TW201434884A - 阻障層形成用組成物、帶有阻障層的半導體基板、太陽電池用基板的製造方法及太陽電池元件的製造方法 - Google Patents
阻障層形成用組成物、帶有阻障層的半導體基板、太陽電池用基板的製造方法及太陽電池元件的製造方法 Download PDFInfo
- Publication number
- TW201434884A TW201434884A TW103104631A TW103104631A TW201434884A TW 201434884 A TW201434884 A TW 201434884A TW 103104631 A TW103104631 A TW 103104631A TW 103104631 A TW103104631 A TW 103104631A TW 201434884 A TW201434884 A TW 201434884A
- Authority
- TW
- Taiwan
- Prior art keywords
- barrier layer
- forming
- semiconductor substrate
- mass
- substrate
- Prior art date
Links
- 230000004888 barrier function Effects 0.000 title claims abstract description 158
- 239000000203 mixture Substances 0.000 title claims abstract description 33
- 239000000758 substrate Substances 0.000 title claims description 102
- 239000004065 semiconductor Substances 0.000 title claims description 54
- 238000000034 method Methods 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 239000002612 dispersion medium Substances 0.000 claims abstract description 27
- 239000011230 binding agent Substances 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 5
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims abstract description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 5
- 230000007062 hydrolysis Effects 0.000 claims abstract description 4
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 4
- 238000012643 polycondensation polymerization Methods 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 150
- 238000009792 diffusion process Methods 0.000 claims description 76
- 239000011254 layer-forming composition Substances 0.000 claims description 70
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 23
- 150000001875 compounds Chemical class 0.000 claims description 23
- 229910052707 ruthenium Inorganic materials 0.000 claims description 23
- 239000002904 solvent Substances 0.000 claims description 21
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 15
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 13
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 11
- 238000007650 screen-printing Methods 0.000 claims description 11
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000001856 Ethyl cellulose Substances 0.000 claims description 10
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 10
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 10
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 9
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 9
- 229920001249 ethyl cellulose Polymers 0.000 claims description 9
- 229940116411 terpineol Drugs 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000004925 Acrylic resin Substances 0.000 claims description 7
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- 229920002678 cellulose Polymers 0.000 claims description 6
- 239000001913 cellulose Substances 0.000 claims description 6
- 150000003505 terpenes Chemical class 0.000 claims description 5
- 235000007586 terpenes Nutrition 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 3
- 229920000180 alkyd Polymers 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 229920001709 polysilazane Polymers 0.000 abstract description 2
- 239000002210 silicon-based material Substances 0.000 abstract description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 abstract 1
- 239000000047 product Substances 0.000 description 24
- 239000000463 material Substances 0.000 description 23
- -1 siloxane compound Chemical class 0.000 description 21
- 238000000576 coating method Methods 0.000 description 19
- 239000011248 coating agent Substances 0.000 description 15
- 239000000126 substance Substances 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 12
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 10
- 239000002019 doping agent Substances 0.000 description 10
- 238000002161 passivation Methods 0.000 description 10
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 8
- 229910052732 germanium Inorganic materials 0.000 description 8
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 239000007864 aqueous solution Substances 0.000 description 7
- 235000019441 ethanol Nutrition 0.000 description 7
- SWNSMVKUMFUITJ-UHFFFAOYSA-N 1-(8-methylnonyl)cyclohexan-1-ol Chemical compound C(CCCCCCC(C)C)C1(CCCCC1)O SWNSMVKUMFUITJ-UHFFFAOYSA-N 0.000 description 6
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 6
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000004094 surface-active agent Substances 0.000 description 6
- 229910052715 tantalum Inorganic materials 0.000 description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 4
- 238000001354 calcination Methods 0.000 description 4
- KBPLFHHGFOOTCA-UHFFFAOYSA-N caprylic alcohol Natural products CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 4
- 230000003301 hydrolyzing effect Effects 0.000 description 4
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- ZWRUINPWMLAQRD-UHFFFAOYSA-N nonan-1-ol Chemical compound CCCCCCCCCO ZWRUINPWMLAQRD-UHFFFAOYSA-N 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000013008 thixotropic agent Substances 0.000 description 4
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- 229920002907 Guar gum Polymers 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 229940044949 eucalyptus oil Drugs 0.000 description 3
- 239000010642 eucalyptus oil Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 235000010417 guar gum Nutrition 0.000 description 3
- 239000000665 guar gum Substances 0.000 description 3
- 229960002154 guar gum Drugs 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- LCGLNKUTAGEVQW-UHFFFAOYSA-N methyl monoether Natural products COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 3
- 239000002736 nonionic surfactant Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- PGMYKACGEOXYJE-UHFFFAOYSA-N pentyl acetate Chemical compound CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- GRWFGVWFFZKLTI-IUCAKERBSA-N (-)-α-pinene Chemical compound CC1=CC[C@@H]2C(C)(C)[C@H]1C2 GRWFGVWFFZKLTI-IUCAKERBSA-N 0.000 description 2
