TW201418358A - Thermosetting epoxy resin composition, adhesive film for forming insulating layer and multilayer printed wiring board - Google Patents

Abstract

The present invention provides an epoxy resin composition with low dielectric loss tangent, and capable of forming a coarsening surface with excellent adhesion to a conductor layer and forming an insulation layer having the properties of even more multiple lamination and high densification excellent in layer build-up with balance corresponding to a multilayered printed wiring board. The thermosetting epoxy resin composition of the present invention is to make, when the nonvolatile ingredient in the resin composition at least containing epoxy resin (A) and naphthalene-containing active ester compound (B) is 100 mass%, the content of the abovementioned naphthalene-containing active ester compound (B) is 0.1~30 mass%.

Description

Thermosetting epoxy resin composition, adhesive film for forming an insulating layer, and multilayer printed wiring board

The present invention relates to a thermosetting epoxy resin composition and a cured product thereof, which are low in dielectric tangent and low in roughness, and which are suitable for forming an insulating layer having a roughened surface capable of improving peel strength, and have roughness A multilayer printed wiring board having a low degree and a cured layer of a roughened surface which can improve the peel strength as an insulating layer.

With the miniaturization and high performance of the electronic device, it is known that the surface of the insulating layer is subjected to roughening treatment in accordance with the method of forming a multilayered and high-density conductor in the build-up layer of the multilayer printed wiring board to be used. A semi-additive method of forming a conductor layer by electroless plating or electrolytic plating by an additive method of forming a conductor layer by electroless plating, and in the case of such methods, between the surface of the insulating layer and the plated conductor layer The adhesion is mainly ensured by roughening the surface of the insulating layer to form a surface having fine concavities and convexities which exhibits a fixing effect.

The fixing effect of the irregularities formed on the surface of the insulating layer is larger as the surface roughness is larger, and the greater the roughness, the more the insulating layer is improved. The adhesion of the plated conductor layer. However, when the roughness of the surface of the insulating layer is large, the thin film conductor layer formed on the roughened surface is partially removed by etching to form a specific wiring pattern, and the conductor entering the concave portion in the surface of the insulating layer should be removed. Since the layer portion is in a state in which it is difficult to remove, it takes a long time for the etching process to be performed, and at the same time, due to the influence, the wiring pattern portion to be left is eroded to damage the fine wiring, and the risk of disconnection becomes high. Therefore, in order to reduce the thickness and increase the density of the wiring, the surface state of the insulating layer is required to be as fine as possible as possible, and the rough surface of the adhesion to the thin film conductor layer formed by plating can be sufficiently ensured.

Further, the insulating layer is also required to have a low coefficient of thermal expansion of the line so as not to cause a difference in linear thermal expansion coefficient between the conductor layer formed by the wiring pattern formed on the surface of the insulating layer. When the linear thermal expansion coefficient of the insulating layer is high, the difference in thermal expansion coefficient from the conductor layer becomes large, and it is likely to cause a problem such as cracking between the insulating layer and the conductor layer.

In the past, an "active ester compound" is known as a hardener used as a thermosetting resin composition for forming an insulating layer of an inner layer circuit board of the multilayer printed wiring board as described above, and as the "active ester compound", mainly The "active ester compound containing a dicyclopentadiene diphenol structure" is used. However, in recent years, the progress of more stratification and high density in the build-up of multilayer printed wiring boards has been remarkable, and there are many proposals for forming an epoxy resin composition which can correspond to the insulating layer of this condition.

Patent Document 1 discloses that an active ester compound obtained by arylating a phenolic hydroxy group in a novolak resin can be used as a hardener for a thermosetting epoxy resin composition, and formation of a low dielectric property can be obtained. The hardened layer of the edge layer.

In Patent Document 2, as the roughness of the roughened surface on which the surface of the cured product is roughened is relatively small, the roughened surface exhibits high adhesion to the plated conductor and the linear thermal expansion coefficient is small. The epoxy resin composition of the insulating layer contains (A) an epoxy resin, (B) an active ester compound, (C) a phenol resin having a triazine structure, (D) a maleimide compound, and (E) Epoxy resin composition of phenoxy resin.

Further, in Patent Document 3, a thermosetting epoxy resin composition capable of imparting a cured product exhibiting a low dielectric constant and a low dielectric tangent and having excellent heat resistance and flame retardancy is described as containing a polycondensation. An aryloxy structure is a main skeleton, and an epoxy resin composition of an active ester resin having an arylcarbonyl group on an aromatic core of the structure.

As described above, there are many proposals for an epoxy resin composition suitable for forming an insulating layer of an inner layer circuit board, but a fine roughened surface which can form a low dielectric tangent and is excellent in adhesion to a conductor layer can be used. There is an increasing expectation that an epoxy resin composition having an insulating layer which is well-balanced and capable of being more stratified and densified by the build-up of a multilayer printed wiring board is formed.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Publication No. 07-082348

[Patent Document 2] JP-A-2010-090238

[Patent Document 3] JP-A-2012-012534

An object of the present invention is to provide a roughened surface having fine concavities and convexities which exhibits low dielectric tangentiality and excellent adhesion to a conductor layer, and which can be formed in a well-balanced manner and can be increased in accordance with a multilayer printed wiring board. A thermosetting epoxy resin composition of an insulating layer having more stratification and higher density in a layer, a printed wiring board having an insulating layer formed of the cured product, and a multilayer formed of the printed wiring board Printed wiring board.

Further, an object of the present invention is to provide a film for forming an insulating layer formed of a resin composition layer composed of the above-mentioned thermosetting epoxy resin composition on a support film, and impregnating the thermosetting epoxy resin composition A prepreg for forming an insulating layer formed in a sheet-like reinforcing substrate.

As a result of a review of the curing agent or the blending resin used in the thermosetting epoxy resin composition, the present inventors have found that various kinds of resins known as resin components blended in the epoxy resin composition are "naphthalene-containing". When the active ester compound of the structure is blended in a resin composition in a specific amount, it will become a means for solving the above problems, and the following invention is completed.

[1] A thermosetting epoxy resin composition comprising at least an epoxy resin (A) and a thermosetting of an active ester compound (B) containing a naphthalene structure In the epoxy resin composition, when the non-volatile component in the thermosetting epoxy resin composition is 100% by mass, the content of the active ester compound (B) containing the naphthalene structure is 0.1 to 30% by mass.

