できるように
基板33と同じ幅を有する。また、案内板29は、水平
方向から傾斜する姿勢で筐体15に固定されている。こ
れにより、基板33は、案内板29の案内溝29bに沿
って自重により下方へスライドするようになっている。
案内板29の表面29a側の下辺部は、後述するように
分割時に基板33における分割線Sの部分を支持する支
点部31として機能する。
Next, the details of the operating portion 19 will be described with reference to FIGS. 1, 2 and 3. The acting portion 19 includes a dividing force applying member 23 for applying a dividing force to the substrate, a stopper member 25 for defining the position of the substrate, a holding member 27 for fixing the substrate at a predetermined position during division, and a substrate And a guide plate 29 for guiding and supplying the splitting force applying member 23. The guide plate 29 is a plate-shaped member, and has a guide groove 29b extending in the longitudinal direction at the center portion on the front surface 29a side. The guide groove 29b has the same width as the substrate 33 so that the substrate 33 can be accommodated therein. Further, the guide plate 29 is fixed to the housing 15 in a posture inclined from the horizontal direction. As a result, the substrate 33 slides downward along the guide groove 29b of the guide plate 29 by its own weight.
A lower side portion of the guide plate 29 on the front surface 29a side functions as a fulcrum portion 31 that supports a portion of the dividing line S on the substrate 33 at the time of division, as described later.

【0011】ストッパ部材25は、案内板29の下流側
に配置されており、案内板29により案内された基板3
3の下端面(案内方向前端面)33aとほぼ面接触する
ようなストッパ面25aを有する。ストッパ面25aと
基板33の下端面33aとの当接態様は、ストッパ面2
5aの全体が基板33の下端面33aの一部に当接する
ように設定されている。さらに、ストッパ部材25にお
ける裏面25b側(分割時の揺動方向側)で且つ基板3
3の下端面33aと対向する側には、逃がし面25cが
形成されている。逃がし面25cは、ストッパ面25a
と裏面25bとの間に位置し、ストッパ面25aに対し
て所定角度で傾斜している。逃がし面25cは分割され
た基板部分の落下を促すものであり、逃がし面25cの
ほぼ下方には、落下する基板部分を所定のルートで案内
するスロープ状の基板スライダー35(図1参照)が配
設されている。ストッパ部材25におけるストッパ面2
5aと反対側には、分割ピッチ調整用ハンドル37が接
続されている。図2に矢印Aで示されるように、このハ
ンドル37を回転させることによって、ストッパ部材2
5は、矢印Bで示されるように、案内板29の延長方向
すなわち基板33の案内方向と平行な方向に移動でき
る。
The stopper member 25 is disposed on the downstream side of the guide plate 29, and the substrate 3 guided by the guide plate 29.
3 has a stopper surface 25a which comes into substantially surface contact with the lower end surface (front end surface in the guiding direction) 33a. The contact state between the stopper surface 25a and the lower end surface 33a of the substrate 33 is determined by the stopper surface 2
The entire 5a is set so as to contact a part of the lower end surface 33a of the substrate 33. Further, on the back surface 25b side of the stopper member 25 (the swinging direction side at the time of division) and on the substrate 3
An escape surface 25c is formed on the side of the lower surface 3 that faces the lower end surface 33a. The relief surface 25c is the stopper surface 25a.
And the back surface 25b, and is inclined at a predetermined angle with respect to the stopper surface 25a. The escape surface 25c promotes the falling of the divided board portion, and a slope-like board slider 35 (see FIG. 1) for guiding the falling board portion along a predetermined route is arranged substantially below the escape surface 25c. It is set up. Stopper surface 2 of stopper member 25
A split pitch adjusting handle 37 is connected to the side opposite to 5a. By rotating this handle 37 as shown by an arrow A in FIG.
5 can move in a direction parallel to the extension direction of the guide plate 29, that is, the guide direction of the substrate 33, as indicated by arrow B.