- GQVMHMFBVWSSPF-SOYUKNQTSA-N (4E,6E)-2,6-dimethylocta-2,4,6-triene Chemical compound C\C=C(/C)\C=C\C=C(C)C GQVMHMFBVWSSPF-SOYUKNQTSA-N 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 2
- VPBZZPOGZPKYKX-UHFFFAOYSA-N 1,2-diethoxypropane Chemical compound CCOCC(C)OCC VPBZZPOGZPKYKX-UHFFFAOYSA-N 0.000 description 2
- MQGIBEAIDUOVOH-UHFFFAOYSA-N 1-[2-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOCCOCCCC MQGIBEAIDUOVOH-UHFFFAOYSA-N 0.000 description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 2
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 2
- OJVAMHKKJGICOG-UHFFFAOYSA-N 2,5-hexanedione Chemical compound CC(=O)CCC(C)=O OJVAMHKKJGICOG-UHFFFAOYSA-N 0.000 description 2
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- FEBUJFMRSBAMES-UHFFFAOYSA-N 2-[(2-{[3,5-dihydroxy-2-(hydroxymethyl)-6-phosphanyloxan-4-yl]oxy}-3,5-dihydroxy-6-({[3,4,5-trihydroxy-6-(hydroxymethyl)oxan-2-yl]oxy}methyl)oxan-4-yl)oxy]-3,5-dihydroxy-6-(hydroxymethyl)oxan-4-yl phosphinite Chemical class OC1C(O)C(O)C(CO)OC1OCC1C(O)C(OC2C(C(OP)C(O)C(CO)O2)O)C(O)C(OC2C(C(CO)OC(P)C2O)O)O1 FEBUJFMRSBAMES-UHFFFAOYSA-N 0.000 description 2
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 241000416162 Astragalus gummifer Species 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 2
- NUPSHWCALHZGOV-UHFFFAOYSA-N Decyl acetate Chemical compound CCCCCCCCCCOC(C)=O NUPSHWCALHZGOV-UHFFFAOYSA-N 0.000 description 2
- 239000004375 Dextrin Substances 0.000 description 2
- 229920001353 Dextrin Polymers 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 2
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 2
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229920001615 Tragacanth Chemical class 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 229940088601 alpha-terpineol Drugs 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 description 2
- 229910000387 ammonium dihydrogen phosphate Inorganic materials 0.000 description 2
- 230000003667 anti-reflective effect Effects 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyl acetate Chemical compound CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 description 2
- 239000001768 carboxy methyl cellulose Substances 0.000 description 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 2
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 2
- ULDHMXUKGWMISQ-UHFFFAOYSA-N carvone Chemical compound CC(=C)C1CC=C(C)C(=O)C1 ULDHMXUKGWMISQ-UHFFFAOYSA-N 0.000 description 2
- 239000003093 cationic surfactant Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- GQVMHMFBVWSSPF-UHFFFAOYSA-N cis-alloocimene Natural products CC=C(C)C=CC=C(C)C GQVMHMFBVWSSPF-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- 235000019425 dextrin Nutrition 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 239000002003 electrode paste Substances 0.000 description 2
- RGXWDWUGBIJHDO-UHFFFAOYSA-N ethyl decanoate Chemical compound CCCCCCCCCC(=O)OCC RGXWDWUGBIJHDO-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000008273 gelatin Substances 0.000 description 2
- 229920000159 gelatin Polymers 0.000 description 2
- 235000019322 gelatine Nutrition 0.000 description 2
- 235000011852 gelatine desserts Nutrition 0.000 description 2
- 239000003349 gelling agent Substances 0.000 description 2
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- XAOGXQMKWQFZEM-UHFFFAOYSA-N isoamyl propanoate Chemical compound CCC(=O)OCCC(C)C XAOGXQMKWQFZEM-UHFFFAOYSA-N 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- KXKVLQRXCPHEJC-UHFFFAOYSA-N methyl acetate Chemical compound COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 2
- YRHYCMZPEVDGFQ-UHFFFAOYSA-N methyl decanoate Chemical compound CCCCCCCCCC(=O)OC YRHYCMZPEVDGFQ-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 235000019837 monoammonium phosphate Nutrition 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- 235000013772 propylene glycol Nutrition 0.000 description 2
- 150000003304 ruthenium compounds Chemical class 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- 239000000196 tragacanth Chemical class 0.000 description 2
- 235000010487 tragacanth Nutrition 0.000 description 2
- 229940116362 tragacanth Drugs 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- 229920001285 xanthan gum Polymers 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- YHQGMYUVUMAZJR-UHFFFAOYSA-N α-terpinene Chemical compound CC(C)C1=CC=C(C)CC1 YHQGMYUVUMAZJR-UHFFFAOYSA-N 0.000 description 2
- IHPKGUQCSIINRJ-UHFFFAOYSA-N β-ocimene Natural products CC(C)=CCC=C(C)C=C IHPKGUQCSIINRJ-UHFFFAOYSA-N 0.000 description 2
- WTARULDDTDQWMU-RKDXNWHRSA-N (+)-β-pinene Chemical compound C1[C@H]2C(C)(C)[C@@H]1CCC2=C WTARULDDTDQWMU-RKDXNWHRSA-N 0.000 description 1
- WTARULDDTDQWMU-IUCAKERBSA-N (-)-Nopinene Natural products C1[C@@H]2C(C)(C)[C@H]1CCC2=C WTARULDDTDQWMU-IUCAKERBSA-N 0.000 description 1
- FYGDTMLNYKFZSV-URKRLVJHSA-N (2s,3r,4s,5s,6r)-2-[(2r,4r,5r,6s)-4,5-dihydroxy-2-(hydroxymethyl)-6-[(2r,4r,5r,6s)-4,5,6-trihydroxy-2-(hydroxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-6-(hydroxymethyl)oxane-3,4,5-triol Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1[C@@H](CO)O[C@@H](OC2[C@H](O[C@H](O)[C@H](O)[C@H]2O)CO)[C@H](O)[C@H]1O FYGDTMLNYKFZSV-URKRLVJHSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- WJMXTYZCTXTFJM-UHFFFAOYSA-N 1,1,1,2-tetraethoxydecane Chemical compound C(C)OC(C(OCC)(OCC)OCC)CCCCCCCC WJMXTYZCTXTFJM-UHFFFAOYSA-N 0.000 description 1
- ANBBCZAIOXDZPV-UHFFFAOYSA-N 1,1,1-trimethoxy-2-methyldecane Chemical compound CC(C(OC)(OC)OC)CCCCCCCC ANBBCZAIOXDZPV-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- PVMMVWNXKOSPRB-UHFFFAOYSA-N 1,2-dipropoxypropane Chemical compound CCCOCC(C)OCCC PVMMVWNXKOSPRB-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 description 1
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- QMGJMGFZLXYHCR-UHFFFAOYSA-N 1-(2-butoxypropoxy)butane Chemical compound CCCCOCC(C)OCCCC QMGJMGFZLXYHCR-UHFFFAOYSA-N 0.000 description 1
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 description 1
- HQSLKNLISLWZQH-UHFFFAOYSA-N 1-(2-propoxyethoxy)propane Chemical compound CCCOCCOCCC HQSLKNLISLWZQH-UHFFFAOYSA-N 0.000 description 1
