JP6844311B2 - Resin composition - Google Patents

Description

The present invention relates to resin compositions. Furthermore, the present invention relates to a resin sheet, a printed wiring board, a semiconductor device, and a method for producing the resin composition containing the resin composition.

As a manufacturing technique for a printed wiring board, a manufacturing method by a build-up method in which an insulating layer and a conductor layer are alternately stacked on an inner layer substrate is known. The insulating layer is generally formed by curing the resin composition.

Electronic devices are becoming smaller and more sophisticated, and in multi-layer printed wiring boards, build-up layers are multi-layered, and there is a demand for finer wiring and higher densities. Various efforts have been made to achieve miniaturization and high density of wiring. For example, Patent Document 1 discloses a resin composition capable of obtaining an insulating layer capable of forming fine wiring. ing.

Japanese Unexamined Patent Publication No. 2016-8280

By the way, in recent years, as the amount of information communication has increased, the number of parts to be mounted on the printed wiring board has increased, and along with this, the heat history due to the reflow process given to the insulating layer in the printed wiring board has increased. doing. In addition, as the demand for small high-performance electronic devices has increased in recent years, the thermal history of the reflow process per unit volume of the insulating layer has also increased.

As the thermal history increases, the importance of long-term reliability of plating adhesion between the insulating layer and the conductor layer increases, but reducing the thickness of the insulating layer affects the long-term reliability of plating adhesion. To exert. When the insulating layer is used as an interlayer insulating film, it is necessary to reduce the thickness of the insulating layer, so that a resin composition having excellent long-term reliability of plating adhesion is currently required.

An object of the present invention is to provide a resin composition having excellent long-term reliability of plating adhesion, a resin sheet containing the resin composition, a printed wiring board, a semiconductor device, and a method for producing the resin composition. And.

As a result of diligent studies, the present inventors have found that surface treatment of an inorganic filler with two specific types of silane compounds improves the long-term reliability of plating adhesion and the like, and complete the present invention. I arrived.

That is, the present invention includes the following contents.
[1] A resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler.
The component (C) is (C1) aminosilane compound and epoxysilane compound, (C2) vinylsilane compound and (meth) acrylicsilane compound, (C3) mercaptosilane compound and epoxysilane compound, or (C4) aminosilane compound and acrylicsilane compound. A resin composition that has been surface-treated with.
[2] The resin composition according to [1], wherein the content of the component (C) is 50% by mass or more when the non-volatile component in the resin composition is 100% by mass.
[3] (C) a carbon amount per unit surface area of the component is ^{0.05mg / m 2 ~1mg / m 2} , [1] or the resin composition according to [2].
[4] The resin composition according to any one of [1] to [3], wherein the average particle size of the component (C) is 0.01 μm to 5 μm.
[5] The resin composition according to any one of [1] to [4], wherein the component (C) is silica.
[6] The component (C1), the component (C2), the component (C3), or the component (C4) is 0.5 parts by mass to 3 parts by mass with respect to 100 parts by mass of the inorganic filler, [1] to The resin composition according to any one of [5].
[7] The resin composition according to any one of [1] to [6], which is used for forming an insulating layer of a multilayer printed wiring board.
[8] The resin composition according to any one of [1] to [6], which is used for forming an interlayer insulating layer of a multilayer printed wiring board.
[9] Inorganic by (C1) aminosilane compound and epoxysilane compound, (C2) (meth) acrylic silane compound and vinylsilane compound, (C3) mercaptosilane compound and epoxysilane compound, or (C4) aminosilane compound and acrylicsilane compound. Including the step of surface treating the filler
In the step, the inorganic filler is surface-treated with one of the two silane compounds contained in the component (C1), the component (C2), the component (C3), or the component (C4), and then the other. A method for producing a resin composition, in which an inorganic filler is surface-treated with the silane compound of.
[10] The method for producing a resin composition according to [9], wherein the inorganic filler is surface-treated with an aminosilane compound and then the inorganic filler is surface-treated with an epoxysilane compound.
[11] The method for producing a resin composition according to [9], wherein the inorganic filler is surface-treated with a vinylsilane compound and then the inorganic filler is surface-treated with a (meth) acrylicsilane compound.
[12] The method for producing a resin composition according to [9], wherein the inorganic filler is surface-treated with a mercaptosilane compound and then the inorganic filler is surface-treated with an epoxysilane compound.
[13] The method for producing a resin composition according to [9], wherein the inorganic filler is surface-treated with an aminosilane compound and then the inorganic filler is surface-treated with an acrylic silane compound.
[14] A resin sheet comprising a support and a resin composition layer provided on the support and containing the resin composition according to any one of [1] to [8].
[15] The resin sheet according to [14], wherein the thickness of the resin composition layer is 30 μm or less.
[16] The resin sheet according to [14], wherein the thickness of the resin composition layer is 20 μm or less.
[17] A printed wiring board including an insulating layer formed of a cured product of the resin composition according to any one of [1] to [8].
[18] A semiconductor device including the printed wiring board according to [17].

According to the present invention, it is possible to provide a resin composition having excellent long-term reliability of plating adhesion, a resin sheet containing the resin composition, a printed wiring board, a semiconductor device, and a method for producing the resin composition. It became so.

Hereinafter, the resin composition, the resin sheet, the printed wiring board, the semiconductor device, and the method for producing the resin composition of the present invention will be described in detail.

[Resin composition]
The resin composition of the present invention is a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, and the component (C) is (C1) an aminosilane compound and an epoxy. The surface is treated with a silane compound, (C2) vinyl silane compound and (meth) acrylic silane compound, (C3) mercaptosilane compound and epoxy silane compound, or (C4) aminosilane compound and acrylic silane compound. The resin composition may further contain additives such as (D) a thermoplastic resin, (E) a curing accelerator, (F) a flame retardant, and (G) an organic filler, if necessary. Hereinafter, each component contained in the resin composition of the present invention will be described in detail.

<(A) Epoxy resin>
The resin composition of the present invention contains (A) an epoxy resin. Examples of the epoxy resin include bixilenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, and trisphenol type epoxy resin. Naftor novolac type epoxy resin, phenol novolac type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol novolac Type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring-containing epoxy resin, cyclohexanedimethanol type epoxy resin, naphthylene Examples thereof include ether type epoxy resin, trimethylol type epoxy resin, and tetraphenylethane type epoxy resin. The epoxy resin may be used alone or in combination of two or more. The component (A) is preferably an aromatic skeleton-containing epoxy resin from the viewpoint of reducing the thermal expansion rate, and is preferably a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol AF type epoxy resin, a naphthalene type epoxy resin, or a biphenyl type epoxy. More preferably, it is one or more selected from the resin and the bisphenol type epoxy resin. The aromatic skeleton is a chemical structure generally defined as aromatic, and also includes polycyclic aromatics and aromatic heterocycles.

The epoxy resin preferably contains an epoxy resin having two or more epoxy groups in one molecule. When the non-volatile component of the epoxy resin is 100% by mass, at least 50% by mass or more is preferably an epoxy resin having two or more epoxy groups in one molecule. Among them, one molecule has two or more epoxy groups, and a liquid epoxy resin at a temperature of 20 ° C. (hereinafter referred to as “liquid epoxy resin”) and one molecule have three or more epoxy groups. It is preferable to contain a solid epoxy resin (hereinafter referred to as "solid epoxy resin") at a temperature of 20 ° C. By using a liquid epoxy resin and a solid epoxy resin in combination as the epoxy resin, a resin composition having excellent flexibility can be obtained. In addition, the breaking strength of the cured product of the resin composition is also improved.

Examples of the liquid epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenol novolac type epoxy resin, and ester skeleton. An alicyclic epoxy resin, a cyclohexanedimethanol type epoxy resin, a glycidylamine type epoxy resin, and an epoxy resin having a butadiene structure are preferable, and a glycidylamine type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a bisphenol AF are preferable. Type epoxy resin and naphthalene type epoxy resin are more preferable. Specific examples of the liquid epoxy resin include "HP4032", "HP4032D", "HP4032SS" (naphthalene type epoxy resin) manufactured by DIC Co., Ltd., "828US", "jER828EL", and "825" manufactured by Mitsubishi Chemical Co., Ltd. , "Epicoat 828EL" (bisphenol A type epoxy resin), "jER807", "1750" (bisphenol F type epoxy resin), "jER152" (phenol novolac type epoxy resin), "630", "630LSD" (glycidylamine) Type epoxy resin), "ZX1059" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd. (mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin), "EX-721" manufactured by Nagase ChemteX Corporation (glycidyl ester type) Epoxy resin), "Selokiside 2021P" manufactured by Daicel Co., Ltd. (alicyclic epoxy resin having an ester skeleton), "PB-3600" (epoxy resin having a butadiene structure), "Selokiside 2021P" manufactured by Nippon Steel Chemical Co., Ltd. Examples thereof include "ZX1658", "ZX1658GS" (liquid 1,4-glycidylcyclohexane), and "630LSD" (glycidylamine type epoxy resin) manufactured by Mitsubishi Chemical Corporation. These may be used individually by 1 type, and may be used in combination of 2 or more type.

Examples of the solid epoxy resin include naphthalene type tetrafunctional epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, and naphthylene ether type epoxy resin. Anthracene type epoxy resin, bisphenol A type epoxy resin, and tetraphenylethane type epoxy resin are preferable, and naphthalene type tetrafunctional epoxy resin, naphthol type epoxy resin, and biphenyl type epoxy resin are more preferable. Specific examples of the solid epoxy resin include "HP4032H" (naphthalene type epoxy resin), "HP-4700", "HP-4710" (naphthalene type tetrafunctional epoxy resin), and "N-690" manufactured by DIC Co., Ltd. (Cresol novolac type epoxy resin), "N-695" (cresol novolac type epoxy resin), "HP-7200" (dicyclopentadiene type epoxy resin), "HP-7200HH", "HP-7200H", "EXA" -7311 "," EXA-7311-G3 "," EXA-7311-G4 "," EXA-7311-G4S "," HP6000 "(naphthylene ether type epoxy resin)," EPPN "manufactured by Nippon Kayaku Co., Ltd. -502H "(Trisphenol type epoxy resin)," NC7000L "(Naftor novolac type epoxy resin)," NC3000H "," NC3000 "," NC3000L "," NC3100 "(biphenyl type epoxy resin), Nippon Steel & Sumitomo Metal Corporation "ESN475V" (naphthalene type epoxy resin), "ESN485" (naphthol novolac type epoxy resin), Mitsubishi Chemical Co., Ltd. "YX4000H", "YX4000", "YL6121" (biphenyl type epoxy resin), "YX4000HK" (Bixilenoll type epoxy resin), "YX8800" (anthracene type epoxy resin), "PG-100", "CG-500" manufactured by Osaka Gas Chemical Co., Ltd., "YL7760" manufactured by Mitsubishi Chemical Co., Ltd. ( Bisphenol AF type epoxy resin), "YL7800" (fluorene type epoxy resin), "jER1010" (solid bisphenol A type epoxy resin), "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Corporation, etc. Can be mentioned. These may be used individually by 1 type, and may be used in combination of 2 or more type.

