WO2016023244A1 - 非金属构件与金属构件的一体成型方法 - Google Patents

非金属构件与金属构件的一体成型方法 Download PDF

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WO2016023244A1
WO2016023244A1 PCT/CN2014/085136 CN2014085136W WO2016023244A1 WO 2016023244 A1 WO2016023244 A1 WO 2016023244A1 CN 2014085136 W CN2014085136 W CN 2014085136W WO 2016023244 A1 WO2016023244 A1 WO 2016023244A1
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metal
metal member
periphery
metal part
semi
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PCT/CN2014/085136
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English (en)
French (fr)
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李扬德
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东莞颠覆产品设计有限公司
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Application filed by 东莞颠覆产品设计有限公司 filed Critical 东莞颠覆产品设计有限公司
Priority to US15/503,726 priority Critical patent/US20170305790A1/en
Priority to EP14899915.4A priority patent/EP3181268A4/en
Publication of WO2016023244A1 publication Critical patent/WO2016023244A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C23/00—Extruding metal; Impact extrusion
    • B21C23/002—Extruding materials of special alloys so far as the composition of the alloy requires or permits special extruding methods of sequences
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C45/00—Amorphous alloys

Definitions

  • the present invention relates to a method of integrally forming a non-metallic member and a metal member. Background technique
  • the frame of electronic devices such as mobile phones and tablet computers is gradually processed with alloy materials.
  • the metal frame made of alloy materials not only has good aesthetics, but also protects fragile panels or back plates of electronic devices.
  • the traditional method is to embed the panel, backboard or plastic component of the electronic product into the formed metal frame, and then assemble the metal frame with the corresponding component.
  • the method combines the metal frame with the panel and back of the electronic product. There is a certain assembly gap between them, and even by precisely controlling the processing accuracy of the product, the assembly gap will still exist on the electronic product.
  • a method for integrally trapping a glass insert into a metal frame and an electronic device produced is disclosed in the patent document of the publication No. CN101815594, one of which is mentioned in the patent document.
  • a metal molding process places a metal frame on a surface or an edge of a transparent member. Specifically, a transparent member is placed in a cavity of the mold, and liquid metal is injected into the mold cavity. After the metal is cooled, The surface or the periphery of the transparent member forms a metal frame.
  • the method can eliminate the installation gap and integrally form the transparent member and the metal frame, in the operation, the metal needs to be heated, cast, and rapidly cooled, and the process conditions are required. High, the processing process is complicated, and the yield of the workpiece is low.
  • the above patent also mentions another type of MIM process to make metal powder transparent.
  • the method of the periphery of the component is to form the powder on the outside of the transparent member by a high-temperature sintering process, and the internal structure of the metal frame after sintering is relatively loose, and it is often difficult to carry out subsequent surface treatment such as grinding, oxidation, electroplating, etc., so that it is difficult Meet people's requirements for the aesthetics of electronic products.
  • the object of the present invention is to provide a method for integrally forming a non-metal member and a metal member, which has a simple and easy process, high yield, and reduces the difficulty of surface treatment of the metal member, and simultaneously processes
  • the integrally formed member has the advantage of being aesthetically pleasing.
  • the method for integrally forming a non-metal member and a metal member includes the following steps:
  • the material of the metal member is an aluminum-magnesium alloy or an aluminum-copper alloy or an aluminum-nickel alloy or a zirconium alloy or a titanium alloy.
  • the periphery of the non-metallic member is provided with a snap structure.
  • the snap-fit structure is an IHJ groove or boss formed by the edge of the non-metallic member.
  • the coefficient of thermal expansion of the metal member is greater than or equal to the rate of thermal expansion of the non-metallic member.
  • a cushioning member Prior to performing step C, a cushioning member is placed between the metal member and the non-metallic member, the cushioning member being a continuous structure located at the periphery of the non-metallic member.
  • the non-metallic component is a ceramic.
  • the method used in the present invention is that the metal member is bonded to the outside of the transparent non-metal member by means of hot press forming, the process method is simple and easy, the yield is high, and the pressed metal member is used. It has high compactness and high strength, and reduces the difficulty of subsequent surface treatment of metal members.
  • Figure 1 is a schematic flow chart of the method of the present invention
  • Figure 2 is a schematic view showing the structure of a mold used in the method of the present invention. detailed description
  • the method for integrally forming a non-metal member and a metal member according to the present invention is used for processing a ceramic plate 50 and a metal frame.
  • 60-body molding member which is used as a component of an electronic product, wherein the ceramic plate 50 is a back plate of an electronic product, and the metal frame 60 is a metal frame around the periphery of the electronic product, and the method includes the following steps :