- KZVBBTZJMSWGTK-UHFFFAOYSA-N 1-[2-(2-butoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCCC KZVBBTZJMSWGTK-UHFFFAOYSA-N 0.000 description 1
- BOGFHOWTVGAYFK-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOCCC BOGFHOWTVGAYFK-UHFFFAOYSA-N 0.000 description 1
- KTSVVTQTKRGWGU-UHFFFAOYSA-N 1-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOCCCC KTSVVTQTKRGWGU-UHFFFAOYSA-N 0.000 description 1
- OHRSSDYDJRJIMN-UHFFFAOYSA-N 1-[2-[2-(2-butoxypropoxy)propoxy]propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OCC(C)OCCCC OHRSSDYDJRJIMN-UHFFFAOYSA-N 0.000 description 1
- YZWVMKLQNYGKLJ-UHFFFAOYSA-N 1-[2-[2-(2-ethoxyethoxy)ethoxy]ethoxy]-2-methoxyethane Chemical compound CCOCCOCCOCCOCCOC YZWVMKLQNYGKLJ-UHFFFAOYSA-N 0.000 description 1
- JVMKCHOJVQIXQN-UHFFFAOYSA-N 1-[2-[2-[2-(2-butoxypropoxy)propoxy]propoxy]propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OCC(C)OCC(C)OCCCC JVMKCHOJVQIXQN-UHFFFAOYSA-N 0.000 description 1
- BNXZHVUCNYMNOS-UHFFFAOYSA-N 1-butylpyrrolidin-2-one Chemical compound CCCCN1CCCC1=O BNXZHVUCNYMNOS-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- ZIKLJUUTSQYGQI-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxypropoxy)propane Chemical compound CCOCC(C)OCC(C)OCC ZIKLJUUTSQYGQI-UHFFFAOYSA-N 0.000 description 1
- KIAMPLQEZAMORJ-UHFFFAOYSA-N 1-ethoxy-2-[2-(2-ethoxyethoxy)ethoxy]ethane Chemical compound CCOCCOCCOCCOCC KIAMPLQEZAMORJ-UHFFFAOYSA-N 0.000 description 1
- ORRRIJVZQZKAKQ-UHFFFAOYSA-N 1-ethoxy-2-[2-(2-ethoxypropoxy)propoxy]propane Chemical compound CCOCC(C)OCC(C)OCC(C)OCC ORRRIJVZQZKAKQ-UHFFFAOYSA-N 0.000 description 1
- FXAFMVDJGZBDEP-UHFFFAOYSA-N 1-ethoxy-2-[2-[2-(2-ethoxypropoxy)propoxy]propoxy]propane Chemical compound CCOCC(C)OCC(C)OCC(C)OCC(C)OCC FXAFMVDJGZBDEP-UHFFFAOYSA-N 0.000 description 1
- BPIUIOXAFBGMNB-UHFFFAOYSA-N 1-hexoxyhexane Chemical compound CCCCCCOCCCCCC BPIUIOXAFBGMNB-UHFFFAOYSA-N 0.000 description 1
- BAWUFGWWCWMUNU-UHFFFAOYSA-N 1-hexylpyrrolidin-2-one Chemical compound CCCCCCN1CCCC1=O BAWUFGWWCWMUNU-UHFFFAOYSA-N 0.000 description 1
- RERATEUBWLKDFE-UHFFFAOYSA-N 1-methoxy-2-[2-(2-methoxypropoxy)propoxy]propane Chemical compound COCC(C)OCC(C)OCC(C)OC RERATEUBWLKDFE-UHFFFAOYSA-N 0.000 description 1
- ROSYHLFNMZTEKZ-UHFFFAOYSA-N 1-methoxy-2-[2-[2-(2-methoxypropoxy)propoxy]propoxy]propane Chemical compound COCC(C)OCC(C)OCC(C)OCC(C)OC ROSYHLFNMZTEKZ-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- MWOODERJGVWYJE-UHFFFAOYSA-N 1-methyl-1-phenylhydrazine Chemical compound CN(N)C1=CC=CC=C1 MWOODERJGVWYJE-UHFFFAOYSA-N 0.000 description 1
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical class CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- 239000001169 1-methyl-4-propan-2-ylcyclohexa-1,4-diene Substances 0.000 description 1
- JOERQAIRIDZWHX-UHFFFAOYSA-N 1-propoxy-2-(2-propoxypropoxy)propane Chemical compound CCCOCC(C)OCC(C)OCCC JOERQAIRIDZWHX-UHFFFAOYSA-N 0.000 description 1
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 description 1
- DCALJVULAGICIX-UHFFFAOYSA-N 1-propylpyrrolidin-2-one Chemical compound CCCN1CCCC1=O DCALJVULAGICIX-UHFFFAOYSA-N 0.000 description 1
- AWCLBAGIVYIMDI-UHFFFAOYSA-N 2,3,4-trimethylfluoren-1-one Chemical compound CC=1C(=C(C(C2=CC3=CC=CC=C3C=12)=O)C)C AWCLBAGIVYIMDI-UHFFFAOYSA-N 0.000 description 1
- AWBIJARKDOFDAN-UHFFFAOYSA-N 2,5-dimethyl-1,4-dioxane Chemical compound CC1COC(C)CO1 AWBIJARKDOFDAN-UHFFFAOYSA-N 0.000 description 1
- KKQVUWHSUOGDEI-UHFFFAOYSA-N 2-(2-butan-2-yloxyethoxy)ethanol Chemical compound CCC(C)OCCOCCO KKQVUWHSUOGDEI-UHFFFAOYSA-N 0.000 description 1
- GHGDAJBKEFQCBH-UHFFFAOYSA-N 2-(2-heptan-2-yloxyethoxy)ethanol Chemical compound CCCCCC(C)OCCOCCO GHGDAJBKEFQCBH-UHFFFAOYSA-N 0.000 description 1
- CCGHAVKVTFDDJU-UHFFFAOYSA-N 2-(2-heptan-2-yloxypropoxy)propan-1-ol Chemical compound CC(CCCCC)OC(C)COC(C)CO CCGHAVKVTFDDJU-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 description 1
- FIIFPAUBZGVKCI-UHFFFAOYSA-N 2-(2-pentan-2-yloxyethoxy)ethanol Chemical compound CCCC(C)OCCOCCO FIIFPAUBZGVKCI-UHFFFAOYSA-N 0.000 description 1
- ZMSQRSUTMFYPLQ-UHFFFAOYSA-N 2-(8-methylnonyl)phenol Chemical compound CC(C)CCCCCCCC1=CC=CC=C1O ZMSQRSUTMFYPLQ-UHFFFAOYSA-N 0.000 description 1
- HQLKZWRSOHTERR-UHFFFAOYSA-N 2-Ethylbutyl acetate Chemical compound CCC(CC)COC(C)=O HQLKZWRSOHTERR-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- RGICCULPCWNRAB-UHFFFAOYSA-N 2-[2-(2-hexoxyethoxy)ethoxy]ethanol Chemical compound CCCCCCOCCOCCOCCO RGICCULPCWNRAB-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- YIXPMXHWOUQTBS-UHFFFAOYSA-N 2-[2-(2-pentan-2-yloxypropoxy)propoxy]propan-1-ol Chemical compound CC(CCC)OC(C)COC(C)COC(C)CO YIXPMXHWOUQTBS-UHFFFAOYSA-N 0.000 description 1
- LKAIVSMFSUHTGS-UHFFFAOYSA-N 2-[2-[2-(2-heptan-2-yloxyethoxy)ethoxy]ethoxy]ethanol Chemical compound CCCCCC(C)OCCOCCOCCOCCO LKAIVSMFSUHTGS-UHFFFAOYSA-N 0.000 description 1
- SHHZIUZGAHMEJB-UHFFFAOYSA-N 2-[2-[2-(2-heptan-2-yloxypropoxy)propoxy]propoxy]propan-1-ol Chemical compound CC(CCCCC)OC(C)COC(C)COC(C)COC(C)CO SHHZIUZGAHMEJB-UHFFFAOYSA-N 0.000 description 1
- NREVKVJUSKPCFL-UHFFFAOYSA-N 2-[2-[2-(2-methoxypropoxy)propoxy]propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)COC(C)CO NREVKVJUSKPCFL-UHFFFAOYSA-N 0.000 description 1
- JPKNIKSLAPWTRU-UHFFFAOYSA-N 2-[2-[2-(2-pentan-2-yloxyethoxy)ethoxy]ethoxy]ethanol Chemical compound CCCC(C)OCCOCCOCCOCCO JPKNIKSLAPWTRU-UHFFFAOYSA-N 0.000 description 1
- HSDVPOIMGHIBHF-UHFFFAOYSA-N 2-[2-[2-(2-pentan-2-yloxypropoxy)propoxy]propoxy]propan-1-ol Chemical compound CC(CCC)OC(C)COC(C)COC(C)COC(C)CO HSDVPOIMGHIBHF-UHFFFAOYSA-N 0.000 description 1
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- BYVKCQBOHJQWIO-UHFFFAOYSA-N 2-ethoxyethyl propanoate Chemical compound CCOCCOC(=O)CC BYVKCQBOHJQWIO-UHFFFAOYSA-N 0.000 description 1
- TZYRSLHNPKPEFV-UHFFFAOYSA-N 2-ethyl-1-butanol Chemical compound CCC(CC)CO TZYRSLHNPKPEFV-UHFFFAOYSA-N 0.000 description 1
- WOYWLLHHWAMFCB-UHFFFAOYSA-N 2-ethylhexyl acetate Chemical compound CCCCC(CC)COC(C)=O WOYWLLHHWAMFCB-UHFFFAOYSA-N 0.000 description 1