[2] The thermosetting epoxy resin composition according to [1], wherein the active ester compound (B) having a naphthalene structure has an active ester compound of a polyoxynaphthalene structure and an arylcarbonyloxy group.

[3] The thermosetting epoxy resin composition according to [1] or [2] wherein the active ester compound (B) having a naphthalene structure is bonded to an aryl group on a naphthalene nucleus of a polyoxynaphthalene structure. An active ester compound of a carbonyloxy group.

[4] The thermosetting epoxy resin composition according to any one of [1] to [3] wherein the epoxy resin (A) contains a liquid epoxy resin.

[5] The thermosetting epoxy resin composition according to any one of [1] to [4] further comprising an inorganic filler.

[6] The thermosetting epoxy resin composition according to any one of [1] to [5] further comprising a thermoplastic resin.

[7] The thermosetting epoxy resin composition according to any one of [1] to [6], which is a resin composition for an insulating layer of a multilayer printed wiring board in which a conductor layer is formed by plating.

[8] A resin composition comprising a thermosetting epoxy resin composition according to any one of [1] to [7], wherein the resin film is formed on the support film. Layered.

[9] A prepreg for forming an insulating layer, which is characterized in that the thermosetting epoxy resin composition according to any one of [1] to [7] is impregnated into a flaky fiber. It is made of a substrate.

[10] An insulator for a printed wiring board, which is the resin composition layer of the adhesive film for forming an insulating layer according to [8], or the prepreg for forming an insulating layer according to [9] The hardened material is formed.

[11] An insulator for a printed wiring board, which is obtained by providing a patterned conductor layer on an insulating layer made of an insulator for a printed wiring board according to [10].

[12] The insulator for a printed wiring board according to [10], wherein the insulating layer has a surface roughness Ra of 10 to 200 nm, Rq of 15 to 250 nm, and a peeling strength between the insulating layer and the conductor layer. It is 0.35 kgf/cm or more.

[13] A multilayer printed wiring board obtained by laminating an insulator for a printed wiring board according to [11] or [12].

[14] A semiconductor device comprising the multilayer printed wiring board according to [13].

The thermosetting epoxy resin composition has a low dielectric tangent and can form a roughened surface excellent in adhesion to a conductor layer, and can be formed to have a well-balanced layer which can be added to a multilayer printed wiring board. A thermosetting epoxy resin composition of a cured layer of an insulating layer having more stratification and higher density.

Further, the cured product obtained by curing the thermosetting epoxy resin composition is subjected to roughening treatment to form a surface roughness Ra. In the case of fine concavities and convexities of 15 to 250 nm and Rq of 15 to 250 nm, the Rq is a roughened surface excellent in adhesion to the conductor layer, and thus is particularly useful as an insulating layer forming material in a multilayer printed wiring board.

In the following, the thermosetting epoxy resin composition, the insulating layer forming adhesive film, the insulating layer forming prepreg, the printed wiring board insulator, and the multilayer printed wiring board of the present invention are further described in detail.

The thermosetting epoxy resin composition of the present invention contains an epoxy resin (A) and an active ester compound (B) having a naphthalene structure as essential components, and may contain an inorganic filler, a thermoplastic resin, or an epoxy resin as needed. A hardener, a hardening accelerator, and an additive used in a resin composition for forming an insulating layer in a multilayer printed wiring board.

<Epoxy Resin (A)>

The epoxy resin (A) used in the thermosetting epoxy resin composition of the present invention is an epoxy resin generally used in a resin composition for forming an insulating layer in a multilayer printed wiring board, and can be appropriately selected from the following examples. use.

That is, the epoxy resin (A) is exemplified by, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, phenol novolak type epoxy resin. Resin, t-butyl-catechol epoxy resin, naphthol epoxy resin, naphthalene epoxy resin, naphthalene ether epoxy resin, glycidylamine epoxy resin, glycidyl ester epoxy resin Grease, cresol novolak type epoxy resin, biphenyl type epoxy resin, bismuth type epoxy resin, linear aliphatic epoxy resin, epoxy resin with butadiene structure, alicyclic epoxy resin, miscellaneous Ring epoxy resin, epoxy resin containing spiro ring, cyclohexane dimethanol type epoxy resin, trimethylol type epoxy resin, halogenated epoxy resin, and the like.

Two or more types of epoxy resins (A) may be used in combination. When the epoxy resin (A) is 100% by mass of the nonvolatile component of the epoxy resin (A), it is preferably at least 50% by mass or more of an epoxy resin having two or more epoxy groups in one molecule. Further, the epoxy resin (A) is preferably an aromatic epoxy resin (liquid epoxy resin) having two or more epoxy groups in one molecule and liquid at a temperature of 20 ° C. More preferably, it is an aromatic epoxy resin (solid epoxy resin) containing the liquid epoxy resin and having three or more epoxy groups in one molecule and being solid at a temperature of 20 ° C.

Further, in the present invention, the aromatic epoxy resin means an epoxy resin having an aromatic ring skeleton in its molecule. The so-called epoxy equivalent (g/eq) means the molecular weight per one epoxy group. By using a liquid epoxy resin and a solid epoxy resin as an epoxy resin, when an epoxy resin composition is used in the form of a film, a film exhibiting sufficient flexibility and excellent workability can be formed, and the ring can be improved. The breaking strength of the cured product of the oxyresin composition and the durability of the multilayer printed wiring board.

Further, when a liquid epoxy resin and a solid epoxy resin are used together as an epoxy resin, the blending ratio (liquid epoxy resin: solid epoxy resin) is preferably 1:0.1 in terms of a mass ratio. The range of 1:2. When the liquid epoxy resin is used in this range and used in the form of a film, sufficient flexibility can be obtained, workability can be improved, and sufficient fluidity at the time of lamination can be obtained. Further, by using a solid epoxy resin in this range, when the adhesiveness of the epoxy resin composition is lowered and the film is used in the form of a film, the degassing property at the time of vacuum lamination can be improved. Further, the peeling property of the protective film or the support film at the time of vacuum lamination is good, and the heat resistance after hardening can also be improved.

In the epoxy resin composition of the present invention, when the nonvolatile content of the epoxy resin composition is 100% by mass, the content of the epoxy resin (A) is preferably from 10 to 50% by mass, more preferably from 20 to 40% by mass. %, and more preferably 20 to 35 mass%. When the content of the epoxy resin (A) is within this range, the curing property of the epoxy resin composition tends to be improved.