  • the ceramic plate 50 is placed in the cavity of the mold shown in FIG. 2, and the ceramic plate 50 is specifically placed on the core insert 40 of the fixed mold 20 parting surface, and the size of the core insert 40 Corresponding to the ceramic plate 50, after being placed, the ceramic plate 50 is aligned with the edge of the core insert 40;
  • the metal frame 60 is placed in the mold, and the metal frame 60 is placed on the periphery of the ceramic plate 50, so that the metal frame 60 forms a continuous structure on the periphery of the ceramic plate 50.
  • the movable mold 10 is pressed down to make the metal.
  • the frame 60 surrounds the periphery of the ceramic plate 50 and the core insert 40, and moves the mold insert 30 around the mold parting surface.
  • the cavity of the mold is closed, and the metal frame 60 is closely placed at the edge portion of the mold cavity. At this time, it is necessary to ensure that the mold clamping block 30 has a certain degree of lateral movement freedom to prevent the metal frame 60 from forming a large pressing force on the ceramic plate 50 due to thermal expansion during subsequent heating;
  • the metal frame 60 is heated, wherein the metal frame 60 is preferably made of an aluminum-magnesium alloy, and the metal frame 60 is heated into a semi-solidified metal by a heating device. At this time, the metal frame 60 is thermally expanded to apply the mold clamping block 30. The outer top pressure causes the mold clamping block 30 to move away from the mold cavity. Since the thickness of the metal frame 60 is small, the displacement of the mold clamping block 30 caused by thermal expansion is very limited, and can be heated before According to the thickness of the metal frame 60, the coefficient of thermal expansion, and the heating temperature, the displacement of the heated mold clamping block 30 is roughly calculated, thereby setting a limiting mechanism for the clamping block 30 according to the displacement;
  • the cooling device supplies the refrigerant to the cooling flow path of the mold, and rapidly cools the semi-solidified metal frame 60, and the semi-solidified metal frame 60 During the rapid cooling process, the internal atoms of the alloy are less than ordered and crystallized, thereby obtaining a solid amorphous structure of the amorphous alloy, and finally the metal frame 60 is formed into a metal frame 60 of an amorphous alloy located at the periphery of the ceramic plate 50. After the mold, an integrally formed member of the metal frame 60 and the ceramic plate 50 is formed.
  • the above steps C, D and E are performed in a vacuum environment, specifically, after the step B is completed, the external portion is used.
  • the vacuuming device draws air out of the mold cavity.
  • the integrally formed member produced by the above method can be used for an electronic product with a ceramic back plate and a metal frame, and the ceramic plate 50 is used as a back plate of a mobile phone, which does not shield the operator's network compared to the existing metal mobile phone case.
  • the signal enhances the mobile phone's wif i signal, and at the same time realizes NFC near field communication and wireless charging of the mobile phone.
  • the external single crystal silicon can realize solar charging.
  • the method may also require subsequent processing such as grinding, electroplating, oxidation, etc., because in the above method, the metal frame 60 is processed by pressing the semi-solidified metal to make the metal
  • the internal structure of the frame 60 is relatively dense and has higher strength, thereby providing a good foundation for surface treatment processes such as grinding, electroplating, and oxidation.
  • the material of the metal frame 60 is also preferably an aluminum-copper alloy or an aluminum-nickel alloy or a zirconium alloy or a titanium alloy.
  • other metal materials can be used for the metal frame 60 of the electronic product. Optional range.
  • a nip structure may be provided on the periphery of the ceramic plate 50.
  • the groove may be formed along the edge of the ceramic plate 50.
  • the semi-solidified metal frame 60 is subjected to an external pressing force.
  • the inner side surface forms a structure partially embedded in the above-mentioned groove; of course, the engaging structure may also be a flange formed by the edge of the ceramic plate 50, and when pressed, the semi-solidified metal frame 60 is deformed to clamp the flange.
  • the thermal expansion rate of the metal frame 60 may be required to be greater than or the thermal expansion rate of the ceramic plate 50.
  • the thermal expansion of the ceramic plate 50 can be effectively controlled, and the influence of temperature on the ceramic plate 50 can be minimized.
  • the above ceramic plate 50 may be replaced by a plate-like quartz stone or a high temperature resistant material such as marble, or a boride, a carbide, a fluoride, a silicide, a phosphide, a sulfide or the like may be used instead.
  • a buffer member may be added between the metal frame 60 and the periphery of the ceramic plate 50.
  • the buffer member is a continuous structure located at the periphery of the ceramic plate 50; the buffer member may be a a member that facilitates the combination of the ceramic plate 50 and the metal frame 60, It may also be a member having a certain elasticity.
  • the cushioning member may be 65Mn. After the cushion member formed of 65Mn is placed between the metal frame 60 and the ceramic plate 50 to form an integrally formed member, 65Mn is better.
  • the elasticity of the metal frame 60 is greatly impacted when the electronic product falls from a high level, and the cushioning member can be used to reduce the impact force, thereby effectively protecting the ceramic plate 50.
  • the method of the present invention is also applicable to the combination of other metal members and non-transparent non-metal members such as ceramics.
  • the method of forming is substantially the same as that of the above method, regardless of the application method, and will not be described in detail herein.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Telephone Set Structure (AREA)
  • Ceramic Products (AREA)