- VAHNPAMCADTGIO-UHFFFAOYSA-N 2-methoxyethyl propanoate Chemical compound CCC(=O)OCCOC VAHNPAMCADTGIO-UHFFFAOYSA-N 0.000 description 1
- XTDKZSUYCXHXJM-UHFFFAOYSA-N 2-methoxyoxane Chemical compound COC1CCCCO1 XTDKZSUYCXHXJM-UHFFFAOYSA-N 0.000 description 1
- PFNHSEQQEPMLNI-UHFFFAOYSA-N 2-methyl-1-pentanol Chemical compound CCCC(C)CO PFNHSEQQEPMLNI-UHFFFAOYSA-N 0.000 description 1
- JWUJQDFVADABEY-UHFFFAOYSA-N 2-methyltetrahydrofuran Chemical compound CC1CCCO1 JWUJQDFVADABEY-UHFFFAOYSA-N 0.000 description 1
- ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 2-octanone Chemical compound CCCCCCC(C)=O ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- HYDWALOBQJFOMS-UHFFFAOYSA-N 3,6,9,12,15-pentaoxaheptadecane Chemical compound CCOCCOCCOCCOCCOCC HYDWALOBQJFOMS-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- GHMKDZIUDKBFIR-UHFFFAOYSA-N 4-(5-methyl-2-propan-2-ylcyclohexyl)phenol Chemical compound CC(C)C1CCC(C)CC1C1=CC=C(O)C=C1 GHMKDZIUDKBFIR-UHFFFAOYSA-N 0.000 description 1
- MQWCXKGKQLNYQG-UHFFFAOYSA-N 4-methylcyclohexan-1-ol Chemical compound CC1CCC(O)CC1 MQWCXKGKQLNYQG-UHFFFAOYSA-N 0.000 description 1
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 1
- CPIVYSAVIPTCCX-UHFFFAOYSA-N 4-methylpentan-2-yl acetate Chemical compound CC(C)CC(C)OC(C)=O CPIVYSAVIPTCCX-UHFFFAOYSA-N 0.000 description 1
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- ZPQAKYPOZRXKFA-UHFFFAOYSA-N 6-Undecanone Chemical compound CCCCCC(=O)CCCCC ZPQAKYPOZRXKFA-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920001817 Agar Polymers 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229920002498 Beta-glucan Polymers 0.000 description 1
- 108010027529 Bio-glue Proteins 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- PZKBIVOXIFYDRI-UHFFFAOYSA-N CC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound CC(C(OCC)(OCC)OCC)CCCCCCCC PZKBIVOXIFYDRI-UHFFFAOYSA-N 0.000 description 1
- CIURCIMZEPBPPG-UHFFFAOYSA-N CC(CCC)OC(C)COC(C)CO Chemical compound CC(CCC)OC(C)COC(C)CO CIURCIMZEPBPPG-UHFFFAOYSA-N 0.000 description 1
- 239000005973 Carvone Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XATIFGDHQQXOMD-UHFFFAOYSA-N ClCl.[P] Chemical compound ClCl.[P] XATIFGDHQQXOMD-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YYLLIJHXUHJATK-UHFFFAOYSA-N Cyclohexyl acetate Chemical compound CC(=O)OC1CCCCC1 YYLLIJHXUHJATK-UHFFFAOYSA-N 0.000 description 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- 229920000161 Locust bean gum Polymers 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- WSTYNZDAOAEEKG-UHFFFAOYSA-N Mayol Natural products CC1=C(O)C(=O)C=C2C(CCC3(C4CC(C(CC4(CCC33C)C)=O)C)C)(C)C3=CC=C21 WSTYNZDAOAEEKG-UHFFFAOYSA-N 0.000 description 1
- XOBKSJJDNFUZPF-UHFFFAOYSA-N Methoxyethane Chemical compound CCOC XOBKSJJDNFUZPF-UHFFFAOYSA-N 0.000 description 1
- 239000005640 Methyl decanoate Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 229920000881 Modified starch Polymers 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- JKRZOJADNVOXPM-UHFFFAOYSA-N Oxalic acid dibutyl ester Chemical compound CCCCOC(=O)C(=O)OCCCC JKRZOJADNVOXPM-UHFFFAOYSA-N 0.000 description 1
- 244000090599 Plantago psyllium Species 0.000 description 1
- 235000010451 Plantago psyllium Nutrition 0.000 description 1
- RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical compound C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- WTARULDDTDQWMU-UHFFFAOYSA-N Pseudopinene Natural products C1C2C(C)(C)C1CCC2=C WTARULDDTDQWMU-UHFFFAOYSA-N 0.000 description 1
- 229920002305 Schizophyllan Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 229930182558 Sterol Natural products 0.000 description 1
- 240000004584 Tamarindus indica Species 0.000 description 1
- 235000004298 Tamarindus indica Nutrition 0.000 description 1
- SMEGJBVQLJJKKX-HOTMZDKISA-N [(2R,3S,4S,5R,6R)-5-acetyloxy-3,4,6-trihydroxyoxan-2-yl]methyl acetate Chemical compound CC(=O)OC[C@@H]1[C@H]([C@@H]([C@H]([C@@H](O1)O)OC(=O)C)O)O SMEGJBVQLJJKKX-HOTMZDKISA-N 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- RAVJWRLVWIYIGO-UHFFFAOYSA-N [N-]=[N+]=[N-].[N-]=[N+]=[N-].[OH4+2] Chemical compound [N-]=[N+]=[N-].[N-]=[N+]=[N-].[OH4+2] RAVJWRLVWIYIGO-UHFFFAOYSA-N 0.000 description 1
- ZGACYOKNEKDSNK-UHFFFAOYSA-N ac1mjht3 Chemical compound C1CC2(C)C3C(=O)OC(=O)C3C1(C(C)C)C=C2 ZGACYOKNEKDSNK-UHFFFAOYSA-N 0.000 description 1
- 229940022663 acetate Drugs 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- WBJMFJMRMFQXCO-UHFFFAOYSA-N acetic acid;2-[2-(2-hydroxyethoxy)ethoxy]-1-methoxyethanol Chemical compound CC(O)=O.COC(O)COCCOCCO WBJMFJMRMFQXCO-UHFFFAOYSA-N 0.000 description 1
- TUVYSBJZBYRDHP-UHFFFAOYSA-N acetic acid;methoxymethane Chemical compound COC.CC(O)=O TUVYSBJZBYRDHP-UHFFFAOYSA-N 0.000 description 1
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 1
- 229940081735 acetylcellulose Drugs 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000008272 agar Substances 0.000 description 1
- 235000010419 agar Nutrition 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- XCPQUQHBVVXMRQ-UHFFFAOYSA-N alpha-Fenchene Natural products C1CC2C(=C)CC1C2(C)C XCPQUQHBVVXMRQ-UHFFFAOYSA-N 0.000 description 1
- MVNCAPSFBDBCGF-UHFFFAOYSA-N alpha-pinene Natural products CC1=CCC23C1CC2C3(C)C MVNCAPSFBDBCGF-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229940072049 amyl acetate Drugs 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Natural products C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 1
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- BCZWPKDRLPGFFZ-UHFFFAOYSA-N azanylidynecerium Chemical compound [Ce]#N BCZWPKDRLPGFFZ-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 229940007550 benzyl acetate Drugs 0.000 description 1
- 229930006722 beta-pinene Natural products 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- BTMVHUNTONAYDX-UHFFFAOYSA-N butyl propionate Chemical compound CCCCOC(=O)CC BTMVHUNTONAYDX-UHFFFAOYSA-N 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 235000010418 carrageenan Nutrition 0.000 description 1
- 239000000679 carrageenan Substances 0.000 description 1
- 229920001525 carrageenan Polymers 0.000 description 1
