WO2016023245A1 - 非金属构件与金属构件的一体成型方法 - Google Patents

非金属构件与金属构件的一体成型方法 Download PDF

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WO2016023245A1
WO2016023245A1 PCT/CN2014/085137 CN2014085137W WO2016023245A1 WO 2016023245 A1 WO2016023245 A1 WO 2016023245A1 CN 2014085137 W CN2014085137 W CN 2014085137W WO 2016023245 A1 WO2016023245 A1 WO 2016023245A1
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metal
metal member
metal part
periphery
semi
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PCT/CN2014/085137
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English (en)
French (fr)
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李扬德
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东莞颠覆产品设计有限公司
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Priority to EP14899797.6A priority Critical patent/EP3181267B1/en
Priority to US15/503,760 priority patent/US20170274448A1/en
Publication of WO2016023245A1 publication Critical patent/WO2016023245A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • B22D19/04—Casting in, on, or around objects which form part of the product for joining parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • B22D19/16—Casting in, on, or around objects which form part of the product for making compound objects cast of two or more different metals, e.g. for making rolls for rolling mills
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing

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  • the present invention relates to a method of integrally forming a non-metallic member and a metal member.
  • the frame of electronic devices such as mobile phones and tablet computers is gradually processed by alloy materials.
  • the metal frame made of alloy materials not only has good aesthetics, but also protects fragile panels or back plates of electronic devices.
  • the traditional method is to embed the panel, backboard or plastic component of the electronic product into the formed metal frame, and then assemble the metal frame with the corresponding component.
  • the method combines the metal frame with the panel and backboard of the electronic product. There is a certain assembly gap between them, and even if the precision of the product is precisely controlled, the assembly gap will still exist on the electronic product.
  • One of the methods for inserting a glass insert into a metal frame and the electronic device produced is disclosed in the patent document of the publication No. CN101815594, one of which is The metal molding process places the metal frame on the surface or the edge of the transparent member. Specifically, the transparent member is placed in the cavity of the mold, and the liquid metal is injected into the mold cavity, and after the metal is cooled, it is transparent. The surface or the periphery of the member forms a metal frame.
  • the method can eliminate the installation gap and integrally form the transparent member and the metal frame, in the operation, the metal needs to be heated, cast, and rapidly cooled, and the process conditions are required. High, the processing process is complicated, and the yield of the workpiece is low.
  • the above patent also mentions another method of molding metal powder by MIM process.
  • the powder is formed on the outside of the transparent member by a high-temperature sintering process, and the internal structure of the metal frame after sintering is relatively loose, and it is often difficult to carry out subsequent surface treatment such as grinding, oxidation, electroplating, etc. It is difficult to meet people's requirements for the aesthetics of electronic products.
  • the object of the present invention is to provide a method for integrally forming a non-metal member and a metal member, which has a simple and easy process, high yield, and reduces the difficulty of surface treatment of the metal member.
  • the present invention adopts the following technical solutions:
  • the method for integrally forming a non-metal member and a metal member includes the following steps:
  • the material of the metal member is an aluminum-magnesium alloy or an aluminum-copper alloy or an aluminum-nickel alloy or a zirconium alloy or a titanium alloy.
  • the periphery of the non-metallic member is provided with a snap structure.
  • the snap structure is a groove or a raised portion formed by the edge of the non-metallic member.
  • the coefficient of thermal expansion of the metal member is greater than or equal to the rate of thermal expansion of the non-metallic member.
  • a cushioning member Prior to performing step C, a cushioning member is placed between the metal member and the non-metallic member, the cushioning member being a continuous structure located at the periphery of the non-metallic member.
  • the non-metallic component is glass or sapphire.
  • the method adopted by the present invention combines the metal member with the outside of the transparent non-metal member by means of hot press forming, and the process method is simple and easy, the yield is high, and the pressed metal member has a comparative advantage. High compactness and high strength, and reduce the difficulty of subsequent surface treatment of metal components.
  • Figure 1 is a schematic flow chart of the method of the present invention
  • Figure 2 is a schematic view showing the structure of a mold used in the method of the present invention.
  • the method for integrally molding a non-metal member and a metal member of the present invention is used for processing a glass plate 50 and a metal frame 60 integrally formed member, and the integrally molded member is used as an electronic device.