Abstract

一种非金属构件与金属构件的一体成型方法，包括如下步骤：A、将不透明的非金属构件置于模具中；B、在模具中于非金属构件的周缘置入金属构件，该金属构件为一位于非金属构件周缘的连续结构；C、加热金属构件，使金属构件形成被限定在模具型腔中的半固态化的金属；D、利用模具挤压半固态化的金属，使该半固态化的金属无缝的结合于非金属构件的周缘；E、快速冷却位于非金属构件周缘的半固态化的金属，使半固态化的金属成型为无缝结合于非金属构件周缘的非晶金属。该方法简单易行，成品率高，压制的金属构件具有较高的致密性和较高的强度，并且，降低了金属构件后续表面处理的难度。

Description

非金属构件与金属构件的一体成型方法 技术领域
本发明涉及一种非金属构件与金属构件的一体成型方法。 背景技术
目前， 如手机、 平板电脑等电子设备的边框逐渐釆用合金材料加 工而成，合金材料制成的金属边框不仅具有较好的美观度， 同时还能 够保护电子设备的易碎面板或背板。 传统的做法是将电子产品的面 板、 背板或塑料构件嵌入到加工成型的金属框架内， 然后将金属框架 与相应的部件装配， 此种方法结合后的金属框架与电子产品的面板、 背板之间存在一定的装配间隙， 即使通过精确控制产品的加工精度， 该装配间隙依然会存在于电子产品上。
公开号为 CN101815594的专利文献中公开了一种 "用于将玻璃插 入物一体地陷到金属边框中的方法及所生产的电子设备" ， 该专利文 献中所提及的方法之一是釆用一种金属模制工艺将金属边框置于透 明构件的表面或边缘， 具体的是， 将透明构件置于模具的型腔， 再将 液态的金属注入到模具型腔中，待金属冷却后， 在透明构件的表面或 周缘形成金属边框， 该方法虽然能够消除安装间隙，使透明构件与金 属边框一体成型， 但其在操作时， 需要将金属高温加热、 浇铸、 快速 冷却等工序，工艺条件要求较高，加工过程复杂，工件的成品率较低。 当然，上述专利还提及了另一种釆用 MIM工艺使金属粉末成型于透明 构件周缘的方法， 其是利用高温烧结工艺将粉末成型于透明构件外 部， 通过烧结成型后的金属边框其内部组织较为疏松， 通常很难进行 后续的打磨、 氧化、 电镀等表面处理， 因此很难满足人们对于电子产 品边框美观度的要求。
另外上述的专利 CN101815594中仅提到利用玻璃、蓝宝石等透明 构件与金属材料的结合， 在整个的模制或 MIM工艺中， 由于玻璃、 蓝 宝石等透明构件是处在高温环境下，这些材质的透明构件受高温影响 较大， 因此， 在与金属形成一体构件后， 透明材质的组织结构受到一 定的影响， 从而影响电子产品的外形美观度。 发明内容
针对现有技术的不足，本发明的目的旨在于提供一种非金属构件 与金属构件的一体成型方法， 其工艺方法简单易行， 成品率高， 且降 低了金属构件表面处理的难度，同时加工成的一体成型构件具有外形 美观的优点。
为实现上述目的， 本发明釆用如下技术方案：
非金属构件与金属构件的一体成型方法， 包括如下步骤：
A、 将不透明的非金属构件置于模具中；
B、 在模具中于非金属构件的周缘置入金属构件， 该金属构件为 一位于非金属构件周缘的连续结构；