- 229940113118 carrageenan Drugs 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 229920003086 cellulose ether Polymers 0.000 description 1
- WXANAQMHYPHTGY-UHFFFAOYSA-N cerium;ethyne Chemical compound [Ce].[C-]#[C] WXANAQMHYPHTGY-UHFFFAOYSA-N 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- WYACBZDAHNBPPB-UHFFFAOYSA-N diethyl oxalate Chemical compound CCOC(=O)C(=O)OCC WYACBZDAHNBPPB-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- HIBQNYVRJZBSDX-UHFFFAOYSA-N ethyl 2-hydroxypropanoate;methyl 2-hydroxypropanoate Chemical compound COC(=O)C(C)O.CCOC(=O)C(C)O HIBQNYVRJZBSDX-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- TZMFJUDUGYTVRY-UHFFFAOYSA-N ethyl methyl diketone Natural products CCC(=O)C(C)=O TZMFJUDUGYTVRY-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- LCWMKIHBLJLORW-UHFFFAOYSA-N gamma-carene Natural products C1CC(=C)CC2C(C)(C)C21 LCWMKIHBLJLORW-UHFFFAOYSA-N 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 229920013819 hydroxyethyl ethylcellulose Polymers 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 235000001510 limonene Nutrition 0.000 description 1
- 229940087305 limonene Drugs 0.000 description 1
- 235000010420 locust bean gum Nutrition 0.000 description 1
- 239000000711 locust bean gum Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- VNKYTQGIUYNRMY-UHFFFAOYSA-N methoxypropane Chemical compound CCCOC VNKYTQGIUYNRMY-UHFFFAOYSA-N 0.000 description 1
- IMXBRVLCKXGWSS-UHFFFAOYSA-N methyl 2-cyclohexylacetate Chemical compound COC(=O)CC1CCCCC1 IMXBRVLCKXGWSS-UHFFFAOYSA-N 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- RXTNIJMLAQNTEG-UHFFFAOYSA-N methylamyl acetate Natural products CCCCC(C)OC(C)=O RXTNIJMLAQNTEG-UHFFFAOYSA-N 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 235000019426 modified starch Nutrition 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940017144 n-butyl lactate Drugs 0.000 description 1
- PZYDAVFRVJXFHS-UHFFFAOYSA-N n-cyclohexyl-2-pyrrolidone Chemical compound O=C1CCCN1C1CCCCC1 PZYDAVFRVJXFHS-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000001814 pectin Substances 0.000 description 1
- 235000010987 pectin Nutrition 0.000 description 1
- 229920001277 pectin Polymers 0.000 description 1
- GXOHBWLPQHTYPF-UHFFFAOYSA-N pentyl 2-hydroxypropanoate Chemical compound CCCCCOC(=O)C(C)O GXOHBWLPQHTYPF-UHFFFAOYSA-N 0.000 description 1
- 150000007875 phellandrene derivatives Chemical class 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 239000003586 protic polar solvent Substances 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- GRWFGVWFFZKLTI-UHFFFAOYSA-N rac-alpha-Pinene Natural products CC1=CCC2C(C)(C)C1C2 GRWFGVWFFZKLTI-UHFFFAOYSA-N 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000013074 reference sample Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 150000003432 sterols Chemical class 0.000 description 1
- 235000003702 sterols Nutrition 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 235000011044 succinic acid Nutrition 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229940057402 undecyl alcohol Drugs 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 235000010493 xanthan gum Nutrition 0.000 description 1
- 239000000230 xanthan gum Substances 0.000 description 1
- 229940082509 xanthan gum Drugs 0.000 description 1
- UHVMMEOXYDMDKI-JKYCWFKZSA-L zinc;1-(5-cyanopyridin-2-yl)-3-[(1s,2s)-2-(6-fluoro-2-hydroxy-3-propanoylphenyl)cyclopropyl]urea;diacetate Chemical compound [Zn+2].CC([O-])=O.CC([O-])=O.CCC(=O)C1=CC=C(F)C([C@H]2[C@H](C2)NC(=O)NC=2N=CC(=CC=2)C#N)=C1O UHVMMEOXYDMDKI-JKYCWFKZSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/16—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
- H01L31/0682—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
- H01L21/2255—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Sustainable Development (AREA)
- Photovoltaic Devices (AREA)
- Formation Of Insulating Films (AREA)
Abstract
本發明是一種阻障層形成用組成物,其含有選自由通式1:(R1)4-nSi(OR2)n所示的至少一種烷氧基矽烷、聚矽氮烷、及將上述烷氧基矽烷水解並縮合聚合而成的矽氧烷樹脂所組成的組群中的至少一種含有矽的化合物、有機黏合劑、及分散介質,且25℃時的黏度為1 Pa.s~100 Pa.s。式中,R1及R2分別獨立地表示碳數1~6的脂肪族烴基或芳香族烴基,n表示1~4的任意整數。在包含2個以上R1或R2時,各R1或各R2可相同亦可不同。
Description
本發明是有關於一種阻障層形成用組成物、帶有阻障層的半導體基板、太陽電池用基板的製造方法及太陽電池元件的製造方法。
對現有的矽太陽電池元件的製造步驟進行說明。
首先,為了促進光封閉效應謀求高效率化,而準備在受光面上形成有紋理(texture)結構的p型矽基板,繼而在磷醯氯(POCl3)、氮氣及氧氣的混合氣體環境下,在800℃~900℃下進行數十分鐘的處理,而在p型矽基板的表面同樣地形成n型擴散層。繼而,在受光面塗佈銀(Ag)等電極膏,在背面側塗佈鋁(Al)等電極膏後,進行熱處理(煅燒),藉此獲得太陽電池元件。
然而,由於在受光面側的電極的正下方不會入射太陽
光,因此該部分不發電。因此,開發了在受光面無電極,且在背面具有n+型擴散層及p+型擴散層,在各擴散層上具有n電極及p電極的背面電極型太陽電池(例如參照日本專利特開2011-507246號公報)。
對形成此種背面電極型太陽電池的方法進行說明。在n型矽基板的受光面及背面的整個面上形成阻障層。此處,阻障層具有抑制摻雜劑在矽基板內擴散的功能。繼而,除去矽基板的背面的阻障層的一部分而形成開口部。繼而,若使p型摻雜劑自阻障層的開口部擴散至矽基板的背面,則會在與開口部對應的區域形成p+型擴散層。繼而,在將矽基板的背面的阻障層全部除去後,再次在矽基板的背面的整個面上形成阻障層。繼而,將與形成有上述p+型擴散層的區域不同的區域的阻障層的一部分除去而形成開口部,使n型摻雜劑自該開口部擴散至矽基板的背面,而形成n+型擴散層。繼而,藉由將矽基板的背面的阻障層全部除去,而在背面形成p+型擴散層及n+型擴散層。繼而,藉由形成紋理結構、抗反射層、鈍化層、電極等而完成背面電極型太陽電池。
提出利用藉由熱氧化法在矽基板表面生成的氧化膜作為上述阻障層的方法(例如參照日本專利特開2002-329880號公報)。另一方面,亦提出使用包含SiO2前驅物的遮蔽膏(masking paste)的阻障層的形成方法(例如參照日本專利特開2011-119341號公報)。
但是上述的日本專利特開2002-329880號公報所記載的
藉由熱氧化法在矽基板表面生成氧化膜的方法中,由於處理過程(throughput)長,因此存在製造成本變高的問題。
另外,日本專利特開2011-119341號公報所記載的使用含有SiO2前驅物的遮蔽膏的方法中,是假定0.1mPa.s~30mPa.s的低黏度膏,藉由網版印刷法的塗佈困難,而難以形成厚的遮罩層。因此,在為該方法時,存在無法充分地防止摻雜劑的擴散的問題。
本發明是鑒於以上現有的問題點而成,課題是提供一種可充分地防止施體元素或受體元素擴散至半導體基板的阻障層形成用組成物、使用其的帶有阻障層的半導體基板、太陽電池用基板的製造方法、及太陽電池元件的製造方法。
用以解決上述課題的具體的方法如以下所述。
<1>一種阻障層形成用組成物,其含有選自由下述通式1所示的至少一種烷氧基矽烷、聚矽氮烷(polysilazane)、及將上述烷氧基矽烷水解並縮合聚合而成的矽氧烷樹脂所組成的組群中的至少一種含有矽的化合物、有機黏合劑、及分散介質,且25℃時的黏度為1Pa.s~100Pa.s。
(R1)4-nSi(OR2)n…通式1
通式1中,R1及R2分別獨立地表示碳數1~6的脂肪族烴基或芳香族烴基,n表示1~4的任意整數。在包含2個以上R1
或R2時,各R1或各R2可相同亦可不同。
<2>如上述<1>所述之阻障層形成用組成物,其中上述含有矽的化合物的含有率以SiO2換算計為1質量%~18質量%。
<3>如上述<1>所述之阻障層形成用組成物,其中上述含有矽的化合物的含有率以SiO2換算計為5質量%~16質量%。
<4>如上述<1>所述之阻障層形成用組成物,其中上述含有矽的化合物的含有率以SiO2換算計為6質量%~13質量%。
<5>如上述<1>至<4>中任一項所述之阻障層形成用組成物,其中上述有機黏合劑包含選自由纖維素衍生物、丙烯酸系樹脂及醇酸樹脂所組成的組群中的至少一種。
<6>如上述<1>至<5>中任一項所述之阻障層形成用組成物,其中上述有機黏合劑包含乙基纖維素。
<7>如上述<1>至<6>中任一項所述之阻障層形成用組成物,其中上述分散介質包含選自由水、醇溶劑、醚溶劑、二醇單醚溶劑及萜烯(terpene)溶劑所組成的組群中的至少一種。
<8>如上述<1>至<6>中任一項所述之阻障層形成用組成物,其中上述分散介質包含選自由萜品醇、丁基卡必醇及丁基卡必醇乙酸酯所組成的組群中的至少一種。