【0012】分割力付与部材23は、その作用面23a
が基板33の表面33bにおける支点部31よりも下流
側部分と対向するように、配置されている。また、本実
施の形態では、分割力付与部材23の幅は、基板33を
その全幅に亙って覆うように基板33の幅の約1.5倍
の長さを有する。これにより、分割力付与部材23は、
後述する押え部材27と協同して分割力を基板33の分
割線Sに沿って均一に付与することができ、基板33の
一部分のみに応力が集中することを防止して、かけやク
ラックの発生を回避し基板33を上面から下面に亙って
垂直に分割する。なお、分割力付与部材23の幅は、基
板33の幅の約1.5倍に限定されるものではなく、基
板33をその全幅に亙って覆うように基板33に当接す
ることができる態様であれば、他の寸法でもよく、例え
ば、基板33と同一幅であってもよい。また、分割力付
与部材23における作用面23aと反対側には、厚み調
整用ハンドル39が接続されている。矢印Cに示される
ように、このハンドル39を回転させることによって、
分割力付与部材23は、矢印Dで示されるように、基板
の案内方向と垂直な方向に移動できる。さらに、分割力
付与部材23は、矢印Eで示されるように、ストッパ部
材25と一体的に(同角速度で)揺動するように支持さ
れている。かかる揺動動作は、電動モータ17の駆動力
により、本実施の形態では支点部31を中心軸として、
行われる。
The dividing force applying member 23 has an acting surface 23a.
Are arranged so as to face a portion of the surface 33b of the substrate 33 on the downstream side of the fulcrum portion 31. Further, in the present embodiment, the width of the dividing force applying member 23 is about 1.5 times the width of the substrate 33 so as to cover the substrate 33 over the entire width thereof. Thereby, the dividing force application member 23
The dividing force can be uniformly applied along the dividing line S of the substrate 33 in cooperation with a pressing member 27, which will be described later, and it is possible to prevent stress from concentrating only on a part of the substrate 33 and generate cracks or cracks. By avoiding the above, the substrate 33 is vertically divided from the upper surface to the lower surface. The width of the dividing force applying member 23 is not limited to about 1.5 times the width of the substrate 33, and it can be in contact with the substrate 33 so as to cover the entire width of the substrate 33. Other dimensions may be used, for example, the width may be the same as that of the substrate 33. Further, a thickness adjusting handle 39 is connected to the side of the dividing force applying member 23 opposite to the acting surface 23a. By rotating this handle 39, as shown by arrow C,
The dividing force applying member 23 can move in a direction perpendicular to the guiding direction of the substrate, as shown by an arrow D. Further, the dividing force applying member 23 is supported so as to swing integrally (at the same angular velocity) with the stopper member 25, as shown by an arrow E. This swinging operation is performed by the driving force of the electric motor 17 with the fulcrum portion 31 as the central axis in the present embodiment.
Done.