C、 加热金属构件， 使金属构件形成被限定在模具型腔中的半固 态化的金属； D、 利用模具挤压半固态化的金属， 使该半固态化的金属无缝的 结合于非金属构件的周缘；
E、 快速冷却位于非金属构件周缘的半固态化的金属， 使半固态 化的金属成型为无缝结合于非金属构件周缘的非晶金属。
金属构件的材质为铝镁合金或铝铜合金或铝镍合金或锆合金或 钛合金。
非金属构件的周缘设置有咬合结构。
咬合结构为顺延非金属构件的边缘形成的 IHJ槽或凸起部。
金属构件的热膨胀率大于或者等于非金属构件的热膨胀率。 在进行步骤 C之前，位于金属构件和非金属构件之间加入一緩冲 件， 该緩冲件为位于非金属构件周缘的连续结构。
非金属构件为陶瓷。
本发明的有益效果在于：
相比于现有技术，本发明所釆用的方法由于是釆用热压成型的方 式使金属构件结合于透明的非金属构件外部， 其工艺方法简单易行， 成品率高， 压制的金属构件具有较高的致密性和较高的强度， 并且， 降低了金属构件后续表面处理的难度。 附图说明
图 1为本发明方法的流程示意图；
图 2为本发明方法所用模具的结构示意图。 具体实施方式
下面， 结合附图以及具体实施方式， 对本发明做进一步描述： 如图 1 所示， 为本发明的非金属构件与金属构件的一体成型方 法， 该方法用于加工一种陶瓷板 50与金属边框 60—体成型构件， 该 一体成型构件被用于作为一种电子产品的零部件， 其中， 陶瓷板 50 为电子产品的背板， 金属边框 60为电子产品周缘的金属框， 该方法 包括如下步骤：
A、 将陶瓷板 50置于如图 2所示的模具的型腔中， 陶瓷板 50具 体的是置于定模 20分型面上的模芯嵌块 40上， 模芯嵌块 40的尺寸 与陶瓷板 50相当， 置入后， 将陶瓷板 50与模芯嵌块 40的边缘对齐；
B、将金属边框 60置于模具中，使金属边框 60置于陶瓷板 50的 周缘，使金属边框 60在陶瓷板 50的周缘形成一个连续结构，合模后， 动模 10下压，使金属边框 60包围于陶瓷板 50和模芯嵌块 40的周缘， 移动模具分型面四周的合模嵌块 30 , 模具的型腔封闭， 金属边框 60 被紧密的置于模具型腔的边缘部分， 此时， 需要确保合模嵌块 30具 有一定的横向移动自由度， 以避免后续加热时金属边框 60由于热膨 胀对陶瓷板 50形成较大的挤压力；
C、 加热金属边框 60, 其中金属边框 60优选釆用铝镁合金， 利 用加热装置将金属边框 60加热成半固态化的金属， 此时， 金属边框 60 由于热膨胀， 对合模嵌块 30 实施向外的顶压力， 使合模嵌块 30 向着远离模具型腔的方向移动， 由于金属边框 60的厚度较小， 因此 其热膨胀导致的合模嵌块 30的位移非常有限， 可以在加热之前， 依 据金属边框 60的厚度、 热膨胀系数以及加热温度等参数大致计算加 热后的合模嵌块 30移动的位移大小， 从而依据该位移大小为合模嵌 块 30设置限位机构；
D、 利用液压缸或其他顶压机构向着模具型腔的方向顶压合模嵌 块 30 , 使半固态化的金属边框 60尽量的向着陶瓷板 50的边缘收缩， 确保半固态化的金属边框 60无缝的结合在陶瓷板 50的周缘，保持上 述对合模嵌块 30施加的顶压外力；