<9>如上述<1>至<8>中任一項所述之阻障層形成用組成物,其中25℃時的黏度為10Pa.s~80Pa.s。
<10>一種帶有阻障層的半導體基板,其具有:半導體基板、及
在上述導體基板上所賦予的作為如上述<1>至<9>中任一項所述之阻障層形成用組成物的乾燥體的阻障層。
<11>一種太陽電池用基板的製造方法,其包括:將如上述<1>至<9>中任一項所述之阻障層形成用組成物賦予至半導體基板上而形成圖案狀阻障層的步驟;在上述半導體基板上的未形成上述阻障層的部分,擴散施體元素或受體元素,而在上述半導體基板內部分地形成擴散層的步驟。
<12>如上述<11>所述之太陽電池用基板的製造方法,其中將上述阻障層形成用組成物賦予至上述半導體基板的方法為網版印刷法。
<13>一種太陽電池元件的製造方法,其包括:在藉由如上述<11>或<12>所述之製造方法而得的太陽電池用基板的擴散層上形成電極的步驟。
根據本發明,可提供一種能充分地防止施體元素或受體元素擴散至半導體基板的阻障層形成用組成物、使用其的帶有阻障層的半導體基板、太陽電池用基板的製造方法、及太陽電池元件的製造方法。
10‧‧‧n型半導體基板
11‧‧‧阻障層
12、13‧‧‧塗佈用擴散材料
12'、13'‧‧‧熱處理物(煅燒物)
14‧‧‧n+型擴散層
15‧‧‧p+型擴散層
16‧‧‧抗反射層
17‧‧‧鈍化層
18‧‧‧n電極(背面電極)
19‧‧‧p電極(背面電極)
圖1(1)~圖1(8)是概念性地表示本發明的太陽電池用基
板及太陽電池元件的製造步驟的一例的剖面圖。
首先,對本發明的阻障層形成用組成物進行說明,繼而對使用阻障層形成用組成物的帶有阻障層的半導體基板、太陽電池用基板的製造方法及太陽電池元件的製造方法進行說明。
另外,在本說明書中「步驟」的用語,不僅是獨立的步驟,而且在無法與其他步驟明確地區別時,若會達成該步驟的所期望的作用,則亦包括在本用語中。另外,本說明書中「~」表示包含其前後所記載的數值分別作為最小值及最大值的範圍。而且本說明書中,關於組成物中的各成分的量,在組成物中存在多種與各成分相當的物質時,只要無特別說明,是指組成物中所存在的該多種物質的合計量。本說明書中「層」的用語是在以平面圖觀察時,除了形成於整個面上的形狀的構成外,亦包括形成於一部分面上的形狀的構成。
另外,有時將施體元素或受體元素稱為摻雜劑。
另外,本發明中的阻障層在以平面圖觀察半導體基板時,不僅包括形成於整個面上的情形,亦包括形成於一部分面上的情形。
<阻障層形成用組成物>
本發明的阻障層形成用組成物含有:選自由下述通式1所示的至少一種烷氧基矽烷、聚矽氮烷、及將上述烷氧基矽烷水解並縮合聚合而成的矽氧烷樹脂所組成的組群中的至少一種含有矽的化合物、有機黏合劑、及分散介質。並且,本發明的阻障層形成
用組成物在25℃時的黏度為1Pa.s~100Pa.s。
(R1)4-nSi(OR2)n…通式1
通式1中,R1及R2分別獨立地表示碳數1~6的脂肪族烴基或芳香族烴基,n表示1~4的任意整數。在包含2個以上R1或R2時,各R1或各R2可相同亦可不同。
以下,將選自由通式(R1)4-nSi(OR2)n所示的至少一種烷氧基矽烷、聚矽氮烷、及將上述烷氧基矽烷水解並縮合聚合而成的矽氧烷樹脂所組成的組群中的至少一種含有矽的化合物亦稱為「特定含有矽的化合物」。所謂矽氧烷化合物,是指具有Si-O-Si鍵的化合物。
本發明的阻障層形成用組成物會阻礙作為摻雜劑的施體元素或受體元素擴散至半導體基板。因此,在半導體基板中在不想擴散施體元素或受體元素的區域,使用本發明的阻障層形成用組成物形成阻障層,藉此可充分地防止上述區域中的施體元素及受體元素的擴散。因此,可在半導體基板內選擇性地形成摻雜區域。對於其理由,可認為如以下所述。
在阻障層形成用組成物中,與可調節為特定黏度的有機黏合劑、分散介質一起包含特定含有矽的化合物,在半導體基板上藉由網版印刷法塗佈該阻障層形成用組成物,進行熱處理而形成的阻障層,具有高的阻障性能。其原因是,藉由網版印刷法可
容易地形成厚的阻障層。另外,藉由使用將黏度調整為1Pa.s~100Pa.s的阻障層形成用組成物,而可形成難以產生龜裂的阻障層。該阻障層具有高的阻障性能、即可有效地防止摻雜劑的擴散。
特定含有矽的化合物是選自由下述通式1所示的至少一種烷氧基矽烷、聚矽氮烷、及將上述烷氧基矽烷水解並縮合聚合而成的矽氧烷樹脂所組成的組群中的至少一種。
(R1)4-nSi(OR2)n 通式1
通式1中,R1及R2分別獨立地為碳數1~6的脂肪族烴基或芳香族烴基,n為1~4的任意整數。在包含2個以上R1或R2時,各R1或各R2可相同亦可不同。
作為R1及R2,可分別獨立地例示:甲基、乙基、正丙基、異丙基、正丁基、異丁基、正戊基、異戊基、正己基、異己基等烷基,苯基,鹵化烷基等。
具體而言,作為烷氧基矽烷,較佳為使用選自由四乙氧基矽烷、四甲氧基矽烷、甲基三甲氧基矽烷及甲基三乙氧基矽烷所組成的組群中的至少一種,更佳為使用選自由四乙氧基矽烷及四甲氧基矽烷所組成的組群中的至少一種。四乙氧基矽烷及四甲氧基矽烷富有反應性,因此容易形成緻密的層,且可形成阻障性能高的阻障層。
另外,作為將烷氧基矽烷水解並縮合聚合而成的矽氧烷
樹脂,可列舉:下述通式2及通式3所示的化合物。
SinOn-1(OCH3)2(n+1) 通式2
SinOn-1(OC2H5)2(n+1) 通式3
通式2及通式3中,n分別獨立地表示2~100的整數,n較佳為2~20,n更佳為3~8。作為此種市售品,可列舉:三菱化學股份有限公司的矽酸甲酯寡聚物「MKC Silicate」、多摩化學工業股份有限公司的矽酸酯(Silicate(矽酸酯)40、Silicate 45、M Silicate 51等)、考科特(COLCOAT)股份有限公司的矽酸酯(Methyl Silicate(矽酸甲酯)51、Methyl Silicate 53A、Ethyl Silicate(矽酸乙酯)40、Ethyl Silicate 48)、如EMS-485的矽酸酯寡聚物,聚二甲基矽氧烷等甲基矽油、甲基苯基矽油、甲基氫矽油、改質矽油等矽油。
另外,作為特定含有矽的化合物,可使用聚矽氮烷。藉由使用反應性高的聚矽氮烷,而容易形成緻密的層,且可形成阻障性能高的阻障層。可使用無機及有機的任一種聚矽氮烷,作為無機聚矽氮烷,例如可列舉:具有下述通式4所示的結構單元的直鏈狀化合物。
[化1]
通式4中,n表示整數。
無機聚矽氮烷的重量平均分子量較佳為690~2000。特別是可列舉:一分子中具有3個~10個SiH3基,且藉由化學分析而得的元素比率為Si:59~61、N:31~34及H:6.5~7.5的各質量%的全氫聚矽氮烷,及聚苯乙烯換算平均分子量為3,000~20,000的範圍內的全氫聚矽氮烷。另外,無機聚矽氮烷的重量平均分子量是藉由凝膠滲透層析法(Gel Permeation Chromatography,GPC),根據使用標準聚苯乙烯的校準曲線進行換算。
作為聚矽氮烷的市售品,可列舉:安智電子材料(AZ Electronic Materials)公司的「NN110」、日本科萊恩(Clariant Japan)公司的「Aquamica」、利茲工廠(R'z Factory)公司的「Hard Barrier XR」等。
為了進行水解,根據需要可在阻障層形成用組成物中添加水、觸媒等。作為觸媒,可例示:鹽酸、硝酸、硫酸、硼酸、磷酸、氫氟酸等無機酸,及甲酸、乙酸、丙酸、丁酸、油酸、亞麻油酸、水楊酸、苯甲酸、鄰苯二甲酸、草酸、乳酸、琥珀酸等有機酸。另外,作為觸媒,可添加氨、胺等鹼。
另外,阻障層形成用組成物中的特定含有矽的化合物的含有率,以SiO2換算計較佳為1質量%~18質量%,更佳為5質量%~16質量%,尤佳為6質量%~13質量%。藉由特定含有矽的化合物的含有率為上述範圍內,而有獲得充分的阻障層控制效果的傾向。
(分散介質)
本發明的阻障層形成用組成物含有分散介質。所謂分散介質,是在組成物中使特定含有矽的化合物或有機黏合劑分散或溶解的介質。
作為上述溶劑,例如可列舉:丙酮、甲基乙基酮、甲基-正丙基酮、甲基異丙基酮、甲基-正丁基酮、甲基異丁基酮、甲基-正戊基酮、甲基-正己基酮、二乙基酮、二丙基酮、二異丁基酮、三甲基壬酮、環己酮、環戊酮、甲基環己酮、2,4-戊烷二酮、丙酮基丙酮等酮溶劑,二乙醚、甲基乙醚、甲基-正丙醚、二異丙醚、四氫呋喃、甲基四氫呋喃、二噁烷、二甲基二噁烷、乙二醇二甲醚、乙二醇二乙醚、乙二醇二-正丙醚、乙二醇二丁醚、二乙二醇單-正丁醚(別名為丁基卡必醇)、二乙二醇二甲醚、二乙二醇二乙醚、二乙二醇甲基乙醚、二乙二醇甲基-正丙醚、二乙二醇甲基-正丁醚、二乙二醇二-正丙醚、二乙二醇二-正丁醚、二乙二醇甲基-正己醚、三乙二醇二甲醚、三乙二醇二乙醚、三乙二醇甲基乙醚、三乙二醇甲基-正丁醚、三乙二醇二-正丁醚、三乙二醇甲基-正己醚、四乙二醇二甲醚、四乙二醇二乙醚、四乙二醇甲基乙醚、
四乙二醇甲基-正丁醚、四乙二醇二-正丁醚、四乙二醇甲基-正己醚、四乙二醇二-正丁醚、丙二醇二甲醚、丙二醇二乙醚、丙二醇二-正丙醚、丙二醇二丁醚、二丙二醇二甲醚、二丙二醇二乙醚、二丙二醇甲基乙醚、二丙二醇甲基-正丁醚、二丙二醇二-正丙醚、二丙二醇二-正丁醚、二丙二醇甲基-正己醚、三丙二醇二甲醚、三丙二醇二乙醚、三丙二醇甲基乙醚、三丙二醇甲基-正丁醚、三丙二醇二-正丁醚、三丙二醇甲基-正己醚、四丙二醇二甲醚、四丙二醇二乙醚、四丙二醇甲基乙醚、四丙二醇甲基-正丁醚、四丙二醇二-正丁醚、四丙二醇甲基-正己醚等醚溶劑,乙酸甲酯、乙酸乙酯、乙酸正丙酯、乙酸異丙酯、乙酸正丁酯、乙酸異丁酯、乙酸第二丁酯、乙酸正戊酯、乙酸第二戊酯、乙酸3-甲氧基丁酯、乙酸甲基戊酯、乙酸2-乙基丁酯、乙酸2-乙基己酯、乙酸2-(2-丁氧基乙氧基)乙酯、乙酸苄酯、乙酸環己酯、乙酸甲基環己酯、乙酸壬酯、乙醯乙酸甲酯、乙醯乙酸乙酯、乙酸二乙二醇甲醚酯、乙酸二乙二醇單乙醚酯、乙酸二乙二醇單-正丁醚酯(別名為丁基卡必醇乙酸酯)、乙酸二丙二醇甲醚酯、乙酸二丙二醇乙醚酯、二乙酸二醇酯、乙酸甲氧基三乙二醇酯、丙酸乙酯、丙酸正丁酯、丙酸異戊酯、草酸二乙酯、草酸二-正丁酯、乳酸甲酯、乳酸乙酯、乳酸正丁酯、乳酸正戊酯、乙二醇甲醚丙酸酯、乙二醇乙醚丙酸酯、乙二醇甲醚乙酸酯、乙二醇乙醚乙酸酯、丙二醇甲醚乙酸酯、丙二醇乙醚乙酸酯、丙二醇丙醚乙酸酯、γ-丁內酯、γ-戊內酯等酯溶劑,乙腈、N-甲基吡咯啶酮、N-乙基吡咯啶酮、N-丙基吡咯啶酮、N-
丁基吡咯啶酮、N-己基吡咯啶酮、N-環己基吡咯啶酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、二甲基亞碸等非質子性極性溶劑,甲醇、乙醇、正丙醇、異丙醇、正丁醇、異丁醇、第二丁醇、第三丁醇、正戊醇、異戊醇、2-甲基丁醇、第二戊醇、第三戊醇、3-甲氧基丁醇、正己醇、2-甲基戊醇、第二己醇、2-乙基丁醇、第二庚醇、正辛醇、2-乙基己醇、第二辛醇、正壬醇、正癸醇、第二-十一烷基醇、三甲基壬醇、第二-十四烷基醇、第二-十七烷基醇、苯酚、環己醇、甲基環己醇、苄醇、異莰基環己醇、乙二醇、1,2-丙二醇、1,3-丁二醇、二乙二醇、二丙二醇、三乙二醇、三丙二醇等醇溶劑,乙二醇單甲醚、乙二醇單乙醚(溶纖劑)、乙二醇單苯醚、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇單-正丁醚、二乙二醇單-正己醚、乙氧基三甘醇(glycol)、四乙二醇單-正丁醚、丙二醇單甲醚、二丙二醇單甲醚、二丙二醇單乙醚、三丙二醇單甲醚等二醇單醚溶劑,α-萜品烯、α-萜品醇、月桂油烯、別羅勒烯(Allo-ocimene)、檸檬烯、二戊烯、α-蒎烯、β-蒎烯、萜品醇(terpineol)、香芹酮(carvone)、羅勒烯、水芹烯(phellandrene)等萜烯溶劑,二甲苯、異莰基苯酚、1-異丙基-4-甲基-雙環[2.2.2]辛-5-烯-2,3-二甲酸酐、及對薄荷烯基苯酚。該些可單獨使用一種或組合二種以上而使用。
該些中,就對半導體基板的塗佈性的觀點而言,作為分散介質,較佳為選自由水、醇溶劑、醚溶劑、二醇單醚溶劑及萜烯溶劑所組成的組群中的至少一種,更佳為水、醇、溶纖劑、萜
品醇(α-萜品醇等)、二乙二醇單-正丁醚、或乙酸二乙二醇單-正丁醚,尤佳為選自由萜品醇、丁基卡必醇及丁基卡必醇乙酸酯所組成的組群中的至少一種。
阻障層形成用組成物中的分散介質的含有率考慮塗佈性、及摻雜劑濃度而確定,例如較佳為5質量%以上、99質量%以下,更佳為20質量%以上、95質量%以下,尤佳為40質量%以上、90質量%以下。
(有機黏合劑)
本發明的阻障層形成用組成物含有有機黏合劑。藉由含有有機黏合劑,而可調節黏度,並且可抑制網版印刷時的印刷線的底切(undercut)。
作為有機黏合劑,例如可適當選擇:聚乙烯醇、聚丙烯醯胺樹脂、聚乙烯醯胺樹脂、聚乙烯吡咯啶酮樹脂、聚環氧乙烷樹脂,聚碸樹脂、丙烯醯胺烷基碸樹脂,纖維素醚、羧基甲基纖維素、羥基乙基纖維素、乙基纖維素等纖維素衍生物,明膠、明膠衍生物,澱粉、澱粉衍生物,海藻酸鈉化合物,黃原膠(xanthan)、瓜爾膠(guar gum)、瓜爾膠衍生物,硬葡聚糖(scleroglucan)、硬葡聚糖衍生物,黃蓍膠(tragacanth)、黃蓍膠衍生物,糊精、糊精衍生物,(甲基)丙烯酸樹脂、(甲基)丙烯酸烷基酯樹脂、(甲基)丙烯酸二甲基胺基乙酯樹脂等含有胺基的(甲基)丙烯酸酯樹脂,丁二烯樹脂,苯乙烯樹脂,丁醛樹脂,及該些的共聚物。
該些中,作為有機黏合劑,就分解性、及防止網版印刷
時的滴液的觀點而言,較佳為包含選自由丙烯酸樹脂、醇酸樹脂及纖維素衍生物所組成的組群中的至少一種,更佳為至少包含纖維素衍生物。作為纖維素衍生物,可例示:乙基纖維素、硝基纖維素、乙醯基纖維素、羧基甲基纖維素、甲基纖維素、羥基丙基纖維素、羥基乙基纖維素,該些中較佳為使用乙基纖維素。該些可單獨使用一種或組合二種以上而使用。
有機黏合劑的分子量並無特別限制,理想為鑒於作為組成物的所期望的黏度而適當調整。在阻障層形成用組成物中,有機黏合劑的含有率較佳為0.5質量%以上、30質量%以下,更佳為3質量%以上、25質量%以下,尤佳為3質量%以上、20質量%以下。
另外,作為上述分散介質及有機黏合劑,可使用溶解了有機黏合劑的分散介質。