  • the peripheral metal frame, the method includes the following steps:
  • the glass plate 50 is placed in the cavity of the mold as shown in FIG. 2, and the glass plate 50 is specifically placed on the core insert 40 of the fixed mold 20 parting surface, and the size of the core insert 40 is Corresponding to the glass plate 50, after being placed, the glass plate 50 is aligned with the edge of the core insert 40;
  • the metal frame 60 is placed in the mold so that the metal frame 60 is located at the periphery of the glass plate 50.
  • the metal frame 60 forms a continuous structure on the periphery of the glass plate 50.
  • the movable mold 10 is pressed down to make the metal frame. 60 surrounds the periphery of the glass plate 50 and the core insert 40, moves the mold insert 30 around the mold parting surface, the cavity of the mold is closed, and the metal frame 60 is closely placed at the edge portion of the mold cavity.
  • it is necessary to ensure that the mold clamping block 30 has a certain degree of lateral movement freedom to avoid a large pressing force of the metal frame 60 on the glass plate 50 due to thermal expansion during subsequent heating;
  • the metal frame 60 is heated.
  • the metal frame 60 is preferably made of an aluminum-magnesium alloy.
  • the metal frame 60 is heated into a semi-solidified metal by a heating device. At this time, the metal frame 60 is outwardly extended to the mold block 30 due to thermal expansion.
  • the top pressure causes the mold clamping block 30 to move away from the mold cavity. Since the thickness of the metal frame 60 is small, the displacement of the mold clamping block 30 caused by thermal expansion is very limited, and can be based on metal before heating.
  • the thickness of the frame 60, the coefficient of thermal expansion, and the heating temperature generally calculate the displacement of the heated mold clamping block 30, thereby setting a limiting mechanism for the clamping block 30 according to the displacement;
  • the cooling device supplies the refrigerant to the cooling flow path of the mold, and rapidly cools the semi-solidified metal frame 60, and the semi-solidified metal frame 60 During the rapid cooling process, the internal atoms of the alloy are less than ordered and crystallized, thereby obtaining a solid amorphous structure of the amorphous alloy, and finally the metal frame 60 is formed into a metal frame 60 of an amorphous alloy located at the periphery of the glass plate 50. After the mold, an integrally formed member of the metal frame 60 and the glass sheet 50 is formed.
  • the above steps C, D, and E are performed in a vacuum environment, specifically, after the step B is completed, the external portion is utilized.
  • the vacuuming device draws air out of the mold cavity.
  • the integrally formed member produced by the above method can be used for an electronic product with a glass back plate and a metal frame; the glass plate 50 can also be a glass panel of a display screen such as a mobile phone or a tablet computer, that is, the above method can be a metal A method of integrally forming a frame with a glass panel of a display screen.
  • the method may further require subsequent processing such as grinding, electroplating, oxidation, etc., because in the above method, the metal frame 60 is processed by pressing the semi-solidified metal to make the metal frame
  • the internal structure of 60 is relatively dense and has higher strength, which provides a good foundation for surface treatment processes such as grinding, electroplating and oxidation.
  • the material of the metal frame 60 may also preferably be an aluminum-copper alloy or an aluminum-nickel alloy or a zirconium alloy or a titanium alloy. Of course, other metal materials can be used as long as they can be used.
  • the metal frame 60 for making electronic products is within an optional range.
  • a snap structure may be provided on the periphery of the glass plate 50. Specifically, a groove may be formed along the edge of the glass plate 50. When pressed, the semi-solidified metal frame 60 is subjected to an external pressing force. The inner side surface forms a structure partially embedded in the above-mentioned groove; of course, the snap-fit structure may also be a flange formed by the edge of the glass sheet 50, and when pressed, the semi-solidified metal frame 60 is deformed to clamp the flange.
  • the thermal expansion rate of the metal frame 60 may be required to be greater than or the thermal expansion rate of the glass plate 50.
  • the thermal expansion of the glass plate 50 can be effectively controlled, and the influence of temperature on the glass plate 50 can be minimized.
  • sapphire or other transparent member may be used instead of the above-mentioned glass plate 50.
  • any material suitable as an electronic product back sheet or a panel is within an optional range.
  • a buffer member may be added between the metal frame 60 and the periphery of the glass plate 50.
  • the buffer member is a continuous structure located at the periphery of the glass plate 50; the buffer member may be a glass.
  • the member of the plate 50 combined with the metal frame 60 may also be a member having a certain elasticity.
  • the cushioning member may be 65Mn, and the cushion member formed of 65Mn is placed between the metal frame 60 and the glass plate 50 to form an integral shape.
  • the method of the present invention is also applicable to the combination of other metal members and transparent non-metal members, and the molding method is substantially the same as the above method steps regardless of the application mode. No detailed explanation is given here.