When a liquid epoxy resin and a solid epoxy resin are used in combination as the epoxy resin, their quantity ratio (liquid epoxy resin: solid epoxy resin) is in the range of 1: 0.1 to 1:15 in terms of mass ratio. preferable. By setting the amount ratio of the liquid epoxy resin to the solid epoxy resin within such a range, i) when used in the form of a resin sheet, appropriate adhesiveness is provided, and ii) when used in the form of a resin sheet. Sufficient flexibility can be obtained, handleability is improved, and iii) a cured product having sufficient breaking strength can be obtained. From the viewpoint of the effects of i) to iii) above, the amount ratio of the liquid epoxy resin to the solid epoxy resin (liquid epoxy resin: solid epoxy resin) is more in the range of 1: 1 to 1:10 in terms of mass ratio. The range of 1: 1.1 to 1: 8 is preferable, and the range of 1: 1.1 to 1: 8 is more preferable.

The content of the epoxy resin in the resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, still more preferably 15% by mass, from the viewpoint of obtaining an insulating layer exhibiting good mechanical strength and insulation reliability. That is all. The upper limit of the content of the epoxy resin is not particularly limited as long as the effect of the present invention is exhibited, but is preferably 60% by mass or less, more preferably 50% by mass or less, and further preferably 40% by mass or less.

In the present invention, the content of each component in the resin composition is a value when the non-volatile component in the resin composition is 100% by mass, unless otherwise specified.

The epoxy equivalent of the epoxy resin is preferably 50 to 5000, more preferably 50 to 3000, still more preferably 80 to 2000, and even more preferably 110 to 1000. Within this range, the crosslink density of the cured product becomes sufficient, and an insulating layer having a small surface roughness can be provided. The epoxy equivalent can be measured according to JIS K7236, and is the mass of the resin containing 1 equivalent of the epoxy group.

The weight average molecular weight of the epoxy resin is preferably 100 to 5000, more preferably 250 to 3000, and even more preferably 400 to 1500. Here, the weight average molecular weight of the epoxy resin is a polystyrene-equivalent weight average molecular weight measured by a gel permeation chromatography (GPC) method.

<(B) Hardener>
The resin composition of the present invention contains (B) a curing agent. The curing agent is not particularly limited as long as it has a function of curing the epoxy resin, and for example, a phenol-based curing agent, a naphthol-based curing agent, an active ester-based curing agent, a benzoxazine-based curing agent, a cyanate ester-based curing agent, and a curing agent. Examples include carbodiimide-based curing agents. The curing agent may be used alone or in combination of two or more. The component (B) is preferably one or more selected from a phenol-based curing agent, a naphthol-based curing agent, an active ester-based curing agent, a carbodiimide-based curing agent, and a cyanate ester-based curing agent.

As the phenol-based curing agent and the naphthol-based curing agent, a phenol-based curing agent having a novolak structure or a naphthol-based curing agent having a novolak structure is preferable from the viewpoint of heat resistance and water resistance. Further, from the viewpoint of adhesion to the conductor layer, a nitrogen-containing phenol-based curing agent is preferable, and a triazine skeleton-containing phenol-based curing agent is more preferable. Of these, a triazine skeleton-containing phenol novolac curing agent is preferable from the viewpoint of highly satisfying heat resistance, water resistance, and adhesion to the conductor layer.

Specific examples of the phenol-based curing agent and the naphthol-based curing agent include "MEH-7700", "MEH-7810", "MEH-7851", "MEH-7851H" manufactured by Meiwa Kasei Co., Ltd., and Nippon Kasei Co., Ltd. "NHN", "CBN", "GPH" manufactured by Yakuhin Co., Ltd., "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN495" manufactured by Nippon Steel & Sumitomo Metal Corporation "SN375", "SN395", "TD-2090", "LA-7052", "LA-7554", "LA-1356", "LA-3018-50P", "EXB-9500" manufactured by DIC Corporation. And so on.

An active ester-based curing agent is also preferable from the viewpoint of obtaining an insulating layer having excellent adhesion to the conductor layer. The active ester-based curing agent is not particularly limited, but generally contains one molecule of an ester group having high reactive activity such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds. A compound having two or more of them is preferably used. The active ester-based curing agent is preferably obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester-based curing agent obtained from a carboxylic acid compound and a hydroxy compound is preferable, and an active ester-based curing agent obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferable. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid and the like. Examples of the phenol compound or naphthol compound include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-. Cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenol, trihydroxybenzophenol, tetrahydroxybenzophenone, fluoroglusin, Examples thereof include benzenetriol, dicyclopentadiene-type diphenol compounds, and phenol novolac. Here, the "dicyclopentadiene-type diphenol compound" refers to a diphenol compound obtained by condensing two phenol molecules with one dicyclopentadiene molecule.

Specifically, an active ester compound containing a dicyclopentadiene-type diphenol structure, an active ester compound containing a naphthalene structure, an active ester compound containing an acetylated product of phenol novolac, and an active ester compound containing a benzoylated product of phenol novolac are preferable. Of these, an active ester compound containing a naphthalene structure and an active ester compound containing a dicyclopentadiene-type diphenol structure are more preferable. The "dicyclopentadiene-type diphenol structure" represents a divalent structural unit composed of phenylene-dicyclopentylene-phenylene.

Commercially available products of active ester-based curing agents include "EXB9451", "EXB9460", "EXB9460S", "HPC-8000-65T", and "HPC-8000H-" as active ester compounds containing a dicyclopentadiene type diphenol structure. "65TM", "EXB-8000L-65TM" (manufactured by DIC Co., Ltd.), "EXB9416-70BK" (manufactured by DIC Co., Ltd.) as an active ester compound containing a naphthalene structure, as an active ester compound containing an acetylated product of phenol novolac. "DC808" (manufactured by Mitsubishi Chemical Corporation), "YLH1026" (manufactured by Mitsubishi Chemical Corporation) as an active ester compound containing a benzoylated product of phenol novolac, and "DC808" as an active ester-based curing agent which is an acetylated product of phenol novolac. (Made by Mitsubishi Chemical Co., Ltd.), "YLH1026" (manufactured by Mitsubishi Chemical Co., Ltd.), "YLH1030" (manufactured by Mitsubishi Chemical Co., Ltd.), "YLH1048" as an active ester-based curing agent which is a benzoylated product of phenol novolac. (Manufactured by Mitsubishi Chemical Co., Ltd.) and the like.

Specific examples of the benzoxazine-based curing agent include "HFB2006M" manufactured by Showa High Polymer Co., Ltd., "Pd" and "FA" manufactured by Shikoku Chemicals Corporation.

Examples of the cyanate ester-based curing agent include bisphenol A disicianate, polyphenol cyanate, oligo (3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis (2,6-dimethylphenylcyanate), and 4,4. '-Etilidene diphenyl disianate, hexafluorobisphenol A disyanate, 2,2-bis (4-cyanate) phenylpropane, 1,1-bis (4-cyanate phenylmethane), bis (4-cyanate-3,5-dimethyl) Bifunctional cyanate resins such as phenyl) methane, 1,3-bis (4-cyanatephenyl-1- (methylethylidene)) benzene, bis (4-cyanatephenyl) thioether, and bis (4-cyanatephenyl) ether, phenol Examples thereof include polyfunctional cyanate resins derived from novolak and cresol novolak, and prepolymers in which these cyanate resins are partially triazined. Specific examples of the cyanate ester-based curing agent include "PT30" and "PT60" (both phenol novolac type polyfunctional cyanate ester resins), "BA230", and "BA230S75" (bisphenol A disocyanate) manufactured by Lonza Japan Co., Ltd. Prepolymers in which some or all of them are triazined to form a trimer) and the like.

Specific examples of the carbodiimide-based curing agent include "V-03" and "V-07" manufactured by Nisshinbo Chemical Co., Ltd.

The amount ratio of the epoxy resin to the curing agent is a ratio of [total number of epoxy groups in the epoxy resin]: [total number of reactive groups in the curing agent], preferably in the range of 1: 0.1 to 10: 1. 1: 0.5 to 5: 1 is more preferable, and 1: 1 to 1: 1 is even more preferable. Here, the reactive group of the curing agent is an active hydroxyl group, an active ester group, or the like, and differs depending on the type of the curing agent. The total number of epoxy groups in the epoxy resin is the total number of all epoxy resins obtained by dividing the solid content mass of each epoxy resin by the epoxy equivalent, and the total number of reactive groups in the curing agent is The value obtained by dividing the solid content mass of each curing agent by the reaction group equivalent is the total value for all the curing agents. By setting the amount ratio of the epoxy resin and the curing agent within such a range, the heat resistance of the cured product of the resin composition is further improved.

In one embodiment, the resin composition comprises the aforementioned (A) epoxy resin and (B) curing agent. The resin composition is (A) a mixture of a liquid epoxy resin and a solid epoxy resin as the epoxy resin (the mass ratio of the liquid epoxy resin: the solid epoxy resin is preferably 1: 0.1 to 1:15, more preferably. 1: 1 to 1:10, more preferably 1: 1.1 to 1: 8), as (B) a phenol-based curing agent, a naphthol-based curing agent, an active ester-based curing agent, a carbodiimide-based curing agent and It is preferable to contain at least one selected from the group consisting of cyanate ester-based curing agents.

The content of the curing agent in the resin composition is not particularly limited, but is preferably 30% by mass or less, more preferably 25% by mass or less, and further preferably 20% by mass or less. The lower limit is not particularly limited, but is preferably 1% by mass or more, more preferably 5% by mass or more, still more preferably 7% by mass or more, or 10% by mass or more.

<(C) Inorganic filler>
The resin composition of the present invention contains (C) an inorganic filler, and the inorganic filler is surface-treated with at least two types of silane compounds. The two types of silane compounds are (C1) aminosilane compound and epoxysilane compound, (C2) (meth) acrylicsilane compound and vinylsilane compound, (C3) mercaptosilane compound and epoxysilane compound, or (C4) aminosilane compound and acrylicsilane. It is a compound. That is, one kind of inorganic filler is surface-treated with two kinds of specific silane compounds.

The material of the inorganic filler is not particularly limited, but for example, silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, water. Aluminum oxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide , Zirconium oxide, barium titanate, barium titanate, barium zirconate, calcium zirconate, zirconium phosphate, zirconium tungstate phosphate and the like. Of these, silica is particularly suitable. Further, as silica, spherical silica is preferable. The inorganic filler may be used alone or in combination of two or more.

The average particle size of the inorganic filler is preferably 5 μm or less, more preferably 2.5 μm or less, still more preferably 2 μm or less, more preferably 2 μm or less, from the viewpoint of improving circuit embedding property and obtaining an insulating layer having low surface roughness. It is 1.5 μm or less. The lower limit of the average particle size is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.05 μm or more, still more preferably 0.1 μm or more, or 0.5 μm or more. Examples of commercially available inorganic fillers having such an average particle size include "SP60-05", "SP507-05", "SPH516-05", and Admatex Co., Ltd. manufactured by Nippon Steel & Sumitomo Metal Materials Co., Ltd. "YC100C", "YA050C", "YA050C-MJE", "YA010C", "UFP-30" manufactured by Denka Co., Ltd., "Silfil NSS-3N", "Silfil NSS-4N", "Silfil NSS-4N" manufactured by Tokuyama Co., Ltd. Examples thereof include "Silfil NSS-5N", "SO-C4", "SO-C2" and "SO-C1" manufactured by Admatex Co., Ltd.

The average particle size of the inorganic filler can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, it can be measured by creating a particle size distribution of the inorganic filler on a volume basis with a laser diffraction / scattering type particle size distribution measuring device and using the median diameter as the average particle size. As the measurement sample, an inorganic filler dispersed in water by ultrasonic waves can be preferably used. As the laser diffraction / scattering type particle size distribution measuring device, "LA-500" manufactured by HORIBA, Ltd. or the like can be used.