另外,阻障層形成用組成物可使用作為溶劑而例示的異莰基環己醇,來作為與有機黏合劑一起使用或替代有機黏合劑的材料。異莰基環己醇可作為「Terusolve MTPH」(日本萜化學股份有限公司、商品名)而自商業獲得。異莰基環己醇的沸點高達308℃~318℃,且自阻障層除去時,無需如有機黏合劑般藉由煅燒進行脫脂處理,而是可藉由利用加熱使其氣化而消失。
在阻障層形成用組成物含有異莰基環己醇時,在阻障層形成用組成物的總質量中,異莰基環己醇的含有率較佳為0.5質量%~85質量%,更佳為1質量%~80質量%,尤佳為2質量%~80
質量%。
(其他成分)
阻障層形成用組成物除了特定含有矽的化合物、有機黏合劑、及分散介質外,根據需要可含有增黏劑、濕潤劑、界面活性劑、無機粉末、觸變劑等各種添加劑來作為其他成分。
作為上述界面活性劑,可列舉:非離子界面活性劑、陽離子界面活性劑、陰離子界面活性劑等。其中,就在半導體裝置中的重金屬等雜質的帶入少而言,較佳為非離子界面活性劑或陽離子界面活性劑。而且作為非離子界面活性劑,可例示:含有矽的界面活性劑、含有氟的界面活性劑及有機系界面活性劑,就擴散等在加熱時迅速地煅燒而言,較佳為有機系界面活性劑。
作為有機系界面活性劑,可例示:環氧乙烷-環氧丙烷的嵌段共聚物、乙炔二醇化合物等,就進一步降低半導體裝置的電阻值的不均而言,更佳為乙炔二醇化合物。
作為無機粉末,可例示:氧化矽、氮化矽、碳化矽等的粉末。
阻障層形成用組成物可含有觸變劑。藉此可容易地控制觸變性,並可構成具有適合於網版印刷的黏度的網版印刷用阻障層形成用組成物。而且,藉由控制觸變性,而可控制印刷時的阻障層形成用組成物的印刷圖案的滲出及毛邊。
作為觸變劑,可例示:聚醚化合物、脂肪酸醯胺、有機填料、無機填料、氫化蓖麻油、脲胺基甲酸酯醯胺、生物膠
(biogum)、瓜爾膠、刺槐豆膠(Locust bean gum)、角叉菜膠、果膠、瓊脂、β-葡聚糖、羅望籽膠(tamarind seed gum)、車前籽膠(psyllium seed gum)、聚乙烯吡咯啶酮、矽酮系增黏凝膠化劑及油系凝膠化劑(商品名:GEL ALL(新日本理化股份有限公司)、「GEL ALL」為註冊商標)。
上述的有機黏合劑亦可兼作觸變劑的作用,作為此種材料,可列舉乙基纖維素。
本發明的阻障層形成用組成物就不污染半導體基板、即抑制半導體基板中的載子(carrier)的再結合的觀點而言,在阻障層形成用組成物中,鐵、鎢、金、鎳、鉻、錳等金屬的含有率較佳為10質量%以下,更佳為5質量%以下,尤佳為1質量%以下。
阻障層形成用組成物在25℃時的黏度為1Pa.s~100Pa.s。
本說明書中所謂黏度,定義為將在25℃下以每分鐘特定次數(min-1、1/60sec-1)使EMD型旋轉黏度計旋轉1分鐘時的測定值乘以特定換算係數而得的值。換算係數因因轉速及所用的錐(cone)的種類而不同。本說明書中,使用安裝有錐角度為3°、錐半徑為14mm的錐形轉子(cone rotor)的EMD型旋轉黏度計,對保持為25℃±1℃的阻障層形成用組成物測定黏度。
本發明的阻障層形成用組成物在25℃下藉由EHD型旋轉黏度計以旋轉速度為0.5min-1~5min-1測定的黏度為1Pa.s~100Pa.s,更佳為5Pa.s~80Pa.s,尤佳為10Pa.s~80Pa.s,特佳
為10Pa.s~60Pa.s。若阻障層形成用組成物的黏度為1Pa.s以上,則在塗佈於半導體基板上時難以引起滴液,並且若阻障層形成用組成物的黏度為100Pa.s以下,則可形成細的塗佈圖案。
本發明的阻障層形成用組成物可藉由使用摻合機、研缽、轉子、自轉-公轉攪拌機等,將特定含有矽的化合物、有機黏合劑、分散介質、以及根據需要而添加的成分混合而得。另外,在混合時,亦可根據需要進行加熱。此時的加熱溫度例如可設為30℃~100℃。
<帶有阻障層的半導體基板>
本發明的帶有阻障層的半導體基板具有:半導體基板、及在上述半導體基板上所賦予的作為上述阻障層形成用組成物的乾燥體的阻障層。藉由在半導體基板上設置阻障層,而可在設置了阻障層的區域以外的區域選擇性地形成雜質擴散層。
作為阻障層形成用組成物在半導體基板上的賦予量,並無特別限制,較佳為設為0.01g/m2~100g/m2,更佳為0.1g/m2~20g/m2。賦予阻障層形成用組成物而形成的阻障層的厚度並無特別限制,較佳為0.1μm~50μm,更佳為1μm~30μm。
另外,阻障層為阻障層形成用組成物的乾燥體,是將阻障層形成用組成物中所含的分散介質的至少一部分除去而形成。作為分散介質的除去方法,例如可列舉:在80℃~500℃左右的溫度下,在使用加熱板時,進行1分鐘~10分鐘的熱處理,在使用乾燥機等時,進行10分鐘~30分鐘左右的熱處理的方法。該熱處
理條件根據阻障層形成用組成物的分散介質的種類及含量而調節,在本發明中並不特別限定於上述條件。
阻障層中的分散介質的含有率(殘存率)並無特別限制。阻障層中的分散介質的含有率較佳為30質量%以下,更佳為0.01質量%~15質量%,尤佳為0.1質量%~5質量%。阻障層中的分散介質的含有率可根據阻障層形成用組成物中的非揮發性成分的含量與阻障層形成用組成物在半導體基板上的賦予量而算出。
<太陽電池用基板及太陽電池元件的製造方法>
本發明的太陽電池用基板的製造方法包括:將上述阻障層形成用組成物賦予至半導體基板上而形成圖案狀阻障層的步驟;及在上述半導體基板上的未形成上述阻障層的部分,擴散施體元素或受體元素,而在上述半導體基板內部分地形成擴散層的步驟。
另外,本發明的太陽電池元件的製造方法包括:在藉由上述製造方法而得的太陽電池用基板的擴散層上形成電極的步驟。
此處,一邊參照圖1(1)~圖1(8)一邊對使用本發明的阻障層形成用組成物的太陽電池用基板及太陽電池元件的製造方法進行說明。圖1(1)~圖1(8)是概念性地表示本發明的太陽電池用基板及太陽電池元件的製造步驟的一例的示意剖面圖。
另外,圖1(1)~圖1(8)中對背面電極型太陽電池用基板及太陽電池元件進行說明,但本發明的阻障層形成用組成
物亦可應用於任意形式的太陽電池用基板及太陽電池元件。
作為背面電極型以外的其他形式,可例示:選擇性射極(selective emitter)型及兩面受光型。在選擇性射極型太陽電池用基板中,在受光面側的電極正下方形成摻雜劑濃度高於其他區域的擴散層。在形成該高濃度的擴散層的區域時,可使用本發明的阻障層形成用組成物。另外,在兩面受光型太陽電池元件中,在兩面形成指排(finger bar)及匯流排(bus bar)作為電極,在半導體基板的一個面上形成n+型擴散層,在另一個面上形成p+型擴散層。為了在位置上選擇性地形成該n+型擴散層及p+型擴散層,而可使用本發明的阻障層形成用組成物。
圖1(1)中,在作為n型半導體基板10的矽基板上賦予鹼溶液而除去損傷層,並藉由蝕刻而獲得紋理結構。
詳細內容是,藉由20質量%氫氧化鈉水溶液除去自錠切片時所產生的矽基板表面的損傷層。繼而,藉由包含1質量%氫氧化鈉水溶液與10質量%異丙醇的水溶液,將矽基板蝕刻,而在n型半導體基板10上形成紋理結構(圖中省略紋理結構的記載)。太陽電池元件藉由在n型半導體基板10的受光面側形成紋理結構,而促進光封閉效應,並謀求高效率化。
圖1(2)中,在n型半導體基板10的受光面及作為該受光面的相反面的背面,賦予本發明的阻障層形成用組成物,而形成阻障層11。本發明中,賦予方法並無限制,可列舉:印刷法、旋塗法、刷塗、噴霧法、刮刀法、輥塗法、噴墨法等,較佳為使
用網版印刷法。
作為上述阻障層形成用組成物的賦予量,並無特別限制,較佳為設為0.01g/m2以上、100g/m2以下,更佳為0.1g/m2以上、20g/m2以下。上述阻障層形成用組成物的塗佈厚度並無特別限制,較佳為0.1μm以上、50μm以下,更佳為1μm以上、30μm以下。
另外,根據阻障層形成用組成物的組成,有時在賦予後需要用以使組成物中所含的分散介質揮發的乾燥步驟。該情況下,在80℃~300℃左右的溫度下,在使用加熱板時,乾燥1分鐘~10分鐘,在使用乾燥機等時,乾燥10分鐘~30分鐘左右。該乾燥條件根據阻障層形成用組成物的分散介質的含量而調節,本發明中並不特別限定於上述條件。該情況下,阻障層可作為將阻障層形成用組成物乾燥的乾燥體而獲得。
另外,在背面將阻障層形成為圖案狀。在為印刷法、噴墨法等時,圖案狀阻障層可藉由將阻障層形成用組成物11賦予成圖案狀而得。另一方面,在為旋塗法、刷塗、噴霧法、刮刀法、輥塗法等時,可藉由將阻障層形成用組成物11塗佈於整個面上後,利用蝕刻等部分地除去而獲得圖案狀阻障層。
繼而,在圖1(3)中,塗佈用以形成n+型擴散層及p+型擴散層的塗佈用擴散材料12、塗佈用擴散材料13。繼而,在圖1(4)中,進行熱擴散而在n型半導體基板10上形成n+型擴散層14、p+型擴散層15。藉由用以熱擴散的熱處理,而塗佈用擴散材
料12、塗佈用擴散材料13成為塗佈用擴散材料的熱處理物(煅燒物)12'、熱處理物(煅燒物)13',並且通常形成玻璃層。作為用以進行熱擴散的熱處理溫度,並無特別限制,較佳為在750℃~1050℃的溫度下在1分鐘~300分鐘的條件下進行熱處理。
此處,對一次性形成n+型擴散層14與p+型擴散層15的方法進行圖示,但亦可逐個地擴散。例如,首先塗佈用以形成p+型擴散層15的塗佈用擴散材料13並進行熱擴散,將塗佈用擴散材料的熱處理物(煅燒物)13'除去後,塗佈用以形成n+型擴散層14的塗佈用擴散材料12並進行熱擴散,而可除去塗佈用擴散材料的熱處理物(煅燒物)12'。
另外,此處對使用塗佈用擴散材料12、塗佈用擴散材料13的情形進行了說明,但亦可同樣地應用於使用POCl3氣或BBr3氣的方法。該情況下,首先將n型半導體基板10中形成p+型擴散層15的預定的區域作為開口部,並在作為該開口部的區域以外藉由阻障層形成用組成物形成阻障層11。繼而,在與該開口部對應的n型半導體基板10上形成p+型擴散層15後,將阻障層11除去。繼而,將形成n+型擴散層14的預定的區域作為開口部,並在作為該開口部的區域以外藉由阻障層形成用組成物形成阻障層11。繼而,在與該開口部對應的n型半導體基板10上形成n+型擴散層14。
繼而,在圖1(5)中,將阻障層11、及塗佈用擴散材料的熱處理物(煅燒物)12'、熱處理物(煅燒物)13'除去,而獲
得太陽電池用基板。作為上述除去方法,可列舉:浸漬於包含酸的水溶液中等方法,較佳為根據阻障層11、及用以形成n+型擴散層14及p+型擴散層15的塗佈用擴散材料的熱處理物(煅燒物)12'、熱處理物(煅燒物)13'的組成進行確定。具體而言,較佳為包括:藉由包含氫氟酸的水溶液,將藉由熱擴散處理在半導體基板上生成的玻璃層[熱處理物(煅燒物)12'、熱處理物(煅燒物)13']、及阻障層11進行蝕刻的步驟。
繼而,在圖1(6)中,在受光面上賦予抗反射層16,在背面賦予鈍化層17。抗反射層16與鈍化層17的組成可相同亦可不同。作為抗反射層16,例如可列舉氮化矽層,作為鈍化層17,例如可列舉氧化矽層。抗反射層及鈍化層的厚度並無特別限制,較佳為設為10nm~300nm,更佳為設為30nm~150nm。
繼而,在圖1(7)中,將在n+型擴散層14、及p+型擴散層15上(背面側)的鈍化層17上形成電極的部位開口。開口的方法並無特別限制,例如可藉由利用噴墨法等在欲開口的部位塗佈蝕刻液(例如包含氫氟酸、氟化銨或磷酸的溶液),並進行熱處理而開口。
繼而,在圖1(8)中,在n+型擴散層14、及p+型擴散層15上(背面側)分別形成n電極18及p電極19。本發明中,n電極18及p電極19的材質及形成方法並無特別限定。例如可塗佈包含鋁、銀、或銅的電極形成用膏並乾燥而形成n電極18及p電極19。繼而,將n電極18及p電極19進行熱處理(煅燒)而
完成太陽電池元件。
另外,若使用包含玻璃粉者作為上述電極形成用膏,則可省略圖1(7)中所示的開口的步驟。若將包含玻璃粉的電極形成用膏塗佈於鈍化層17上,在600℃~900℃的範圍內進行數秒鐘~數分鐘的熱處理(煅燒)後,則玻璃粉將背面側的鈍化層17熔融,膏中的金屬粒子(例如銀粒子)與矽基板10形成接觸部並凝固。藉此,將所形成的背面電極18、背面電極19與矽基板10導通。其稱為燒穿(fire through)。
<太陽電池>
太陽電池包含上述太陽電池元件的至少一種,在太陽電池元件的電極上配置配線材料而構成。太陽電池進一步根據需要可經由配線材料將多個太陽電池元件連結,並進一步藉由密封材料進行密封。
作為上述配線材料及密封材料,並無特別限制,可自業界通常所用者中適當選擇。
[實施例]
以下,對本發明的實施例進行更具體地說明,但本發明並不限定於該些實施例。另外,只要無特別記述,化學品全部使用試劑。另外,只要無特別說明,「%」是指「質量%」。
<實施例1>
(阻障層形成用組成物11的製備)
在萜品醇(日本萜化學(Nippon Terpene Chemicals)股份有
限公司「TERPINEOL-LW」)8.5g中添加乙基纖維素(陶氏化學(Dow Chemical)公司「ETHOCEL STD200」、(ETHOCEL)為註冊商標)1.5g,在150℃下溶解1小時,而製備15質量%乙基纖維素/萜品醇溶液。
將矽酸乙酯(多摩化學工業股份有限公司「Silicate 40」、SiO2換算量:40%)1.5g(矽化合物以SiO2換算計為6質量%)、15質量%乙基纖維素/萜品醇溶液4.3g(乙基纖維素:6.45質量%)、及萜品醇4.2g(萜品醇:63.55質量%)加入塑膠製容器中。使用自轉-公轉攪拌機(新基(Thinky)股份有限公司「AR-100」),將上述成分混合10分鐘,而製備阻障層形成用組成物11。
該阻障層形成用組成物11在25℃、5min-1時的黏度為25Pa.s。黏度是使用EHD型黏度計(東京計器股份有限公司、錐角度:3°、錐半徑:14mm),將阻障層形成用組成物的取樣量設為0.4ml而測定。
(磷擴散液的製備)
製備磷酸二氫銨(和光純藥工業股份有限公司)的20質量%水溶液,使用上清液的飽和磷酸二氫銨水溶液作為磷擴散液。
(熱擴散及蝕刻步驟)
在經紋理處理的n型矽基板(以下亦稱為「n型矽基板」)表面上,藉由網版印刷(MT-320T、中晶科技(MICROTEK)股份有限公司)塗佈阻障層形成用組成物11,並在150℃的加熱板上乾燥5分鐘後,藉由500℃的加熱板乾燥1分鐘。將其作為帶有阻
障層基板。
繼而,準備另外的矽基板,將磷擴散液以500min-1進行旋塗(三笠(MIKASA)股份有限公司、MS-A100),並在200℃下乾燥。將其作為對向擴散用基板。
