CN103843127A - 真空夹持中的受控表面粗糙度 - Google Patents

真空夹持中的受控表面粗糙度 Download PDF

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Publication number
CN103843127A
CN103843127A CN201280047597.4A CN201280047597A CN103843127A CN 103843127 A CN103843127 A CN 103843127A CN 201280047597 A CN201280047597 A CN 201280047597A CN 103843127 A CN103843127 A CN 103843127A
Authority
CN
China
Prior art keywords
chuck
equipment
vacuum
support
chuck support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280047597.4A
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English (en)
Chinese (zh)
Inventor
罗伯特·A·费古森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of CN103843127A publication Critical patent/CN103843127A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/34—Accessory or component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Laser Beam Processing (AREA)
CN201280047597.4A 2011-09-30 2012-09-28 真空夹持中的受控表面粗糙度 Pending CN103843127A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/250,871 US8960686B2 (en) 2011-09-30 2011-09-30 Controlled surface roughness in vacuum retention
US13/250,871 2011-09-30
PCT/US2012/057779 WO2013049476A1 (en) 2011-09-30 2012-09-28 Controlled surface roughness in vacuum retention

Publications (1)

Publication Number Publication Date
CN103843127A true CN103843127A (zh) 2014-06-04

Family

ID=47991829

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280047597.4A Pending CN103843127A (zh) 2011-09-30 2012-09-28 真空夹持中的受控表面粗糙度

Country Status (6)

Country Link
US (1) US8960686B2 (enExample)
JP (1) JP2014534612A (enExample)
KR (1) KR20140069325A (enExample)
CN (1) CN103843127A (enExample)
TW (1) TW201330169A (enExample)
WO (1) WO2013049476A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104088875A (zh) * 2014-07-20 2014-10-08 格林精密部件（惠州）有限公司 一种气压式防气泡组装夹具
CN112484963A (zh) * 2019-09-12 2021-03-12 朗美通经营有限责任公司 用于底部发射或底部检测光学设备的测试设备
CN113053774A (zh) * 2019-12-27 2021-06-29 迪科特测试科技(苏州)有限公司 探测装置
CN113710985A (zh) * 2019-03-20 2021-11-26 科磊股份有限公司 用于转换背侧表面粗糙度为前侧覆盖的系统及方法
US12172344B2 (en) 2019-05-09 2024-12-24 Suss Microtec Lithography Gmbh Stamp replication device and method for producing a holding means for a stamp replication device as well as a stamp

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
US9502278B2 (en) 2013-04-22 2016-11-22 International Business Machines Corporation Substrate holder assembly for controlled layer transfer
JP6934305B2 (ja) * 2017-02-17 2021-09-15 株式会社ディスコ ウエーハの保持方法
US11524392B2 (en) * 2020-11-24 2022-12-13 Applied Materials, Inc. Minimal contact gripping of thin optical devices
WO2022271627A1 (en) * 2021-06-24 2022-12-29 Nanosys, Inc. Apparatus and method for transferring light-emitting diodes

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02239621A (ja) * 1989-03-13 1990-09-21 Fuji Electric Co Ltd 真空チャツク装置
JP2000286329A (ja) * 1999-03-31 2000-10-13 Hoya Corp 基板保持チャックとその製造方法、露光方法、半導体装置の製造方法及び露光装置
CN101131917A (zh) * 2006-08-23 2008-02-27 北京北方微电子基地设备工艺研究中心有限责任公司 刻蚀设备的控温装置及其控制晶片温度的方法
WO2008066804A1 (en) * 2006-11-27 2008-06-05 Momentive Performance Materials Inc. Quartz encapsulated heater assembly

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5959098A (en) * 1996-04-17 1999-09-28 Affymetrix, Inc. Substrate preparation process
US6399143B1 (en) * 1996-04-09 2002-06-04 Delsys Pharmaceutical Corporation Method for clamping and electrostatically coating a substrate
JP2000164647A (ja) * 1998-11-24 2000-06-16 Matsushita Electric Ind Co Ltd ウエハカセット及び半導体集積回路の検査装置
JP4090416B2 (ja) * 2003-09-30 2008-05-28 日東電工株式会社 粘着テープ付ワークの離脱方法及び離脱装置
WO2005092564A1 (ja) * 2004-03-25 2005-10-06 Ibiden Co., Ltd. 真空チャックおよび吸着板
JP4705450B2 (ja) * 2005-03-11 2011-06-22 株式会社ディスコ ウェーハの保持機構
US20070026772A1 (en) * 2005-07-28 2007-02-01 Dolechek Kert L Apparatus for use in processing a semiconductor workpiece
JP2007115961A (ja) * 2005-10-21 2007-05-10 Tecdia Kk 基板保持装置
JP5074125B2 (ja) 2007-08-09 2012-11-14 リンテック株式会社 固定治具並びにワークの処理方法
JP2009183997A (ja) * 2008-02-08 2009-08-20 Lintec Corp ワークの支持体および該支持体を用いたワークの加工方法
KR101517020B1 (ko) * 2008-05-15 2015-05-04 삼성디스플레이 주식회사 유기전계발광표시장치의 제조장치 및 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02239621A (ja) * 1989-03-13 1990-09-21 Fuji Electric Co Ltd 真空チャツク装置
JP2000286329A (ja) * 1999-03-31 2000-10-13 Hoya Corp 基板保持チャックとその製造方法、露光方法、半導体装置の製造方法及び露光装置
CN101131917A (zh) * 2006-08-23 2008-02-27 北京北方微电子基地设备工艺研究中心有限责任公司 刻蚀设备的控温装置及其控制晶片温度的方法
WO2008066804A1 (en) * 2006-11-27 2008-06-05 Momentive Performance Materials Inc. Quartz encapsulated heater assembly

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104088875A (zh) * 2014-07-20 2014-10-08 格林精密部件（惠州）有限公司 一种气压式防气泡组装夹具
CN104088875B (zh) * 2014-07-20 2017-08-15 广东格林精密部件股份有限公司 一种气压式防气泡组装夹具
CN113710985A (zh) * 2019-03-20 2021-11-26 科磊股份有限公司 用于转换背侧表面粗糙度为前侧覆盖的系统及方法
CN113710985B (zh) * 2019-03-20 2022-10-04 科磊股份有限公司 用于转换背侧表面粗糙度为前侧覆盖的系统及方法
US12172344B2 (en) 2019-05-09 2024-12-24 Suss Microtec Lithography Gmbh Stamp replication device and method for producing a holding means for a stamp replication device as well as a stamp
CN112484963A (zh) * 2019-09-12 2021-03-12 朗美通经营有限责任公司 用于底部发射或底部检测光学设备的测试设备
CN112484963B (zh) * 2019-09-12 2023-09-05 朗美通经营有限责任公司 用于底部发射或底部检测光学设备的测试设备
CN113053774A (zh) * 2019-12-27 2021-06-29 迪科特测试科技(苏州)有限公司 探测装置

Also Published As

Publication number Publication date
US20130082448A1 (en) 2013-04-04
WO2013049476A1 (en) 2013-04-04
JP2014534612A (ja) 2014-12-18
TW201330169A (zh) 2013-07-16
US8960686B2 (en) 2015-02-24
KR20140069325A (ko) 2014-06-09

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