【0013】押え部材27は、分割力付与部材23の上
流に配置されている。押え部材27の押え面27aは、
案内板29の表面29aと平行に延びている。また、図
3に示されるように、押え部材27の幅は、基板33の
幅とほぼ同じに設定されており、これにより、押え部材
27は基板33をその全幅に亙って覆うように押さえ
る。押え面27aにおける下辺部は、案内板29におけ
る支点部31から表面29aに対して垂直に延びる仮想
面V(図2参照)上に位置し、すなわち、後述するよう
に分割時に基板33における分割線Sに沿って位置する
押え端部41として機能する。押え部材27は、図示し
ない弾性部材により常時、図2の矢印R方向にすなわち
案内板29に向けて付勢されていると共に、基板解放時
には、電動モータ17及びタイミング制御部21の作用
により、弾性力に抗して矢印U方向にすなわち案内板2
9から離隔する方向に引き上げられる。さらに、押え部
材27における押え面27aと反対側には、押え力調整
用ハンドル43が接続されている。矢印Fで示されるよ
うに、このハンドル43を回転させることによって、押
え部材27は、矢印Gで示されるように、基板の案内方
向と垂直な方向に移動できる。このハンドル43によっ
て調整される押え部材27の位置は、押え部材27が弾
性力に抗して最も案内面29aから離隔できる位置であ
り、この調整により押え部材27に作用する弾性力すな
わち押え力の設定が行なえる。
The pressing member 27 is arranged upstream of the dividing force applying member 23. The pressing surface 27a of the pressing member 27 is
It extends parallel to the surface 29a of the guide plate 29. Further, as shown in FIG. 3, the width of the pressing member 27 is set to be substantially the same as the width of the substrate 33, whereby the pressing member 27 presses the substrate 33 so as to cover the entire width thereof. . The lower side portion of the pressing surface 27a is located on an imaginary plane V (see FIG. 2) that extends perpendicularly to the surface 29a from the fulcrum portion 31 of the guide plate 29, that is, the dividing line on the substrate 33 at the time of division as described later. It functions as a presser end portion 41 located along S. The pressing member 27 is always urged by an elastic member (not shown) in the direction of arrow R in FIG. 2, that is, toward the guide plate 29, and when the substrate is released, the pressing member 27 is elastic by the action of the electric motor 17 and the timing control unit 21. In the direction of arrow U against the force, that is, the guide plate 2
It is pulled up in the direction away from 9. Further, a pressing force adjusting handle 43 is connected to the pressing member 27 on the side opposite to the pressing surface 27a. By rotating the handle 43 as shown by the arrow F, the pressing member 27 can move in the direction perpendicular to the guiding direction of the substrate as shown by the arrow G. The position of the pressing member 27 adjusted by the handle 43 is the position where the pressing member 27 can be separated most from the guide surface 29a against the elastic force, and the elastic force acting on the pressing member 27, that is, the pressing force, is adjusted by this adjustment. Can be set.

【0014】タイミング制御部21は、本実施の形態で
は複数のカム部材やリンク部材を有するものであり、電
動モータ17の駆動力を所定のタイミングで作用部19
の各部品に割り振り、これによって、押え部材27の押
え解放動作や、分割力付与部材23及びストッパ部材2
5の揺動・分割動作などの各種動作を実現する。
The timing control unit 21 has a plurality of cam members and link members in this embodiment, and the driving force of the electric motor 17 is applied to the action unit 19 at a predetermined timing.
Of the pressing force of the pressing member 27, the dividing force applying member 23 and the stopper member 2
Various operations such as rocking / splitting of 5 are realized.

【0015】次に、以上のように構成された基板分割装
置の動作について説明する。案内板29の案内溝29b
に基板33をセットする。このとき、押え部材27は基
板33の表面から十分離隔しうる解放位置まで引き上げ
られている。このため、基板33は、案内板29の傾斜
により、自重で下方にスライドし、基板33の下端面3
3aがストッパ部材25のストッパ面25aに突き当た
るところで、基板33のスライドは停止する。なお、本
実施の形態では、基板33の作用部19への移動をより
確実にするため、図示しない錘を基板33の上端面に作
用させている。
Next, the operation of the substrate dividing apparatus configured as described above will be described. Guide groove 29b of the guide plate 29
The substrate 33 is set on. At this time, the pressing member 27 is pulled up to a release position where it can be separated from the surface of the substrate 33. Therefore, the base plate 33 slides downward by its own weight due to the inclination of the guide plate 29, and the lower end surface 3 of the base plate 33.
When 3a abuts the stopper surface 25a of the stopper member 25, the sliding of the substrate 33 stops. In the present embodiment, a weight (not shown) acts on the upper end surface of the substrate 33 in order to ensure the movement of the substrate 33 to the action portion 19.

