TW201309111A - Electromagnetic shielding material for FPC - Google Patents
Electromagnetic shielding material for FPC Download PDFInfo
- Publication number
- TW201309111A TW201309111A TW101114506A TW101114506A TW201309111A TW 201309111 A TW201309111 A TW 201309111A TW 101114506 A TW101114506 A TW 101114506A TW 101114506 A TW101114506 A TW 101114506A TW 201309111 A TW201309111 A TW 201309111A
- Authority
- TW
- Taiwan
- Prior art keywords
- electromagnetic wave
- wave shielding
- fpc
- shielding material
- film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
本發明係關係一種FPC用電磁波屏蔽材料，其被覆重複受到彎曲動作的可撓性印刷基板(以下稱為FPC)，用於屏蔽電磁波。 The present invention relates to an electromagnetic wave shielding material for FPC which is coated with a flexible printed circuit board (hereinafter referred to as FPC) which is repeatedly subjected to a bending operation for shielding electromagnetic waves.
在行動電話等行動用電子機器中，為了將框體的外形尺寸縮小以易於攜帶搬運，而使電子零件集成在印刷基板上。此外，為了縮小框體的外形尺寸，藉由將印刷基板分割成複數個，並在所分割的印刷基板間的連接配線上使用具有可撓性的FPC，則可折疊印刷基板，或使其進行滑動。 In an electronic device for operation such as a mobile phone, an electronic component is integrated on a printed circuit board in order to reduce the outer dimensions of the casing to facilitate carrying and carrying. Further, in order to reduce the outer dimensions of the casing, by folding the printed substrate into a plurality of pieces and using a flexible FPC on the connection wiring between the divided printed substrates, the printed substrate can be folded or subjected to slide.
另外，近年來，為了防止受到從外部接收的電磁波雜訊或內部電子零件間彼此接收的電磁波雜訊的影響而導致電子機器進行錯誤動作的情形，故使用電磁波屏蔽材料被覆重要的電子零件或FPC。 In addition, in recent years, in order to prevent an electronic device from malfunctioning due to the influence of electromagnetic wave noise received from the outside or electromagnetic wave noise received between internal electronic components, the electromagnetic wave shielding material is used to cover important electronic parts or FPC. .
習知，作為依此種電磁波屏蔽的目的而使用的電磁波屏蔽材料，係使用在軋延銅箔、軟質鋁箔等金屬箔的表面上設置有黏著劑層者。藉由由此種金屬箔所構成的電磁波屏蔽材料，被覆屏蔽對象物(例如，參照專利文獻1、2)。 Conventionally, as an electromagnetic wave shielding material used for the purpose of such electromagnetic wave shielding, an adhesive layer is provided on the surface of a metal foil such as a rolled copper foil or a soft aluminum foil. The object to be shielded is covered with an electromagnetic wave shielding material made of such a metal foil (see, for example, Patent Documents 1 and 2).
具體而言，為了屏蔽重要的電子零件免於電磁波，利用金屬箔或金屬板作成密閉箱狀予以被覆。另外，為了屏蔽彎曲的FPC的配線免於電磁波，而在金屬箔的單面上設置接著 劑層，藉由該黏著劑層而進行貼合。 Specifically, in order to shield important electronic components from electromagnetic waves, they are covered with a metal foil or a metal plate in a closed box shape. In addition, in order to shield the curved FPC wiring from electromagnetic waves, it is placed on one side of the metal foil. The agent layer is bonded by the adhesive layer.
近年來，作為隨身攜帶的電子機器，行動電話急速普及。行動電話較佳係在不使用而收納在口袋等中時整體尺寸儘量縮小，在使用時則可將整體尺寸增大。故謀求將行動電話小型化‧薄型化、以及改善操作性。作為解決此等課題的方法，已採用將行動電話折疊為二的開閉方式、或滑動開閉方式的框體構造。 In recent years, as an electronic device that is carried around, mobile phones have rapidly spread. It is preferable that the mobile phone is as small as possible when it is stored in a pocket or the like without being used, and the overall size can be increased when it is used. Therefore, it is required to miniaturize the mobile phone, reduce the thickness, and improve the operability. As a method for solving such problems, an opening/closing method in which a mobile phone is folded into two or a frame structure in which a slide opening and closing method is used has been adopted.
另外，不論是將行動電話折疊為二的開閉方式、或滑動開閉方式的任一框體構造，均需要頻繁地進行操作畫面的開閉(啟動、停止的操作)。操作畫面的開閉次數以數十次/天或者數百次/天的頻率進行。 In addition, it is necessary to frequently open and close the operation screen (operation of starting and stopping) regardless of whether the mobile phone is folded into two or the other of the frame structure of the slide opening and closing method. The number of opening and closing of the operation screen is performed at a frequency of several tens of times/day or hundreds of times/day.
如此，使用於行動電話的FPC及被覆FPC以進行電磁波屏蔽的FPC用電磁波屏蔽材料，係與習知行動式電子機器相比以非常多的頻率重複受到彎曲動作。因此，發揮FPC的電磁波屏蔽作用的FPC用電磁波屏蔽材料受到苛刻的重複應力。一旦無法耐受該重複應力，最終構成FPC用電磁波屏蔽材料的基材、以及金屬箔等的屏蔽材料將受到斷裂、剝離等損傷。其結果，有FPC用電磁波屏蔽材料的電磁波屏蔽機能降低或者消失之虞。 As described above, the FPC used for the mobile phone and the electromagnetic wave shielding material for FPC that shields the FPC from electromagnetic wave shielding are repeatedly subjected to the bending operation at a much higher frequency than the conventional mobile electronic device. Therefore, the electromagnetic wave shielding material for FPC which exhibits the electromagnetic wave shielding effect of the FPC is subjected to severe repeated stress. When the repeated stress is not tolerated, the base material constituting the electromagnetic wave shielding material for FPC and the shielding material such as the metal foil are damaged by breakage, peeling, or the like. As a result, the electromagnetic wave shielding function of the electromagnetic wave shielding material for FPC can be reduced or eliminated.
因此，已知有用於應付受到此種重複彎曲動作的電磁波屏蔽材料(例如，參照專利文獻3)。 Therefore, an electromagnetic wave shielding material for coping with such repeated bending operation has been known (for example, refer to Patent Document 3).
專利文獻1：日本專利實開昭56-084221號公報 Patent Document 1: Japanese Patent Publication No. Sho 56-084221
專利文獻2：日本專利特開昭61-222299號公報 Patent Document 2: Japanese Patent Laid-Open No. 61-222299
專利文獻3：日本專利特開平7-122883號公報 Patent Document 3: Japanese Patent Laid-Open No. Hei 7-122883
如上述專利文獻1、2所揭示，在軋延銅箔、軟質鋁箔等金屬箔的表面上設置了黏著劑層的電磁波屏蔽材料中，在彎曲動作的次數少、使用時間較短的情況下，屏蔽性能並無故障。但是，在使用時間長達五年至十年、彎曲動作次數變多的情況，存在有彎曲特性的耐久性不足的問題。此種習知之電磁波屏蔽材料並不具有可使用於最近之行動電話的FPC用電磁波屏蔽材料所需要的、在100萬次以上的彎曲試驗中合格的彎曲特性。 In the electromagnetic wave shielding material in which the adhesive layer is provided on the surface of the metal foil such as rolled copper foil or soft aluminum foil, when the number of bending operations is small and the use time is short, There is no fault in shielding performance. However, when the use time is as long as five to ten years and the number of bending operations is increased, there is a problem that the durability of the bending property is insufficient. Such a conventional electromagnetic wave shielding material does not have a bending property which is acceptable for a bending test of 1 million times or more which is required for an electromagnetic wave shielding material for FPC used in recent mobile phones.