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  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
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  • Organic Chemistry (AREA)
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

非金属构件（50）与金属构件（60）的一体成型方法，包括如下步骤：A、将透明的非金属构件（50）置于模具中；B、在模具中于非金属构件（50）的周缘置入金属构件（60），该金属构件为一位于非金属构件（50）周缘的连续结构；C、加热金属构件（60），使金属构件（60）形成被限定在模具型腔中的半固态化的金属；D、利用模具挤压半固态化的金属，使该半固态化的金属无缝的结合于非金属构件（50）的周缘；E、快速冷却位于非金属构件（50）周缘的半固态化的金属，使半固态化的金属成型为无缝结合于非金属构件（50）周缘的非晶金属。本方法简单易行，成品率高，压制的金属构件具有较高的致密性和较高的强度，并且，降低了金属构件后续表面处理的难度。

Description

非金属构件与金属构件的一体成型方法 技术领域
本发明涉及一种非金属构件与金属构件的一体成型方法。
背景技术
目前，如手机、平板电脑等电子设备的边框逐渐采用合金材料加工而成，合金材料制成的金属边框不仅具有较好的美观度，同时还能够保护电子设备的易碎面板或背板。传统的做法是将电子产品的面板、背板或塑料构件嵌入到加工成型的金属框架内，然后将金属框架与相应的部件装配，此种方法结合后的金属框架与电子产品的面板、背板之间存在一定的装配间隙，即使通过精确控制产品的加工精度，该装配间隙依然会存在于电子产品上。
公开号为CN101815594的专利文献中公开了一种“用于将玻璃插入物一体地陷到金属边框中的方法及所生产的电子设备”，该专利文献中所提及的方法之一是采用一种金属模制工艺将金属边框置于透明构件的表面或边缘，具体的是，将透明构件置于模具的型腔，再将液态的金属注入到模具型腔中，待金属冷却后，在透明构件的表面或周缘形成金属边框，该方法虽然能够消除安装间隙，使透明构件与金属边框一体成型，但其在操作时，需要将金属进行高温加热、浇铸、快速冷却等工序，工艺条件要求较高，加工过程复杂，工件的成品率较低。此外，上述专利还提及了另一种采用MIM工艺使金属粉末成型 于透明构件周缘的方法，其是利用高温烧结工艺将粉末成型于透明构件外部，通过烧结成型后的金属边框其内部组织较为疏松，通常很难进行后续的打磨、氧化、电镀等表面处理，因此很难满足人们对于电子产品边框美观度的要求。
发明内容
针对现有技术的不足，本发明的目的旨在于提供一种非金属构件与金属构件的一体成型方法，其工艺方法简单易行，成品率高，且降低了金属构件表面处理的难度。
为实现上述目的，本发明采用如下技术方案：
非金属构件与金属构件的一体成型方法，包括如下步骤：
A、将透明的非金属构件置于模具中；
B、在模具中于非金属构件的周缘置入金属构件，该金属构件为一位于非金属构件周缘的连续结构；
C、加热金属构件，使金属构件形成被限定在模具型腔中的半固态化的金属；
D、利用模具挤压半固态化的金属，使该半固态化的金属无缝的结合于非金属构件的周缘；
E、快速冷却位于非金属构件周缘的半固态化的金属，使半固态化的金属成型为无缝结合于非金属构件周缘的非晶金属。
金属构件的材质为铝镁合金或铝铜合金或铝镍合金或锆合金或钛合金。
非金属构件的周缘设置有咬合结构。
咬合结构为顺延非金属构件的边缘形成的凹槽或凸起部。
金属构件的热膨胀率大于或者等于非金属构件的热膨胀率。
在进行步骤C之前，位于金属构件和非金属构件之间加入一缓冲件，该缓冲件为位于非金属构件周缘的连续结构。
非金属构件为玻璃或蓝宝石。
本发明的有益效果在于：
相比于现有技术，本发明所采用的方法由于是采用热压成型的方式使金属构件结合于透明的非金属构件外部，其工艺方法简单易行，成品率高，压制的金属构件具有较高的致密性和较高的强度，并且，降低了金属构件后续表面处理的难度。
附图说明
图1为本发明方法的流程示意图；
图2为本发明方法所用模具的结构示意图。
具体实施方式
下面，结合附图以及具体实施方式，对本发明做进一步描述：
如图1所示，为本发明的非金属构件与金属构件的一体成型方法，该方法用于加工一种玻璃板50与金属边框60一体成型构件，还一体成型构件被用于作为一种电子产品的零部件，其中，玻璃板50为电子产品的屏幕面板玻璃或者背板玻璃，金属边框60为电子产品 周缘的金属框，该方法包括如下步骤：