The inorganic filler contained in the resin composition of the present invention includes (C1) aminosilane compound and epoxysilane compound, (C2) (meth) acrylic silane compound and vinylsilane compound, (C3) mercaptosilane compound and epoxysilane compound, or (C3) mercaptosilane compound and epoxysilane compound. C4) The surface is treated with an aminosilane compound and an acrylic silane compound.

As a result of examining the surface treatment of the inorganic filler with two kinds of silane compounds, the present inventors have obtained the inorganic filler with the component (C1), the component (C2), the component (C3), or the component (C4). It has been found that surface treatment can improve the long-term reliability of plating adhesion and the long-term reliability of substrate adhesion. This is because the two types of silane compounds are treated on the surface of the inorganic filler, so that the silane compounds are bonded to each other and a stronger network is constructed, so that the bonding force with the plating metal and the base metal is increased. It is believed that this will improve the long-term reliability of plating adhesion and the long-term reliability of substrate adhesion.

When the inorganic filler is surface-treated with the component (C1), the molar ratio (amino group / epoxy group) of the aminosilane compound to the epoxysilane compound is preferably 0.05 to 20, more preferably 0.1 to 10. More preferably, it is 0.2 to 5.

The aminosilane compound in the component (C1) is not particularly limited as long as it is a silane compound having an amino group, but an aminosilane-based coupling agent is used from the viewpoint of improving the long-term reliability of plating adhesion and the long-term reliability of substrate adhesion. preferable. Commercially available products of aminosilane compounds include "KBM-903" (3-aminopropyltrimethoxysilane), "KBE-903" (3-aminopropyltriethoxysilane), and "KBM-573" manufactured by Shin-Etsu Chemical Industry Co., Ltd. (N-phenyl-3-aminopropyltrimethoxysilane), "KBM-602" (N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane), "KBM-603" (N-2- (amino) Ethyl) -3-aminopropyltrimethoxysilane), "KBM-6803" (N-2- (aminoethyl) -8-aminooctyltrimethoxysilane) and the like can be mentioned.

The epoxy silane compound is not particularly limited as long as it is a silane compound having an epoxy group, but an epoxy silane coupling agent is preferable from the viewpoint of improving the long-term reliability of plating adhesion and the long-term reliability of substrate adhesion. Commercially available epoxysilane compounds include "X-12-1231" (3- (2-glycidylphenyl) propyltrimethoxysilane) and "KBM-403" (3-glycidoxypropyl) manufactured by Shin-Etsu Chemical Industry Co., Ltd. Trimethoxysilane), "KBM-303" (2- (3,4) -epoxycyclohexyl) ethyltrimethoxysilane), "KBM-402" (3-glycidoxypropylmethyldimethoxysilane), "KBE-403" (3-glycidoxypropyltriethoxysilane), "KBE-402" (3-glycidoxypropylmethyldiethoxysilane), "KBM-4803" (8-glycidoxyoctyltrimethoxysilane) and the like can be mentioned. ..

When the inorganic filler is surface-treated with the component (C2), the molar ratio (vinyl group / (meth) acrylic group) of the vinylsilane compound to the (meth) acrylic compound is preferably 0.05 to 20, more preferably 0. .1-10, more preferably 0.2-5.

The (meth) acrylic silane compound is not particularly limited as long as it is a silane compound having a (meth) acrylic group, but from the viewpoint of improving the long-term reliability of plating adhesion and the long-term reliability of substrate adhesion, (meth) Acrylosilane-based coupling agents are preferable. Commercially available products of (meth) acrylic silane compounds include "KBM-503" (3-methacryloxypropyltrimethoxysilane) and "KBE-503" (3-methacryloxypropyltriethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd. , "KBM-502" (3-methacryloxypropylmethyldimethoxysilane), "KBE-502" (3-methacryloxypropylmethyldiethoxysilane), "KBM-5803" (8-methacryloxyoctylrimethoxysilane), Examples thereof include "KBM-5103" (3-acryloxypropyltrimethoxysilane). In addition, "(meth) acrylic" refers to an acrylic group and a methacrylic group.

The vinylsilane compound is not particularly limited as long as it is a silane compound having a vinyl group, but a vinylsilane-based coupling agent is preferable from the viewpoint of improving the long-term reliability of plating adhesion and the long-term reliability of substrate adhesion. Commercially available vinylsilane compounds include "KBE-1003" (vinyltriethoxysilane), "KBM-1003" (vinyltrimethoxysilane), and "KBM-1083" (trimethoxy (7-octene)) manufactured by Shin-Etsu Chemical Co., Ltd. 1-yl) silane) and the like can be mentioned.

When the inorganic filler is surface-treated with the component (C3), the molar ratio (mercapto group / epoxy group) of the mercaptosilane compound to the epoxysilane compound is preferably 0.05 to 20, more preferably 0.1 to 10. , More preferably 0.2 to 5.

The mercaptosilane compound is not particularly limited as long as it is a silane compound having a mercapto group, but a mercaptosilane-based coupling agent is preferable from the viewpoint of improving the long-term reliability of plating adhesion and the long-term reliability of substrate adhesion. Examples of commercially available mercaptosilane compounds include "KBM-803" (3-mercaptopropyltrimethoxysilane) and "KBM-802" (3-mercaptopropylmethyldimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd.

As the epoxy silane compound in the component (C3), the same epoxy silane compound as the epoxy silane compound in the component (C1) can be used.

When the inorganic filler is surface-treated with the component (C4), the molar ratio (amino group / acrylic group) of the aminosilane compound to the acrylicsilane compound is preferably 0.05 to 20, more preferably 0.1 to 10. More preferably, it is 0.2 to 5.

As the aminosilane compound in the component (C4), the same aminosilane compound as the aminosilane compound in the component (C1) can be used. The acrylic silane compound in the component (C4) is not particularly limited as long as it is a silane compound having an acrylic group, but from the viewpoint of improving the long-term reliability of plating adhesion and the long-term reliability of substrate adhesion, an acrylic silane-based cup Ring agents are preferred. Examples of commercially available acrylic silane compounds include "KBM-5103" (3-acryloxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd.

From the viewpoint of improving the long-term reliability of plating adhesion and the long-term reliability of substrate adhesion, the component (C) is 0.5 parts by mass or more of the component (C1) with respect to 100 parts by mass of the inorganic filler. The surface is preferably surface-treated with the C2) component, the (C3) component, or the (C4) component, more preferably 0.8 parts by mass or more, and further preferably 1 part by mass or more. The upper limit is preferably 3 parts by mass or less, more preferably 2.5 parts by mass or less, and further preferably 2 parts by mass or less.

After the inorganic filler is surface-treated with the component (C1), the component (C2), the component (C3), or the component (C4), the surface may be further treated with another surface treatment agent. Further, the inorganic filler which has been surface-treated with another surface treatment agent in advance may be further surface-treated with the component (C1), the component (C2), the component (C3), or the component (C4). Further, the inorganic filler may be surface-treated with a plurality of components (C1) to (C4). The other surface treatment agent is a component (C1), a component (C2), a component (C3), or a component (C4) when the surface is treated with the component (C1), the component (C2), the component (C3), or the component (C3). Silane compound contained in component (C4) (aminosilane compound and epoxysilane compound in the case of component (C1), vinylsilane compound and (meth) acrylicsilane compound in the case of component (C2), mercaptosilane in the case of component (C3) It means a surface treatment agent other than a compound and an epoxysilane compound, and in the case of the component (C4), an aminosilane compound and an acrylicsilane compound).

Other surface treatment agents include aminosilane compounds, epoxysilane compounds, mercaptosilane compounds, vinylsilane compounds, (meth) acrylicsilane compounds, alkoxysilane compounds, organosilazane compounds such as hexamethyldisilazane, alkoxy oligomers, and titanate-based couplings. It is preferable that the treatment is performed with one or more surface treatment agents such as agents. Examples of commercially available surface treatment agents include "SZ-31" (hexamethyldisilazane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM-103" (phenyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., and the like. Can be mentioned.

The degree of surface treatment with the component (C1), the component (C2), the component (C3), or the component (C4) can be evaluated by the amount of carbon per unit surface area of the inorganic filler. Carbon content per unit surface area of the inorganic filler, from the viewpoint of improving dispersibility of the inorganic filler is preferably 0.02 mg / ^{m 2} or more, 0.05 mg / ^{m 2} or more preferably, 0.1 mg / ^{m 2} The above is more preferable, and 0.2 mg / m ² or more is more preferable. On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin varnish and the melt viscosity in the sheet form, 1 mg / m ² or less is preferable, 0.8 mg / m ² or less is more preferable, and 0.5 mg / m ² or less is further preferable. preferable. When the surface is treated with another surface treatment agent, the total amount of the component (C1), the component (C2), the component (C3), or the component (C4) plus the other surface treatment agent should be within the above range. Just do it.

The amount of carbon per unit surface area of the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (for example, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25 ° C. for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of the inorganic filler can be measured using a carbon analyzer. Specifically, the amount of carbon per unit surface area of the inorganic filler can be measured according to the method described in <Measurement of carbon amount> described later.

The content of the inorganic filler in the resin composition is preferably 50% by mass or more, more preferably 55% by mass or more, still more preferably 60% by mass or more, or 65% by mass from the viewpoint of reducing the coefficient of thermal expansion. That is all. The upper limit is preferably 95% by mass or less, more preferably 90% by mass or less, still more preferably 85% by mass or less, or 80% by mass or less from the viewpoint of mechanical strength of the insulating layer, particularly elongation.

<(D) Thermoplastic resin>
The resin composition of the present invention may contain (D) a thermoplastic resin. Examples of the thermoplastic resin include phenoxy resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyimide resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyethersulfone resin, polyphenylene ether resin, polycarbonate resin, and polyether. Examples thereof include ether ketone resin and polyester resin, and phenoxy resin is preferable. The thermoplastic resin may be used alone or in combination of two or more.

The polystyrene-equivalent weight average molecular weight of the thermoplastic resin is preferably in the range of 8,000 to 70,000, more preferably in the range of 10,000 to 60,000, and even more preferably in the range of 20,000 to 60,000. The polystyrene-equivalent weight average molecular weight of the thermoplastic resin is measured by gel permeation chromatography (GPC). Specifically, the polystyrene-equivalent weight average molecular weight of the thermoplastic resin is determined by using LC-9A / RID-6A manufactured by Shimadzu Corporation as a measuring device and Shodex K-800P / K- by Showa Denko Corporation as a column. 804L / K-804L can be calculated by measuring the column temperature at 40 ° C. using chloroform or the like as a mobile phase and using a standard polystyrene calibration curve.

Examples of the phenoxy resin include bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol acetphenone skeleton, novolak skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantan skeleton, and terpen Examples thereof include a phenoxy resin having one or more skeletons selected from the group consisting of a skeleton and a trimethylcyclohexane skeleton. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. The phenoxy resin may be used alone or in combination of two or more. Specific examples of the phenoxy resin include "1256" and "4250" (both bisphenol A skeleton-containing phenoxy resin), "YX8100" (bisphenol S skeleton-containing phenoxy resin), and "YX6954" manufactured by Mitsubishi Chemical Corporation. Bisphenol acetophenone skeleton-containing phenoxy resin), and in addition, "FX280" and "FX293" manufactured by Nippon Steel & Sumitomo Metal Corporation, "YX6954BH30", "YX7553", "YX7553BH30" manufactured by Mitsubishi Chemical Corporation, Examples thereof include "YL7553BH30", "YL7769BH30", "YL6794", "YL7213", "YL7290", "YL7891BH30" and "YL7482".