<Active ester compound containing naphthalene structure (B)>

The "active naphthalene-containing active ester compound (B)" (naphthalene-type active ester compound) in the thermosetting epoxy resin composition of the present invention has a function as a hardener of an epoxy resin, and is considered to be a resin for roughening treatment. When the surface of the cured material is cured, it also contributes to the formation of fine irregularities having good adhesion to the conductor layer.

The active ester compound (B) having a naphthalene structure is not particularly limited as long as it has a naphthalene structure and an arylcarbonyloxy group, but is preferably an active ester compound having a polyoxynaphthalene structure and an arylcarbonyloxy group. An active ester compound of an arylcarbonyloxy group bonded to a naphthalene core of an oxidized naphthalene structure. The polyoxynaphthalene structure may also be a polyoxynaphthalene structure substituted with an alkyl group having 1 to 4 carbon atoms. As above The active ester compound can be produced by a condensation reaction of a compound having a naphthalene structure having a core-substituted hydroxy group with a carboxylic acid compound having a carboxyl group on a naphthalene nucleus or a benzene nucleus. The active ester compound is, for example, a compound contained in "an active ester compound which is esterified with an aryl carboxylic acid as a main skeleton and has a poly(aryleneoxy structure) as described in Patent Document 3).

The active ester compound (B) having a naphthalene structure is specifically exemplified by the compound represented by the following formula (1).

In the formula (1), R _{1 is} each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom, and each of R _{2 is} independently a hydrogen atom or a monovalent group represented by the following formula (2). X is independently a hydrogen atom, a benzamidine group or a naphthylcarbonyl group, preferably a benzamidine group, and n and m are each independently an integer of 0 to 5, and either n or m is an integer of 1 or more].

[In the formula (2), R ₁ is the same as above, X is the same as above, p is an integer of 1 or 2, and further, at least one of X in the above formula (1) and formula (2) Is benzylidene or naphthalenecarbonyl].

In the thermosetting epoxy resin composition of the present invention, when the non-volatile component of the thermosetting epoxy resin composition is 100% by mass, the content of the active ester compound (B) having a naphthalene structure is 0.1 to 30 mass. %. According to this, it is possible to form a roughened surface of fine concavities and convexities which exhibit low dielectric tangential and have excellent adhesion to the conductor layer and etching property. The content of the active ester compound (B) having a naphthalene structure is more preferably from 3 to 30% by mass, still more preferably from 5 to 28% by mass.

<Inorganic Filler>

By further containing the inorganic filler in the thermosetting epoxy resin composition of the present invention, the linear thermal expansion coefficient or the dielectric tangent can be lowered. The inorganic filler is exemplified by, for example, cerium oxide, aluminum oxide, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate. , barium titanate, calcium titanate, magnesium titanate, barium titanate, titanium oxide, barium zirconate, calcium zirconate and the like. Among them, cerium oxide such as amorphous cerium oxide, pulverized cerium oxide, molten cerium oxide, crystalline cerium oxide, synthetic cerium oxide, hollow cerium oxide, spherical cerium oxide or the like is preferably further reduced. In terms of surface roughness of the insulating layer, it is more preferably molten cerium oxide, spherical cerium oxide, and more preferably spherical molten cerium oxide. These may be used alone or in combination of two or more. Commercially available spheroidal molten cerium oxide is exemplified by ADMATECHS (share) "SOC2", "SOC1", etc.

The average particle diameter of the inorganic filler is not particularly limited, but the surface of the insulating layer is low in roughness, and from the viewpoint of formation of fine wiring, it is preferably 5 μm or less, more preferably 3 μm or less, and still more preferably 2 μm. Further, it is more preferably 1 μm or less, still more preferably 0.8 μm or less, more preferably 0.6 μm or less, still more preferably 0.4 μm or less. On the other hand, when the resin composition is used as a resin paint, it is preferably 0.01 μm or more, more preferably 0.03 μm or more, and more preferably 0.05 μm from the viewpoint of preventing the viscosity of the paint from rising and the workability from being lowered. The above is more preferably 0.07 μm or more, and still more preferably 0.1 μm or more. The average particle diameter of the above inorganic filler can be measured by a laser diffraction and scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler can be determined on a volume basis by a laser diffraction scattering type particle size distribution measuring apparatus, and the median diameter can be measured as an average particle diameter. The measurement sample can preferably be obtained by dispersing an inorganic filler in water by using ultrasonic waves. As the laser diffraction scattering type particle size distribution measuring apparatus, LA-950 or the like manufactured by Horiba, Ltd. can be used. The inorganic filler is preferably an amine decane coupling agent, a urea based alkyl coupling agent, an epoxy decane coupling agent, a mercapto decane coupling agent, a decane coupling agent, a vinyl decane coupling agent, or styrene. A surface treatment agent such as a quinone coupling agent, an acrylate decane coupling agent, an isocyanate decane coupling agent, a thioether decane coupling agent, an organic decazane compound, or a titanate coupling agent is surface-treated to improve the resistance thereof. Wet and dispersible. These may be used alone or in combination of two or more.

When the inorganic filler is blended, the content is thermosetting. The content of the inorganic filler is different, and the content of the inorganic filler is preferably from 30 to 90% by mass, more preferably from 30 to 90% by mass, based on the nonvolatile content of the thermosetting epoxy resin composition. 40 to 80% by mass, and more preferably 50 to 70% by mass. When the content of the inorganic filler is too small, the linear thermal expansion coefficient of the cured product tends to be high, and when the content is too large, it tends to be difficult to form a film when the film is attached, and the cured product tends to be brittle.