E、在上述保持对合模嵌块 30施加外部顶压力的状态下， 利用冷 却装置向模具的冷却流道中输送冷媒，快速的冷却上述半固态化的金 属边框 60 , 半固态化的金属边框 60在快速冷却的过程中， 合金内部 原子来不及有序排列结晶，从而得到固态的无序结构的非晶合金， 最 终使金属边框 60成型为位于陶瓷板 50周缘的非晶合金的金属边框 60, 脱模后， 形成金属边框 60与陶瓷板 50的一体成型构件。
本发明的上述方法中， 为了避免金属边框 60在高温环境下被氧 化， 上述的步骤 C、 步骤 D和步骤 E均是在真空环境下进行的， 具体 的是， 在完成步骤 B之后， 利用外部的抽真空装置将模具型腔中的空 气抽走。
上述方法制作的一体成型构件可以用于带有陶瓷背板和金属边 框的电子产品， 利用陶瓷板 50作为手机的背板， 其相比于现有的金 属手机外壳， 不会屏蔽运营商的网络信号， 增强手机的 wif i信号， 同时可实现手机的 NFC近场通信、 无线充电， 此外， 外界单晶硅能够 实现太阳能充电。 当适用于电子设备时，上述方法在脱模后，还可能需要进行打磨、 电镀、 氧化等后续工艺处理， 由于在上述方法中， 釆用压制半固态化 金属的方式加工金属边框 60 , 使金属边框 60的内部结构较为致密， 具有更高的强度， 从而为打磨、 电镀、 氧化等表面处理工艺提供良好 的基础。
本发明中， 金属边框 60的材质还优选的釆用铝铜合金或铝镍合 金或锆合金或钛合金， 当然， 其他的金属材料只要其能够被用于制作 电子产品的金属边框 60, 都在可选的范围之内。
为了增加结合强度， 可以是在陶瓷板 50的周缘设置咬合结构， 具体的是， 可以顺延陶瓷板 50的边缘形成凹槽， 在挤压时， 半固态 化的金属边框 60受外部挤压力， 其内侧表面形成部分嵌入到上述凹 槽中的结构； 当然， 咬合结构也可以是顺延陶瓷板 50边缘形成的凸 缘， 在挤压时， 半固态化的金属边框 60变形以夹持凸缘。
选用材料时， 可以要求金属边框 60的热膨胀率大于或者陶瓷板 50的热膨胀率， 如此， 在加热金属边框 60时， 可有效的控制陶瓷板 50的热膨胀， 尽量的减少温度对陶瓷板 50的影响。 作为电子产品的 部件， 上述的陶瓷板 50还可以选用板状的石英石或大理石等耐高温 材料替代， 也可以选用硼化物、 碳化物、 氟化物、 硅化物、 磷化物、 硫化物等替代。
本发明中， 在进行上述的步骤 C之前， 还可以在金属边框 60和 陶瓷板 50周缘之间加入一緩冲件，緩冲件为位于陶瓷板 50周缘的连 续结构；緩冲件可以是一种利于陶瓷板 50与金属边框 60结合的构件， 也可以是一种具有一定弹性的构件， 例如， 緩冲件可以是 65Mn,在将 由 65Mn形成的緩冲件置于金属边框 60和陶瓷板 50之间形成一体成 型构件后， 由于 65Mn具有较好的弹性， 在电子产品从高出跌落时， 金属边框 60受到较大的冲击， 緩冲件则可用于减緩冲击力， 从而有 效的保护陶瓷板 50。
本发明的方法还适用于其他的金属构件与陶瓷等非透明的非金 属构件的结合， 无论是何种应用方式， 其成型的方法与上述方法步骤 大致相同， 在这里不做详细的说明。
对本领域的技术人员来说， 可根据以上描述的技术方案以及构 思，做出其它各种相应的改变以及形变， 而所有的这些改变以及形变 都应该属于本发明权利要求的保护范围之内。

