TW201313428A - 微細凹凸構造轉印用鑄模 - Google Patents

微細凹凸構造轉印用鑄模 Download PDF

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Publication number
TW201313428A
TW201313428A TW101121831A TW101121831A TW201313428A TW 201313428 A TW201313428 A TW 201313428A TW 101121831 A TW101121831 A TW 101121831A TW 101121831 A TW101121831 A TW 101121831A TW 201313428 A TW201313428 A TW 201313428A
Authority
TW
Taiwan
Prior art keywords
transfer
mold
pattern portion
region
barrier region
Prior art date
Application number
TW101121831A
Other languages
English (en)
Chinese (zh)
Inventor
Jun Koike
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of TW201313428A publication Critical patent/TW201313428A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW101121831A 2011-06-30 2012-06-18 微細凹凸構造轉印用鑄模 TW201313428A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011145795 2011-06-30
JP2011285596 2011-12-27

Publications (1)

Publication Number Publication Date
TW201313428A true TW201313428A (zh) 2013-04-01

Family

ID=47423946

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101121831A TW201313428A (zh) 2011-06-30 2012-06-18 微細凹凸構造轉印用鑄模

Country Status (5)

Country Link
JP (1) JPWO2013002048A1 (ja)
KR (1) KR101556836B1 (ja)
CN (1) CN103650106B (ja)
TW (1) TW201313428A (ja)
WO (1) WO2013002048A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6083135B2 (ja) * 2012-06-08 2017-02-22 大日本印刷株式会社 ナノインプリント用テンプレート及びそれを用いたパターン形成方法
JP5629033B1 (ja) * 2013-01-23 2014-11-19 デクセリアルズ株式会社 親水性積層体、及びその製造方法、防汚用積層体、物品、及びその製造方法、並びに防汚方法
CN109155236A (zh) * 2016-05-18 2019-01-04 综研化学株式会社 光固化性树脂组合物、其树脂层以及压印用模具
JP7000653B2 (ja) * 2016-12-14 2022-01-19 大日本印刷株式会社 加飾フィルム、転写シート、加飾成形品及びその製造方法
JP6805902B2 (ja) * 2017-03-08 2020-12-23 大日本印刷株式会社 加飾成形品及びその製造方法、並びに転写シート
CN113631382A (zh) * 2019-03-29 2021-11-09 大日本印刷株式会社 转印片和装饰成型品的制造方法
KR102631250B1 (ko) * 2019-05-15 2024-01-30 덴카 주식회사 막 담체 및 검사 키트
JP7287833B2 (ja) * 2019-05-22 2023-06-06 デクセリアルズ株式会社 モールド、及び樹脂シート
US11899357B2 (en) 2021-05-17 2024-02-13 Taiwan Semiconductor Manufacturing Co., Ltd. Lithography mask
JP2023088692A (ja) * 2021-12-15 2023-06-27 スタンレー電気株式会社 透光性樹脂部材

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3604985B2 (ja) * 2000-01-18 2004-12-22 株式会社石川製作所 パターン転写装置
JP4756339B2 (ja) * 2005-11-04 2011-08-24 コニカミノルタホールディングス株式会社 微細構造転写方法、微細構造転写装置及び光学素子製造方法
JP5053007B2 (ja) * 2007-09-13 2012-10-17 富士フイルム株式会社 インプリント用モールド構造体、及び該インプリント用モールド構造体を用いたインプリント方法、並びに、磁気記録媒体
US8075299B2 (en) * 2008-10-21 2011-12-13 Molecular Imprints, Inc. Reduction of stress during template separation
JP4792096B2 (ja) * 2009-03-19 2011-10-12 株式会社東芝 テンプレートパターンの設計方法、テンプレートの製造方法及び半導体装置の製造方法。
JP5548680B2 (ja) 2009-03-30 2014-07-16 昭和電工株式会社 シートプレス成形方法および燃料電池用セパレータの製造方法
JP5464980B2 (ja) * 2009-11-18 2014-04-09 旭化成株式会社 感光性樹脂積層体
JP5499668B2 (ja) 2009-12-03 2014-05-21 大日本印刷株式会社 インプリント用モールドおよび該モールドを用いたパターン形成方法
JP2011168812A (ja) * 2010-02-16 2011-09-01 Hitachi Maxell Ltd スタンパの製造方法、レジストマスタ、スタンパおよび成形品

Also Published As

Publication number Publication date
CN103650106A (zh) 2014-03-19
JPWO2013002048A1 (ja) 2015-02-23
KR101556836B1 (ko) 2015-10-01
CN103650106B (zh) 2016-11-09
KR20130133293A (ko) 2013-12-06
WO2013002048A1 (ja) 2013-01-03

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