Examples of the polyvinyl acetal resin include polyvinyl formal resin and polyvinyl butyral resin, and polyvinyl butyral resin is preferable. Specific examples of the polyvinyl acetal resin include "Electrified Butyral 4000-2", "Electrified Butyral 5000-A", "Electrified Butyral 6000-C", "Electrified Butyral 6000-EP", Sekisui Chemical Co., Ltd. Examples thereof include Eslek BH series, BX series (for example, BX-5Z), KS series (for example, KS-1), BL series, and BM series manufactured by Sekisui Chemical Co., Ltd.

Specific examples of the polyimide resin include "Ricacoat SN20" and "Ricacoat PN20" manufactured by New Japan Chemical Co., Ltd. Specific examples of the polyimide resin include a linear polyimide obtained by reacting a bifunctional hydroxyl group-terminated polybutadiene, a diisocyanate compound and a tetrabasic acid anhydride (polyimide described in JP-A-2006-37083), and a polysiloxane skeleton. Examples thereof include modified polyimides such as contained polyimides (polyimides described in JP-A-2002-12667 and JP-A-2000-319386).

Specific examples of the polyamide-imide resin include "Vilomax HR11NN" and "Vilomax HR16NN" manufactured by Toyobo Co., Ltd. Specific examples of the polyamide-imide resin include modified polyamide-imides such as "KS9100" and "KS9300" (polysiloxane skeleton-containing polyamide-imide) manufactured by Hitachi Chemical Industries, Ltd.

Specific examples of the polyether sulfone resin include "PES5003P" manufactured by Sumitomo Chemical Co., Ltd.

Specific examples of the polysulfone resin include polysulfones "P1700" and "P3500" manufactured by Solvay Advanced Polymers Co., Ltd.

Specific examples of the polyphenylene ether resin include oligophenylene ether styrene resin "OPE-2St 1200" manufactured by Mitsubishi Gas Chemical Company, Inc.

Among them, as the thermoplastic resin, a phenoxy resin and a polyvinyl acetal resin are preferable. Therefore, in one preferred embodiment, the thermoplastic resin comprises one or more selected from the group consisting of phenoxy resins and polyvinyl acetal resins.

When the resin composition contains a thermoplastic resin, the content of the thermoplastic resin is preferably 0.5% by mass or more, more preferably 0.8% by mass or more, still more preferably 1% by mass or more. The upper limit is not particularly limited, but may be preferably 30% by mass or less, more preferably 20% by mass or less, still more preferably 15% by mass or less.

<(E) Curing accelerator>
The resin composition of the present invention may contain (E) a curing accelerator. Examples of the curing accelerator include phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, metal-based curing accelerators, and the like, and phosphorus-based curing accelerators and amine-based curing accelerators. Curing accelerators, imidazole-based curing accelerators, and metal-based curing accelerators are preferable, and amine-based curing accelerators, imidazole-based curing accelerators, and metal-based curing accelerators are more preferable. The curing accelerator may be used alone or in combination of two or more.

Examples of the phosphorus-based curing accelerator include triphenylphosphine, phosphonium borate compound, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, and (4-methylphenyl) triphenylphosphonium thiocyanate. , Tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate and the like, and triphenylphosphine and tetrabutylphosphonium decanoate are preferable.

Examples of the amine-based curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6, -tris (dimethylaminomethyl) phenol, and 1,8-diazabicyclo. Examples thereof include (5,4,0) -undecene, and 4-dimethylaminopyridine and 1,8-diazabicyclo (5,4,0) -undecene are preferable.

Examples of the imidazole-based curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, and the like. 2-Ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-Cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl- 2-Phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecyl Imidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1')]-ethyl-s-triazine, 2,4- Diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2- Phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline , 2-Phenylimidazoline and other imidazole compounds and adducts of the imidazole compound and an epoxy resin are mentioned, with 2-ethyl-4-methylimidazole and 1-benzyl-2-phenylimidazole being preferred.

As the imidazole-based curing accelerator, a commercially available product may be used, and examples thereof include "P200-H50" manufactured by Mitsubishi Chemical Corporation.

Examples of the guanidine-based curing accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1- (o-tolyl) guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, and the like. Tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo [4.4.0] deca-5-ene, 7-methyl-1,5,7-triazabicyclo [4.4.0] Deca-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1 Examples thereof include −allyl biguanide, 1-phenylbiguanide, 1- (o-tolyl) biguanide, and dicyandiamide, 1,5,7-triazabicyclo [4.4.0] deca-5-ene is preferable.

Examples of the metal-based curing accelerator include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of the organic metal complex include an organic cobalt complex such as cobalt (II) acetylacetonate and cobalt (III) acetylacetonate, an organic copper complex such as copper (II) acetylacetonate, and zinc (II) acetylacetonate. Examples thereof include organic zinc complexes such as iron (III) acetylacetonate, organic nickel complexes such as nickel (II) acetylacetonate, and organic manganese complexes such as manganese (II) acetylacetonate. Examples of the organic metal salt include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, zinc stearate and the like.

The content of the curing accelerator in the resin composition is not particularly limited, but is preferably 0.01% by mass to 3% by mass when the non-volatile components of the epoxy resin and the curing agent are 100% by mass.

<(F) Flame Retardant>
The resin composition of the present invention may contain (F) a flame retardant. Examples of the flame retardant include an organic phosphorus flame retardant, an organic nitrogen-containing phosphorus compound, a nitrogen compound, a silicone flame retardant, and a metal hydroxide. The flame retardant may be used alone or in combination of two or more.

As the flame retardant, a commercially available product may be used, and examples thereof include "HCA-HQ" manufactured by Sanko Co., Ltd. and "PX-200" manufactured by Daihachi Chemical Industry Co., Ltd.

When the resin composition contains a flame retardant, the content of the flame retardant is not particularly limited, but is preferably 0.5% by mass to 20% by mass, more preferably 0.5% by mass to 15% by mass, still more preferably. More preferably, it is 0.5% by mass to 10% by mass.

<(G) Organic filler>
The resin composition of the present invention may contain (G) an organic filler. Examples of the organic filler include rubber particles, polyamide fine particles, silicone particles and the like.

As the rubber particles, commercially available products may be used, and examples thereof include "EXL2655" manufactured by Dow Chemical Japan Co., Ltd. and "AC3816N" manufactured by Aica Kogyo Co., Ltd.

When the resin composition contains an organic filler, the content of the organic filler is preferably 0.1% by mass to 20% by mass, more preferably 0.2% by mass to 10% by mass, and further preferably 0. It is 3% by mass to 5% by mass, or 0.5% by mass to 3% by mass.

<(H) Arbitrary additive>
The resin composition of the present invention may further contain other additives, if necessary, and such other additives include, for example, organic copper compounds, organic zinc compounds, organic cobalt compounds and the like. Examples thereof include metal compounds, thickeners, defoaming agents, leveling agents, adhesion imparting agents, resin additives such as colorants, and the like.

The resin composition of the present invention provides an insulating layer having good long-term reliability of plating adhesion. Therefore, the resin composition of the present invention can be suitably used as a resin composition for forming an insulating layer of a printed wiring board (resin composition for an insulating layer of a printed wiring board), and interlayer insulation of the printed wiring board. It can be more preferably used as a resin composition for forming a layer (resin composition for an interlayer insulating layer of a printed wiring board).

[Manufacturing method of resin composition]
The method for producing the resin composition of the present invention is (C1) aminosilane compound and epoxysilane compound, (C2) (meth) acrylic silane compound and vinylsilane compound, (C3) mercaptosilane compound and epoxysilane compound, or (C4) aminosilane. The step of surface-treating the inorganic filler with the compound and the acrylic silane compound is included.

The step of surface-treating the inorganic filler is not particularly limited, and the inorganic filler can be surface-treated by a known method.

For example, the inorganic filler may be surface-treated at the same time with two kinds of silane compounds contained in the component (C1), the component (C2), the component (C3), or the component (C4). When the surface is treated with the component (C1), the inorganic filler may be surface-treated with the aminosilane compound and the epoxysilane compound at the same time.

In one preferred embodiment, in the present invention, (C1) aminosilane compounds and epoxysilane compounds, (C2) (meth) acrylicsilane compounds and vinylsilane compounds, (C3) mercaptosilane compounds and epoxysilane compounds, or (C4) aminosilanes. Two types of silane compounds including a step of surface-treating an inorganic filler with a compound and an acrylic silane compound, wherein the step is contained in the component (C1), the component (C2), the component (C3), or the component (C4). Of these, the inorganic filler is surface-treated with one of the silane compounds, and then the inorganic filler is surface-treated with the other silane compound. The present inventors have found that this method can further improve the long-term reliability of plating adhesion and the long-term reliability of substrate adhesion. By surface-treating the two types of silane compounds separately in order, the functional groups (in the case of the (C1) component, the amino group of the aminosilane compound and the epoxy group of the epoxysilane compound, and in the case of the (C2) component, the vinylsilane compound A vinyl group and a (meth) acrylic group of a (meth) acrylic silane compound, a mercapto group of a mercaptosilane compound and an epoxy group of an epoxysilane compound in the case of the (C3) component, and an amino group of an aminosilane compound in the case of the (C4) component. It is considered that this is because the acrylic group of the acrylic silane compound) easily reacts with each other.

Specifically, when the inorganic filler is surface-treated with the component (C1), the inorganic filler is surface-treated with an aminosilane compound from the viewpoint of being hard to aggregate and easy to treat, and then the inorganic filler is further treated with an epoxy silane compound. Is preferably surface-treated.

When the inorganic filler is surface-treated with the component (C2), the inorganic filler is surface-treated with a vinylsilane compound from the viewpoint of being hard to aggregate and easy to treat, and then the inorganic filler is further surface-treated with a (meth) acrylicsilane compound. It is preferable to treat it.

When the inorganic filler is surface-treated with the component (C3), it is preferable that the inorganic filler is surface-treated with a mercaptosilane compound and then further surface-treated with an epoxysilane compound from the viewpoint of difficulty in agglomeration and ease of treatment.

When the inorganic filler is surface-treated with the component (C4), it is preferable to surface-treat the inorganic filler with an aminosilane compound and then further surface-treat with an acrylic silane compound from the viewpoint of difficulty in agglomeration and ease of treatment.

In the method for producing the resin composition of the present invention, the degree of surface treatment of the component (C1), the component (C2), the component (C3), or the component (C4), the content ratio of each silane compound, etc. are as described above. is there.

The method for producing a resin composition of the present invention includes a step of mixing a surface-treated inorganic filler with other components to form a resin composition. A known method can be used as the mixing method or the like. Other components are (A) epoxy resin, (B) curing agent, (D) thermoplastic resin, (E) curing accelerator, (F) flame retardant, (G) organic filler, and the like. As mentioned above.

[Resin sheet]
The resin sheet of the present invention has a support and a resin composition layer containing the resin composition of the present invention provided on the support.

The thickness of the resin composition layer is preferably 30 μm or less, more preferably 25 μm or less, and further preferably 20 μm or less because the plating depth can be suppressed to be small. The lower limit of the thickness of the resin composition layer is not particularly limited, but may be usually 1 μm or more, 1.5 μm or more, 2 μm or more, or the like.

Examples of the support include a film made of a plastic material, a metal foil, and a paper pattern, and a film made of a plastic material and a metal leaf are preferable.