【0016】また、基板33の案内板29へのセット
後、あるいはセットに先立って、ストッパ部材25と分
割力付与部材23との位置の調整を行なう。すなわち、
支点部31とストッパ面25aとの案内方向に関する間
隔Hが、基板33における隣り合う分割線Sの間隔と等
しくなるように、ハンドル37を操作して分割ピッチを
調整する。また、ハンドル39を操作し、分割する基板
33の厚みに応じて、案内板29の表面29aと分割力
付与部材23の作用面23aとの間隔を調整する。かか
る調整により、基板33の下端面33aがストッパ面2
5aと当接した状態で、案内板29の支点部31が基板
33の分割線Sと重なる状態にする。また、必要に応
じ、適当な時期にハンドル45を回転させて押え部材2
7の開き量を調整しておき、後述する押え力が最適な状
態となるように調整する。
After the substrate 33 is set on the guide plate 29 or before the setting, the positions of the stopper member 25 and the dividing force applying member 23 are adjusted. That is,
The handle 37 is operated to adjust the division pitch so that the distance H between the fulcrum portion 31 and the stopper surface 25a in the guide direction becomes equal to the distance between the adjacent division lines S on the substrate 33. Further, the handle 39 is operated to adjust the distance between the surface 29a of the guide plate 29 and the acting surface 23a of the splitting force imparting member 23 according to the thickness of the substrate 33 to be split. By such adjustment, the lower end surface 33a of the substrate 33 is moved to the stopper surface 2
The fulcrum portion 31 of the guide plate 29 overlaps the dividing line S of the substrate 33 in the state of being in contact with the 5a. Further, if necessary, the handle 45 is rotated at an appropriate time to hold down the pressing member 2.
The opening amount of 7 is adjusted in advance so that the pressing force described later is in an optimum state.

【0017】以上のような各種調整や基板のセットが完
了した後、以下の分割動作に移る。図示しない分割スイ
ッチをオンにすると、電動モータ17の駆動力がタイミ
ング制御部21を介して作用し、図4の(a)に示され
るように、押え部材27が弾性力による押え力で基板3
3を押さえる。さらに、電動モータ17の駆動力は、タ
イミング制御部21によるタイミング制御作用によって
押え工程よりも遅れて分割力付与部材23及びストッパ
部材25に伝達される。これにより、基板33が押え部
材27により押さえられた状態で、図4の(b)に符号
Eで示されるように、分割力付与部材23及びストッパ
部材25が支点部31を中心に揺動し、基板33が分割
線Sに沿って分割される。また、本実施の形態では、案
内板29の支点部31及び押え部材27の押え端部41
がそれぞれ分割線Sに揃って位置し、且つ、押え部材2
7が基板33をその全幅に亙って押さえている状態で、
少なくとも基板33の全幅に亙って延びる分割力付与手
段23が基板33に分割力が付与する。このため、分割
力は分割線Sに沿って正確且つ均一に作用し、従来に比
べ、基板33は分割線Sに沿って真っ直ぐ精度よく分割
され、かけやクラックが発生しない。さらに、その分割
面に関しても、基板33の上面から下面に亙って垂直に
割れ斜めに割れることなくきれいな仕上がりとなる。ま
た、分割力を付与する部材を基板33の片面側だけに設
ける構成であるため、揺動による分割態様を採用してお
りながら、分割力付与部材23を押え部材27の押え端
部41換言すれば分割線Sにより接近させる構成を採る
ことができ、かかる構成によっても、基板33を分割線
Sに沿って真っ直ぐ精度よく分割できる効果を得やすく
なっている。
After the above various adjustments and the setting of the substrate are completed, the following division operation is performed. When a division switch (not shown) is turned on, the driving force of the electric motor 17 acts via the timing control section 21, and as shown in FIG. 4A, the pressing member 27 is pressed by the elastic force to cause the substrate 3 to move.
Hold down 3. Further, the driving force of the electric motor 17 is transmitted to the splitting force imparting member 23 and the stopper member 25 later than the pressing process by the timing control action of the timing control unit 21. As a result, in the state where the substrate 33 is pressed by the pressing member 27, the dividing force applying member 23 and the stopper member 25 swing around the fulcrum portion 31 as indicated by the symbol E in FIG. 4B. The substrate 33 is divided along the dividing line S. Further, in the present embodiment, the fulcrum portion 31 of the guide plate 29 and the holding end portion 41 of the holding member 27 are provided.
Are aligned with the dividing line S, and the pressing member 2
While 7 holds the substrate 33 over its entire width,
The dividing force applying unit 23 extending at least over the entire width of the substrate 33 applies the dividing force to the substrate 33. For this reason, the dividing force acts accurately and uniformly along the dividing line S, and the substrate 33 is divided along the dividing line S in a straight and accurate manner as compared with the conventional case, and cracks and cracks do not occur. Further, the divided surface also has a clean finish from the upper surface to the lower surface of the substrate 33 without vertical cracks or oblique cracks. Further, since the member for applying the dividing force is provided only on one surface side of the substrate 33, the dividing force applying member 23 is used for the pressing end portion 41 of the pressing member 27 in other words while adopting the dividing mode by swinging. For example, it is possible to adopt a configuration in which it is closer to the dividing line S, and such an arrangement also facilitates the effect of dividing the substrate 33 along the dividing line S in a straight and accurate manner.