<Thermoplastic resin>

The thermosetting epoxy resin composition of the present invention can further improve the mechanical strength of the cured product by further containing a thermoplastic resin, and can further improve the film forming ability when used in the form of a film. Examples of the thermoplastic resin include phenoxy resin, polyvinyl acetal resin, polyimide resin, polyamidoximine resin, polyether oxime resin, polyfluorene resin, polyether oxime resin, and polyphenylene ether. The resin, the polycarbonate resin, the polyetheretherketone resin, and the polyester resin are preferably a phenoxy resin or a polyethylene acetal resin. These thermoplastic resins may be used alone or in combination of two or more. The weight average molecular weight of the thermoplastic resin is preferably in the range of 8,000 to 200,000, more preferably in the range of 12,000 to 100,000. Further, the weight average molecular weight in the present invention is measured by a gel permeation chromatography (GPC) method (in terms of polystyrene). For the weight average molecular weight measured by the GPC method, LC-9A/RID-6A manufactured by Shimadzu Corporation can be used as a measuring device, and Shodex K-800P/K-804L/K-made by Showa Denko Co., Ltd. can be used. 804L was used as a column, and chloroform or the like was used as a mobile phase, and the column temperature was measured at 40 ° C, and was calculated using a calibration line of standard polystyrene.

When the amount of the non-volatile component in the thermosetting epoxy resin composition is 100% by mass, the amount is preferably 0.1 to 10% by mass, more preferably 0.5 to 5% by mass. When it is in this range, the film forming ability or the mechanical strength can be improved, and the roughness of the surface of the insulating layer after the increase in the melt viscosity or the wet roughening step can be reduced.

<hardener for epoxy resin>

Further, a thermosetting epoxy resin composition of the present invention may further use a general hardener for an epoxy resin. Examples of hardeners for epoxy resins that can be used are TD2090, TD2131 [DIC (trade name), trade name], MEH-7600, MEH-7851, MEH-8000H [Minghe Chemical Co., Ltd., trade name), NHN, CBN, GPH-65, GPH-103 [Nippon Chemical Co., Ltd., trade name], SN170, SN180, SN190, SN475, SN485, SN495, SN375, SN395 [Nippon Steel Chemical Co., Ltd., trade name], LA7052 , such as phenolic curing agent such as LA7054, LA3018, LA1356 [DIC (share), trade name], Fa, Pd [Four countries into the company, trade name], HFB2006M [Showa polymer (share), trade name] Benzoxazine-based hardener, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, acid anhydride hardener, PT30, PT60, BA230S75 [Japan LONZA (shares) ), a cyanate-based curing agent such as a trade name].

<hardening accelerator>

The thermosetting epoxy resin composition of the present invention further comprises a hard The accelerator can effectively adjust the hardening time and the hardening temperature. The hardening accelerator is exemplified by an organic phosphine compound such as TPP, TPP-K, TPP-S, TPTP-S [Beixing Chemical Industry Co., Ltd., trade name], Curezol 2MZ, 2E4MZ, Cl1Z, Cl1Z-CN, Cl1Z-CNS, Imidazole compounds such as Cl1Z-A, 2MZ-OK, 2MA-OK, 2PHZ [Four Nations Chemical Industry Co., Ltd., trade name], Novacure [Asahi Kasei Industrial Co., Ltd., trade name], Fujicure [Fuji Chemical Industry Co., Ltd., Amine adduct compound of the trade name], 1,8-diazabicyclo[5,4,0]undecene-7,4-dimethylaminopyridine, benzyldimethylamine, 2, An amine compound such as 4,6-gin(dimethylaminomethyl)phenol or 4-dimethylaminopyridine, or an organic metal complex such as cobalt, copper, zinc, iron, nickel, manganese or tin, or an organic metal salt . Two or more types of hardening accelerators may be used in combination. When the total amount of the epoxy resin contained in the epoxy resin composition is 100% by mass (nonvolatile content), it is preferably used in the range of 0.05 to 1% by mass.

The thermosetting epoxy resin composition of the present invention may optionally contain various other resin additives other than the above, within the range in which the effects of the present invention are exerted. Examples of the resin additive include organic fillers such as strontium powder, nylon powder, fluorine powder, and rubber particles, tackifiers such as Orben and Benton, polyfluorene-based, fluorine-based, polymeric antifoaming agents or admixtures, and imidazole. Titanium, thiazole, triazole, decane coupling agent and other adhesion imparting agents, phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, carbon black and other colorants, metal hydroxides, phosphorus compounds, etc. Flame retardant, etc.

The thermosetting epoxy resin composition of the present invention may be suitably mixed with the above components, and may be triaxially rolled, ball milled, or bead-polished as needed. Mixing means such as a machine or a sand mill, or a mixing means such as a super-kneading machine or a planetary kneading machine, or mixing and mixing. Further, a resin paint was prepared by further adding an organic solvent.

Since the thermosetting epoxy resin composition of the present invention has a low dielectric tangent and can form a roughened surface excellent in adhesion to a conductor layer, it can be preferably used as a resin composition for forming a conductor layer by plating. The material (a resin composition for an insulating layer of a multilayer printed wiring board on which a conductor layer is formed by plating) is further preferably used as a resin composition for layering of a multilayer printed wiring board.

The thermosetting epoxy resin composition of the present invention is particularly suitable for use as a component of an insulating layer forming material of a multilayer printed wiring board, and can be used for a solder resist, an underfill material, a die bonding material, a semiconductor sealing material, a buried resin, The parts are embedded in a wide range of applications requiring a resin composition such as a resin. In addition, the form of the resin composition of the present invention is not particularly limited, but can be applied to a sheet-like laminate such as a film or a prepreg, or a circuit board (for laminate use, multilayer printed wiring board use, etc.). The resin composition of the present invention may be applied to a circuit board by a paint to form an insulating layer. However, it is generally used in the formation of an insulating layer in the form of a sheet-like laminate such as a film or a prepreg.

<Sheet laminate] (Continuous film for forming an insulating layer)

The adhesive film for forming an insulating layer of the present invention is characterized in that a resin composition layer made of a thermosetting epoxy resin composition is provided on the support film. The adhesive film for forming an insulating layer can be applied to a support by using a method known in the art, for example, dissolving a resin composition in an organic solvent to a resin paint, and applying the resin paint to a support using a die coater or the like. It is produced by drying an organic solvent by heating or blowing hot air to form a resin composition layer.

The organic solvent may, for example, be a ketone such as acetone, methyl ethyl ketone or cyclohexanone, ethyl acetate, butyl acetate, fibrin acetate, propylene glycol monomethyl ether acetate or carbitol acetate. Acetate, carbaryl alcohol such as cellosolve or butyl carbitol, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, etc. A guanamine solvent or the like. The organic solvent may be used in combination of two or more kinds.

