TW201433860A - 基板貼合裝置及基板貼合用具 - Google Patents

基板貼合裝置及基板貼合用具 Download PDF

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Publication number
TW201433860A
TW201433860A TW103106371A TW103106371A TW201433860A TW 201433860 A TW201433860 A TW 201433860A TW 103106371 A TW103106371 A TW 103106371A TW 103106371 A TW103106371 A TW 103106371A TW 201433860 A TW201433860 A TW 201433860A
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TW
Taiwan
Prior art keywords
substrate
display substrate
bonding
display
main body
Prior art date
Application number
TW103106371A
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English (en)
Chinese (zh)
Inventor
Kazuyuki Sonobe
Kohei Kinugawa
Fujio Yamasaki
Masaki Araki
Koichiro Miura
Michiko HATAKEYAMA
Original Assignee
Hitachi High Tech Corp
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Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Publication of TW201433860A publication Critical patent/TW201433860A/zh

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TW103106371A 2013-02-28 2014-02-26 基板貼合裝置及基板貼合用具 TW201433860A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013039039 2013-02-28
JP2013233660A JP2014194520A (ja) 2013-02-28 2013-11-12 基板貼り合わせ装置及び基板貼り合わせ用具

Publications (1)

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TW201433860A true TW201433860A (zh) 2014-09-01

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TW103106371A TW201433860A (zh) 2013-02-28 2014-02-26 基板貼合裝置及基板貼合用具

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JP (1) JP2014194520A (ja)
TW (1) TW201433860A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI739305B (zh) * 2019-09-05 2021-09-11 日商鎧俠股份有限公司 基板貼合裝置、製造系統及半導體裝置之製造方法
TWI747327B (zh) * 2020-06-15 2021-11-21 吳伯仁 製造微發光二極體顯示器的系統與方法
TWI815447B (zh) * 2021-05-19 2023-09-11 日商日本顯示器股份有限公司 顯示裝置之製造方法及保持基板

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10903267B2 (en) * 2019-04-04 2021-01-26 Bor-Jen Wu System and method for making micro LED display
CN112510167B (zh) * 2020-12-18 2023-08-15 重庆莱宝科技有限公司 显示面板及其制备方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI739305B (zh) * 2019-09-05 2021-09-11 日商鎧俠股份有限公司 基板貼合裝置、製造系統及半導體裝置之製造方法
US11776931B2 (en) 2019-09-05 2023-10-03 Kioxia Corporation Substrate bonding apparatus, manufacturing system, and semiconductor device manufacturing method
TWI747327B (zh) * 2020-06-15 2021-11-21 吳伯仁 製造微發光二極體顯示器的系統與方法
TWI815447B (zh) * 2021-05-19 2023-09-11 日商日本顯示器股份有限公司 顯示裝置之製造方法及保持基板

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JP2014194520A (ja) 2014-10-09

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