TW201427832A - 面板及其製造方法 - Google Patents
面板及其製造方法 Download PDFInfo
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- TW201427832A TW201427832A TW101147062A TW101147062A TW201427832A TW 201427832 A TW201427832 A TW 201427832A TW 101147062 A TW101147062 A TW 101147062A TW 101147062 A TW101147062 A TW 101147062A TW 201427832 A TW201427832 A TW 201427832A
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- sapphire
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- 238000000034 method Methods 0.000 title claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 38
- 239000010980 sapphire Substances 0.000 claims abstract description 38
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 18
- 239000000843 powder Substances 0.000 claims description 29
- 239000000919 ceramic Substances 0.000 claims description 23
- 238000005245 sintering Methods 0.000 claims description 14
- 239000002131 composite material Substances 0.000 claims description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 8
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000002485 combustion reaction Methods 0.000 abstract 1
- 238000003825 pressing Methods 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
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- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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Abstract
一種面板，其包括顯示窗及與該顯示窗相結合之支撐體，該顯示窗由藍寶石製成，該支撐體由陶瓷材料製成，該顯示窗與該支撐體藉由燒結方法一體成型而成。本發明還提供一種用於製造該面板之方法。
Description
本發明涉及一種殼體，尤其涉及一種面板及其製造方法。
先前之電子裝置殼體包括由玻璃製成之顯示面板，玻璃具有透光性好、價格便宜等優點，然，由於玻璃硬度較低，使用過程中容易劃傷，影響電子裝置之外觀。
鑒於上述內容，有必要提供一種不易碎裂、且抗劃傷之面板及其製造方法。
一種面板，其包括顯示窗及與該顯示窗相結合之支撐體，該顯示窗由藍寶石製成，該支撐體由陶瓷材料製成，該顯示窗與該支撐體藉由燒結方法一體成型而成。
一種面板之製造方法，其包括以下步驟：
提供藍寶石及陶瓷粉末；
燒結該藍寶石及該陶瓷粉末以形成陶瓷材料與該藍寶石結合於一體之複合材料；
切割該複合材料以形成面板，該面板包括由藍寶石製成之顯示窗及與該顯示窗相結合之由陶瓷材料製成之支撐體；及
對該面板進行表面處理。
本發明之面板由藍寶石和陶瓷材料藉由燒結方法一體成型而成，該面板之顯示窗由藍寶石製成，該面板之支撐體由陶瓷材料製成。由於藍寶石透光性好，顯示效果好，且藍寶石及陶瓷材料之硬度高，抗劃傷。
請參閱圖1及圖2，本發明實施方式之面板100由藍寶石與陶瓷材料複合而成。面板100包括顯示窗10及與顯示窗10相結合之支撐體30。顯示窗10由藍寶石材料製成，其透光性好，硬度高，可作行動電話、平板電腦、手錶、MP3、MP4等電子產品之顯示窗。支撐體30由陶瓷材料製成，支撐體30用以便於將顯示窗10安裝於電子裝置上。可理解，支撐體30亦可係氧化鋯陶瓷、氮化矽陶瓷、滑石瓷等。本發明實施方式中，面板100係行動電話面板，其係平板狀，顯示窗10位於面板100之大致中間位置，支撐體30結合於顯示窗10之周緣，支撐體30和顯示窗10藉由燒結方法一體成型而成。可理解，根據設計需要，顯示窗10可位於面板100之邊緣，即支撐體30亦可結合於顯示窗10之至少一側邊，以便於將顯示窗10安裝於電子裝置上即可。
請同時參閱圖2至圖5，本發明實施方式之面板100之實施例一之製造方法包括以下步驟：
S201：提供藍寶石50及陶瓷粉末60。本發明實施方式中，藍寶石50被切割成預定形狀，其長度和寬度與行動電話面板上之顯示區域相對應，陶瓷粉末60主要係氧化鋁粉末。
S202：燒結藍寶石50及陶瓷粉末60以形成陶瓷材料與藍寶石結合於一體之複合材料300。本發明實施方式中，提供燒結爐200，其包括模具201、用於壓緊藍寶石50之夾持件203及用於壓抵陶瓷粉末60之加壓模組205。加壓模組205係液壓模組，其包括壓桿2051及連接於壓桿2051末端之抵持塊2053。模具201由石墨材料製成，模具201上凹設有模腔207。將藍寶石50固定於模腔207之大致中間位置，同時將陶瓷粉末60填充於藍寶石50四周，並在氬氣、氮氣或其他惰性氣體保護气体保護下，夾持件203壓抵藍寶石50之上表面，加壓模組205壓抵陶瓷粉末60之上表面，同時進行高溫高壓燒結。燒結條件係：溫度1400℃至1600℃，壓力：10-40Mpa，升溫速率：10-30℃/min，待溫度及壓力升至設定溫度及壓力以後，保持恒溫恒壓0.5-2h。可理解，亦可在真空條件下對藍寶石50及陶瓷粉末60進行高溫高壓燒結。可理解，陶瓷粉末60亦可含有氧化鋯粉末、氮化矽粉末、滑石粉末等。