When a film made of a plastic material is used as the support, the plastic material may be, for example, polyethylene terephthalate (hereinafter, may be abbreviated as "PET") or polyethylene naphthalate (hereinafter, abbreviated as "PEN"). ) Etc., polyester, polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylic such as polymethylmethacrylate (PMMA), cyclic polyolefin, triacetylcellulose (TAC), polyethersulfide (PES), polyether. Examples thereof include ketones and polyimides. Of these, polyethylene terephthalate and polyethylene naphthalate are preferable, and inexpensive polyethylene terephthalate is particularly preferable.

When a metal foil is used as the support, examples of the metal foil include copper foil and aluminum foil, and copper foil is preferable. As the copper foil, a foil made of a single metal of copper may be used, and a foil made of an alloy of copper and another metal (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used. You may use it.

The support may be matted, corona-treated, or antistatic-treated on the surface to be joined to the resin composition layer.

Further, as the support, a support with a release layer having a release layer on the surface to be joined with the resin composition layer may be used. Examples of the release agent used for the release layer of the support with the release layer include one or more release agents selected from the group consisting of alkyd resin, polyolefin resin, urethane resin, and silicone resin. .. As the support with a release layer, a commercially available product may be used. For example, "SK-1" manufactured by Lintec Co., Ltd., which is a PET film having a release layer containing an alkyd resin-based release agent as a main component. , "AL-5", "AL-7", "Lumirror T6AM" manufactured by Toray Industries, Inc., and the like.

The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. When a support with a release layer is used, the thickness of the entire support with a release layer is preferably in the above range.

For the resin sheet, for example, a resin varnish in which a resin composition is dissolved in an organic solvent is prepared, and this resin varnish is applied onto a support using a die coater or the like and further dried to form a resin composition layer. It can be manufactured by.

Examples of the organic solvent include ketones such as acetone, methyl ethyl ketone (MEK) and cyclohexanone, acetic acid esters such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate, cellosolve and butyl carbitol and the like. Carbitols, aromatic hydrocarbons such as toluene and xylene, and amide solvents such as dimethylformamide, dimethylacetamide (DMAc) and N-methylpyrrolidone can be mentioned. The organic solvent may be used alone or in combination of two or more.

Drying may be carried out by a known method such as heating or blowing hot air. The drying conditions are not particularly limited, but the resin composition layer is dried so that the content of the organic solvent is 10% by mass or less, preferably 5% by mass or less. Although it depends on the boiling point of the organic solvent in the resin varnish, for example, when a resin varnish containing 30% by mass to 60% by mass of an organic solvent is used, the resin composition is obtained by drying at 50 ° C. to 150 ° C. for 3 to 10 minutes. A material layer can be formed.

In the resin sheet, a protective film similar to the support can be further laminated on the surface of the resin composition layer that is not bonded to the support (that is, the surface opposite to the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, it is possible to prevent dust and the like from adhering to the surface of the resin composition layer and scratches. The resin sheet can be rolled up and stored. When the resin sheet has a protective film, it can be used by peeling off the protective film.

The minimum melt viscosity of the resin composition layer (or resin composition) in the resin sheet is preferably 500 poise or more, more preferably 1000 poise or more, and 1500 poise or more from the viewpoint of stably maintaining the thickness even if the resin composition layer is thin. Is even more preferable. The upper limit of the minimum melt viscosity is preferably 10000 poise or less, more preferably 8000 poise or less, still more preferably 6500 poise or less, 5000 poise or less, or 4000 poise or less from the viewpoint of obtaining good component embedding property.

The minimum melt viscosity of the resin composition layer means the minimum viscosity exhibited by the resin composition layer when the resin of the resin composition layer is melted. Specifically, when the resin composition layer is heated at a constant temperature rise rate to melt the resin, the melt viscosity decreases as the temperature rises in the initial stage, and then increases as the temperature rises when the temperature exceeds a certain level. To do. The minimum melt viscosity means the melt viscosity of such a minimum point. The minimum melt viscosity of the resin composition layer can be measured by a dynamic viscoelastic method, and can be measured, for example, according to the method described in <Measurement of minimum melt viscosity> described later.

The cured product of the resin composition (or resin composition layer) of the present invention (for example, a cured product obtained by heating at 100 ° C. for 30 minutes and then curing at 180 ° C. for 30 minutes) has a surface roughness after desmear treatment. Shows good arithmetic mean roughness (Ra). That is, it provides an insulating layer showing a good surface roughness after desmear treatment. The arithmetic mean roughness (Ra) is preferably 250 nm or less, more preferably 200 nm or less, still more preferably 150 nm or less. The lower limit may be 1 nm or more. The arithmetic mean roughness (Ra) can be measured according to the method described later (measurement of arithmetic mean roughness (Ra) and root mean square roughness (Rq)).

The cured product of the resin composition (or resin composition layer) of the present invention (for example, a cured product obtained by heating at 100 ° C. for 30 minutes and then curing at 180 ° C. for 30 minutes) has a surface roughness after desmear treatment. It shows a good root mean square roughness (Rq). That is, it provides an insulating layer showing a good surface roughness after desmear treatment. The root mean square roughness (Rq) is preferably 300 nm or less, more preferably 250 nm or less, still more preferably 200 nm or less. The lower limit may be 1 nm or more. The root mean square roughness (Rq) can be measured according to the method described later (Measurement of Arithmetic Mean Roughness (Ra), Root Mean Square Roughness (Rq)).

The cured product of the resin composition (or resin composition layer) of the present invention (for example, a cured product obtained by heating at 100 ° C. for 30 minutes and then curing at 180 ° C. for 30 minutes) exhibits good plating adhesion. That is, it provides an insulating layer showing good plating peel strength. The plating peel strength of the cured resin composition is preferably 1.5 kgf / cm or less, more preferably 1 kgf / cm or less, still more preferably 0.8 kgf / cm or less. The lower limit may be 0.1 kgf / cm or more. The evaluation of the plating adhesion can be performed according to the method described later (Measurement of plating adhesion (plating peel strength)).

The cured product of the resin composition (or resin composition layer) of the present invention (for example, a cured product obtained by heating at 100 ° C. for 30 minutes and then curing at 180 ° C. for 30 minutes) is under the conditions of 130 ° C. and 85% RH. Shows good plating adhesion below. That is, it provides an insulating layer showing good plating peel strength after HAST. The plating peel strength of the cured resin composition after HAST is preferably 1.5 kgf / cm or less, more preferably 1 kgf / cm or less, and further preferably 0.6 kgf / cm or less. The lower limit may be 0.1 kgf / cm or more. The evaluation of the plating adhesion after HAST can be measured according to the method described later (Measurement of plating adhesion (plating peel strength)).

The cured product of the resin composition (or resin composition layer) of the present invention (for example, a cured product obtained by heating at 100 ° C. for 30 minutes, then heating at 180 ° C. for 30 minutes, and further curing at 190 ° C. for 90 minutes) , Shows good substrate adhesion. That is, it provides an insulating layer showing good base peel strength. The base peel strength of the cured resin composition is preferably 1.5 kgf / cm or less, more preferably 1 kgf / cm or less, still more preferably 0.8 kgf / cm or less. The lower limit may be 0.1 kgf / cm or more. The evaluation of the adhesion to the base can be measured according to the method described in <Evaluation of the adhesion to the base> described later.

The cured product of the resin composition (or resin composition layer) of the present invention (for example, a cured product obtained by heating at 100 ° C. for 30 minutes, then heating at 180 ° C. for 30 minutes, and further curing at 190 ° C. for 90 minutes) , 130 ° C., 85% RH, shows good substrate adhesion. That is, it provides an insulating layer showing good base peel strength after HAST. The base peel strength of the cured resin composition after HAST is preferably 1.5 kgf / cm or less, more preferably 1 kgf / cm or less, and further preferably 0.6 kgf / cm or less. The lower limit may be 0.1 kgf / cm or more. The evaluation of the base adhesion after HAST can be measured according to the method described in <Evaluation of base adhesion> described later.

Instead of the resin sheet of the present invention, a prepreg formed by impregnating a sheet-like fiber base material with the resin composition of the present invention may be used.

The sheet-shaped fiber base material used for the prepreg is not particularly limited, and those commonly used as the base material for the prepreg such as glass cloth, aramid non-woven fabric, and liquid crystal polymer non-woven fabric can be used. From the viewpoint of reducing the thickness of the printed wiring board, the thickness of the sheet-shaped fiber base material is preferably 900 μm or less, more preferably 800 μm or less, still more preferably 700 μm or less, still more preferably 600 μm or less. In particular, in the present invention, since the plating depth can be suppressed to be small, 30 μm or less is preferable, 20 μm or less is more preferable, and 10 μm or less is further preferable. The lower limit of the thickness of the sheet-shaped fiber base material is not particularly limited, but may be usually 1 μm or more, 1.5 μm or more, 2 μm or more, or the like.

The prepreg can be produced by a known method such as a hot melt method or a solvent method.

The thickness of the prepreg can be in the same range as the resin composition layer in the above-mentioned adhesive sheet.

[Printed circuit board]
The printed wiring board of the present invention includes an insulating layer formed of a cured product of the resin composition of the present invention.

Specifically, the printed wiring board of the present invention can be manufactured by a method including the following steps (I) and (II) using the above-mentioned resin sheet.
(I) A step of laminating a resin sheet on an inner layer substrate so that the resin composition layer of the resin sheet is bonded to the inner layer substrate (II) A step of thermosetting the resin composition layer to form an insulating layer.

The "inner layer substrate" used in the step (I) is mainly a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a heat-curable polyphenylene ether substrate, or the like, or one or both sides of the substrate. A circuit board on which a patterned conductor layer (circuit) is formed. Further, the inner layer circuit board of the intermediate product in which the insulating layer and / or the conductor layer should be further formed when the printed wiring board is manufactured is also included in the "inner layer board" in the present invention. When the printed wiring board is a circuit board with built-in components, an inner layer board with built-in components may be used.

The inner layer substrate and the resin sheet can be laminated, for example, by heat-pressing the resin sheet to the inner layer substrate from the support side. Examples of the member for heat-pressing the resin sheet to the inner layer substrate (hereinafter, also referred to as “heat-bonding member”) include a heated metal plate (SUS end plate or the like) or a metal roll (SUS roll). It is preferable not to press the heat-bonded member directly onto the resin sheet, but to press it through an elastic material such as heat-resistant rubber so that the resin sheet sufficiently follows the surface irregularities of the inner layer substrate.

The inner layer substrate and the resin sheet may be laminated by a vacuum laminating method. In the vacuum laminating method, the heat crimping temperature is preferably in the range of 60 ° C. to 160 ° C., more preferably 80 ° C. to 140 ° C., and the heat crimping pressure is preferably 0.098 MPa to 1.77 MPa, more preferably 0. It is in the range of .29 MPa to 1.47 MPa, and the heat crimping time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. Lamination is preferably carried out under reduced pressure conditions at a pressure of 26.7 hPa or less.

Lamination can be performed by a commercially available vacuum laminator. Examples of the commercially available vacuum laminator include a vacuum pressurizing laminator manufactured by Meiki Seisakusho Co., Ltd., a vacuum applicator manufactured by Nikko Materials Co., Ltd., and the like.

After the lamination, the laminated resin sheet may be smoothed by pressing the heat-bonded member from the support side under normal pressure (under atmospheric pressure), for example. The press conditions for the smoothing treatment can be the same as the heat-bonding conditions for the above-mentioned lamination. The smoothing process can be performed by a commercially available laminator. The lamination and smoothing treatment may be continuously performed using the above-mentioned commercially available vacuum laminator.

The support may be removed between steps (I) and step (II) or after step (II).

In step (II), the resin composition layer is thermoset to form an insulating layer.

