TW201432723A - 導電性膏料 - Google Patents

導電性膏料 Download PDF

Info

Publication number
TW201432723A
TW201432723A TW102146829A TW102146829A TW201432723A TW 201432723 A TW201432723 A TW 201432723A TW 102146829 A TW102146829 A TW 102146829A TW 102146829 A TW102146829 A TW 102146829A TW 201432723 A TW201432723 A TW 201432723A
Authority
TW
Taiwan
Prior art keywords
component
conductive paste
group
mass
acid
Prior art date
Application number
TW102146829A
Other languages
English (en)
Chinese (zh)
Inventor
Fumio Moriuchi
Hideharu Sato
Original Assignee
Pelnox Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pelnox Ltd filed Critical Pelnox Ltd
Publication of TW201432723A publication Critical patent/TW201432723A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW102146829A 2012-12-21 2013-12-18 導電性膏料 TW201432723A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012289431 2012-12-21

Publications (1)

Publication Number Publication Date
TW201432723A true TW201432723A (zh) 2014-08-16

Family

ID=50978365

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102146829A TW201432723A (zh) 2012-12-21 2013-12-18 導電性膏料

Country Status (5)

Country Link
JP (1) JPWO2014098036A1 (ja)
KR (1) KR101699645B1 (ja)
CN (1) CN105008462B (ja)
TW (1) TW201432723A (ja)
WO (1) WO2014098036A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10672531B2 (en) * 2014-07-22 2020-06-02 Alpha Assembly Solutions Inc. Stretchable interconnects for flexible electronic surfaces
CN107545945A (zh) * 2017-07-03 2018-01-05 杭州正祺新材料有限公司 一种薄膜电容器电极封装用导电浆料及其制造方法
KR102007862B1 (ko) * 2017-10-31 2019-08-06 엘에스니꼬동제련 주식회사 태양전지 전극용 도전성 페이스트 및 이를 사용하여 제조된 태양전지
CN110157246B (zh) * 2019-06-18 2022-04-08 海盐华达油墨有限公司 一种导电油墨的制备方法
CN115602357A (zh) * 2022-10-24 2023-01-13 浙江振有电子股份有限公司(Cn) 一种强稳定性、高导电性的贯孔铜浆及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0693455A (ja) * 1991-04-08 1994-04-05 Mitsubishi Gas Chem Co Inc 銅膜形成基材の製造法
JPH05135619A (ja) * 1991-11-13 1993-06-01 Kao Corp 導電性銅ペーストの製造方法および該方法により得られる導電性銅ペースト
JPH05217422A (ja) * 1992-02-04 1993-08-27 Kao Corp 導電性ペーストおよび導電性塗膜
JP3152070B2 (ja) * 1994-07-08 2001-04-03 三菱マテリアル株式会社 透明導電膜形成用組成物
JPH1072673A (ja) * 1996-04-30 1998-03-17 Nippon Terupen Kagaku Kk 金属ペースト及び金属膜の製造方法
KR100709724B1 (ko) * 2007-01-30 2007-04-24 (주)이그잭스 도전막 형성을 위한 금속 페이스트
CN104246909B (zh) * 2012-03-30 2017-09-12 荒川化学工业股份有限公司 导电浆料、固化物、电极以及电子设备
JP6089175B2 (ja) * 2012-06-29 2017-03-08 荒川化学工業株式会社 導電性ペーストの製造方法

Also Published As

Publication number Publication date
CN105008462A (zh) 2015-10-28
KR20150089001A (ko) 2015-08-04
CN105008462B (zh) 2017-03-08
KR101699645B1 (ko) 2017-01-24
JPWO2014098036A1 (ja) 2017-01-12
WO2014098036A1 (ja) 2014-06-26

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