A、将玻璃板50置于如图2所示的模具的型腔中，玻璃板50具体的是置于定模20分型面上的模芯嵌块40上，模芯嵌块40的尺寸与玻璃板50相当，置入后，将玻璃板50与模芯嵌块40的边缘对齐；
B、将金属边框60置于模具中，使金属边框60位于玻璃板50的周缘，该金属边框60在玻璃板50的周缘形成一个连续结构，合模后，动模10下压，使金属边框60包围于玻璃板50和模芯嵌块40的周缘，移动模具分型面四周的合模嵌块30，模具的型腔封闭，金属边框60被紧密的置于模具型腔的边缘部分，此时，需要确保合模嵌块30具有一定的横向移动自由度，以避免后续加热时金属边框60由于热膨胀对玻璃板50形成较大的挤压力；
C、加热金属边框60，其中金属边框60优选采用铝镁合金，利用加热装置将金属边框60加热成半固态化的金属，此时，金属边框60由于热膨胀，对合模嵌块30实施向外的顶压力，使合模嵌块30向着远离模具型腔的方向移动，由于金属边框60的厚度较小，因此其热膨胀导致的合模嵌块30的位移非常有限，可以在加热之前，依据金属边框60的厚度、热膨胀系数以及加热温度等参数大致计算加热后的合模嵌块30移动的位移大小，从而依据该位移大小为合模嵌块30设置限位机构；
D、利用液压缸或其他顶压机构向着模具型腔的方向顶压合模嵌块30，使半固态化的金属边框60尽量的向着玻璃板50的边缘收缩，确保半固态化的金属边框60无缝的结合在玻璃板50的周缘，保持上 述对合模嵌块30施加的顶压外力；
E、在上述保持对合模嵌块30施加外部顶压力的状态下，利用冷却装置向模具的冷却流道中输送冷媒，快速的冷却上述半固态化的金属边框60，半固态化的金属边框60在快速冷却的过程中，合金内部原子来不及有序排列结晶，从而得到固态的无序结构的非晶合金，最终使金属边框60成型为位于玻璃板50周缘的非晶合金的金属边框60，脱模后，形成金属边框60与玻璃板50的一体成型构件。
本发明的上述方法中，为了避免金属边框60在高温环境下被氧化，上述的步骤C、步骤D和步骤E均是在真空环境下进行的，具体的是，在完成步骤B之后，利用外部的抽真空装置将模具型腔中的空气抽走。
上述方法制作的一体成型构件可以用于带有玻璃背板和金属边框的电子产品；上述的玻璃板50也可以是手机、平板电脑等显示屏的玻璃面板，即上述方法可以是一种将金属边框与显示屏的玻璃面板一体成型的方法。
当适用于电子设备时，上述方法在脱模后，还可能需要进行打磨、电镀、氧化等后续工艺处理，由于在上述方法中，采用压制半固态化金属的方式加工金属边框60，使金属边框60的内部结构较为致密，具有更高的强度，从而为打磨、电镀、氧化等表面处理工艺提供良好的基础。
本发明中，金属边框60的材质还可以优选的采用铝铜合金或铝镍合金或锆合金或钛合金，当然，其他的金属材料只要其能够被用于 制作电子产品的金属边框60，都在可选的范围之内。
为了增加结合强度，可以是在玻璃板50的周缘设置咬合结构，具体的是，可以顺延玻璃板50的边缘形成凹槽，在挤压时，半固态化的金属边框60受外部挤压力，其内侧表面形成部分嵌入到上述凹槽中的结构；当然，咬合结构也可以是顺延玻璃板50边缘形成的凸缘，在挤压时，半固态化的金属边框60变形以夹持凸缘。
选用材料时，可以要求金属边框60的热膨胀率大于或者玻璃板50的热膨胀率，如此，在加热金属边框60时，可有效的控制玻璃板50的热膨胀，尽量的减少温度对玻璃板50的影响。本发明的上述方法中还可以采用蓝宝石或其他透明构件来替代上述的玻璃板50，作为电子产品的部件，任何适合作为电子产品背板、面板的材质都在可选的范围内。
本发明中，在进行上述的步骤C之前，还可以在金属边框60和玻璃板50周缘之间加入一缓冲件，缓冲件为位于玻璃板50周缘的连续结构；缓冲件可以是一种利于玻璃板50与金属边框60结合的构件，也可以是一种具有一定弹性的构件，例如，缓冲件可以是65Mn,在将由65Mn形成的缓冲件置于金属边框60和玻璃板50之间形成一体成型构件后，由于65Mn具有较好的弹性，在电子产品从高出跌落时，金属边框60受到较大的冲击，缓冲件则可用于减缓冲击力，从而有效的保护玻璃板50。
本发明的方法还适用于其他的金属构件与透明的非金属构件的结合，无论是何种应用方式，其成型的方法与上述方法步骤大致相同， 在这里不做详细的说明。
对本领域的技术人员来说，可根据以上描述的技术方案以及构思，做出其它各种相应的改变以及形变，而所有的这些改变以及形变都应该属于本发明权利要求的保护范围之内。

