TW201330169A - 在真空保持中經控制之表面粗糙度 - Google Patents

在真空保持中經控制之表面粗糙度 Download PDF

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Publication number
TW201330169A
TW201330169A TW101136109A TW101136109A TW201330169A TW 201330169 A TW201330169 A TW 201330169A TW 101136109 A TW101136109 A TW 101136109A TW 101136109 A TW101136109 A TW 101136109A TW 201330169 A TW201330169 A TW 201330169A
Authority
TW
Taiwan
Prior art keywords
chuck
vacuum
rough surface
wafer
component
Prior art date
Application number
TW101136109A
Other languages
English (en)
Chinese (zh)
Inventor
Robert A Ferguson
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of TW201330169A publication Critical patent/TW201330169A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/34—Accessory or component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Laser Beam Processing (AREA)
TW101136109A 2011-09-30 2012-09-28 在真空保持中經控制之表面粗糙度 TW201330169A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/250,871 US8960686B2 (en) 2011-09-30 2011-09-30 Controlled surface roughness in vacuum retention

Publications (1)

Publication Number Publication Date
TW201330169A true TW201330169A (zh) 2013-07-16

Family

ID=47991829

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101136109A TW201330169A (zh) 2011-09-30 2012-09-28 在真空保持中經控制之表面粗糙度

Country Status (6)

Country Link
US (1) US8960686B2 (enExample)
JP (1) JP2014534612A (enExample)
KR (1) KR20140069325A (enExample)
CN (1) CN103843127A (enExample)
TW (1) TW201330169A (enExample)
WO (1) WO2013049476A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
US9502278B2 (en) * 2013-04-22 2016-11-22 International Business Machines Corporation Substrate holder assembly for controlled layer transfer
CN104088875B (zh) * 2014-07-20 2017-08-15 广东格林精密部件股份有限公司 一种气压式防气泡组装夹具
JP6934305B2 (ja) * 2017-02-17 2021-09-15 株式会社ディスコ ウエーハの保持方法
US11036147B2 (en) * 2019-03-20 2021-06-15 Kla Corporation System and method for converting backside surface roughness to frontside overlay
NL2023097B1 (en) 2019-05-09 2020-11-30 Suss Microtec Lithography Gmbh Stamp replication device and method for producing a holding means for a stamp replication device as well as a stamp
US10801969B1 (en) * 2019-09-12 2020-10-13 Lumentum Operations Llc Testing device for bottom-emitting or bottom-detecting optical devices
CN113053774A (zh) * 2019-12-27 2021-06-29 迪科特测试科技(苏州)有限公司 探测装置
US11524392B2 (en) * 2020-11-24 2022-12-13 Applied Materials, Inc. Minimal contact gripping of thin optical devices
US20220415698A1 (en) * 2021-06-24 2022-12-29 Nanosys, Inc. Apparatus and method for transferring light-emitting diodes

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02239621A (ja) 1989-03-13 1990-09-21 Fuji Electric Co Ltd 真空チャツク装置
US5959098A (en) * 1996-04-17 1999-09-28 Affymetrix, Inc. Substrate preparation process
US6399143B1 (en) * 1996-04-09 2002-06-04 Delsys Pharmaceutical Corporation Method for clamping and electrostatically coating a substrate
JP2000164647A (ja) * 1998-11-24 2000-06-16 Matsushita Electric Ind Co Ltd ウエハカセット及び半導体集積回路の検査装置
JP2000286329A (ja) 1999-03-31 2000-10-13 Hoya Corp 基板保持チャックとその製造方法、露光方法、半導体装置の製造方法及び露光装置
JP4090416B2 (ja) * 2003-09-30 2008-05-28 日東電工株式会社 粘着テープ付ワークの離脱方法及び離脱装置
CN100467210C (zh) * 2004-03-25 2009-03-11 揖斐电株式会社 真空卡盘和吸附板
JP4705450B2 (ja) * 2005-03-11 2011-06-22 株式会社ディスコ ウェーハの保持機構
US20070026772A1 (en) * 2005-07-28 2007-02-01 Dolechek Kert L Apparatus for use in processing a semiconductor workpiece
JP2007115961A (ja) * 2005-10-21 2007-05-10 Tecdia Kk 基板保持装置
CN100468619C (zh) * 2006-08-23 2009-03-11 北京北方微电子基地设备工艺研究中心有限责任公司 刻蚀设备的控温装置及其控制晶片温度的方法
EP2094879A1 (en) 2006-11-27 2009-09-02 Momentive Performance Materials Inc. Quartz encapsulated heater assembly
JP5074125B2 (ja) 2007-08-09 2012-11-14 リンテック株式会社 固定治具並びにワークの処理方法
JP2009183997A (ja) * 2008-02-08 2009-08-20 Lintec Corp ワークの支持体および該支持体を用いたワークの加工方法
KR101517020B1 (ko) * 2008-05-15 2015-05-04 삼성디스플레이 주식회사 유기전계발광표시장치의 제조장치 및 제조방법

Also Published As

Publication number Publication date
US20130082448A1 (en) 2013-04-04
WO2013049476A1 (en) 2013-04-04
US8960686B2 (en) 2015-02-24
KR20140069325A (ko) 2014-06-09
JP2014534612A (ja) 2014-12-18
CN103843127A (zh) 2014-06-04

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