The drying conditions are not particularly limited, but the resin composition layer is preferably dried to an organic solvent content of 10% by mass or less, preferably 5% by mass or less. The amount of the organic solvent in the paint varies depending on the boiling point of the organic solvent. For example, the resin composition can be formed by drying the paint containing 30 to 60% by mass of the organic solvent at 50 to 150 ° C for about 3 to 10 minutes. Floor.

The thickness of the resin composition layer formed in the adhesive film for forming an insulating layer is preferably equal to or greater than the thickness of the laminate. The thickness of the conductor layer of the circuit board is usually in the range of 5 to 70 μm, so the resin composition layer preferably has a thickness of 10 to 100 μm. From the viewpoint of film formation, it is preferably from 15 to 80 μm.

Examples of the support include a film of a polyolefin such as polyethylene, polypropylene, or polyvinyl chloride, polyethylene terephthalate (hereinafter sometimes abbreviated as "PET"), and polyethylene naphthalate B. Various plastic films such as polyester film such as diester, polycarbonate film, and polyimide film. And also A release paper, a metal foil such as a copper foil or an aluminum foil, or the like can be used. Among them, in terms of versatility, it is preferably a plastic film, more preferably a polyethylene terephthalate film. Surface treatment such as surface modification (MAD) treatment or corona treatment may be applied to the support and the protective film described later. Further, the release treatment may be carried out by a release agent such as a polyoxymethylene resin release agent, an alkyd resin release agent, or a fluororesin release agent.

The thickness of the support is not particularly limited, and is preferably from 10 to 150 μm, more preferably from 25 to 50 μm.

The surface of the resin composition layer which is not adhered to the support may be further laminated with a protective film according to the support. The thickness of the protective film is not particularly limited, but is, for example, 1 to 40 μm. By laminating the protective film, adhesion of dirt or the like to the surface of the resin composition layer can be prevented.

The adhesive film for forming an insulating layer having the above configuration may be wound into a roll and stored.

(Prepreg for forming an insulating layer)

The prepreg for forming an insulating layer of the present invention is characterized in that the thermosetting epoxy resin composition is impregnated into the sheet-like fibrous base material. That is, the thermosetting epoxy resin composition of the present invention can be impregnated into a sheet-like reinforcing substrate by a hot melt method or a solvent method, and heated and semi-cured. As the flaky reinforcing substrate, a fiber for prepreg made of a conventional fiber such as glass cloth or linalin fiber can be used. Further, the prepreg for forming an insulating layer of the present invention is preferably provided on the support.

The hot melt method does not dissolve the resin composition in the organic solvent Preparing a prepreg by temporarily applying it to a support and laminating it to a sheet-like reinforcing substrate, or directly applying a resin composition to a sheet-like reinforcing substrate by a die coater. The method. Further, the solvent method is the same as the method for producing the adhesive film for forming an insulating layer, and the resin is dissolved in an organic solvent to prepare a resin paint, and the flaky reinforcing substrate is immersed in the paint to impregnate the resin paint. Reinforce the substrate and then dry it. Further, the prepreg for forming an insulating layer of the present invention may be prepared by continuously and thermally laminating the underlying film for forming an insulating layer from both sides of the sheet-like reinforcing substrate under heat and pressure. A support or a protective film may be used similarly to the above-described adhesive film for forming an insulating layer.

As described above, the insulator for a printed wiring board formed of the cured product of the resin composition layer for the insulating layer forming film and the insulator for the printed wiring board formed of the cured product of the insulating layer forming prepreg are suitable as the insulator. An insulating layer for a multilayer printed wiring board. Further, it is more preferable to provide a patterned conductor layer (circuit) on the insulating layer formed of the insulator for the printed wiring board. Moreover, it is preferable to laminate a plurality of multilayer printed wiring boards in which a plurality of insulators for printed wiring boards having the conductor layers (circuits) are laminated.

<Multilayer Printed Wiring Board Using Sheet Laminates>

Next, an example of a method of manufacturing a multilayer printed wiring board using the sheet-like laminate produced as described above will be described.

First, a sheet laminate is laminated on one or both sides of a circuit board using a vacuum laminator. The substrate used for the circuit substrate is exemplified by, for example, a glass epoxy substrate, a metal substrate, and a polyester base. A plate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate, or the like. Here, the term "circuit substrate" as used herein refers to a conductor layer (circuit) formed by patterning on one or both sides of a substrate as described above. In the multilayer printed wiring board in which the conductor layer and the insulating layer are alternately laminated, the one or both sides of the outermost layer of the multilayer printed wiring board are patterned and processed into a conductor layer (circuit). It is called in the circuit board. Further, the surface of the conductor layer may be subjected to pre-roughening treatment by blackening treatment, copper etching or the like.

In the above lamination, when the sheet-like laminate material has a protective film, after the protective film is removed, the sheet-like laminate material and the circuit substrate may be preheated as needed, and the laminate is laminated on the circuit substrate while pressing and heating the sheet-like laminate material. on. In the sheet-like laminate of the present invention, a method of laminating on a circuit board under reduced pressure by vacuum lamination is preferred. The lamination conditions are not particularly limited, but it is preferably, for example, a pressing temperature (laminating temperature) of 70 to 140 ° C, and a pressing pressure (laminating pressure) of preferably 1 to 11 kgf/cm ² (9.8). ×10 ⁴ to 107.9 × 10 ⁴ N/m ² ), the pressing time (lamination time) is preferably 5 to 180 seconds, and the air pressure is set to 20 mmHg (26.7 hPa) or less under reduced pressure. Further, the lamination method may be a batch type or a continuous type using a roll. Vacuum lamination can be carried out using a commercially available vacuum laminator. Commercially available vacuum laminating machines include, for example, a vacuum coater manufactured by Nichigo Morton Co., Ltd., a vacuum press laminator manufactured by a famous machine manufacturer, and a drum type dry coating manufactured by Hitachi Industrial Co., Ltd. Cloth machine, vacuum laminator manufactured by Hitachi AIC Co., Ltd., etc.

After laminating the sheet-like laminate material on the circuit board, after cooling to room temperature, the resin can be peeled off by peeling off the support. The resultant is thermally hardened to form a cured product, and an insulating layer is formed on the circuit substrate. The conditions of the heat hardening may be appropriately selected depending on the kind and content of the resin component in the resin composition, but it is preferably from 20 minutes to 180 minutes at 150 ° C to 220 ° C, and more preferably from 30 ° C to 210 ° C for 30 minutes. Choose within 120 minutes. After the insulating layer is formed, when the support is not peeled off before the hardening, the peeling may be performed at this time as needed.