S203：切割複合材料300以形成面板100，面板100包括由藍寶石製成之顯示窗10及與顯示窗10相結合之由陶瓷材料製成之支撐體30。本發明實施方式中，複合材料300經初步切割後，其長度和寬度分別與行動電話之長度和寬度相對應。
S204：對面板100進行表面處理。本發明實施方式中，藉由打磨、拋光等表面處理，以提高面板100之表面平整度及光滑度。
請同時參閱圖6，本發明之面板100之第二實施例之製造方法與第一實施例之製造方法大致相同。燒結爐400包括模具401、用於壓緊藍寶石50之夾持件403及用於壓抵陶瓷粉末60之加壓模組405。加壓模組405係液壓模組，其包括壓桿4051及連接於壓桿4051末端之抵持塊4053。模具401由石墨材料製成，模具401上凹設有模腔407。本發明之面板100之第二實施例之製造方法與第一實施例之區別在於，圖6中在藍寶石50及陶瓷粉末60之上下表面分別加壓以一步提高陶瓷材料與藍寶石之結合強度。
可理解，藍寶石50用於與陶瓷材料相結合之側邊上可凸設有V型凸起或凹設有凹槽，以進一步增強顯示窗10與支撐體30之間之結合力。
本發明之面板100由藍寶石與陶瓷粉末經由燒結方法一體成型而成，藍寶石與陶瓷材料結合強度高，藍寶石具有透光性好，硬度高、抗劃傷等特性；同時，陶瓷材料硬度高、耐磨性好、價格低廉，從而使得本發明之面板100具有抗劃傷性能好、價格便宜之優點。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上該者僅係本發明之較佳實施方式，本發明之範圍並不以上述實施方式係限，舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
100．．．面板
10．．．顯示窗
30．．．支撐體
50．．．藍寶石
60．．．陶瓷粉末
200、400．．．燒結爐
201、401．．．模具
203、403．．．夾持件
205、405．．．加壓模組
2051、4051．．．壓桿
2053、4053．．．抵持塊
207、407．．．模腔
300．．．複合材料
圖1係本發明實施方式之面板之結構示意圖。
圖2係圖1所示面板沿II-II線之剖視圖。
圖3係用於製造圖1所示面板之實施例一之燒結爐之剖視圖。
圖4係燒結而成之藍寶石與陶瓷之複合材料。
圖5係圖1所示面板之製造方法之流程圖。
圖6係用於製造圖1所示面板之實施例二之燒結爐之剖視圖。
100．．．面板
10．．．顯示窗
30．．．支撐體
Claims (10)
- 一種面板，其包括顯示窗及與該顯示窗相結合之支撐體，其改良在於：該顯示窗由藍寶石製成，該支撐體由陶瓷材料製成，該顯示窗與該支撐體藉由燒結方法一體成型而成。
- 如申請專利範圍第1項所述之面板，其中該顯示窗位於該面板之中間位置，該支撐體結合於該顯示視窗之周緣。
- 如申請專利範圍第1項所述之面板，其中該支撐體結合於該顯示窗之一側。
- 如申請專利範圍第1項所述之面板，其中該陶瓷粉末主要包括氧化鋁粉末、氧化鋯粉末、氮化矽粉末或滑石粉末。
- 一種面板之製造方法，其包括以下步驟：
提供藍寶石及陶瓷粉末；
燒結該藍寶石及該陶瓷粉末以形成陶瓷材料與該藍寶石結合於一體之複合材料；
切割該複合材料以形成面板，該面板包括由藍寶石製成之顯示窗及與該顯示窗相結合之由陶瓷材料製成之支撐體；及
對上述面板進行表面處理。 - 如申請專利範圍第5項所述之面板之製造方法，其中該陶瓷粉末主要包括氧化鋁粉末、氧化鋯粉末、氮化矽粉末或滑石粉末。
- 如申請專利範圍第5項所述之面板之製造方法，其中該顯示窗位於該面板之中間位置，該支撐體結合於該顯示視窗之周緣。
- 如申請專利範圍第5項所述之面板之製造方法，其中該支撐體結合於該顯示窗之一側。
- 如申請專利範圍第5項所述之面板之製造方法，其中該燒結條件為：溫度1400℃至1600℃，壓力：10-40Mpa，升溫速率：10-30℃/min，待溫度及壓力升至設定溫度及壓力以後，保持恒溫恒壓0.5-2h。
- 如申請專利範圍第9項所述之面板之製造方法，其中燒結該藍寶石及陶瓷粉末時，分別從該藍寶石及陶瓷粉末之上下表面加壓。
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| CN201210524876.7A CN103864452B (zh) | 2012-12-10 | 2012-12-10 | 面板及其制造方法 |
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| CN205115306U (zh) | 2014-09-30 | 2016-03-30 | 苹果公司 | 陶瓷部件 |
| US10071539B2 (en) | 2014-09-30 | 2018-09-11 | Apple Inc. | Co-sintered ceramic for electronic devices |
| US9843014B2 (en) | 2015-02-20 | 2017-12-12 | Apple Inc. | Electronic devices with sapphire-coated substrates |
| US10207387B2 (en) | 2015-03-06 | 2019-02-19 | Apple Inc. | Co-finishing surfaces |
| US10216233B2 (en) | 2015-09-02 | 2019-02-26 | Apple Inc. | Forming features in a ceramic component for an electronic device |