另外，專利文獻3揭示有一種電磁波屏蔽材料，係在柔軟性薄膜的單面上設置金屬蒸鍍等金屬薄膜，在其上積層導電性接著劑。並記載有該電磁波屏蔽材料可被覆於受到重複彎曲的電線類而使用。根據專利文獻3的實施例，在厚度為12μm的聚酯薄膜的單面上設置厚度為0.5μm的含銀粉之導電性塗料的塗佈膜，在其上設置使混合有聚酯系接著劑與鎳粉末的導電性接著劑加熱乾燥且厚度為30μm的導電性接著劑層。另外，其記載有進行50萬次將沿著外徑10mm 的心軸(mandrel)外周以180°的角度彎曲後恢復為直線的動作視為1周期的彎曲試驗，結果並無損傷。 Further, Patent Document 3 discloses an electromagnetic wave shielding material in which a metal thin film such as metal vapor deposition is provided on one surface of a flexible film, and a conductive adhesive is laminated thereon. It is described that the electromagnetic wave shielding material can be applied to electric wires subjected to repeated bending. According to the embodiment of Patent Document 3, a coating film of a silver powder-containing conductive coating having a thickness of 0.5 μm is provided on one surface of a polyester film having a thickness of 12 μm, and a polyester-based adhesive is mixed thereon. The conductive adhesive of the nickel powder was heat-dried and a conductive adhesive layer having a thickness of 30 μm. In addition, it is described that 500,000 times will be 10mm along the outer diameter. The mandrel's outer circumference was bent at an angle of 180° and returned to a straight line as a one-cycle bending test, and the results were not damaged.
然而，在最近的行動電話中，為了將框體的外形尺寸變小，而以0.1mm單位削減框體的厚度，謀求盡可能的薄型。可於此種薄型框體中使用的FPC用電磁波屏蔽材料必須具有優越彎曲性能。例如，要求其即使進行100萬次以上將沿著外徑2mm 的心軸(mandrel)外周以180°的角度彎曲後恢復為直線的動作視為1周期的彎曲試驗亦無損傷。相較於習知，需要一種能夠克服苛刻條件下之彎曲試驗的FPC用電磁波屏蔽材料。 However, in recent mobile phones, in order to reduce the outer dimensions of the casing, the thickness of the casing is reduced by 0.1 mm, and the thickness is as thin as possible. The electromagnetic wave shielding material for FPC which can be used in such a thin frame body must have superior bending properties. For example, it is required to carry 2 million times or more along the outer diameter even if it is performed more than 1 million times. The mandrel's outer circumference is bent at an angle of 180° and then returned to a straight line. It is considered that the one-cycle bending test is not damaged. Compared to the prior art, there is a need for an electromagnetic wave shielding material for FPC that can overcome the bending test under severe conditions.
另外，專利文獻3之實施例所記載的電磁波屏蔽材料，係在厚度為12μm的樹脂薄膜上積層厚度為0.5μm的導電性塗料的塗佈膜、及厚度為30μm的導電性接著劑層。該電磁波屏蔽材料整體的厚度超過40μm。 In addition, the electromagnetic wave shielding material described in the example of the patent document 3 is a coating film of a conductive coating material having a thickness of 0.5 μm and a conductive adhesive layer having a thickness of 30 μm on a resin film having a thickness of 12 μm. The thickness of the electromagnetic wave shielding material as a whole exceeds 40 μm.
如上所述，為了將行動電話的框體的外形尺寸盡可能地減薄，所以要求FPC用電磁波屏蔽材料的整體厚度減薄至30μm以下。亦即，相較於習知之FPC用電磁波屏蔽材料，要求整體的厚度更薄、且可耐受更嚴厲之彎曲試驗的結實的FPC用電磁波屏蔽材料。 As described above, in order to reduce the outer dimensions of the casing of the mobile phone as much as possible, the overall thickness of the electromagnetic wave shielding material for FPC is required to be reduced to 30 μm or less. That is, compared with the conventional electromagnetic wave shielding material for FPC, a solid FPC electromagnetic wave shielding material which is thinner in overall thickness and can withstand a more severe bending test is required.
另外，為了使黏著劑層具有導電性，使用於FPC用電磁波屏蔽材料的導電性黏著劑必須相當多量地添加導電性粉末(金屬微粒子或碳微粒子)。但是，若使導電性粉末的添加量變多，則黏著劑層的黏著力降低。 In addition, in order to make the adhesive layer conductive, it is necessary to add a conductive powder (metal fine particles or carbon fine particles) to the conductive adhesive used for the electromagnetic wave shielding material for FPC. However, when the amount of the conductive powder added is increased, the adhesive strength of the adhesive layer is lowered.
另外，在行動電話的FPC用電磁波屏蔽材料等中，因為 重複彎曲操作，所以基材與導電性膏層、以及導電性膏層和FPC之間的各層的接著介面將部分地於層間發生剝離。而有在該剝離處導電性膏層發生斷裂，電磁波屏蔽性能經時性降低之虞。 In addition, in the FPC electromagnetic wave shielding material of mobile phones, etc., because Since the bending operation is repeated, the subsequent interface between the substrate and the conductive paste layer, and the layers between the conductive paste layer and the FPC will partially peel off between the layers. On the other hand, in the peeling, the conductive paste layer is broken, and the electromagnetic wave shielding performance is lowered with time.
另外，為了使FPC用電磁波屏蔽材料的基材亦可耐受電子機器之壽命期間的重複彎曲操作(例如100萬次的彎曲試驗)，亦需要優越的彎曲特性。 Further, in order to make the substrate of the electromagnetic wave shielding material for FPC to withstand the repeated bending operation during the life of the electronic device (for example, a bending test of 1 million times), excellent bending characteristics are also required.
本發明目的在於提供一種富有柔軟性並呈薄型，且即使重複進行苛刻的彎曲動作，電磁波屏蔽性能亦不致降低的彎曲特性優越的FPC用電磁波屏蔽材料。 An object of the present invention is to provide an electromagnetic wave shielding material for FPC which is excellent in flexibility and which is thin and has a bending property which is excellent in electromagnetic wave shielding performance even if a severe bending operation is repeated.
為了耐受苛刻的彎曲動作、藉由高溫加熱所進行的導電性膏的燒成，本發明中使用由耐熱性樹脂之薄膜所構成的基材。本發明中，藉由在由所塗佈之電介質的薄樹脂薄膜所構成的基材上，依序積層接著劑層、導電性膏層的薄膜層，而達到提高基材與導電性膏層間的密著力。因此，本發明的技術思想在於，在確保FPC用電磁波屏蔽性能的同時，亦提高彎曲性能。 In order to withstand the severe bending operation and the baking of the conductive paste by high-temperature heating, a substrate composed of a film of a heat-resistant resin is used in the present invention. In the present invention, by sequentially laminating the film layer of the adhesive layer and the conductive paste layer on the substrate composed of the thin resin film of the applied dielectric, the improvement between the substrate and the conductive paste layer is achieved. Confidence. Therefore, the technical idea of the present invention is to improve the bending performance while ensuring the electromagnetic wave shielding performance of the FPC.
另外，本發明中，由耐熱性樹脂之薄膜所構成的基材係考慮到柔軟性和耐熱性，而使用所塗佈之電介質的薄樹脂薄膜。如此，能夠將除去了支撐體薄膜6及剝離薄膜7的FPC用電磁波屏蔽材料的整體厚度減薄至25μm以下。 Further, in the present invention, the base material composed of the film of the heat resistant resin is a thin resin film using the applied dielectric in consideration of flexibility and heat resistance. In this manner, the entire thickness of the electromagnetic wave shielding material for FPC from which the support film 6 and the release film 7 are removed can be reduced to 25 μm or less.