The thermosetting conditions of the resin composition layer are not particularly limited, and the conditions usually adopted when forming the insulating layer of the printed wiring board may be used.

For example, the thermosetting conditions of the resin composition layer differ depending on the type of the resin composition and the like, but the curing temperature is in the range of 120 ° C. to 240 ° C. (preferably in the range of 150 ° C. to 220 ° C., more preferably 170 ° C. to 170 ° C. The curing time can be in the range of 5 minutes to 120 minutes (preferably 10 minutes to 100 minutes, more preferably 15 minutes to 90 minutes).

Before the resin composition layer is thermoset, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermosetting the resin composition layer, the resin composition layer is heated at a temperature of 50 ° C. or higher and lower than 120 ° C. (preferably 60 ° C. or higher and 110 ° C. or lower, more preferably 70 ° C. or higher and 100 ° C. or lower). Preheating may be performed for 5 minutes or longer (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes).

When manufacturing a printed wiring board, at least one of (III) a step of drilling a hole in the insulating layer, (IV) a step of roughening the insulating layer, and (V) a step of forming a conductor layer is further carried out. May be good. These steps (III) to (V) may be carried out according to various methods known to those skilled in the art used for manufacturing a printed wiring board. When the support is removed after the step (II), the support is removed between the steps (II) and the step (III), between the steps (III) and the step (IV), or the step ( It may be carried out between IV) and step (V).

In another embodiment, the printed wiring board of the present invention can be manufactured using the prepreg described above. The manufacturing method is basically the same as when a resin sheet is used.

The step (III) is a step of drilling holes in the insulating layer, whereby holes such as via holes and through holes can be formed in the insulating layer. The step (III) may be carried out by using, for example, a drill, a laser, a plasma, or the like, depending on the composition of the resin composition used for forming the insulating layer. The size and shape of the hole may be appropriately determined according to the design of the printed wiring board.

Step (IV) is a step of roughening the insulating layer. The procedure and conditions of the roughening treatment are not particularly limited, and known procedures and conditions usually used when forming the insulating layer of the printed wiring board can be adopted. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order. The swelling solution is not particularly limited, and examples thereof include an alkaline solution and a surfactant solution, and an alkaline solution is preferable, and the alkaline solution is more preferably a sodium hydroxide solution and a potassium hydroxide solution. Examples of commercially available swelling liquids include "Swelling Dip Security SBU" and "Swelling Dip Security SBU" manufactured by Atotech Japan Co., Ltd. The swelling treatment with the swelling liquid is not particularly limited, but can be performed, for example, by immersing the insulating layer in the swelling liquid at 30 ° C. to 90 ° C. for 1 minute to 20 minutes. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the cured product in a swelling solution at 40 ° C. to 80 ° C. for 5 minutes to 15 minutes. The oxidizing agent is not particularly limited, and examples thereof include an alkaline permanganate solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. The roughening treatment with an oxidizing agent such as an alkaline permanganate solution is preferably carried out by immersing the insulating layer in an oxidizing agent solution heated to 60 ° C. to 80 ° C. for 10 to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP" and "Dosing Solution Security P" manufactured by Atotech Japan Co., Ltd. The neutralizing solution is preferably an acidic aqueous solution, and examples of commercially available products include "Reduction Solution Security P" manufactured by Atotech Japan Co., Ltd. The treatment with the neutralizing solution can be performed by immersing the treated surface that has been roughened with an oxidizing agent in the neutralizing solution at 30 ° C. to 80 ° C. for 5 to 30 minutes. From the viewpoint of workability and the like, a method of immersing the object roughened with an oxidizing agent in a neutralizing solution at 40 ° C. to 70 ° C. for 5 to 20 minutes is preferable.

Step (V) is a step of forming a conductor layer.

The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer is one or more selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. Contains metal. The conductor layer may be a single metal layer or an alloy layer, and the alloy layer may be, for example, an alloy of two or more metals selected from the above group (for example, nickel-chromium alloy, copper, etc.). A layer formed of a nickel alloy and a copper / titanium alloy) can be mentioned. Among them, from the viewpoint of versatility of conductor layer formation, cost, ease of patterning, etc., a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or a nickel-chromium alloy, copper, etc. An alloy layer of a nickel alloy or a copper-titanium alloy is preferable, and a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or an alloy layer of a nickel-chromium alloy is more preferable, and a single copper layer is preferable. A metal layer is more preferred.

The conductor layer may have a single-layer structure, a single metal layer made of different types of metals or alloys, or a multi-layer structure in which two or more alloy layers are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of nickel-chromium alloy.

The thickness of the conductor layer is generally 3 μm to 35 μm, preferably 5 μm to 30 μm, depending on the desired printed wiring board design.

In one embodiment, the conductor layer may be formed by plating. For example, the surface of the insulating layer can be plated by a conventionally known technique such as a semi-additive method or a full additive method to form a conductor layer having a desired wiring pattern. Hereinafter, an example of forming the conductor layer by the semi-additive method will be shown.

First, a plating seed layer is formed on the surface of the insulating layer by electroless plating. Next, a mask pattern that exposes a part of the plating seed layer corresponding to a desired wiring pattern is formed on the formed plating seed layer. After forming a metal layer by electrolytic plating on the exposed plating seed layer, the mask pattern is removed. After that, the unnecessary plating seed layer can be removed by etching or the like to form a conductor layer having a desired wiring pattern.

[Semiconductor device]
The semiconductor device of the present invention includes a printed wiring board. The semiconductor device of the present invention can be manufactured by using the printed wiring board of the present invention.

Examples of semiconductor devices include various semiconductor devices used in electrical products (for example, computers, mobile phones, digital cameras, televisions, etc.) and vehicles (for example, motorcycles, automobiles, trains, ships, aircraft, etc.).

The semiconductor device of the present invention can be manufactured by mounting a component (semiconductor chip) on a conductive portion of a printed wiring board. The "conduction point" is a "place for transmitting an electric signal in the printed wiring board", and the place may be a surface or an embedded place. Further, the semiconductor chip is not particularly limited as long as it is an electric circuit element made of a semiconductor.

The method for mounting the semiconductor chip in manufacturing the semiconductor device of the present invention is not particularly limited as long as the semiconductor chip functions effectively, but specifically, a wire bonding mounting method, a flip chip mounting method, and no bumps. Examples thereof include a mounting method using a build-up layer (BBUL), a mounting method using an anisotropic conductive film (ACF), and a mounting method using a non-conductive film (NCF). Here, the "mounting method using the bumpless build-up layer (BBUL)" means "a mounting method in which the semiconductor chip is directly embedded in the recess of the printed wiring board and the semiconductor chip is connected to the wiring on the printed wiring board". Is.

Hereinafter, the present invention will be specifically described with reference to Examples, but the present invention is not limited to these Examples. In the following description, "parts" and "%" mean "parts by mass" and "% by mass", respectively, unless otherwise specified. In addition, Me in the structural formula represents a methyl group.

First, various measurement methods and evaluation methods will be described.

<Measurement of average particle size>
100 mg of an inorganic filler, 0.1 g of a dispersant (“SN9228” manufactured by San Nopco Co., Ltd.), and 10 g of methyl ethyl ketone were weighed in a vial and dispersed by ultrasonic waves for 20 minutes. Using a laser diffraction type particle size distribution measuring device (“SALD-2200” manufactured by Shimadzu Corporation), the particle size distribution was measured by the batch cell method, and the average particle size based on the median diameter was calculated.

<Measurement of specific surface area>
The specific surface area of the inorganic filler was measured using a BET fully automatic specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Co., Ltd.).

<Measurement of carbon content>
Each of the following 3 g of inorganic filler was used as a sample. The sample and 30 g of MEK (methyl ethyl ketone) were placed in a centrifuge tube, stirred to suspend the solid content, and irradiated with 500 W of ultrasonic waves at 25 ° C. for 5 minutes. Then, it was separated into solid and liquid by centrifugation, and 20 g of the supernatant was removed. Further, 20 g of MEK was added, and the solid content was suspended by stirring, and 500 W ultrasonic waves were irradiated at 25 ° C. for 5 minutes. Then, solid-liquid separation was performed by centrifugation, and 26 g of the supernatant was removed. The remaining suspension was dried at 160 ° C. for 30 minutes. 0.3 g of this dried sample was accurately weighed into the measuring crucible, and a combustion improver (3.0 g of tungsten and 0.3 g of tin) was further added to the measuring crucible. The measuring crucible was set in a carbon analyzer (“EMIA-321V2” manufactured by HORIBA, Ltd.), and the amount of carbon was measured. The amount of carbon per unit surface area was calculated by dividing the measured value of the amount of carbon by the specific surface area of the inorganic filler used.

<Inorganic filler used>
Inorganic filler 1: Spherical silica (“SO-C2” manufactured by Admatex Co., Ltd., surface-treated with hexamethyldisilazane, average particle size 0.77 μm, specific surface area 5.8 m ² / g) per 100 parts After treatment with 0.6 parts of an aminosilane-based coupling agent (“KBM-573” manufactured by Shin-Etsu Chemical Co., Ltd.), an epoxy silane-based coupling agent (“KBM-403” manufactured by Shin-Etsu Chemical Co., Ltd.) Processed with 0.4 parts. The amount of carbon per unit surface area was 0.45 mg / m ² .

Inorganic filler 2: Aminosilane-based coupling agent (aminosilane-based coupling agent) for 100 parts of spherical silica (“SPH516-05” manufactured by Shin-Etsu Chemical Co., Ltd., average particle size 0.29 μm, specific surface area 16.3 m ^{2 / g).} After treating with 0.5 part of "KBE-903" manufactured by Shin-Etsu Chemical Co., Ltd., it is treated with 1.5 parts of an epoxy silane coupling agent ("X-12-1231" manufactured by Shin-Etsu Chemical Co., Ltd.). What I did. The amount of carbon per unit surface area was 0.42 mg / m ² .

Inorganic filler 3: Vinylsilane-based coupling agent (Shin-Etsu Chemical Co., Ltd.) for 100 parts of spherical silica (“UFP-30” manufactured by Denka Co., Ltd., average particle size 0.078 μm, specific surface area 30.7 m ^{2 / g)} After being treated with 1 part of "KBE-1003" manufactured by Shin-Etsu Chemical Co., Ltd.), it was treated with 1 part of a methacrylsilane-based coupling agent ("KBM-1003" manufactured by Shin-Etsu Chemical Co., Ltd.). The amount of carbon per unit surface area was 0.36 mg / m ² .

Inorganic filler 4: Spherical silica (“SPH516-05” manufactured by Shin-Etsu Chemical Co., Ltd., average particle size 0.29 μm, specific surface area 16.3 m ² / g) with respect to 100 parts of a mercaptosilane coupling agent ("KBM-803" manufactured by Shin-Etsu Chemical Co., Ltd.) After treatment with 0.5 parts, 1.5 parts of epoxysilane-based coupling agent ("X-12-1231" manufactured by Shin-Etsu Chemical Co., Ltd.) Processed one. The amount of carbon per unit surface area was 0.40 mg / m ² .

Inorganic filler 5: Spherical silica (“SO-C2” manufactured by Admatex Co., Ltd., surface-treated with hexamethyldisilazane, average particle size 0.77 μm, specific surface area 5.8 m ² / g) per 100 parts Then, treated with 0.6 parts of an aminosilane-based coupling agent (“KBM-573” manufactured by Shin-Etsu Chemical Co., Ltd.). The amount of carbon per unit surface area was 0.39 mg / m ² .