【0018】続いて、図4の(c)に矢印Jで示される
ように、分割力付与部材23及びストッパ部材25が逆
方向に揺動して元の状態に戻ると同時に、分割された基
板部分133が自重により落下する。このとき、ストッ
パ部材25のストッパ面25aが基板部分133の下端
面33aの一部に当接する態様であって且つストッパ部
材25の戻り方向(J方向)と逆側に傾斜した逃がし面
25cがあることから、基板部分133は効率よく分割
力付与部材23及びストッパ部材25から離脱・排出さ
れ、落下する。落下した基板部分133は、基板スライ
ダー35によって所定の箇所に案内・収集される。
Subsequently, as shown by an arrow J in FIG. 4C, the dividing force applying member 23 and the stopper member 25 swing in the opposite directions to return to the original state, and at the same time, the divided substrate. The part 133 falls by its own weight. At this time, there is a relief surface 25c in which the stopper surface 25a of the stopper member 25 is in contact with a part of the lower end surface 33a of the substrate portion 133 and is inclined in the direction opposite to the returning direction (J direction) of the stopper member 25. Therefore, the substrate portion 133 is efficiently detached / discharged from the dividing force applying member 23 and the stopper member 25, and falls. The dropped substrate portion 133 is guided and collected at a predetermined position by the substrate slider 35.

【0019】続いて、図5の(a)に矢印Uで示される
ように、押え部材27が基板33から離隔する解放方向
に移動し、それによって、基板33が自重及び錘の作用
で矢印Kに示されるように案内板29を下方にスライド
する。そして、図5の(b)の矢印Rに示されるよう
に、基板33がストッパ部材25に当接した後のタイミ
ングで、押え部材27が押え方向に移動する。これによ
り、図5の(c)に示されるように、前工程と同様に分
割線Sが支点部31及び押え端部41と整列し、その状
態で基板33が押え部材27に押さえられる。さらに、
その後も同様に、基板33に分割力が付与されて分割が
行なわれ、以降、同様に分割線S毎に、基板の分割が行
なわれる。なお、押え部材27の動作及びそのタイミン
グ、分割力付与部材23の動作及びそのタイミングはす
べて、タイミング制御部21によって制御されて、自動
的、連続的に行われる。このため、利用者は、分割スイ
ッチをオンにするだけで、途中、例えば基板送りタイミ
ング毎にストッパを出し入れするなどの余計な作業は行
なう必要はなく、自動的に基板の分割が次々に行なわれ
る。なお、図4及び図5は、分割動作の説明の明瞭性を
優先し、傾斜状態や構造を簡略化した模式図となってい
る。
Subsequently, as shown by the arrow U in FIG. 5A, the pressing member 27 moves in the releasing direction away from the substrate 33, whereby the substrate 33 is moved by its own weight and the weight to the arrow K. The guide plate 29 is slid downward as shown in FIG. Then, as indicated by an arrow R in FIG. 5B, the holding member 27 moves in the holding direction at a timing after the board 33 contacts the stopper member 25. Thereby, as shown in FIG. 5C, the dividing line S is aligned with the fulcrum portion 31 and the pressing end portion 41 as in the previous step, and the substrate 33 is pressed by the pressing member 27 in this state. further,
After that, similarly, a dividing force is applied to the substrate 33 to perform the division, and thereafter, the substrate is similarly divided for each dividing line S. The operation and timing of the pressing member 27 and the operation and timing of the dividing force applying member 23 are all controlled automatically by the timing controller 21. For this reason, the user does not need to perform extra work such as inserting and removing the stopper at every substrate feed timing, only by turning on the division switch, and the substrates are automatically divided one after another. . 4 and 5 are schematic diagrams in which the tilted state and the structure are simplified, giving priority to the clarity of the description of the dividing operation.