另外，本發明中，為了增加屬於基材的由使用溶劑可溶性聚醯亞胺形成的聚醯亞胺薄膜所構成的薄樹脂薄膜、與導電性膏間的密著力，而在基材與導電性膏層之間設置接著劑層。 Further, in the present invention, in order to increase the adhesion between the thin resin film composed of the polyimide film formed of the solvent-soluble polyimine and the conductive paste, the base material and the conductivity are added. An adhesive layer is disposed between the paste layers.
因此，為了解決上述問題，本發明提供一種FPC用電磁波屏蔽材料，其係在支撐體薄膜的單面上依序積層由所塗佈之電介質的薄樹脂薄膜所構成的基材、薄膜的接著劑層、導電性膏層。 Therefore, in order to solve the above problems, the present invention provides an electromagnetic wave shielding material for FPC which is a substrate, a film adhesive, which is formed by laminating a thin resin film of a dielectric to be applied on one surface of a support film. Layer, conductive paste layer.
另外，上述基材係由使用溶劑可溶性聚醯亞胺而形成的聚醯亞胺薄膜所構成，厚度較佳為1~9μm。 Further, the substrate is composed of a polyimide film formed using a solvent-soluble polyimide, and has a thickness of preferably 1 to 9 μm.
另外，上述薄膜的接著劑層係使具有環氧基的聚酯系樹脂組成物交聯而成，厚度較佳為0.05~1μm。 Further, the adhesive layer of the film is obtained by crosslinking a polyester resin composition having an epoxy group, and the thickness is preferably 0.05 to 1 μm.
另外，上述接著劑層較佳係進一步含有光吸收材料，上述光吸收材料係由選自由碳黑、石墨、苯胺黑、菁黑、鈦黑、黑色氧化鐵、氧化鉻、氧化錳所構成群之一種以上的黑色顏料或有色顏料的一種以上所構成。 Further, the adhesive layer preferably further contains a light absorbing material selected from the group consisting of carbon black, graphite, nigrosine, cyanine black, titanium black, black iron oxide, chromium oxide, and manganese oxide. One or more of a black pigment or a colored pigment.
另外，構成上述導電性膏層的導電性膏較佳係含有選自由導電性金屬微粒子、碳奈米管、碳奈米纖維所構成之導電性填充材群中之一者以上、與黏結劑樹脂組成物。 Further, the conductive paste constituting the conductive paste layer preferably contains one or more of a conductive filler group selected from the group consisting of conductive metal fine particles, carbon nanotubes, and carbon nanofibers, and a binder resin. Composition.
另外，上述導電性膏層係藉由將含有平均粒子徑1~100nm的銀奈米粒子和黏結劑樹脂組成物的導電性膏以溫度150~250℃進行燒成，厚度較佳為0.1~2μm。 Further, the conductive paste layer is fired at a temperature of 150 to 250 ° C by a conductive paste containing silver nanoparticle having an average particle diameter of 1 to 100 nm and a binder resin composition, and the thickness is preferably 0.1 to 2 μm. .
另外，構成上述導電性膏層的導電性膏乾燥後的體積電阻率較佳為1.5×10-5Ω．cm以下。 Further, the volume resistivity of the conductive paste constituting the conductive paste layer after drying is preferably 1.5 × 10 -5 Ω. Below cm.
另外，較佳係在上述導電性膏層上進一步積層導電性接著劑層。 Further, it is preferable that a conductive adhesive layer is further laminated on the conductive paste layer.
另外，較佳係在上述導電性接著劑層上進一步貼合經剝離處理的剝離薄膜。 Further, it is preferable that the release-treated release film is further bonded to the conductive adhesive layer.
另外，本發明提供一種行動電話，係將上述FPC用電磁波屏蔽材料使用作為電磁波屏蔽用的構件。 Further, the present invention provides a mobile phone using the electromagnetic wave shielding material for FPC described above as a member for electromagnetic wave shielding.
另外，本發明提供一種電子機器，係將上述FPC用電磁波屏蔽材料使用作為電磁波屏蔽用的構件。 Moreover, the present invention provides an electronic device in which the electromagnetic wave shielding material for FPC described above is used as a member for electromagnetic wave shielding.
上述本發明的FPC用電磁波屏蔽材料係使用由使用具有高溫耐熱性之溶劑可溶性聚醯亞胺而形成的聚醯亞胺薄膜所構成的薄樹脂薄膜(厚度為1~9μm)。本發明的FPC用電磁波屏蔽材料係藉由進行導電性膏的燒成，而可提高導電性，同時可獲得能耐受苛刻彎曲動作的優越彎曲特性。 In the electromagnetic wave shielding material for FPC of the present invention, a thin resin film (thickness: 1 to 9 μm) composed of a polyimide film formed using a solvent-soluble polyimine having high-temperature heat resistance is used. In the electromagnetic wave shielding material for FPC of the present invention, by performing baking of a conductive paste, conductivity can be improved, and excellent bending characteristics capable of withstanding a severe bending action can be obtained.
另外，藉由使用由使用溶劑可溶性聚醯亞胺而形成的聚醯亞胺薄膜所構成的薄樹脂薄膜(厚度為1~9μm)與導電性膏層，則可抑制厚度，且得到電磁波屏蔽性能。 Further, by using a thin resin film (thickness of 1 to 9 μm) composed of a polyimide film formed using a solvent-soluble polyimide, and a conductive paste layer, thickness can be suppressed, and electromagnetic wave shielding performance can be obtained. .
藉此，可將除去了支撐體薄膜6及剝離薄膜7的FPC用電磁波屏蔽材料的整體厚度抑制在25μm以下，可將行動電話及電子機器的整體厚度減薄。 Thereby, the overall thickness of the electromagnetic wave shielding material for FPC from which the support film 6 and the release film 7 are removed can be suppressed to 25 μm or less, and the overall thickness of the mobile phone and the electronic device can be reduced.
藉由在接著劑層內混合由一種以上的黑色顏料或有色顏料所構成的光吸收材料，則可使電磁波屏蔽薄膜的單面側著色成特定色。 By mixing a light absorbing material composed of one or more kinds of black pigments or colored pigments in the adhesive layer, the one-side side of the electromagnetic wave shielding film can be colored into a specific color.
如上述，根據本發明，可提供富有柔軟性、薄型、且即使重複進行苛刻的彎曲動作電磁波屏蔽性能亦不致降低的彎曲特性優越的FPC用電磁波屏蔽材料。 As described above, according to the present invention, it is possible to provide an electromagnetic wave shielding material for FPC which is excellent in flexibility and which is flexible and thin, and which does not have a reduced electromagnetic wave shielding performance even if it is subjected to a severe bending operation.
以下，針對本發明之較佳實施形態進行說明。 Hereinafter, preferred embodiments of the present invention will be described.
本發明之FPC用電磁波屏蔽材料係在貼合在屬於被黏接體的FPC等時，外表面為電介質，不需在該FPC用電磁波屏蔽材料外表面上貼合絕緣薄膜。另外，本發明之FPC用電磁波屏蔽材料係整體厚度減薄，提高對彎曲動作的彎曲性能。 When the electromagnetic wave shielding material for FPC of the present invention is bonded to an FPC or the like which is a bonded body, the outer surface is a dielectric, and it is not necessary to bond an insulating film to the outer surface of the electromagnetic wave shielding material for FPC. Further, the electromagnetic wave shielding material for FPC of the present invention has a reduced overall thickness and improves the bending performance against the bending operation.
