TW201319665A - 剝離裝置、及電子裝置之製造方法 - Google Patents

剝離裝置、及電子裝置之製造方法 Download PDF

Info

Publication number
TW201319665A
TW201319665A TW101132411A TW101132411A TW201319665A TW 201319665 A TW201319665 A TW 201319665A TW 101132411 A TW101132411 A TW 101132411A TW 101132411 A TW101132411 A TW 101132411A TW 201319665 A TW201319665 A TW 201319665A
Authority
TW
Taiwan
Prior art keywords
peeling
substrate
interface
plate
movable bodies
Prior art date
Application number
TW101132411A
Other languages
English (en)
Chinese (zh)
Inventor
Kei Takiuchi
Yasunori Ito
Hiroshi Utsugi
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW201319665A publication Critical patent/TW201319665A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
TW101132411A 2011-09-06 2012-09-05 剝離裝置、及電子裝置之製造方法 TW201319665A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011194399A JP2013052998A (ja) 2011-09-06 2011-09-06 剥離装置、及び電子デバイスの製造方法

Publications (1)

Publication Number Publication Date
TW201319665A true TW201319665A (zh) 2013-05-16

Family

ID=47856953

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101132411A TW201319665A (zh) 2011-09-06 2012-09-05 剝離裝置、及電子裝置之製造方法

Country Status (4)

Country Link
JP (1) JP2013052998A (ko)
KR (1) KR20130026997A (ko)
CN (1) CN102983063A (ko)
TW (1) TW201319665A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104217980A (zh) * 2013-05-31 2014-12-17 乐金显示有限公司 衬底移除设备以及使用其制造平板显示装置的方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6104753B2 (ja) * 2013-08-09 2017-03-29 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法
KR102187752B1 (ko) * 2013-05-07 2020-12-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박리 방법 및 박리 장치
KR102082271B1 (ko) * 2013-05-24 2020-04-16 엘지디스플레이 주식회사 캐리어기판 분리 시스템 및 분리 방법
JP6246605B2 (ja) * 2014-01-28 2017-12-13 株式会社Ｓｃｒｅｅｎホールディングス 剥離装置および剥離方法
KR102064405B1 (ko) 2014-02-04 2020-01-10 삼성디스플레이 주식회사 기판 박리 장치 및 그것을 이용한 기판 박리 방법
JP6459145B2 (ja) * 2014-05-22 2019-01-30 Ａｇｃ株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP6547403B2 (ja) * 2014-06-05 2019-07-24 Ａｇｃ株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP6375554B2 (ja) * 2014-11-12 2018-08-22 Ａｇｃ株式会社 基板の剥離装置及び剥離方法
JP6548006B2 (ja) 2015-02-10 2019-07-24 Ａｇｃ株式会社 積層体の剥離装置、及び剥離方法並びに電子デバイスの製造方法
JP6488912B2 (ja) * 2015-06-25 2019-03-27 Ａｇｃ株式会社 吸着層付き基板の梱包方法及び吸着層付き基板の梱包装置
WO2017065155A1 (ja) * 2015-10-16 2017-04-20 旭硝子株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
CN107686007B (zh) * 2017-08-16 2019-08-20 武汉华星光电半导体显示技术有限公司 玻璃基板分离方法及玻璃基板分离装置
US10374161B2 (en) 2017-08-16 2019-08-06 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Glass substrate separation method and glass substrate separation device
CN107946218A (zh) * 2017-11-29 2018-04-20 北京创昱科技有限公司 一种可实现大产能的薄膜分离设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178330A (en) * 1981-04-28 1982-11-02 Toshiba Corp Manufacture of semiconductor device
JPH0986786A (ja) * 1995-09-25 1997-03-31 Toshiba Corp シート材の剥離方法およびその装置
JP5307970B2 (ja) * 2006-01-11 2013-10-02 旭硝子株式会社 大型ガラス基板の剥離方法及びその装置
CN101333079B (zh) * 2008-08-06 2012-10-31 友达光电股份有限公司 贴膜撕离装置及方法
JP5250435B2 (ja) * 2009-01-16 2013-07-31 リンテック株式会社 シート剥離装置および剥離方法
JP5155454B2 (ja) * 2009-08-31 2013-03-06 旭硝子株式会社 剥離装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104217980A (zh) * 2013-05-31 2014-12-17 乐金显示有限公司 衬底移除设备以及使用其制造平板显示装置的方法

Also Published As

Publication number Publication date
KR20130026997A (ko) 2013-03-14
CN102983063A (zh) 2013-03-20
JP2013052998A (ja) 2013-03-21

Similar Documents

Publication Publication Date Title
TW201319665A (zh) 剝離裝置、及電子裝置之製造方法
TW201319664A (zh) 剝離裝置、及電子裝置之製造方法
JP5445663B2 (ja) 電子デバイスの製造方法
TWI602703B (zh) Substrate stripping apparatus and stripping method, and electronic device manufacturing method
TWI417939B (zh) A manufacturing method of an electronic device, and a peeling device for the same
JP5821664B2 (ja) 貼り合わせ装置、及び貼り合わせ方法
TWI695807B (zh) 積層體之剝離裝置及剝離方法與電子裝置之製造方法
JP6354945B2 (ja) 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP6548006B2 (ja) 積層体の剥離装置、及び剥離方法並びに電子デバイスの製造方法
TW201605636A (zh) 積層體之剝離裝置及剝離方法、以及電子裝置之製造方法
TWI601682B (zh) Substrate stripping apparatus and stripping method, and electronic device manufacturing method
JP6547403B2 (ja) 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
TWI692407B (zh) 積層體之剝離裝置及剝離方法、以及電子裝置之製造方法
JP6459145B2 (ja) 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法