Alternatively, the sheet laminate may be laminated on one or both sides of the circuit board using a vacuum press. The laminating step of heating and pressurizing under reduced pressure can be carried out using a general vacuum hot press. For example, it can be performed by pressurizing a metal plate such as a heated SUS plate from the side of the support layer. The pressurization condition is a pressure reduction condition of usually 1 × 10 ^-2 MPa or less, preferably 1 × 10 ^-3 MPa or less. Heating and pressurization may be carried out in one stage, but it is preferable to carry out the conditions of dividing into two or more stages from the viewpoint of controlling resin bleeding. For example, it is preferred that the temperature in the first stage is 70 to 150 ° C, the pressure is in the range of 1 to 15 kgf / cm ² , and the pressure in the second stage is 150 to 200 ° C. It is carried out in the range of 1 to 40 kgf/cm ² . The time of each stage is preferably 30 to 120 minutes. An insulating layer can be formed on the circuit substrate by thermally curing the resin composition layer. Commercially available vacuum heat presses are exemplified by, for example, MNPC-V-750-5-200 (manufactured by Nago Seiki Co., Ltd.), VH1-1603 (manufactured by Kitagawa Seiki Co., Ltd.), and the like.

The dielectric tangent of the insulating layer is preferably 0.009 or less, more preferably 0.006 or less. The lower the dielectric tangent, the better, especially if there is no lower limit, it is 0.001 or more, 0.003 or more, and the like.

Next, the insulating layer formed on the circuit substrate is subjected to a hole forming process to form a through hole and a through hole. The punching process can be performed by a conventional method such as a drill, a laser, a plasma, and the like, and the most common method is to perform punching using a laser such as a carbon dioxide laser or a YAG laser. . When the support is not peeled off before the piercing process, it is peeled off at this time.

Next, the surface of the insulating layer is roughened. The dry roughening treatment is exemplified by a plasma treatment or the like, and the wet roughening treatment is a method in which a swelling treatment of a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid are sequentially performed. In the wet roughening treatment, it is preferable to form an anchor of the unevenness on the surface of the insulating layer, and to remove the smear in the through hole. The swelling treatment by the swelling liquid is carried out by immersing the insulating layer in the swelling liquid at 50 to 80 ° C for 5 to 20 minutes (preferably at 55 to 70 ° C for 8 to 15 minutes). Examples of the swelling liquid are exemplified by an alkali solution, a surfactant solution, etc., and an alkali solution is preferred. The alkali solution is exemplified by, for example, a sodium hydroxide solution, a potassium hydroxide solution or the like. Commercially available swelling agents include, for example, Swelling Dip Securiganth P, Swelling Dip Securiganth SBU, and the like manufactured by ATOTECH Co., Ltd., Japan. The roughening treatment using an oxidizing agent is performed by immersing the insulating layer in an oxidizing agent solution at 60 to 80 ° C for 10 to 30 minutes (preferably at 70 to 80 ° C for 15 to 25 minutes). The oxidizing agent may, for example, be an alkaline permanganic acid solution, dichromate, ozone, hydrogen peroxide/sulfuric acid, nitric acid or the like in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. Further, the permanganate concentration in the alkaline permanganic acid solution is preferably from 5 to 10% by weight. Commercially available oxidizing agents are listed, for example, as Concentrate manufactured by ATOTECH Co., Ltd. of Japan. Compact CP, Dozing Solution Securiganth P and other alkaline permanganic acid solutions. The neutralization solution and the treatment system are immersed in the neutralization solution at 30 to 50 ° C for 3 to 10 minutes (preferably at 35 to 45 ° C for 3 to 8 minutes). The neutralizing liquid is preferably an acidic aqueous solution, and the commercial product is exemplified by Reduction Solution Securiganth P manufactured by ATOTECH Co., Ltd., Japan.

The roughness of the roughened surface on which the surface of the insulating layer is roughened is preferably 200 nm or less, more preferably 150 nm or less, and still more preferably 100 nm or less from the viewpoint of forming fine wiring. And to ensure the anchoring effect of the roughened surface is preferably 10 nm or more. Further, the Ra value is a type of numerical value of the surface roughness, and is called an arithmetic mean roughness. Specifically, the absolute value of the height of the change from the surface of the average line is measured in the measurement region and the arithmetic average is performed. . For example, WYKONT 3300 manufactured by Veeco Instruments Co., Ltd. can be used, and the VSI contact mode can be used to obtain a value obtained by measuring a range of 121 μm × 92 μm with a 50-fold lens.

Further, since the root mean square roughness (Rq value) reflects the local state of the surface of the insulating layer, it has been found that the surface of the insulating layer which is dense and smooth can be confirmed by the Rq value, and the peel strength is stabilized. In order to form a dense and smooth insulating layer surface, the Rq value is preferably 250 nm or less, more preferably 200 nm or less, still more preferably 150 nm or less, still more preferably 100 nm or less. Further, from the viewpoint of stabilizing the peel strength, it is preferably 15 nm or more, more preferably 30 nm or more. Further, the Rq value indicates one of the numerical values of the surface roughness, and is called a root mean square roughness, specifically, the height of the change from the surface of the average line in the measurement region. The value is expressed as a root mean square.

Next, a conductor layer is formed on the insulating layer by dry plating or wet plating. Dry plating can be carried out by a conventional method such as vapor deposition, sputtering, or ion plating. The wet plating is exemplified by a method of forming a conductor layer by electroless plating and electrolytic plating, a plating resist which forms a pattern opposite to the conductor layer, and a method of forming a conductor layer only by electroless plating. As for the subsequent pattern forming method, for example, a subtractive method, a semi-additive method, or the like which is conventionally known to those skilled in the art can be used, and a multilayer printed wiring board can be manufactured by repeating the above-described series of steps in a plurality of stages. .

The peeling strength between the insulating layer and the conductor layer is preferably 0.35 kgf/cm or more, more preferably 0.4 kgf/cm or more, in order to sufficiently adhere the insulating layer to the conductor layer. The upper limit of the peel strength is preferably as high as possible, and is not particularly limited, but is generally 1.5 kgf/cm or less, 1.2 kgf/cm or less, 1.0 kgf/cm or less, and 0.8 kgf/cm or less. Since the insulating layer of the insulator for a printed wiring board of the present invention has a low roughness and a high peeling strength between the insulating layer and the conductor layer, it can be preferably used as a build-up layer of a multilayer printed wiring board.

