TW201412962A - 研磨用組成物、該研磨用組成物之製造方法以及使用該研磨用組成物之半導體基板之製造方法 - Google Patents

研磨用組成物、該研磨用組成物之製造方法以及使用該研磨用組成物之半導體基板之製造方法 Download PDF

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Publication number
TW201412962A
TW201412962A TW102128464A TW102128464A TW201412962A TW 201412962 A TW201412962 A TW 201412962A TW 102128464 A TW102128464 A TW 102128464A TW 102128464 A TW102128464 A TW 102128464A TW 201412962 A TW201412962 A TW 201412962A
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TW
Taiwan
Prior art keywords
water
polishing composition
soluble polymer
polishing
less
Prior art date
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TW102128464A
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English (en)
Chinese (zh)
Inventor
Shuhei Takahashi
Yoshio Mori
Kohsuke Tsuchiya
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of TW201412962A publication Critical patent/TW201412962A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW102128464A 2012-08-10 2013-08-08 研磨用組成物、該研磨用組成物之製造方法以及使用該研磨用組成物之半導體基板之製造方法 TW201412962A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012178472A JP6013828B2 (ja) 2012-08-10 2012-08-10 研磨用組成物、当該研磨用組成物の製造方法、及び当該研磨用組成物を用いた半導体基板の製造方法

Publications (1)

Publication Number Publication Date
TW201412962A true TW201412962A (zh) 2014-04-01

Family

ID=50068151

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102128464A TW201412962A (zh) 2012-08-10 2013-08-08 研磨用組成物、該研磨用組成物之製造方法以及使用該研磨用組成物之半導體基板之製造方法

Country Status (3)

Country Link
JP (1) JP6013828B2 (ja)
TW (1) TW201412962A (ja)
WO (1) WO2014024930A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7370689B2 (ja) * 2017-12-08 2023-10-30 ダイセルミライズ株式会社 疎水化ヒドロキシエチルセルロースの製造方法及び研磨助剤
JP7433042B2 (ja) * 2019-12-24 2024-02-19 ニッタ・デュポン株式会社 研磨用組成物
JPWO2021182155A1 (ja) * 2020-03-13 2021-09-16

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004014813A (ja) * 2002-06-07 2004-01-15 Showa Denko Kk 金属研磨組成物、それを用いた研磨方法及びそれを用いた基板の製造方法
JP4085262B2 (ja) * 2003-01-09 2008-05-14 三菱瓦斯化学株式会社 レジスト剥離剤
JP2008112969A (ja) * 2006-10-05 2008-05-15 Hitachi Chem Co Ltd 研磨液及びこの研磨液を用いた研磨方法
JP2009064881A (ja) * 2007-09-05 2009-03-26 Fujifilm Corp 金属用研磨用組成物及びそれを用いた化学的機械的研磨方法
JP5492603B2 (ja) * 2010-03-02 2014-05-14 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP5940270B2 (ja) * 2010-12-09 2016-06-29 花王株式会社 研磨液組成物

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Publication number Publication date
WO2014024930A1 (ja) 2014-02-13
JP6013828B2 (ja) 2016-10-25
JP2014036206A (ja) 2014-02-24

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