Inorganic filler 6: Spherical silica (“SO-C2” manufactured by Admatex Co., Ltd., surface-treated with hexamethyldisilazane, average particle size 0.77 μm, specific surface area 5.8 m ² / g) per 100 parts And treated with 0.6 parts of epoxy silane coupling agent ("KBM-403" manufactured by Shin-Etsu Chemical Co., Ltd.). The amount of carbon per unit surface area was 0.31 mg / m ² .

Inorganic filler 7: Aminosilane-based coupling agent (aminosilane-based coupling agent) for 100 parts of spherical silica (“SPH516-05” manufactured by Shin-Etsu Chemical Co., Ltd., average particle size 0.29 μm, specific surface area 16.3 m ^{2 / g).} After treating with 0.5 part of "KBE-903" manufactured by Shin-Etsu Chemical Co., Ltd., it was treated with 1.5 parts of an aminosilane-based coupling agent ("KBM-573" manufactured by Shin-Etsu Chemical Co., Ltd.). The amount of carbon per unit surface area was 0.43 mg / m ² .

Inorganic filler 8: Epoxysilane-based coupling agent (Shin-Etsu Chemical Co., Ltd.) for 100 parts of spherical silica (“UFP-30” manufactured by Denka Co., Ltd., average particle size 0.078 μm, specific surface area 30.7 m ^{2 / g)} After being treated with 1 part of "KBM-403" manufactured by Kogyo Co., Ltd., it was treated with 1 part of a methacrylsilane-based coupling agent ("KBM-503" manufactured by Shin-Etsu Chemical Co., Ltd.). The amount of carbon per unit surface area was 0.35 mg / m ² .

Inorganic filler 9: Aminosilane-based coupling agent (Shin-Etsu Chemical Co., Ltd.) for 100 parts of spherical silica (“UFP-30” manufactured by Denka Co., Ltd., average particle size 0.078 μm, specific surface area 30.7 m ^{2 / g)} After treating with 0.6 parts of "KBE-903" manufactured by Shin-Etsu Chemical Co., Ltd., it was treated with 1 part of an acrylic silane coupling agent ("KBM-5103" manufactured by Shin-Etsu Chemical Co., Ltd.). The amount of carbon per unit surface area was 0.31 mg / m ² .

<Preparation of resin sheet with support (Examples 1 to 5, Comparative Examples 1 to 5)>
Using the resin varnish (resin composition) prepared by the following procedure, resin sheets with supports of Examples and Comparative Examples were prepared.

(Preparation of resin varnish 1)
Bisphenol type epoxy resin ("ZX1059" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., epoxy equivalent about 169, 1: 1 mixture of bisphenol A type and bisphenol F type), 6 parts, bixirenol type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd.) "YX4000HK", epoxy equivalent about 185) 9 parts, biphenyl type epoxy resin ("NC3000L" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 288) 21 parts, and phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, solid 10 parts (1: 1 solution) of cyclohexanone: methyl ethyl ketone (MEK) in an amount of 30% by mass was heated and dissolved in a mixed solvent of 20 parts of solvent naphtha and 5 parts of cyclohexanone with stirring. After cooling to room temperature, 6 parts of a cresol novolac-based curing agent containing a triazine skeleton (hydroxyl equivalent 151, "LA-3018-50P" manufactured by DIC Co., Ltd., 2-methoxypropanol solution having a solid content of 50%), 20 parts of an active ester compound (“HPC-8000-65T” manufactured by DIC Co., Ltd., a toluene solution having a weight average molecular weight of about 2700 and an active group equivalent of about 223 and a non-volatile content of 65% by mass), an amine-based curing accelerator (4- 2 parts of dimethylaminopyridine (DMAP), MEK solution having a solid content of 5% by mass), flame retardant ("HCA-HQ" manufactured by Sanko Co., Ltd., 10- (2,5-dihydroxyphenyl) -10-hydro-9- Oxa-10-phosphophenanthrene-10-oxide, average particle size 2 μm) 2 parts and 170 parts of inorganic filler 1 are mixed and uniformly dispersed with a high-speed rotary mixer, and then a cartridge filter (“SHP050” manufactured by ROKITECHNO). ) Was filtered to prepare a resin varnish 1.

(Preparation of resin varnish 2)
Liquid naphthalene type epoxy resin (epoxy equivalent 144, "HP4032SS" manufactured by DIC Co., Ltd.) 5 parts, bixilenol type epoxy resin (Mitsubishi Chemical Co., Ltd. "YX4000HK", epoxy equivalent about 185) 5 parts, naphthalene type epoxy resin (ESN475V manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., epoxy equivalent 330) 15 parts, and phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Co., Ltd., cyclohexanone with a solid content of 30% by mass: 1: 1 solution of methyl ethyl ketone (MEK)) ) 6 parts were dissolved by heating in a mixed solvent of 20 parts of solvent naphtha and 5 parts of cyclohexanone with stirring. After cooling to room temperature, 10 parts of an active ester compound (“HPC-8000-65T” manufactured by DIC Co., Ltd., a toluene solution having a weight average molecular weight of about 2700 and an active group equivalent of about 223 and a non-volatile content of 65% by mass), carbodiimide 6 parts of resin ("V-03" manufactured by Nisshinbo Chemical Co., Ltd., toluene solution with 50% by mass of non-volatile component), prepolymer of bisphenol A disicanate ("BA230S75" manufactured by Ronza Japan Co., Ltd., cyanate equivalent of about 232, non-volatile content 20 parts of 75% by mass MEK solution, 0.5 parts of curing accelerator (4-dimethylaminopyridine (DMAP), MEK solution with 5% by mass of solid content), curing accelerator (manufactured by Tokyo Kasei Co., Ltd., cobalt ( III) Acetylacetonate [Co (III) Ac, MEK solution with 1% by mass of solid content]) 3 parts, rubber particles (Dow Chemical Japan Co., Ltd., PARALOID EXL2655) 2 parts, flame retardant (Sanko Co., Ltd.) Made by "HCA-HQ", 10- (2,5-dihydroxyphenyl) -10-hydro-9-oxa-10-phosphophenanthrene-10-oxide, average particle size 2 μm) 2 parts, inorganic filler 2 Was mixed and uniformly dispersed with a high-speed rotary mixer, and then filtered with a cartridge filter (“SHP030” manufactured by ROKITECHNO) to prepare a resin varnish 2.

(Preparation of resin varnish 3)
Bisphenol type epoxy resin ("ZX1059" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., epoxy equivalent about 169, 1: 1 mixture of bisphenol A type and bisphenol F type), 5 parts, bisphenol AF type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd.) "YL7760", epoxy equivalent 238) 10 parts, naphthalene type epoxy resin (Nittetsu Sumikin Chemical Co., Ltd. "ESN475V", epoxy equivalent 330) 5 parts, and phenoxy resin (Mitsubishi Chemical Co., Ltd. "YX7553BH30", solid content 10 parts (1: 1 solution) of 30% by mass of cyclohexanone: methyl ethyl ketone (MEK) was dissolved by heating in a mixed solvent of 20 parts of solvent naphtha and 5 parts of cyclohexanone with stirring. After cooling to room temperature, 20 parts of an active ester compound ("HPC-8000-65T" manufactured by DIC Co., Ltd., a toluene solution having a weight average molecular weight of about 2700 and an active group equivalent of about 223 and a non-volatile content of 65% by mass), oligo 15 parts of phenylene ether styrene resin ("OPE-2St 1200" manufactured by Mitsubishi Gas Chemicals, Inc., toluene solution with 72% by mass of solid content), amine-based curing accelerator (4-dimethylaminopyridine (DMAP), solid content 5) 2 parts by mass% MEK solution), 0.5 part of imidazole-based curing accelerator (“1B2PZ” 1-benzyl-2-phenylimidazole manufactured by Shikoku Kasei Kogyo Co., Ltd., MEK solution with 5% solid content), inorganic filler After mixing 60 parts of 3 and uniformly dispersing with a high-speed rotating mixer, the resin varnish 3 was prepared by filtering with a cartridge filter (“SHP020” manufactured by ROKITECHNO).

(Preparation of resin varnish 4)
In the preparation of the resin varnish 1, 1) 170 parts of the inorganic filler 1 was changed to 100 parts of the inorganic filler 4, and 2) the cartridge filter (“SHP050” manufactured by ROKITECHNO) was replaced with the cartridge filter (“SHP030” manufactured by ROKITECHNO). I changed it. The resin varnish 4 was prepared in the same manner as the preparation of the resin varnish 1 except for the above items.

(Preparation of resin varnish 5)
In the preparation of the resin varnish 1, the resin varnish 5 was prepared in the same manner as the preparation of the resin varnish 1 except that 170 parts of the inorganic filler 1 was changed to 170 parts of the inorganic filler 5.

(Preparation of resin varnish 6)
In the preparation of the resin varnish 1, the resin varnish 6 was prepared in the same manner as the preparation of the resin varnish 1 except that 170 parts of the inorganic filler 1 was changed to 170 parts of the inorganic filler 6.

(Preparation of resin varnish 7)
In the preparation of the resin varnish 1, the resin varnish 7 was prepared in the same manner as the preparation of the resin varnish 1 except that 170 parts of the inorganic filler 1 was changed to 85 parts of the inorganic filler and 685 parts of the inorganic filler 1.

(Preparation of resin varnish 8)
In the preparation of the resin varnish 2, the resin varnish 8 was prepared in the same manner as the preparation of the resin varnish 1 except that 100 parts of the inorganic filler 2 was changed to 100 parts of the inorganic filler 7.

(Preparation of resin varnish 9)
In the preparation of the resin varnish 3, the resin varnish 9 was prepared in the same manner as the preparation of the resin varnish 1 except that 60 parts of the inorganic filler was changed to 860 parts of the inorganic filler.

(Preparation of resin varnish 10)
In the preparation of the resin varnish 3, the resin varnish 10 was prepared in the same manner as the preparation of the resin varnish 1 except that 60 parts of the inorganic filler was changed to 960 parts of the inorganic filler.

The components used in the resin varnishes 1 to 10 and their blending amounts (mass parts of non-volatile components) are shown in the table below.

(Preparation of resin sheet)
As a support, a PET film ("Lumilar R80" manufactured by Toray Industries, Inc., thickness 38 μm, softening point 130 ° C., "Release"" was released by an alkyd resin-based mold release agent ("AL-5" manufactured by Lintec Co., Ltd.). Mold PET ") was prepared.

Each resin varnish is uniformly applied on a release PET with a die coater so that the thickness of the resin composition layer after drying is 20 μm, and dried at 70 ° C. to 100 ° C. for 2.5 minutes to release. A resin composition layer was obtained on the mold PET. Next, a rough surface of a polypropylene film (“Alfan MA-411” manufactured by Oji F-Tex Co., Ltd., thickness 15 μm) was applied as a protective film on the surface of the resin composition layer that was not bonded to the support. It was laminated so as to join with. As a result, a resin sheet composed of a support, a resin composition layer, and a protective film was obtained.

<Measurement of minimum melt viscosity>
Only the resin composition layer was peeled off from the release PET (support) and compressed with a mold to prepare measurement pellets (diameter 18 mm, 1.2 to 1.3 g).

Using a dynamic viscoelasticity measuring device (“Rheosol-G3000” manufactured by UBM Co., Ltd.), a starting temperature of 60 ° C. to 200 ° C. was used for 1 g of the sample resin composition layer using a parallel plate having a diameter of 18 mm. The temperature is raised to 5 ° C./min, and the dynamic viscoelasticity is measured under the measurement conditions of measurement temperature interval 2.5 ° C., frequency 1 Hz, and strain 1 deg, and the minimum melt viscosity (poise) is calculated. did.