<Semiconductor device>

A semiconductor device can be manufactured by using the multilayer printed wiring board of the present invention. That is, the semiconductor device of the present invention comprises the multilayer printed wiring board of the present invention. A semiconductor device can be manufactured by mounting a semiconductor wafer on a conductive portion of the multilayer printed wiring board of the present invention. The "conduction portion" is a "portion of a conductive signal in a multilayer printed wiring board", and the position may be a surface or a buried position. And, if the semiconductor wafer is half The electrical circuit component in which the conductor is a material is not particularly limited.

The method of mounting the semiconductor wafer in the manufacture of the semiconductor device of the present invention is not particularly limited as long as the semiconductor wafer is effectively functioned, and specifically, a metal wire bonding method, a flip chip mounting method, and a buildup using a bump (BBUL) The mounting method, the mounting method using an anisotropic conductive film (ACF), the mounting method using a non-conductive film (NCF), and the like.

[Examples]

Hereinafter, the present invention will be described in more detail by way of examples and comparative examples, but the invention is not limited by the examples and the like. In the following description, "parts" and "%" mean "parts by mass" and "% by mass".

test methods. Evaluation method

<Measurement of peel strength of the laminate, arithmetic mean rough plating (Ra), and measurement of root mean square roughness (Rq)>

(1) Underlayer treatment of laminate

The glass cloth substrate with the inner layer circuit formed on both sides of the copper-clad laminate (copper foil thickness 18 μm, residual copper ratio 60%, substrate thickness 0.3 mm, Matsushita Electric Co., Ltd. R5715ES) was immersed in Merck on both sides. In the CZ8100 manufactured by the company, the surface of the copper foil is roughened.

(2) followed by lamination of the film

Using a batch vacuum pressure laminator MVLP-500 [manufactured by Nago Seiki Co., Ltd., trade name], the following films prepared in the following examples and comparative examples were laminated on both surfaces of the laminate. The laminating system was carried out by depressurizing at 30 seconds to bring the gas pressure to 13 hPa or less, followed by pressing at 100 ° C and a pressure of 0.74 MPa for 30 seconds.

(3) Hardening of resin composition

The PET film was peeled off from the film which was laminated, and the resin composition was cured at 170 ° C for 30 minutes to form an insulating layer.

(4) roughening treatment

The above-mentioned laminate in which the insulating layer was formed was immersed in Swelling Dip Securiganth P containing diethylene glycol monobutyl ether in Japan ATOTECH Co., Ltd. at 60 ° C for 10 minutes, and then immersed at 80 ° C for coarsening. Concentrate manufactured by Japan ATOTECH Co., Ltd. In a Compact P (KMnO ₄ : 60 g/L, NaOH: 40 g/L aqueous solution), it was immersed in a Reduction Solution Securiganth P manufactured by Atotech Co., Ltd., Japan as a neutralizing solution for 5 minutes at 40 ° C for 5 minutes. The roughened laminate was used as sample A.

(5) Formation of a conductor layer by a semi-additive method

In order to form a circuit on the surface of the insulating layer, the laminate of Sample A was immersed in a solution for electroless plating containing PdCl ₂ and then immersed in an electroless copper plating solution. After annealing at 150 ° C for 30 minutes and annealing, an etching resist pattern was formed, and after patterning by etching, copper sulfate electrolytic plating was performed to form a conductor layer with a thickness of 30 μm. Next, annealing treatment was performed at 180 ° C for 60 minutes. This laminate was used as sample B.

(6) Determination of arithmetic mean roughness (Ra value) and root mean square roughness (Rq value)

For the sample A, Ra and Rq values were determined from a value obtained by using a non-contact surface roughness meter (WYKONT 3300 manufactured by Veeco Instruments Co., Ltd.) in a VSI contact mode with a 50-fold lens and a measurement range of 121 μm × 92 μm. Next, a numerical value obtained by obtaining an average value of each of 10 points was used as a measured value.

(7) Determination of peel strength of the conductor layer

A portion of the conductor layer of the sample B was formed to have a slit having a width of 10 mm and a length of 100 mm, and the stripping fixture (TSI Co., Ltd., AUTOCOM type testing machine AC-50C-SL) was clamped to one end of the short strip conductor layer. The load (kgf/cm) at a time of peeling 35 mm in the vertical direction at a speed of 50 mm/min was measured at room temperature.

<Measurement of dielectric tangent>

The adhesive film obtained in each of the following Examples and Comparative Examples was thermally cured at 190 ° C for 90 minutes, and the PET film was peeled off to obtain a flaky cured product. The cured product was cut into a test piece having a width of 2 mm and a length of 80 mm, and a cavity resonator perturbation dielectric constant measuring device manufactured by Kanto Applied Electronics Co., Ltd. was used. CP521 and Agilent Technology's network analyzer E8362B were measured by a cavity resonance method at a measurement frequency of 5.8 GHz for tangent tanδ (tan δ). The measurement was performed on two test pieces, and the average value was calculated.

Example 1

A liquid bisphenol A type epoxy resin (epoxy equivalent weight 180, "828US" manufactured by Mitsubishi Chemical Corporation) was stirred in 15 parts of methyl ethyl ketone (hereinafter referred to as "MEK") and 15 parts of cyclohexyl copper. 15 parts of a biphenyl type epoxy resin (epoxy equivalent 291, "NC3000H" manufactured by Nippon Kayaku Co., Ltd.) was dissolved in 15 parts. Subsequently, a naphthalene type active ester compound [EXB9411-65BK, which is manufactured by DIC Co., Ltd., an active ester equivalent of 272, a toluene solution of 65% solid content], and a hardening accelerator [Golden Chemical Industry Co., Ltd., "4-dimethylaminopyridine" 0.15 parts, spherical cerium oxide [average particle size 0.5 μm, "SO-C2" treated with phenylamino decane, ADMATECHS (manufactured by ADMATECHS), carbon amount per unit mass 0.18%] 100 parts, 15 parts of a phenoxy resin (YL6954BH30, a MEK solution having a solid content of 30% by mass, a weight average molecular weight of 40,000), and uniformly dispersed by a high-speed rotary kneader to prepare a resin paint. Next, the resin paint was applied onto a film of polyethylene terephthalate (thickness: 38 μm, hereinafter abbreviated as "PET") by a die coater so that the thickness of the resin after drying became 40 μm. It was dried at 80 to 120 ° C (average 100 ° C) for 6 minutes to obtain a sheet-like adhesive film.