Claims (8)

  1. 非金属构件与金属构件的一体成型方法，其特征在于，包括如下步骤：
    A、将透明的非金属构件置于模具中；
    B、在模具中于非金属构件的周缘置入金属构件，该金属构件为一位于非金属构件周缘的连续结构；
    C、加热金属构件，使金属构件形成被限定在模具型腔中的半固态化的金属；
    D、利用模具挤压半固态化的金属，使该半固态化的金属无缝的结合于非金属构件的周缘；
    E、快速冷却位于非金属构件周缘的半固态化的金属，使半固态化的金属成型为无缝结合于非金属构件周缘的非晶金属。
  2. 如权利要求1所述的非金属构件与金属构件的一体成型方法，其特征在于，金属构件的材质为铝镁合金或铝铜合金或铝镍合金或锆合金或钛合金。
  3. 如权利要求1所述的非金属构件与金属构件的一体成型方法，其特征在于，非金属构件的周缘设置有咬合结构。
  4. 如权利要求3所述的非金属构件与金属构件的一体成型方法，其特征在于，咬合结构为顺延非金属构件的边缘形成的凹槽或凸起部。
  5. 如权利要求1所述的非金属构件与金属构件的一体成型方法，其特征在于，金属构件的热膨胀率大于或者等于非金属构件的热膨胀率。
  6. 如权利要求1所述的非金属构件与金属构件的一体成型方法，其特征在于，在进行步骤C之前，位于金属构件和非金属构件之间加入一缓冲件，该缓冲件为位于非金属构件周缘的连续结构。
  7. 如权利要求1所述的非金属构件与金属构件的一体成型方法，其特征在于，非金属构件为玻璃或蓝宝石。
  8. 如权利要求1所述的非金属构件与金属构件的一体成型方法，其特征在于，步骤C、步骤D和步骤E是在真空环境下进行的。
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