在使帶有阻障層基板與對向擴散用基板以距離1mm對向的狀態下,在850℃下加熱30分鐘,使磷擴散至帶有阻障層基板中。然後,將帶有阻障層基板於10質量%鹽酸水溶液中浸漬5分鐘後進行水洗,繼而於2.5質量%氫氟酸水溶液中浸漬5分鐘。將其進行水洗並乾燥後,進行下述評價。
(薄片電阻的測定)
塗佈了阻障層形成用組成物的部分的基板的薄片電阻,是使用三菱化學股份有限公司、Loresta-EP MCP-T360型低電阻率計,藉由四探針法進行測定。塗佈了阻障層形成用組成物11的部分的薄片電阻為190Ω/□。未塗佈的部分的薄片電阻為40Ω/□。
另外,作為參照試樣,將切片後的n型矽基板於2.5質量%HF水溶液中浸漬5分鐘,將其水洗,並測定乾燥後的薄片電阻,結果為240Ω/□。
<實施例2~實施例6、比較例1>
製備表1及表2所示的組成的阻障層形成用組成物,以與實施例1相同的方式進行評價。將結果表示於表1及表2。另外,表1及表2中所示的材料如以下所述。另外,表中「-」表示未添加。
矽酸甲酯:多摩化學工業股份有限公司、製品名「M Silicate
51」、SiO2換算量:51質量%
聚矽氮烷:安智電子材料公司、製品名「NN110」(10質量%聚矽氮烷/二甲苯溶液)、SiO2換算量:約13.3質量%
丁基卡必醇乙酸酯:和光純藥工業股份有限公司
氧化矽:高純度化學研究所股份有限公司、製品名氧化矽(平均粒徑:1μm)
根據以上所述可知,藉由使用包含特定含有矽的化合物、有機黏合劑、及分散介質,且25℃時的黏度為1Pa.s~100Pa.s的阻障層形成用組成物,而可充分地防止摻雜劑擴散至半導體基板。另外可知,可抑制半導體基板的表面粗糙。
10‧‧‧n型半導體基板
11‧‧‧阻障層
12、13‧‧‧塗佈用擴散材料
12'、13'‧‧‧熱處理物(煅燒物)
14‧‧‧n+型擴散層
15‧‧‧p+型擴散層
16‧‧‧抗反射層
17‧‧‧鈍化層
18‧‧‧n電極(背面電極)
19‧‧‧p電極(背面電極)
Claims (13)
- 一種阻障層形成用組成物,其含有:選自由下述通式1所示的至少一種烷氧基矽烷、聚矽氮烷、及將上述烷氧基矽烷水解並縮合聚合而成的矽氧烷樹脂所組成的組群中的至少一種含有矽的化合物;有機黏合劑;以及分散介質,且25℃時的黏度為1Pa.s~100Pa.s:(R1)4-nSi(OR2)n…通式1[通式1中,R1及R2分別獨立地表示碳數1~6的脂肪族烴基或芳香族烴基,n表示1~4的任意整數;在包含2個以上R1或R2時,各R1或各R2可相同亦可不同]。
- 如申請專利範圍第1項所述之阻障層形成用組成物,其中上述含有矽的化合物的含有率以SiO2換算計為1質量%~18質量%。
- 如申請專利範圍第1項所述之阻障層形成用組成物,其中上述含有矽的化合物的含有率以SiO2換算計為5質量%~16質量%。
- 如申請專利範圍第1項所述之阻障層形成用組成物,其中上述含有矽的化合物的含有率以SiO2換算計為6質量%~13質量 %。
- 如申請專利範圍第1項至第4項中任一項所述之阻障層形成用組成物,其中上述有機黏合劑包含選自由纖維素衍生物、丙烯酸系樹脂及醇酸樹脂所組成的組群中的至少一種。
- 如申請專利範圍第1項至第5項中任一項所述之阻障層形成用組成物,其中上述有機黏合劑包含乙基纖維素。
- 如申請專利範圍第1項至第6項中任一項所述之阻障層形成用組成物,其中上述分散介質包含選自由水、醇溶劑、醚溶劑、二醇單醚溶劑及萜烯溶劑所組成的組群中的至少一種。
- 如申請專利範圍第1項至第6項中任一項所述之阻障層形成用組成物,其中上述分散介質包含選自由萜品醇、丁基卡必醇及丁基卡必醇乙酸酯所組成的組群中的至少一種。
- 如申請專利範圍第1項至第8項中任一項所述之阻障層形成用組成物,其中25℃時的黏度為10Pa.s~80Pa.s。
- 一種帶有阻障層的半導體基板,其具有:半導體基板;以及在上述導體基板上所賦予的作為如申請專利範圍第1項至第9項中任一項所述之阻障層形成用組成物的乾燥體的阻障層。
- 一種太陽電池用基板的製造方法,其包括:將如申請專利範圍第1項至第9項中任一項所述之阻障層形成用組成物賦予至半導體基板上而形成圖案狀阻障層的步驟;以及 在上述半導體基板上的未形成上述阻障層的部分,擴散施體元素或受體元素,而在上述半導體基板內部分地形成擴散層的步驟。
- 如申請專利範圍第11項所述之太陽電池用基板的製造方法,其中將上述阻障層形成用組成物賦予至上述半導體基板的方法為網版印刷法。
- 一種太陽電池元件的製造方法,其包括:在藉由如申請專利範圍第11項或第12項所述之製造方法而得的太陽電池用基板的擴散層上形成電極的步驟。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013024351 | 2013-02-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201434884A true TW201434884A (zh) | 2014-09-16 |
Family
ID=51354116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103104631A TW201434884A (zh) | 2013-02-12 | 2014-02-12 | 阻障層形成用組成物、帶有阻障層的半導體基板、太陽電池用基板的製造方法及太陽電池元件的製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6447493B2 (zh) |
KR (1) | KR20150117644A (zh) |
CN (1) | CN104969364A (zh) |
TW (1) | TW201434884A (zh) |
WO (1) | WO2014126117A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105355721B (zh) * | 2015-12-09 | 2017-09-29 | 苏州徕士达新材料科技有限公司 | 一种太阳能电池扩散阻挡隔离层的合成制备方法 |
KR101921328B1 (ko) | 2016-07-23 | 2018-11-22 | (주)디엔에프 | 반사방지용 코팅 조성물 |
CN109844959A (zh) | 2016-09-29 | 2019-06-04 | 京瓷株式会社 | 太阳能电池元件及太阳能电池元件的制造方法 |
JP2020180274A (ja) * | 2019-04-23 | 2020-11-05 | 住友化学株式会社 | 混合組成物 |
KR20210128235A (ko) * | 2020-04-16 | 2021-10-26 | 삼성에스디아이 주식회사 | 실리카 막 형성용 조성물, 그로부터 형성된 실리카 막, 및 상기 실리카 막을 포함하는 전자 소자 |
CN117148481B (zh) * | 2023-11-01 | 2023-12-29 | 南通创亿达新材料股份有限公司 | 一种增亮型光学板制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100499171B1 (ko) * | 2003-07-21 | 2005-07-01 | 삼성전자주식회사 | 스핀온글래스에 의한 산화실리콘막의 형성방법 |
CN100444331C (zh) * | 2003-11-11 | 2008-12-17 | 三星电子株式会社 | 旋涂玻璃组合物和在半导体制造工序中使用该旋涂玻璃形成氧化硅层的方法 |
US20080166870A1 (en) * | 2004-06-04 | 2008-07-10 | International Business Machines Corporation | Fabrication of Interconnect Structures |
US7846823B2 (en) * | 2005-08-12 | 2010-12-07 | Sharp Kabushiki Kaisha | Masking paste, method of manufacturing same, and method of manufacturing solar cell using masking paste |
WO2010024378A1 (ja) * | 2008-08-29 | 2010-03-04 | 独立行政法人産業技術総合研究所 | 酸化ケイ素薄膜または酸窒化ケイ素化合物薄膜の製造方法およびこの方法で得られる薄膜 |
CN101814547A (zh) * | 2009-02-19 | 2010-08-25 | 上海交大泰阳绿色能源有限公司 | 一种选择性发射极晶体硅太阳能电池的制备方法 |
JP4831709B2 (ja) * | 2010-05-21 | 2011-12-07 | シャープ株式会社 | 半導体装置および半導体装置の製造方法 |
JP6001268B2 (ja) * | 2011-01-31 | 2016-10-05 | 東京応化工業株式会社 | ケイ素含有膜形成組成物および不純物拡散層の形成方法 |
-
2014
- 2014-02-12 KR KR1020157018527A patent/KR20150117644A/ko not_active Application Discontinuation
- 2014-02-12 WO PCT/JP2014/053227 patent/WO2014126117A1/ja active Application Filing
- 2014-02-12 JP JP2015500268A patent/JP6447493B2/ja not_active Expired - Fee Related
- 2014-02-12 CN CN201480006954.1A patent/CN104969364A/zh active Pending
- 2014-02-12 TW TW103104631A patent/TW201434884A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JPWO2014126117A1 (ja) | 2017-02-02 |
CN104969364A (zh) | 2015-10-07 |
WO2014126117A1 (ja) | 2014-08-21 |
JP6447493B2 (ja) | 2019-01-09 |
KR20150117644A (ko) | 2015-10-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201434884A (zh) | 阻障層形成用組成物、帶有阻障層的半導體基板、太陽電池用基板的製造方法及太陽電池元件的製造方法 | |
JP6185845B2 (ja) | 酸化アルミニウムベースの金属配線バリア | |
JP5339012B1 (ja) | 太陽電池用基板の製造方法および太陽電池素子の製造方法 | |
JP2016015509A (ja) | p型拡散層形成組成物、p型拡散層の製造方法及び太陽電池素子の製造方法 | |
JP6295952B2 (ja) | 太陽電池素子及びその製造方法、並びに太陽電池モジュール | |
JP2011187894A (ja) | リンドーパント拡散用塗布液、それにより形成された塗布膜および太陽電池の製造方法 | |
EP2573800A1 (en) | Diffusion agent composition, method of forming an impurity diffusion layer, and solar cell | |
CN107484432A (zh) | 可同时抑制在共扩散方法中的磷扩散的可丝网印刷的硼掺杂糊料 | |
JP7459511B2 (ja) | 半導体素子の製造方法、および、太陽電池の製造方法 | |
TWI545626B (zh) | 擴散劑組成物、雜質擴散層之形成方法及太陽能電池 | |
TWI589012B (zh) | 太陽電池元件及其製造方法 | |
JP2015026666A (ja) | 両面受光型太陽電池素子、その製造方法及び両面受光型太陽電池モジュール | |
TWI605052B (zh) | 鈍化層形成用組成物、帶有鈍化層的半導體基板、帶有鈍化層的半導體基板之製造方法、太陽電池元件、太陽電池元件的製造方法以及太陽電池 | |
JP6295953B2 (ja) | 太陽電池素子及びその製造方法、並びに太陽電池モジュール | |
JP5935256B2 (ja) | p型拡散層形成組成物、p型拡散層の製造方法、及び太陽電池素子の製造方法 | |
EP2495770A1 (en) | Method for producing solar cell | |
JP2014167961A (ja) | パッシベーション膜用組成物、パッシベーション膜付半導体基板及びその製造方法、並びに太陽電池素子及びその製造方法 | |
JP2018016511A (ja) | 保護層形成用組成物、太陽電池素子、太陽電池素子の製造方法及び太陽電池 | |
JP2016213230A (ja) | p型拡散層付き半導体基板の製造方法、p型拡散層付き半導体基板、太陽電池素子の製造方法及び太陽電池素子 | |
WO2018012547A1 (ja) | p型拡散層付き半導体基板の製造方法、p型拡散層付き半導体基板、太陽電池素子の製造方法、及び太陽電池素子 | |
WO2016068315A1 (ja) | n型拡散層形成組成物、n型拡散層の製造方法及び太陽電池素子の製造方法 | |
JP2016213231A (ja) | p型拡散層付き半導体基板の製造方法、p型拡散層付き半導体基板、太陽電池素子の製造方法及び太陽電池素子 | |
JP2017054918A (ja) | n型拡散層形成用組成物、n型拡散層を有する半導体基板の製造方法及び太陽電池素子の製造方法 |