Example 2

Except that the 43 parts of the naphthalene type active ester compound of Example 1 [EXB9411-65BK, active ester equivalent 272, solid content 65% toluene solution] were changed to 80 parts, the same as Example 1 It is exactly the same, making resin paint. Next, a film was obtained in the same manner as in Example 1.

Example 3

Except that the 43 parts of the naphthalene type active ester compound of Example 1 [EXB9411-65BK, active ester equivalent 272, solid content 65% toluene solution] were changed to 20 parts, the same as Example 1 It is exactly the same, making resin paint. Next, a film was obtained in the same manner as in Example 1.

Example 4

In addition, 15 parts of the biphenyl type epoxy resin of the first embodiment (epoxy equivalent 291, "NC3000H" manufactured by Nippon Kayaku Co., Ltd.] was changed to a naphthol type epoxy resin [epoxy equivalent 332, Nippon Steel Chemical Co., Ltd. 15 parts of "ESN475V" made by (share), and added cyanate resin ("BA230S75" manufactured by LONZA Co., Ltd., 75% methyl ethyl ketone solution of solid content) 15 parts and hardening catalyst [zinc naphthenate A resin paint was prepared in the same manner as in Example 3 except that the olein solution (metal content: 8%) of 3% cyclohexanone diluted solution] was 0.03 parts. Next, a film was obtained in the same manner as in Example 1.

Comparative example 1

In addition to the naphthalene type active ester compound of Example 1 [DIC] 43 parts of "EXB9411-65BK", active ester equivalent 272, solid solution 65% toluene solution] was changed to active ester compound [HPC8000-65T by DIC, active ester equivalent 223, solid content 65% toluene Solution] 35 parts, and spherical cerium oxide [average particle size 0.5 μm, "SO-C2" treated with phenylamino decane, ADMATECHS (share), carbon content per unit mass of 0.18%] 100 parts change A resin paint was prepared in the same manner as in Example 1 except that 0.15 parts of a hardening accelerator [manufactured by Kwong Wing Chemical Industry Co., Ltd., "4-dimethylaminopyridine") was changed to 0.1 part. Next, a film was obtained in the same manner as in Example 1.

Comparative example 2

Except that the 43 parts of the naphthalene type active ester compound of Example 1 [EXB9411-65BK, active ester equivalent 272, solid content 65% toluene solution] were changed to 95 parts, the same as Example 1 It is exactly the same, making resin paint. Next, a film was obtained in the same manner as in Example 1.

The peeling strength of the conductor layer, the surface roughness (Ra value) after the roughening treatment, and the (Rq value) of the evaluation sample of the adhesive film produced in the examples and the comparative examples, and the measurement results of the dielectric tangent of the evaluation sample were shown. In Table 1.

As shown in Table 1, the cured ester compound containing the naphthalene structure in the epoxy resin composition of Example 1 was changed to the cured product of the epoxy resin composition of Comparative Example 1 of the active ester compound outside the scope of the present invention. The values of Ra and Rq after the roughening treatment are large compared with the values of Ra and Rq of the roughened surface formed on the surface of the cured product of the epoxy resin composition of Example 1, but are dense with the conductor layer. The properties (peel strength) were smaller than those of Example 1, and the value of dielectric tangent became large.

Further, in the epoxy resin composition of Comparative Example 2, since the compounding amount of the active ester compound having a naphthalene structure was more than the range of the present invention, the adhesion (peeling strength) to the conductor layer was smaller than that of the first embodiment.

As is apparent from the results of the above examples and comparative examples, the epoxy resin composition of the present invention can be formed to have more stratified and high-density characteristics which are compatible with the buildup of the multilayer printed wiring board. The epoxy resin composition of the insulating layer formed by the cured material.

Claims (14)

A thermosetting epoxy resin composition comprising at least an epoxy resin (A) and a thermosetting epoxy resin composition containing an active ester compound (B) having a naphthalene structure, wherein the thermosetting epoxy resin is used When the nonvolatile content in the composition is 100% by mass, the content of the active ester compound (B) having a naphthalene structure is 0.1 to 30% by mass. The thermosetting epoxy resin composition according to claim 1, wherein the active ester compound (B) having a naphthalene structure has an active ester compound of a polyoxynaphthalene structure and an arylcarbonyloxy group. The thermosetting epoxy resin composition according to claim 1, wherein the active ester compound (B) having a naphthalene structure is an active ester compound in which an arylcarbonyloxy group has been bonded to a naphthalene nucleus of a polyoxynaphthalene structure. The thermosetting epoxy resin composition according to claim 1, wherein the epoxy resin (A) contains a liquid epoxy resin. The thermosetting epoxy resin composition of claim 1, which further comprises an inorganic filler. The thermosetting epoxy resin composition of claim 1, which further comprises a thermoplastic resin. The thermosetting epoxy resin composition of claim 1, which is a resin composition for an insulating layer of a multilayer printed wiring board in which a conductor layer is formed by plating. An adhesive film for forming an insulating layer, which is provided on a support film and is provided with a thermosetting epoxy resin according to any one of claims 1 to 7. The resin composition layer formed by the object. A prepreg for forming an insulating layer, which is obtained by impregnating a thermosetting epoxy resin composition according to any one of claims 1 to 7 into a sheet-like fibrous base material. An insulator for a printed wiring board, which is obtained by the resin composition layer of the adhesive film for forming an insulating layer of claim 8 or the cured product for forming a prepreg for insulating layer according to claim 9. An insulator for a printed wiring board, which is obtained by providing a patterned conductor layer on an insulating layer made of an insulator for a printed wiring board according to claim 10. The insulator for a printed wiring board according to claim 10, wherein the insulating layer has a surface roughness Ra of 10 to 200 nm, Rq of 15 to 250 nm, and a peel strength of the insulating layer and the conductor layer of 0.35 kgf/cm or more. A multilayer printed wiring board obtained by laminating a plurality of insulators for a printed wiring board according to claim 11 or 12. A semiconductor device comprising the multilayer printed wiring board of claim 13.