如圖1所示，本發明之FPC用電磁波屏蔽材料5中，基材1為具有可撓性的薄樹脂薄膜，該薄樹脂薄膜係由厚度為1~9μm之使用溶劑可溶性聚醯亞胺而形成的聚醯亞胺薄膜所構成。在基材1的一面上積層支撐體薄膜6，在基材1的另一面依序積層使導電性膏層3與基材1之間的密著力提高的接著劑層2、含有導電性微粒子的導電性膏層3。如圖2所示，另一例之本發明之FPC用電磁波屏蔽材料10，係進一步在導電性膏層3上依序積層導電性接著劑層4、剝離薄膜7。該FPC用電磁波屏蔽材料10係如圖3所示，可作為 除去了2片剝離薄膜6、7的FPC用電磁波屏蔽材料11而使用。 As shown in Fig. 1, in the electromagnetic wave shielding material 5 for FPC of the present invention, the substrate 1 is a flexible thin resin film which is made of a solvent-soluble polyimine having a thickness of 1 to 9 μm. The formed polyimine film is composed of a film. The support film 6 is laminated on one surface of the substrate 1, and the adhesive layer 2 for improving the adhesion between the conductive paste layer 3 and the substrate 1 is sequentially laminated on the other surface of the substrate 1, and the conductive fine particles are contained. Conductive paste layer 3. As shown in FIG. 2, in another example, the electromagnetic wave shielding material 10 for FPC of the present invention is further provided with a conductive adhesive layer 4 and a release film 7 in this order on the conductive paste layer 3. The FPC electromagnetic wave shielding material 10 is as shown in FIG. 3 and can be used as The FPC electromagnetic wave shielding material 11 of the two release films 6 and 7 was removed and used.
本發明之FPC用電磁波屏蔽材料5、10、11中，成為基材1的由使用溶劑可溶性聚醯亞胺而形成的聚醯亞胺薄膜所構成的薄樹脂薄膜，係具有屬於聚醯亞胺樹脂特徵的高機械強度、耐熱性、絕緣性、耐溶劑性，至260℃左右仍呈化學穩定。 In the electromagnetic wave shielding materials 5, 10, and 11 for FPC of the present invention, a thin resin film composed of a polyimide film formed of a solvent-soluble polyimide, which is a substrate 1, has a polyimine. The high mechanical strength, heat resistance, insulation and solvent resistance of the resin are chemically stable up to around 260 °C.
作為聚醯亞胺，有如藉由加熱聚醯胺酸而進行的脫水縮合反應所生成的熱硬化型聚醯亞胺，與可溶於非脫水縮合型之溶劑的溶劑可溶性聚醯胺酸。 As the polyimine, there is a thermosetting polyimine produced by a dehydration condensation reaction by heating poly-proline, and a solvent-soluble polyamine which is soluble in a solvent of a non-dehydration condensation type.
一般已知的聚醯亞胺薄膜的製造方法，有如於極性溶劑中使二胺與羧酸二酐反應，藉此合成屬於醯亞胺前驅物之聚醯胺酸後，對聚醯胺酸藉由熱或使用觸媒而進行脫水環化，以得到對應之聚醯亞胺的方法。然而，該醯亞胺化步驟中之加熱處理溫度較佳為200℃~300℃的溫度範圍。在加熱溫度低於該溫度的情況，有醯亞胺化不進行的可能性，故不佳，在加熱溫度較上述溫度高的情況，有發生化合物之熱分解之虞，亦不佳。 A generally known method for producing a polyimide film, such as reacting a diamine with a carboxylic acid dianhydride in a polar solvent, thereby synthesizing a polyamido acid belonging to a precursor of a quinone imine Dehydration cyclization by heat or using a catalyst to obtain a corresponding polyimine. However, the heat treatment temperature in the ruthenium imidization step is preferably in the range of from 200 ° C to 300 ° C. When the heating temperature is lower than the temperature, there is a possibility that the imidization does not proceed, which is not preferable. When the heating temperature is higher than the above temperature, thermal decomposition of the compound may occur, which is not preferable.
為了更加提高基材的可撓性，本發明之FPC用電磁波屏蔽材料係使用厚度未滿10μm的極薄之聚醯亞胺薄膜。 In order to further improve the flexibility of the substrate, the electromagnetic wave shielding material for FPC of the present invention uses an extremely thin polyimide film having a thickness of less than 10 μm.
因此，在使用作為強度上之增強材料的支撐體薄膜6的單 面上，積層形成較薄的聚醯亞胺薄膜。然而，聚醯亞胺薄膜本身雖對於加熱溫度200℃~250℃之加熱處理具有耐熱性，但支撐體薄膜6由於需兼顧價格和耐熱溫度性能，而使用通用的耐熱性樹脂薄膜、例如聚對苯二甲酸乙二酯(PET)樹脂薄膜，因此無法採用習知之從屬於醯亞胺前驅物的聚醯胺酸形成聚醯亞胺的方法。 Therefore, a single sheet of the support film 6 as a reinforcing material for strength is used. On the surface, a thin layer of polyimide film is formed. However, although the polyimide film itself has heat resistance for heat treatment at a heating temperature of 200 ° C to 250 ° C, the support film 6 requires a combination of a general heat resistant resin film, for example, a pair, because of the consideration of price and heat resistance temperature performance. A film of ethylene phthalate (PET) resin, therefore, a method of forming a polyimine from a polyamic acid belonging to a quinone imine precursor cannot be used.
溶劑可溶性聚醯亞胺係聚醯亞胺的醯亞胺化完全，且可溶於溶劑。因此，塗佈經溶解於溶劑的塗佈液後，藉由在未滿200℃的低溫下使溶劑揮發，則可進行成膜。本發明的FPC用電磁波屏蔽材料中所使用的基材1，係在支撐體薄膜6的單面上塗佈屬於非脫水縮合型的溶劑可溶性聚醯亞胺的塗佈液後，以溫度未滿200℃的加熱溫度使其乾燥，而使用溶劑可溶性聚醯亞胺所形成的聚醯亞胺薄膜的薄樹脂薄膜。藉此，可於由通用的耐熱性樹脂薄膜形成的支撐體薄膜6的單面上，積層厚度為1~9μm的極薄的聚醯亞胺薄膜。可一邊將支撐體薄膜6沿其長度方向搬送，一邊在該支撐體薄膜6上連續地形成基材1、接著劑層2、導電性膏層3等。可藉由輥對輥(roll to roll)的生產方法生產本發明的FPC用電磁波屏蔽材料。 The solvent-soluble polyimine-based polyimine is completely imidized and soluble in a solvent. Therefore, after coating the coating liquid dissolved in the solvent, the solvent can be volatilized at a low temperature of less than 200 ° C to form a film. The substrate 1 used in the electromagnetic wave shielding material for FPC of the present invention is coated with a coating liquid of a solvent-soluble polyimine which is not a dehydrated condensation type on one surface of the support film 6, and the temperature is not satisfied. The film was dried at a heating temperature of 200 ° C, and a thin resin film of a polyimide film formed of a solvent-soluble polyimine was used. Thereby, an extremely thin polyimide film having a thickness of 1 to 9 μm can be laminated on one surface of the support film 6 formed of a general heat resistant resin film. The substrate 1, the adhesive layer 2, the conductive paste layer 3, and the like can be continuously formed on the support film 6 while the support film 6 is conveyed along the longitudinal direction thereof. The electromagnetic wave shielding material for FPC of the present invention can be produced by a roll to roll production method.