【0020】[0020]

【発明の効果】以上説明したように、本発明の基板分割
装置によれば、案内板の支点部及び押え部材の押え端部
が分割線に揃い且つ押え部材が基板の全幅を押さえた状
態で、分割力が基板の全幅に亙り均一に付与されるた
め、かけやクラックなどの発生をなくし、分割面に関し
ても基板上面から下面に亙って垂直に割れ、基板に損傷
を与えることなく分割線に沿ってよりきれいに割ること
ができる。
As described above, according to the substrate dividing apparatus of the present invention, the fulcrum portion of the guide plate and the pressing end portion of the pressing member are aligned with the dividing line and the pressing member holds the entire width of the substrate. Since the dividing force is applied uniformly over the entire width of the board, there is no occurrence of cracks or cracks, and the dividing surface is also cracked vertically from the top surface to the bottom surface of the board, without causing damage to the board. You can split it more neatly along.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明に係る基板分割装置の概要を示す図で
ある。
FIG. 1 is a diagram showing an outline of a substrate dividing apparatus according to the present invention.

【図2】 本発明の基板分割装置における作用部近傍の
拡大図である。
FIG. 2 is an enlarged view of the vicinity of a working portion in the substrate dividing apparatus of the present invention.

【図3】 本発明の基板分割装置における案内板、押え
部材及び基板を斜め上方からみた図である。
FIG. 3 is a view of a guide plate, a pressing member, and a substrate in the substrate dividing device according to the present invention as seen obliquely from above.

【図4】 本発明の基板分割装置における動作を模式的
に示す図である。
FIG. 4 is a diagram schematically showing an operation in the substrate dividing apparatus of the present invention.

【図5】 本発明の基板分割装置における動作を模式的
に示す図である。
FIG. 5 is a diagram schematically showing the operation of the substrate dividing apparatus of the present invention.

【図6】 従来の基板分割装置の要部を示す斜視図であ
る。
FIG. 6 is a perspective view showing a main part of a conventional board dividing device.

【符号の説明】[Explanation of symbols]

11…基板分割装置、23…分割力付与部材、25…ス
トッパ部材、25c…逃がし面、27…押え部材、29
…案内板、31…支点部、33…基板、41…押え端
部、S…分割線。
11 ... Substrate dividing device, 23 ... Dividing force applying member, 25 ... Stopper member, 25c ... Relief surface, 27 ... Holding member, 29
... guide plate, 31 ... fulcrum portion, 33 ... substrate, 41 ... presser end portion, S ... dividing line.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも一つの分割線を有する基板を
該分割線に沿って分割する基板分割装置において、 前記基板にその全幅に亙って分割力を付与する分割力付
与部材と、 前記分割力付与部材に向けて前記基板を案内し、分割時
に前記分割線に沿って該基板を支持するための支点部を
備えた案内板と、 前記基板の案内時に前記分割線と前記支点部とが揃うよ
うに該基板の位置を規定するストッパ部材と、 前記案内板と協働して前記基板をその全幅に亙って押
え、分割時に前記分割線に沿って位置する押え端部を有
する押え部材と、を備えたことを特徴とする基板分割装
置。
1. A substrate dividing apparatus for dividing a substrate having at least one dividing line along the dividing line, a dividing force applying member for giving a dividing force to the substrate over its entire width, and the dividing force. A guide plate having a fulcrum portion for guiding the substrate toward the applying member and supporting the substrate along the dividing line at the time of division; and the dividing line and the fulcrum portion at the time of guiding the substrate. A stopper member that defines the position of the substrate, and a pressing member that cooperates with the guide plate to press the substrate over its entire width and that has a pressing end portion that is located along the dividing line when divided. And a substrate dividing device.
【請求項2】 前記分割力付与部材及び前記ストッパ部
材は、前記基板の表面及び案内方向前端面と当接した状
態で一体的に揺動することにより前記基板に分割力を付
与することを特徴とする請求項1に記載の基板分割装
置。
2. The dividing force applying member and the stopper member apply a dividing force to the substrate by integrally swinging in a state of being in contact with the surface of the substrate and the front end face in the guiding direction. The substrate dividing apparatus according to claim 1.
【請求項3】 前記ストッパ部材は、前記案内方向前端
面と対向する側で且つ分割時の揺動方向側において、分
割された基板部分の排出を促進する逃がし面を有するこ
とを特徴とする請求項2に記載の基板分割装置。
3. The stopper member has a relief surface for promoting discharge of the divided substrate portion on a side facing the guide direction front end surface and on a swinging direction side during division. Item 3. The substrate dividing apparatus according to item 2.
【請求項4】 前記分割力付与部材及び前記ストッパ部
材はそれぞれ、前記基板の案内方向に垂直及び平行に位
置変更が可能であることを特徴とする請求項1乃至3の
何れか一項に記載の基板分割装置。
4. The position of each of the dividing force applying member and the stopper member can be changed in a direction perpendicular to and parallel to the guiding direction of the substrate, according to any one of claims 1 to 3. Board dividing device.
JP2002143069A 2002-05-17 2002-05-17 Board dividing apparatus Withdrawn JP2003340793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002143069A JP2003340793A (en) 2002-05-17 2002-05-17 Board dividing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002143069A JP2003340793A (en) 2002-05-17 2002-05-17 Board dividing apparatus

