TW201343324A - 研磨裝置及研磨方法 - Google Patents

研磨裝置及研磨方法 Download PDF

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Publication number
TW201343324A
TW201343324A TW102113034A TW102113034A TW201343324A TW 201343324 A TW201343324 A TW 201343324A TW 102113034 A TW102113034 A TW 102113034A TW 102113034 A TW102113034 A TW 102113034A TW 201343324 A TW201343324 A TW 201343324A
Authority
TW
Taiwan
Prior art keywords
polishing
film thickness
substrate
film
wafer
Prior art date
Application number
TW102113034A
Other languages
English (en)
Chinese (zh)
Inventor
小林洋一
大野勝俊
Original Assignee
荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荏原製作所股份有限公司 filed Critical 荏原製作所股份有限公司
Publication of TW201343324A publication Critical patent/TW201343324A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW102113034A 2012-04-17 2013-04-12 研磨裝置及研磨方法 TW201343324A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012094114A JP2013222856A (ja) 2012-04-17 2012-04-17 研磨装置および研磨方法

Publications (1)

Publication Number Publication Date
TW201343324A true TW201343324A (zh) 2013-11-01

Family

ID=49325509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102113034A TW201343324A (zh) 2012-04-17 2013-04-12 研磨裝置及研磨方法

Country Status (4)

Country Link
US (1) US20130273814A1 (https=)
JP (1) JP2013222856A (https=)
KR (1) KR20130117334A (https=)
TW (1) TW201343324A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI657894B (zh) * 2014-04-22 2019-05-01 Ebara Corporation 研磨方法及研磨裝置
TWI843783B (zh) * 2018-12-26 2024-06-01 日商荏原製作所股份有限公司 光學式膜厚量測系統之清洗方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102326730B1 (ko) * 2014-03-12 2021-11-17 가부시키가이샤 에바라 세이사꾸쇼 막 두께 측정값의 보정 방법, 막 두께 보정기 및 와전류 센서
JP6404172B2 (ja) * 2015-04-08 2018-10-10 株式会社荏原製作所 膜厚測定方法、膜厚測定装置、研磨方法、および研磨装置
KR102313560B1 (ko) * 2015-06-02 2021-10-18 주식회사 케이씨텍 화학 기계적 연마 장치
JP2018083267A (ja) * 2016-11-25 2018-05-31 株式会社荏原製作所 研磨装置及び研磨方法
JP6829653B2 (ja) * 2017-05-17 2021-02-10 株式会社荏原製作所 研磨装置および研磨方法
JP6948868B2 (ja) * 2017-07-24 2021-10-13 株式会社荏原製作所 研磨装置および研磨方法
JP7083279B2 (ja) * 2018-06-22 2022-06-10 株式会社荏原製作所 渦電流センサの軌道を特定する方法、基板の研磨の進行度を算出する方法、基板研磨装置の動作を停止する方法および基板研磨の進行度を均一化する方法、これらの方法を実行するためのプログラムならびに当該プログラムが記録された非一過性の記録媒体
JP7084811B2 (ja) 2018-07-13 2022-06-15 株式会社荏原製作所 研磨装置および研磨方法
JP7221736B2 (ja) * 2019-03-04 2023-02-14 株式会社荏原製作所 研磨方法および研磨装置
JP7341022B2 (ja) 2019-10-03 2023-09-08 株式会社荏原製作所 基板研磨装置および膜厚マップ作成方法
JP7680347B2 (ja) * 2021-12-24 2025-05-20 株式会社荏原製作所 膜厚測定方法および膜厚測定装置
JP7696822B2 (ja) * 2021-12-28 2025-06-23 株式会社荏原製作所 研磨装置および研磨方法
JP7783107B2 (ja) * 2022-03-30 2025-12-09 株式会社荏原製作所 ワークピースの研磨方法および研磨装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4011892B2 (ja) * 2001-11-20 2007-11-21 富士通株式会社 研磨装置
US20040242121A1 (en) * 2003-05-16 2004-12-02 Kazuto Hirokawa Substrate polishing apparatus
JP4451111B2 (ja) * 2003-10-20 2010-04-14 株式会社荏原製作所 渦電流センサ
JP4641395B2 (ja) * 2004-08-17 2011-03-02 Ｏｋｉセミコンダクタ株式会社 半導体装置の研削方法、及び研削装置
CN101511539B (zh) * 2006-09-12 2012-08-22 株式会社荏原制作所 研磨装置及研磨方法
JP5006883B2 (ja) * 2006-10-06 2012-08-22 株式会社荏原製作所 加工終点検知方法および加工装置
JP5080933B2 (ja) * 2007-10-18 2012-11-21 株式会社荏原製作所 研磨監視方法および研磨装置
JP2009158749A (ja) * 2007-12-27 2009-07-16 Ricoh Co Ltd 化学機械研磨方法及び化学機械研磨装置
JP5513795B2 (ja) * 2009-07-16 2014-06-04 株式会社荏原製作所 研磨方法および装置
JP5728239B2 (ja) * 2010-03-02 2015-06-03 株式会社荏原製作所 研磨監視方法、研磨方法、研磨監視装置、および研磨装置
JP5980476B2 (ja) * 2010-12-27 2016-08-31 株式会社荏原製作所 ポリッシング装置およびポリッシング方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI657894B (zh) * 2014-04-22 2019-05-01 Ebara Corporation 研磨方法及研磨裝置
TWI843783B (zh) * 2018-12-26 2024-06-01 日商荏原製作所股份有限公司 光學式膜厚量測系統之清洗方法

Also Published As

Publication number Publication date
KR20130117334A (ko) 2013-10-25
US20130273814A1 (en) 2013-10-17
JP2013222856A (ja) 2013-10-28

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