本發明中使用的非脫水縮合型的溶劑可溶性聚醯亞胺並無特別限定，可使用市售之溶劑可溶性聚醯亞胺的塗佈液。市售之溶劑可溶性聚醯亞胺的塗佈液，具體可舉例如Solpit 6,6-PI(Solpit工業)、Q-IP-0895D(PI技研)、PIQ(日立化成工業)、SPI-200N(新日鐵化學)、RIKACOAT SN-20、RIKACOAT PN-20(新日本理化)等。將溶劑可溶性聚醯亞胺的塗佈液塗佈於支撐體薄膜上的方法並無特別限定，例如，可藉由模塗機、刮刀式塗佈機、唇式塗佈機等的塗佈機進行塗佈。 The non-dehydrated condensed solvent-soluble polyimine used in the present invention is not particularly limited, and a commercially available solvent-soluble polyimine coating liquid can be used. A commercially available solvent-soluble polyimine coating liquid, specifically, for example, Solpit 6,6-PI (Solpit Industry), Q-IP-0895D (PI Technology), PIQ (Hitachi Chemical Industry), SPI-200N (Nippon Steel Chemical), RIKACOAT SN-20, RIKACOAT PN-20 (New Japan Physical and Chemical) )Wait. The method of applying the solvent-soluble polyimine coating liquid onto the support film is not particularly limited, and for example, a coating machine such as a die coater, a knife coater, or a lip coater can be used. Coating is carried out.
本發明中使用的聚醯亞胺薄膜的厚度較佳為1~9μm。若將聚醯亞胺薄膜的厚度製成未滿0.8μm，則由於所製成之膜的機械性強度較弱，故於技術上困難。另外，若聚醯亞胺薄膜的厚度超過10μm，則無法得到具有優越彎曲性能的FPC用電磁波屏蔽材料5、11。 The thickness of the polyimide film used in the present invention is preferably from 1 to 9 μm. When the thickness of the polyimide film is less than 0.8 μm, the mechanical strength of the film produced is weak, which is technically difficult. Further, when the thickness of the polyimide film exceeds 10 μm, the electromagnetic wave shielding materials 5 and 11 for FPC having excellent bending properties cannot be obtained.
本發明中使用的支撐體薄膜6的基材，可舉例如聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯等的聚酯薄膜、聚丙烯或聚乙烯等的聚烯烴薄膜。 The base material of the support film 6 used in the present invention may, for example, be a polyester film such as polyethylene terephthalate, polybutylene terephthalate or polyethylene naphthalate, or polypropylene. A polyolefin film such as polyethylene.
在支撐體薄膜6的基材為例如聚對苯二甲酸乙二酯等，基材具有某程度的剝離性時，可不於支撐體薄膜6上施行剝離處理，而直接地積層由所塗佈之電介質的薄樹脂薄膜所形成的基材。另外，亦可在支撐體薄膜6上施行易於剝離的剝離處理。 When the base material of the support film 6 is, for example, polyethylene terephthalate or the like, and the substrate has a certain degree of releasability, the release film may be directly deposited without being subjected to a release treatment. A substrate formed of a thin resin film of a dielectric. Further, a peeling treatment which is easy to peel off may be applied to the support film 6.
另外，使用作為上述支撐體薄膜6的基材薄膜，係在不具有剝離性時，塗佈氨基醇酸樹脂或聚矽氧樹脂等的剝離劑後，藉由加熱乾燥而施行剝離處理。由於本發明的FPC用 電磁波屏蔽材料10、11被貼合於FPC，所以最好該剝離劑中不使用聚矽氧樹脂。其原因在於，若將聚矽氧樹脂使用作為剝離劑，則有聚矽氧樹脂的一部分移動至接觸支撐體薄膜6表面之基材1的表面，進一步通過FPC用電磁波屏蔽材料11的內部，從基材1移行至電性接著劑層4的疑慮。並有移行至該導電性接著劑層4表面上的聚矽氧樹脂減弱導電性接著劑層4之接著力之虞。本發明之支撐體薄膜6的厚度，因為在貼附於FPC進行使用時由FPC用電磁波屏蔽材料11的整體的厚度中去除，所以無特別限定，通常為12~150μm左右的厚度。 In addition, when the base film of the support film 6 is used, when a release agent such as an amino alkyd resin or a polyoxymethylene resin is applied, the release agent is applied by heating and drying. Due to the FPC of the present invention Since the electromagnetic wave shielding materials 10 and 11 are bonded to the FPC, it is preferable that the polysilicon resin is not used in the release agent. The reason for this is that when a polyfluorene oxide resin is used as a release agent, a part of the polyoxynoxy resin is moved to the surface of the substrate 1 contacting the surface of the support film 6, and further passes through the inside of the electromagnetic wave shielding material 11 for FPC. The substrate 1 migrates to the electrical adhesive layer 4 for doubt. Further, the polyoxyn resin which migrates to the surface of the conductive adhesive layer 4 weakens the adhesion of the conductive adhesive layer 4. The thickness of the support film 6 of the present invention is not particularly limited as long as it is removed by the thickness of the entire electromagnetic wave shielding material 11 for FPC when it is attached to the FPC, and is usually about 12 to 150 μm.
本發明之FPC用電磁波屏蔽材料5、10、11中所使用的接著劑層2，係為了提高屬於基材1之由使用溶劑可溶性聚醯亞胺而形成的聚醯亞胺薄膜所構成的薄膜與導電性膏層3間的密著力而設置者。 The adhesive layer 2 used in the electromagnetic wave shielding materials 5, 10, and 11 for FPC of the present invention is a film composed of a polyimide film formed of a solvent-soluble polyimide. It is provided with a close contact force with the conductive paste layer 3.
接著劑層2係由於設置於其上之導電性膏層3的燒成溫度為150~250℃，所以需要使用耐熱性優越的接著劑。另外，接著劑層2必須具有對於屬於基材1的使用溶劑可溶性聚醯亞胺而形成的聚醯亞胺薄膜、與導電性膏層3之優越接著力。 In the subsequent layer 2, since the baking temperature of the conductive paste layer 3 provided thereon is 150 to 250 ° C, it is necessary to use an adhesive having excellent heat resistance. Further, the adhesive layer 2 must have a superior adhesion to the conductive paste layer 3 for the polyimide film formed of the solvent-soluble polyimide.
作為用於接著劑層2的接著性樹脂組成物，較佳係使用聚酯樹脂、聚胺基甲酸酯樹脂、(甲基)丙烯酸樹脂、聚乙烯樹 脂、聚苯乙烯樹脂、聚醯胺樹脂等熱可塑性樹脂。另外亦可為環氧樹脂、胺基樹脂、聚醯亞胺樹脂、(甲基)丙烯酸樹脂等之熱硬化型樹脂。 As the adhesive resin composition for the adhesive layer 2, a polyester resin, a polyurethane resin, a (meth)acrylic resin, a polyethylene tree is preferably used. A thermoplastic resin such as a fat, a polystyrene resin or a polyamide resin. Further, it may be a thermosetting resin such as an epoxy resin, an amine resin, a polyimide resin, or a (meth)acrylic resin.
作為接著劑層2的接著性樹脂組成物，特佳為使具有環氧基的聚酯系樹脂組成物交聯的接著性樹脂組成物，或將環氧樹脂作為硬化劑而混合於聚胺基甲酸酯系樹脂中的接著性樹脂組成物。因此，接著劑層2係較塗佈溶劑可溶性聚醯亞胺而積層的、由聚醯亞胺的薄膜所構成之基材1具有更堅硬的物性。具有環氧基的聚酯系樹脂組成物並無特別限定，例如可藉由於1分子中具有2個以上環氧基的環氧樹脂(其之未硬化樹脂)與於1分子中具有2個以上羧基的多元羧酸的反應等而獲得。具有環氧基的聚酯系樹脂組成物的交聯，可使用與環氧基進行反應的環氧樹脂用之交聯劑進行。 The adhesive resin composition of the adhesive layer 2 is particularly preferably an adhesive resin composition obtained by crosslinking a polyester resin composition having an epoxy group, or an epoxy resin as a curing agent and mixed with a polyamine group. An adhesive resin composition in a formate resin. Therefore, the adhesive layer 2 is a harder physical property than the substrate 1 composed of a film of polyimine which is laminated with a solvent-soluble polyimide. The polyester-based resin composition having an epoxy group is not particularly limited, and may be, for example, an epoxy resin having two or more epoxy groups in one molecule (the uncured resin thereof) and two or more molecules per molecule. It is obtained by a reaction of a polyvalent carboxylic acid of a carboxyl group or the like. The crosslinking of the epoxy resin composition having an epoxy group can be carried out by using a crosslinking agent for an epoxy resin which reacts with an epoxy group.