Claims

权 利 要 求 书
1.非金属构件与金属构件的一体成型方法， 其特征在于， 包括如 下步骤：
A、 将不透明的非金属构件置于模具中；
B、 在模具中于非金属构件的周缘置入金属构件， 该金属构件为 一位于非金属构件周缘的连续结构；
C、 加热金属构件， 使金属构件形成被限定在模具型腔中的半固 态化的金属；
D、 利用模具挤压半固态化的金属， 使该半固态化的金属无缝的 结合于非金属构件的周缘；
E、 快速冷却位于非金属构件周缘的半固态化的金属， 使半固态 化的金属成型为无缝结合于非金属构件周缘的非晶金属。
2.如权利要求 1所述的非金属构件与金属构件的一体成型方法， 其特征在于，金属构件的材质为铝镁合金或铝铜合金或铝镍合金或锆 合金或钛合金。
3.如权利要求 1所述的非金属构件与金属构件的一体成型方法， 其特征在于， 非金属构件的周缘设置有咬合结构。
4.如权利要求 3所述的非金属构件与金属构件的一体成型方法， 其特征在于， 咬合结构为顺延非金属构件的边缘形成的 IHJ槽或凸起 部。
5.如权利要求 1所述的非金属构件与金属构件的一体成型方法， 其特征在于，金属构件的热膨胀率大于或者等于非金属构件的热膨胀 率。
6.如权利要求 1所述的非金属构件与金属构件的一体成型方法， 其特征在于， 在进行步骤 C之前， 位于金属构件和非金属构件之间加 入一緩冲件， 该緩冲件为位于非金属构件周缘的连续结构。
7.如权利要求 1所述的非金属构件与金属构件的一体成型方法， 其特征在于， 非金属构件为陶瓷或石英石或大理石。
8.如权利要求 1所述的非金属构件与金属构件的一体成型方法， 其特征在于， 步骤 C、 步骤 D和步骤 E是在真空环境下进行的。
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104339647A (zh) * 2014-10-17 2015-02-11 深圳市锆安材料科技有限公司 不透明非金属构件与金属构件的一体成型方法
CN107931614A (zh) * 2016-10-12 2018-04-20 中兴通讯股份有限公司 结构件的制备方法、壳体及电子设备
CN113493876B (zh) * 2021-07-07 2022-07-01 重庆大学 一种铁基非晶改性镁合金表面的方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030062811A1 (en) * 2001-06-07 2003-04-03 Atakan Peker Metal frame for electronic hardware and flat panel displays
US20090218725A1 (en) * 2008-02-29 2009-09-03 Symbol Technologies, Inc. Injection molded paneled mobile device enclosure
CN101815594A (zh) * 2007-07-12 2010-08-25 苹果公司 用于将玻璃插入物一体地陷到金属边框中的方法及所生产的电子设备
CN102430745A (zh) * 2011-08-18 2012-05-02 比亚迪股份有限公司 非晶合金与异质材料结合的方法及复合体
CN103029368A (zh) * 2011-09-29 2013-04-10 比亚迪股份有限公司 一种复合金属壳体及其制备方法
WO2013141866A1 (en) * 2012-03-22 2013-09-26 Crucible Intellectual Property Llc Methods and systems for skull trapping

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4500383A (en) * 1982-02-18 1985-02-19 Kabushiki Kaisha Meidensha Process for bonding copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy
JPH072266B2 (ja) * 1990-04-04 1995-01-18 京浜精密工業株式会社 袋形製品の鋳造方法
US5673745A (en) * 1996-06-27 1997-10-07 General Electric Company Method for forming an article extension by melting of an alloy preform in a ceramic mold
CN1262248A (zh) * 1999-01-22 2000-08-09 北京市太阳能研究所 玻璃－金属热压封接工艺
JP4558818B2 (ja) * 2008-06-27 2010-10-06 ダイキン工業株式会社 半溶融あるいは半凝固成形法および成形装置
CN101722297B (zh) * 2008-11-03 2012-08-22 和硕联合科技股份有限公司 结构体的成型方法
US8655422B2 (en) * 2010-06-04 2014-02-18 Apple Inc. Ring-shaped cover for portable electronic device
CN102615269B (zh) * 2011-02-01 2015-08-19 昶联金属材料应用制品(广州)有限公司 制造包含复数层金属之壳体的方法及装置
WO2013162504A2 (en) * 2012-04-23 2013-10-31 Apple Inc. Methods and systems for forming a glass insert in an amorphous metal alloy bezel
CN103420622A (zh) * 2012-05-17 2013-12-04 华硕电脑股份有限公司 金属与玻璃复层材料的制备方法及其系统
US9114487B2 (en) * 2012-05-29 2015-08-25 Apple Inc. Components of an electronic device and methods for their assembly

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030062811A1 (en) * 2001-06-07 2003-04-03 Atakan Peker Metal frame for electronic hardware and flat panel displays
CN101815594A (zh) * 2007-07-12 2010-08-25 苹果公司 用于将玻璃插入物一体地陷到金属边框中的方法及所生产的电子设备
US20090218725A1 (en) * 2008-02-29 2009-09-03 Symbol Technologies, Inc. Injection molded paneled mobile device enclosure
CN102430745A (zh) * 2011-08-18 2012-05-02 比亚迪股份有限公司 非晶合金与异质材料结合的方法及复合体
CN103029368A (zh) * 2011-09-29 2013-04-10 比亚迪股份有限公司 一种复合金属壳体及其制备方法
WO2013141866A1 (en) * 2012-03-22 2013-09-26 Crucible Intellectual Property Llc Methods and systems for skull trapping

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3181268A4 *

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