<Evaluation of plating adhesion and surface roughness (arithmetic mean roughness (Ra), root mean square roughness (Rq))>
Using the resin sheets prepared in Examples and Comparative Examples, measurement substrates A and B were prepared according to the following procedure, and plating adhesion and surface roughness were evaluated.

(1) Base treatment of laminated board Glass cloth base material Epoxy resin Double-sided copper-clad laminated board (copper foil thickness 18 μm, substrate thickness 0.3 mm, Panasonic Corporation “R1515F”) both sides manufactured by MEC Co., Ltd. The copper surface was roughened by etching 1 μm with a roughening agent (CZ8101), and rust preventive treatment (CL8300) was performed. Then, under the temperature condition of 130 ° C., the mixture was placed in an oven at 130 ° C. and then heat-treated for 30 minutes.

(2) Laminating of resin sheets The resin composition layer exposed by peeling the protective film from the resin sheets produced in Examples and Comparative Examples is a batch type vacuum pressure laminator (Nikko Materials Co., Ltd. 2-stage build). Using an uplaminator "CVP700"), the resin composition layer was laminated on both sides of the substrate so as to be bonded to the substrate. Lamination was carried out by reducing the pressure for 30 seconds to reduce the atmospheric pressure to 13 hPa or less, and then crimping at 120 ° C. and a pressure of 0.74 MPa for 30 seconds. Next, the laminated resin sheet was heat-pressed at 100 ° C. and a pressure of 0.5 MPa for 60 seconds under atmospheric pressure to smooth it.

(3) Thermosetting of Resin Composition Layer After laminating the resin sheet, it is placed in an oven at 100 ° C. for 30 minutes at a temperature of 100 ° C. with the release PET as a support attached, and then at 180 ° C. Under temperature conditions, it was transferred to an oven at 180 ° C. and then thermoset for 30 minutes to form an insulating layer.

(4) Roughening treatment Swelling dip security P containing diethylene glycol monobutyl ether manufactured by Atotech Japan Co., Ltd., which is a swelling liquid by peeling off the release PET that is the support from the laminated plate on which the insulating layer is formed. It was immersed in (an aqueous solution of glycol ethers and sodium hydroxide) at 60 ° C. for 5 minutes. Next, as a roughening solution, it was immersed in Concentrate Compact P ( _{Aqueous solution of KMnO 4} : 60 g / L, NaOH: 40 g / L) manufactured by Atotech Japan Co., Ltd. at 80 ° C. for 15 minutes. Finally, as a neutralizing solution, it was immersed in Reduction Shorusin Securigant P (aqueous solution of sulfuric acid) manufactured by Atotech Japan Co., Ltd. at 40 ° C. for 5 minutes. After drying at 80 ° C. for 30 minutes, this substrate was used as an evaluation substrate A.

(5) Step of forming a conductor layer (5-1) Electroless plating step In order to form a conductor layer on the surface of the evaluation substrate A, a plating step including the following steps 1 to 6 (manufactured by Atotech Japan Co., Ltd.) The conductor layer was formed by performing a copper plating step) using the chemical solution of.

1. 1. Alkaline cleaning (cleaning of the surface of the insulating layer and charge adjustment)
Product name: Cleaning was performed at 60 ° C. for 5 minutes using Cleaning Cleaner Security 902 (trade name).
2. Soft etching Using an aqueous solution of sodium sulfate acidic peroxodisulfate, the treatment was carried out at 30 ° C. for 1 minute.
3. 3. Predip (Adjustment of charge on the surface of the insulating layer for Pd application)
Pre. Treatment was performed at room temperature for 1 minute using Dip Neoganth B (trade name).
4. Add activator (give Pd to the surface of the insulating layer)
Treatment was performed at 35 ° C. for 5 minutes using Activator Neoganth 834 (trade name).
5. Reduction (Reduction of Pd applied to the insulating layer)
Reducer Neoganth WA (trade name) and Reducer Acceralator 810 mod. Using a mixed solution with (trade name), the treatment was carried out at 30 ° C. for 5 minutes.
6. Electroless copper plating process (Cu is deposited on the surface of the insulating layer (Pd surface))
A mixture of Basic Solution Printganth MSK-DK (trade name), Copper solution Printganth MSK (trade name), Stabilizer Printganth MSK-DK (trade name), and Reducer Cu (trade name) at 35 ° C. Treated for 20 minutes. The thickness of the formed electroless copper plating layer was 1 μm.

(5-2) Electroplating Step Next, after heat treatment at 150 ° C. for 30 minutes, copper sulfate electroplating was performed to form a conductor layer having a thickness of 25 μm. Next, the substrate obtained by performing the annealing treatment at 190 ° C. for 90 minutes was designated as the evaluation substrate B.

(Measurement of Arithmetic Mean Roughness (Ra), Root Mean Square Roughness (Rq))
Using a non-contact type surface roughness meter (WYKO NT3300 manufactured by Becoin Sturments), the evaluation substrate A is used in VSI contact mode, and the measurement range is 121 μm × 92 μm with a 50x lens. I asked. The average value of each of the 6 points was calculated, and the results of rounding off the last digit are shown in the table below.

(Measurement of plating adhesion (plating peel strength))
Make a notch in the conductor layer of the evaluation substrate B with a width of 10 mm and a length of 100 mm, and peel off one end of the notch. The load (kgf / cm) when 35 mm was peeled off in the vertical direction at a speed of 50 mm / min at room temperature was measured using the Instron universal tester, and the plating peel strength before the environmental test was measured. And said. Further, the same sample is peeled off by the same method after a 100-hour accelerated environmental test (HAST) at 130 ° C. and 85% RH with a highly accelerated life test device PM422 (manufactured by Kusumoto Kasei Co., Ltd.). Was measured and used as the plating peel strength after the environmental test. Those having a plating peel strength of 0.25 kgf / cm or more after the environmental test were evaluated as "◯", and those having a plating peel strength of less than 0.25 kgf / cm were evaluated as "x".

<Evaluation of base adhesion>
(1) Base treatment of inner layer circuit board Glass cloth base material Epoxy resin Double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.3 mm, Panasonic Corporation “R1515F”) Both sides are MEC Co., Ltd. The copper surface was roughened by etching 1 μm with a roughening treatment agent (CZ8101), and then rust preventive treatment (CL8300) was performed. Then, under the temperature condition of 130 ° C., the mixture was placed in an oven at 130 ° C. and then heat-treated for 30 minutes.

(2) Lamination of Resin Sheets The resin sheets produced in Examples and Comparative Examples were laminated on both sides of the laminated board using a batch type vacuum pressurizing laminator MVLP-500 (manufactured by Meiki Seisakusho Co., Ltd.). Lamination was carried out by reducing the pressure for 30 seconds to a pressure of 13 hPa or less, and then crimping at 120 ° C. and a pressure of 0.74 MPa for 30 seconds.

(3) Base treatment of copper foil The glossy surface of 3EC-III (electric field copper foil, 35 μm) manufactured by Mitsui Mining & Smelting Co., Ltd. is etched by 1 μm with a roughening treatment agent (CZ8101) manufactured by MEC Co., Ltd. to surface the copper surface. Roughing treatment was performed, and rust prevention treatment (CL8300) was performed. Then, under the temperature condition of 130 ° C., the mixture was placed in an oven at 130 ° C. and then heat-treated for 30 minutes.

(4) Lamination of copper foil and formation of insulating layer The release PET film was peeled off from the resin sheet laminated in (2) above, and the glossy surface of the copper foil treated in (3) above was set to the resin composition layer side. Using a batch type vacuum pressurizing laminator (2-stage build-up laminator "CVP700" manufactured by Nikko Materials Co., Ltd.), the resin composition layer was laminated on both sides of the substrate so as to be bonded to the substrate. Lamination was carried out by reducing the pressure for 30 seconds to reduce the atmospheric pressure to 13 hPa or less, and then crimping at 120 ° C. and a pressure of 0.74 MPa for 30 seconds. Next, the laminated resin sheet was heat-pressed at 100 ° C. and a pressure of 0.5 MPa for 60 seconds under atmospheric pressure to smooth it.

(5) Thermosetting of Resin Composition Layer After laminating the copper foil, it is placed in an oven at 100 ° C. for 30 minutes, and then transferred to an oven at 180 ° C. at 180 ° C. for 30 minutes. After transferring to an oven at 190 ° C. for 1 minute, the mixture was heat-cured for 90 minutes to form an insulating layer, and a substrate was prepared.

(6) Measurement of Adhesion to Copper Foil (Base Peel Strength) The substrate produced in (5) above was cut into small pieces of 150 mm × 30 mm. Make a notch in a small piece of copper foil with a width of 10 mm and a length of 100 mm, peel off one end of the copper foil, and use a gripper (TSE Co., Ltd., Autocom type testing machine AC-50C-SL). Using the Instron universal tester, measure the load when the 35 mm is peeled off vertically at a speed of 50 mm / min at room temperature, and measure the base peel strength (copper foil peel strength) before the environmental test. ). Further, the same sample is peeled off by the same method after a 100-hour accelerated environmental test (HAST) at 130 ° C. and 85% RH with a highly accelerated life test device PM422 (manufactured by Kusumoto Kasei Co., Ltd.). Was measured and used as the base peel strength after the environmental test. Those having a base peel strength of 0.25 kgf / cm or more after the environmental test were evaluated as "◯", and those having a base peel strength of less than 0.25 kgf / cm were evaluated as "x".

＊無機充填材５に含まれるＳＯ−Ｃ２、及び無機充填材６に含まれるＳＯ−Ｃ２を表す。

* Represents SO-C2 contained in the inorganic filler 5 and SO-C2 contained in the inorganic filler 6.

Claims (11)

A resin sheet having a support and a resin composition layer containing a resin composition provided on the support.
The resin composition contains (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler .
The component (B) contains an active ester-based curing agent and contains.
The component (C) is (C1) aminosilane compound and epoxysilane compound, (C2) vinylsilane compound and (meth) acrylicsilane compound, (C3) mercaptosilane compound and epoxysilane compound, or (C4) aminosilane compound and acrylicsilane compound. A resin sheet for forming an insulating layer of a multilayer printed wiring board, which is surface-treated with. The resin sheet according to claim 1, wherein the content of the component (C) is 50% by mass or more when the non-volatile component in the resin composition is 100% by mass. (C) carbon content per unit surface area of the component is ^{0.05mg / m 2 ~1mg / m 2} , the resin sheet according to claim 1 or 2. The resin sheet according to any one of claims 1 to 3, wherein the average particle size of the component (C) is 0.01 μm to 5 μm. The resin sheet according to any one of claims 1 to 4, wherein the component (C) is silica. Any of claims 1 to 5, wherein the component (C1), the component (C2), the component (C3), or the component (C4) is 0.5 parts by mass to 3 parts by mass with respect to 100 parts by mass of the inorganic filler. The resin sheet according to item 1. The resin sheet according to any one of claims 1 to 6, which is used for forming an interlayer insulating layer of a multilayer printed wiring board. The resin sheet according to any one of claims 1 to 7, wherein the thickness of the resin composition layer is 30 μm or less. The resin sheet according to any one of claims 1 to 8, wherein the thickness of the resin composition layer is 20 μm or less. A printed wiring board including an insulating layer formed of a cured product of the resin composition layer of the resin sheet according to any one of claims 1 to 9. A semiconductor device including the printed wiring board according to claim 10.