Publications (1)

Publication Number Publication Date
JP2003340793A true JP2003340793A (en) 2003-12-02

Family

ID=29766244

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2003340793A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007301617A (en) * 2006-05-12 2007-11-22 Nippon Steel Corp Apparatus and method for separating pressure welded material
JP2010274573A (en) * 2009-05-29 2010-12-09 Mitsuboshi Diamond Industrial Co Ltd Breaking apparatus and breaking method
JP2014221551A (en) * 2014-06-30 2014-11-27 三星ダイヤモンド工業株式会社 Breaking device
JP2015009332A (en) * 2013-06-28 2015-01-19 三星ダイヤモンド工業株式会社 Break tool of brittle material substrate
JP2015009496A (en) * 2013-06-28 2015-01-19 三星ダイヤモンド工業株式会社 Break tool of brittle material substrate
JP2015009331A (en) * 2013-06-28 2015-01-19 三星ダイヤモンド工業株式会社 Break tool of brittle material substrate
JP2017061146A (en) * 2015-09-25 2017-03-30 日立金属株式会社 Production device of silicon nitride ceramic aggregate substrate and production method of silicon nitride ceramic aggregate substrate
CN107041075A (en) * 2017-06-02 2017-08-11 吉安市满坤科技有限公司 A kind of new V grooves board separating device and its method
TWI620632B (en) * 2013-06-28 2018-04-11 Mitsuboshi Diamond Ind Co Ltd Cutting tool for substrate of brittle material

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007301617A (en) * 2006-05-12 2007-11-22 Nippon Steel Corp Apparatus and method for separating pressure welded material
JP2010274573A (en) * 2009-05-29 2010-12-09 Mitsuboshi Diamond Industrial Co Ltd Breaking apparatus and breaking method
JP2015009332A (en) * 2013-06-28 2015-01-19 三星ダイヤモンド工業株式会社 Break tool of brittle material substrate
JP2015009496A (en) * 2013-06-28 2015-01-19 三星ダイヤモンド工業株式会社 Break tool of brittle material substrate
JP2015009331A (en) * 2013-06-28 2015-01-19 三星ダイヤモンド工業株式会社 Break tool of brittle material substrate
TWI620632B (en) * 2013-06-28 2018-04-11 Mitsuboshi Diamond Ind Co Ltd Cutting tool for substrate of brittle material
JP2014221551A (en) * 2014-06-30 2014-11-27 三星ダイヤモンド工業株式会社 Breaking device
JP2017061146A (en) * 2015-09-25 2017-03-30 日立金属株式会社 Production device of silicon nitride ceramic aggregate substrate and production method of silicon nitride ceramic aggregate substrate
CN107041075A (en) * 2017-06-02 2017-08-11 吉安市满坤科技有限公司 A kind of new V grooves board separating device and its method

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