另外，接著劑層2可包含光吸收材料，該光吸收材料係由選自由碳黑、石墨、苯胺黑、菁黑、鈦黑、黑色氧化鐵、氧化鉻、氧化錳所構成群的一種以上的黑色顏料或著色顏料所構成。 Further, the adhesive layer 2 may include a light absorbing material which is one or more selected from the group consisting of carbon black, graphite, nigrosine, cyanine black, titanium black, black iron oxide, chromium oxide, and manganese oxide. It is composed of black pigment or colored pigment.
接著劑層2中較佳係混入碳黑等之黑色顏料。由黑色顏料或著色顏料構成的光吸收材料較佳係在接著劑層2中以0.1~30重量%含有。黑色顏料或著色顏料較佳係根據SEM觀察的一次粒子的平均粒徑為0.02~0.1μm左右。 In the subsequent layer 2, a black pigment such as carbon black is preferably mixed. The light absorbing material composed of a black pigment or a coloring pigment is preferably contained in the adhesive layer 2 at 0.1 to 30% by weight. The black pigment or the coloring pigment is preferably an average particle diameter of primary particles observed by SEM of about 0.02 to 0.1 μm.
另外，作為黑色顏料，有將二氧化矽粒子等浸漬在黑色色 材中而僅使表層部成為黑色者，或從黑色的著色樹脂所形成、整體成為黑色者。另外，黑色顏料係除了全黑者以外，亦包含灰色、近黑的茶色、或近黑的綠色等之呈近似黑色之顏色的粒子，只要為不易反射光的暗色即可使用。 Further, as a black pigment, cerium oxide particles or the like are immersed in black color. Among the materials, only the surface layer portion is black, or it is formed of a black colored resin, and the whole is black. In addition, the black pigment may contain particles of a gray color, a near-black color, or a near-black color, which are in a black color, in addition to all black, and may be used as long as it is a dark color that does not easily reflect light.
接著劑層2的厚度較佳為0.05~1μm左右，若是該程度的膜厚度，則可得到導電性膏層3的充分密著力。在接著劑層2的厚度為0.05μm以下的情況，存在有光吸收材料的微粒子露出、基材1與導電性膏層3的密著力降低之虞，另外，即使接著劑層2的厚度超過了1μm，對於由使用溶劑可溶性聚醯亞胺而形成的聚醯亞胺薄膜所構成的基材1或導電性膏層3的接著力的增加並無效果。因此，若接著劑層2的厚度超過1μm，則製造成本增加而不佳。 The thickness of the subsequent agent layer 2 is preferably about 0.05 to 1 μm, and if it is such a film thickness, sufficient adhesion of the conductive paste layer 3 can be obtained. When the thickness of the adhesive layer 2 is 0.05 μm or less, the fine particles of the light absorbing material are exposed, and the adhesion between the substrate 1 and the conductive paste layer 3 is lowered, and the thickness of the adhesive layer 2 is exceeded. 1 μm has no effect on the increase in the adhesion of the substrate 1 or the conductive paste layer 3 composed of the polyimide film formed using the solvent-soluble polyimide. Therefore, if the thickness of the adhesive layer 2 exceeds 1 μm, the manufacturing cost is not improved.
用於本發明的導電性膏層3係使用將導電性填充材(filler)混入至成為黏結劑(binder)的樹脂組成物中的導電性膏。 The conductive paste layer 3 used in the present invention is a conductive paste in which a conductive filler is mixed into a resin composition to be a binder.
作為導電性膏，較佳係含有選自由導電性金屬微粒子、碳奈米管、碳奈米纖維所構成的導電性填充材群中的一者以上、與黏結劑樹脂組成物。作為導電性金屬微粒子，可使用銅、銀、鎳、鋁等的金屬微粉末，較佳係使用導電性能高、價格便宜的銅或銀的微粉末或奈米粒子。另外，亦可使用屬於具有導電性之碳奈米粒子的碳奈米管、碳奈米纖維。 The conductive paste preferably contains one or more of a conductive filler group selected from the group consisting of conductive metal fine particles, carbon nanotubes, and carbon nanofibers, and a binder resin composition. As the conductive metal fine particles, metal fine powders of copper, silver, nickel, aluminum, or the like can be used, and it is preferable to use fine powder or nano particles of copper or silver which have high conductivity and are inexpensive. Further, a carbon nanotube or a carbon nanofiber belonging to the conductive carbon nanoparticle may be used.
為了將導電性膏的燒成溫度抑制在150~250℃之溫度範 圍的低溫，金屬微粒子的平均粒子徑較佳為1~100nm的範圍，更佳為1~60nm的範圍。 In order to suppress the firing temperature of the conductive paste at a temperature of 150 to 250 ° C The average particle diameter of the metal fine particles is preferably in the range of 1 to 100 nm, more preferably in the range of 1 to 60 nm.
最好導電性膏層3乾燥後的體積電阻率為1.5×10-5Ω．cm以下。 Preferably, the conductive paste layer 3 has a volume resistivity after drying of 1.5 × 10 -5 Ω. Below cm.
本發明之FPC用電磁波屏蔽材料5、10、11的導電性膏層3，係藉由含有此種金屬微粒子，不僅可對應薄膜化，而且微粒子之間發生融黏，可同時實現導電率的提高。本發明使用的導電性膏係為了例如使平均粒子徑為1~100nm之範圍的金屬微粒子均勻地分散在分散溶劑中，較佳係藉由有機分子層被覆該金屬微粒子表面，使其在溶劑中的分散性能提高。最終，在導電性膏的加熱燒成步驟中，使金屬微粒子彼此表面接觸，而可得到導電性膏層3的導電性。導電性膏的加熱燒成，係為了例如藉由在150~250℃左右的溫度下進行加熱，使被覆金屬微粒子表面的有機分子層脫離、蒸散除去，故較佳係使燒成溫度在有機分子層的沸點範圍內。 In the conductive paste layer 3 of the electromagnetic wave shielding materials 5, 10, and 11 for FPC of the present invention, by containing such metal fine particles, not only the film formation but also the fusion between the fine particles can be achieved, and the conductivity can be improved at the same time. . The conductive paste used in the present invention is preferably such that the metal fine particles having an average particle diameter of from 1 to 100 nm are uniformly dispersed in a dispersion solvent, and the surface of the metal fine particles is preferably coated with an organic molecular layer in a solvent. The dispersion performance is improved. Finally, in the heating and baking step of the conductive paste, the metal fine particles are brought into surface contact with each other, whereby the conductivity of the conductive paste layer 3 can be obtained. The heating and baking of the conductive paste is performed by, for example, heating at a temperature of about 150 to 250 ° C to remove the organic molecular layer on the surface of the coated metal fine particles, and to evaporate and remove them. Therefore, it is preferable to set the firing temperature to the organic molecules. Within the boiling point range of the layer.