| US10542628B2 (en) | 2017-08-02 | 2020-01-21 | Apple Inc. | Enclosure for an electronic device having a shell and internal chassis |
| KR102343283B1 (ko) | 2017-08-21 | 2021-12-27 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN110357621B (zh) * | 2019-08-12 | 2022-05-17 | Oppo广东移动通信有限公司 | 陶瓷壳体及其制备方法、电子设备 |
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| US3023492A (en) * | 1958-11-19 | 1962-03-06 | Gen Electric | Metalized ceramic member and composition and method for manufacturing same |
| US3227032A (en) * | 1961-03-30 | 1966-01-04 | American Optical Corp | Energy conducting fibers formed of sapphire cladded with quartz |
| US3275358A (en) * | 1963-03-14 | 1966-09-27 | Gen Electric | Glass-to-metal and glass-to-ceramic seals |
| US3267204A (en) * | 1964-08-21 | 1966-08-16 | Stanford Research Inst | Barrier effect insulator |
| US3485658A (en) * | 1965-07-22 | 1969-12-23 | Du Pont | Plural monolayer coated article and process of making |
| US3736158A (en) * | 1971-03-19 | 1973-05-29 | G Cullen | Czochralski-grown spinel for use as epitaxial silicon substrate |
| US3859714A (en) * | 1973-01-12 | 1975-01-14 | Nasa | Bonding of sapphire to sapphire by eutectic mixture of aluminum oxide and zirconium oxide |
| JPS54109776A (en) * | 1978-02-16 | 1979-08-28 | Matsushita Electric Ind Co Ltd | Thin film forming method for transparent substrate |
| US5137852A (en) * | 1991-01-11 | 1992-08-11 | Rockwell International Corp. | High temperature ceramic composites |
| US5954900A (en) * | 1996-10-04 | 1999-09-21 | Envec Mess- Und Regeltechnik Gmbh + Co. | Process for joining alumina ceramic bodies |
| DE10026651C1 (de) * | 2000-05-29 | 2001-07-26 | Siemens Ag | Materialverbund sowie Herstellung und Verwendung des Materialverbunds |
| US6663736B1 (en) * | 2001-11-07 | 2003-12-16 | Saint-Gobain Ceramics & Plastics, Inc. | Method for making a bonded sapphire structure |
| DE112004001032T5 (de) * | 2003-06-13 | 2006-05-18 | Han, Joo-Hwan, Kyungsan | Verfahren zum Verbinden von Keramik: Reaktions-Diffusionsbinden |
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| US9388086B2 (en) * | 2011-03-04 | 2016-07-12 | Raytheon Company | Method of fabricating optical ceramics containing compositionally tailored regions in three dimension |
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| US20170013730A1 (en) | 2017-01-12 |
| US9521790B2 (en) | 2016-12-13 |
| US20140160648A1 (en) | 2014-06-12 |
| CN103864452B (zh) | 2015-10-21 |
| CN103864452A (zh) | 2014-06-18 |
| TWI494224B (zh) | 2015-08-01 |
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