在導電性膏中，作為與導電性填充材混合使用的黏結劑樹脂組成物，較佳係使用聚酯樹脂、(甲基)丙烯酸樹脂、聚乙烯樹脂、聚苯乙烯樹脂、聚醯胺樹脂等之熱可塑性樹脂。另外，亦可使用環氧樹脂、胺基樹脂、聚醯亞胺樹脂、(甲基)丙烯酸樹脂等熱硬化性樹脂。 In the conductive paste, as the binder resin composition to be used in combination with the conductive filler, a polyester resin, a (meth)acrylic resin, a polyethylene resin, a polystyrene resin, a polyamide resin, or the like is preferably used. Thermoplastic resin. Further, a thermosetting resin such as an epoxy resin, an amine resin, a polyimide resin, or a (meth)acrylic resin can also be used.
導電性膏係在此等黏結劑樹脂組成物中混入導電性金屬微粒子、碳奈米管、碳奈米纖維等的導電性填充材後，視需 要加入乙醇或乙醚等之有機溶劑，進行黏度的調整。另外，導電性膏黏度的調整係藉由有機溶劑的添加量(配合比)的增減進行。 The conductive paste is mixed with a conductive filler such as conductive metal fine particles, carbon nanotubes or carbon nanofibers in the composition of the binder resin. To add an organic solvent such as ethanol or diethyl ether, adjust the viscosity. Further, the adjustment of the viscosity of the conductive paste is carried out by increasing or decreasing the amount (mixing ratio) of the organic solvent.
導電性膏層3經燒成後的厚度較佳為0.1~2μm左右，更佳為0.3~1μm左右的厚度。若導電性膏層3燒成後的厚度比0.1μm薄，則難以獲得高電磁波屏蔽性能。另一方面，若導電性膏層3燒成後的厚度比2μm厚，則無法將除去了支撐體薄膜6及剝離薄膜7的FPC用電磁波屏蔽材料11的整體厚度控制在25μm以下。 The thickness of the conductive paste layer 3 after firing is preferably about 0.1 to 2 μm, more preferably about 0.3 to 1 μm. When the thickness of the conductive paste layer 3 after firing is thinner than 0.1 μm, it is difficult to obtain high electromagnetic wave shielding performance. On the other hand, when the thickness of the conductive paste layer 3 after firing is thicker than 2 μm, the thickness of the FPC electromagnetic wave shielding material 11 from which the support film 6 and the release film 7 are removed cannot be controlled to 25 μm or less.
在本發明之FPC用電磁波屏蔽材料10、11中，積層於導電性膏層3上的導電性接著劑，係使用在丙烯酸系接著劑、聚胺基甲酸酯系接著劑、環氧系接著劑、橡膠系接著劑、聚矽氧系接著劑等一般使用的熱硬化型接著劑中混入了導電性之微粒子或四級銨鹽等之離子化合物、導電性高分子等者，並無特別限定。 In the electromagnetic wave shielding materials 10 and 11 for FPC of the present invention, the conductive adhesive laminated on the conductive paste layer 3 is used in an acrylic adhesive, a polyurethane adhesive, or an epoxy adhesive. In the thermosetting type adhesive which is generally used, such as a conductive agent, a rubber-based adhesive, and a polysulfide-based adhesive, an ionic compound such as a conductive fine particle or a quaternary ammonium salt, a conductive polymer, or the like is mixed, and is not particularly limited. .
導電性接著劑係不使用在常溫下顯示感壓接著性的黏著劑。本發明的導電性接著劑係藉由加熱加壓而得的接著劑，較佳係相對於重複的彎曲、其接著力不易降低的接著劑。 The conductive adhesive does not use an adhesive which exhibits pressure-sensitive adhesive properties at normal temperature. The conductive adhesive agent of the present invention is an adhesive obtained by heating and pressurizing, and is preferably an adhesive which is hard to be reduced with respect to repeated bending and its adhesion.
調配至導電性接著劑層4的導電性的微粒子並無特別限定，可應用習知者。可舉例如由碳黑或銀、鎳、銅、鋁等的金屬所構成的金屬微粒子、以及在此等金屬微粒子的表面被 覆了其他金屬的複合金屬微粒子。可適宜選擇使用此等導電性微粒子的一種或兩種以上。 The conductive fine particles to be placed on the conductive adhesive layer 4 are not particularly limited, and those skilled in the art can be applied. For example, metal fine particles composed of carbon black or a metal such as silver, nickel, copper, or aluminum, and the surface of the metal fine particles are Composite metal particles coated with other metals. One or two or more kinds of such conductive fine particles can be appropriately selected and used.
另外，在上述導電性接著劑層4中，若為了得到優越的導電性，故為了使導電性的微粒子彼此之接觸、以及該粒子與導電性膏層及屬於被黏接體的FPC之間的接觸更良好，而含有多量的導電性物質，則接著力降低。另一方面，若為了提高接著力而減低導電性微粒子的含有量，則出現導電性微粒子與導電性膏層以及屬於被黏接體的FPC之間的接觸變得不充分、導電性降低的矛盾問題。因此，導電性微粒子的調配量係相對於接著劑(固形份)100重量部，通常為0.5~50重量部左右，更佳為2~10重量部。 Further, in the conductive adhesive layer 4, in order to obtain superior conductivity, in order to bring the conductive fine particles into contact with each other, and between the particles and the conductive paste layer and the FPC belonging to the bonded body, The contact is better, and when a large amount of conductive material is contained, the force is lowered. On the other hand, when the content of the conductive fine particles is reduced in order to increase the adhesion, the contact between the conductive fine particles and the conductive paste layer and the FPC belonging to the bonded body is insufficient, and the conductivity is lowered. problem. Therefore, the amount of the conductive fine particles is usually from 0.5 to 50 parts by weight, more preferably from 2 to 10 parts by weight, per 100 parts by weight of the adhesive (solid portion).
另外，作為構成本發明之導電性接著劑層4的導電性接著劑，較佳係含有導電性微粒子的各向異性導電性接著劑，可使用公知的物質。作為該各向異性導電性接著劑，可使用例如以環氧樹脂等的絕緣性熱硬化性樹脂為主成分、分散了導電性微粒子的接著劑。 In addition, as the conductive adhesive constituting the conductive adhesive layer 4 of the present invention, an anisotropic conductive adhesive containing conductive fine particles is preferable, and a known one can be used. As the anisotropic conductive adhesive, for example, an adhesive which contains an insulating thermosetting resin such as an epoxy resin as a main component and in which conductive fine particles are dispersed can be used.
另外，作為使用於各向異性導電性接著劑的導電性微粒子，例如可以組合金、銀、鋅、錫、焊錫等的金屬微粒子的單體或2種以上。另外，作為導電性微粒子，可使用經金屬鍍覆的樹脂粒子。導電性微粒子的形狀較佳係具有微細粒子連接成直鏈狀的形狀，或者針形狀。若為此種形狀，則在藉由壓黏構件對FPC進行加熱加壓處理時，可依較低加壓力 使導電性微粒子嵌入至FPC的導體配線。 In addition, as the conductive fine particles to be used for the anisotropic conductive adhesive, for example, a single or two or more kinds of metal fine particles of gold, silver, zinc, tin, or solder may be combined. Further, as the conductive fine particles, metal-plated resin particles can be used. The shape of the conductive fine particles is preferably a shape in which fine particles are connected in a straight chain shape or a needle shape. If it is such a shape, the FPC can be heated and pressurized by the pressure-bonding member, and the pressing force can be lower. The conductive fine particles are embedded in the conductor wiring of the FPC.
各向異性導電性接著劑與FPC的連接電阻值較佳為5Ω/cm以下。 The connection resistance value of the anisotropic conductive adhesive to the FPC is preferably 5 Ω/cm or less.
導電性接著劑的接著力並無特別限制，其測定方法以JIS Z 0237中記載的試驗方法為根據。對於被黏接體表面的接著力係在剝離角度180度剝離、剝離速度300mm/分的條件下，較佳為5~30N/吋的範圍。在接著力未滿5N/吋時，例如，貼合於FPC的電磁波屏蔽材料將從FPC剝離，產生浮起部。 The adhesion of the conductive adhesive is not particularly limited, and the measurement method is based on the test method described in JIS Z 0237. The adhesion force to the surface of the adherend is preferably in the range of 5 to 30 N/吋 under the conditions of a peeling angle of 180 degrees and a peeling speed of 300 mm/min. When the subsequent force is less than 5 N/吋, for example, the electromagnetic wave shielding material bonded to the FPC is peeled off from the FPC to generate a floating portion.
對FPC進行加熱加壓接著的條件並無特別限定，較佳例如溫度為160℃、加壓力為2.54MPa、熱壓30分鐘。 The conditions for heating and pressurizing the FPC are not particularly limited, and for example, the temperature is 160 ° C, the pressing force is 2.54 MPa, and the hot pressing is 30 minutes.
作為剝離薄膜7的基材，可舉例如聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯等之聚酯薄膜、聚丙烯或聚乙烯等的聚烯烴薄膜。在將氨基醇酸樹脂或聚矽氧樹脂等的剝離劑塗佈於此等基材薄膜後，藉由加熱乾燥實施剝離處理。本發明的FPC用電磁波屏蔽材料10、11，由於貼合於FPC，所以在該剝離劑中較佳係不使用聚矽氧樹脂。其原因在於，若使用聚矽氧樹脂作為剝離劑，則有聚矽氧樹脂之一部分移行至接觸剝離薄膜7表面的導電性接著劑層4的表面上，進一步通過FPC用電磁波屏蔽材料11的內部，從導電性接著劑層4移行至基材1的疑慮。另外，有移行至該導電性接著劑層4表面上的聚矽氧樹脂減弱導電性接著 劑層4之接著力的可能性。使用於本發明的剝離薄膜7的厚度由於係在貼附於FPC進行使用時由FPC用電磁波屏蔽材料11的整體厚度中除去，所以無特別限定，通常為12~150μm左右的厚度。 The base material of the release film 7 may, for example, be a polyester film such as polyethylene terephthalate, polybutylene terephthalate or polyethylene naphthalate, or a polypropylene or polyethylene. Olefin film. After a release agent such as an amino alkyd resin or a polyoxyxylene resin is applied to the base film such as this, a release treatment is performed by heating and drying. Since the electromagnetic wave shielding materials 10 and 11 for FPC of the present invention are bonded to the FPC, it is preferable that the polysilicon resin is not used in the release agent. The reason for this is that if a polyoxyxylene resin is used as the release agent, one of the polyoxynoxy resins partially migrates to the surface of the conductive adhesive layer 4 contacting the surface of the release film 7, and further passes through the inside of the electromagnetic wave shielding material 11 for FPC. The problem of migration from the conductive adhesive layer 4 to the substrate 1 is considered. In addition, the polyfluorene oxide which has migrated to the surface of the conductive adhesive layer 4 weakens the conductivity. The possibility of the adhesion of the agent layer 4. The thickness of the release film 7 to be used in the present invention is not particularly limited as long as it is removed from the entire thickness of the electromagnetic wave shielding material 11 for FPC when it is attached to the FPC, and is usually about 12 to 150 μm.
本發明的FPC用電磁波屏蔽材料5、10、11可貼合於重複受到彎曲動作的FPC而使用，適合作為彎曲性能優越的FPC用電磁波屏蔽材料而使用。另外，本發明的FPC用電磁波屏蔽材料可作為電磁波屏蔽用構件而使用於行動電話或電子機器。 The electromagnetic wave shielding materials 5, 10, and 11 for FPC of the present invention can be used by being bonded to an FPC repeatedly subjected to a bending operation, and are suitably used as an electromagnetic wave shielding material for FPC having excellent bending properties. Further, the electromagnetic wave shielding material for FPC of the present invention can be used as a member for electromagnetic wave shielding in a mobile phone or an electronic device.
以下，根據實施例具體說明本發明。 Hereinafter, the present invention will be specifically described based on examples.
將厚度為50μm的聚對苯二甲酸乙二酯(PET)薄膜(東洋紡股份有限公司製、商品號：E5100)作為支撐體薄膜6使用。在該支撐體薄膜6的單面上將溶劑可溶性聚醯亞胺的塗佈液以乾燥後的厚度成為4μm的方式進行流延塗佈，使其乾燥，積層由電介質的薄樹脂薄膜所構成的基材1。在形成的基材1上，使用將作為光吸收材料之黑色顏料的碳黑與耐熱溫度為260~280℃的聚酯系樹脂組成物混合、用於形成接著劑層2的塗料，以使乾燥後的厚度為0.3μm的方式塗佈，積層接著劑層2。在接著劑層2上，使用將一次平均粒子徑約為50nm的銀粒子混合調製成的導電性膏作為導電性 填充材，在以乾燥後的厚度成為0.3μm的方式塗佈後，用溫度150℃燒成而形成導電性膏層3，得到實施例1的FPC用電磁波屏蔽材料。測定乾燥的導電性膏層3的體積電阻率的值為1.5×10-5Ω．cm以下。 A polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd., product number: E5100) having a thickness of 50 μm was used as the support film 6. The coating liquid of the solvent-soluble polyimine on one surface of the support film 6 was cast-coated and dried to have a thickness of 4 μm after drying, and was laminated with a thin resin film of a dielectric. Substrate 1. On the formed substrate 1, a carbon black which is a black pigment of a light absorbing material is mixed with a polyester resin composition having a heat resistance temperature of 260 to 280 ° C, and a coating material for forming the adhesive layer 2 is used for drying. After the thickness was 0.3 μm, the adhesive layer 2 was laminated. On the adhesive layer 2, a conductive paste obtained by mixing silver particles having a primary average particle diameter of about 50 nm was used as a conductive filler, and the thickness after drying was 0.3 μm, and the temperature was 150. The conductive paste layer 3 was formed by firing at ° C to obtain an electromagnetic wave shielding material for FPC of Example 1. The volume resistivity of the dried conductive paste layer 3 was measured to be 1.5 × 10 -5 Ω. Below cm.
將厚度為50μm的聚對苯二甲酸乙二酯(PET)薄膜(東洋紡股份有限公司製、商品號：E5100)作為支撐體薄膜6使用。在該支撐體薄膜6的單面上將溶劑可溶性聚醯亞胺的塗佈液以乾燥後的厚度成為8μm的方式進行流延塗佈，使其乾燥，積層由電介質的薄樹脂薄膜所構成的基材1。在形成的基材1上，使用將作為光吸收材料之黑色顏料的碳黑與耐熱溫度為260~280℃的聚酯系樹脂組成物混合、用於形成接著劑層2的塗料，以使乾燥後的厚度為0.3μm的方式塗佈，積層接著劑層2。在接著劑層2上，使用將一次平均粒子徑約為50nm的銀粒子混合調製成的導電性膏作為導電性填充材，在以乾燥後的厚度成為0.3μm的方式塗佈後，用溫度150℃燒成而形成導電性膏層3，得到實施例2的FPC用電磁波屏蔽材料。測定乾燥的導電性膏層3的體積電阻率的值為1.5×10-5Ω．cm以下。 A polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd., product number: E5100) having a thickness of 50 μm was used as the support film 6. The solvent-soluble polyimine coating liquid was cast-coated on one surface of the support film 6 so as to have a thickness of 8 μm after drying, and dried to form a thin resin film made of a dielectric. Substrate 1. On the formed substrate 1, a carbon black which is a black pigment of a light absorbing material is mixed with a polyester resin composition having a heat resistance temperature of 260 to 280 ° C, and a coating material for forming the adhesive layer 2 is used for drying. After the thickness was 0.3 μm, the adhesive layer 2 was laminated. On the adhesive layer 2, a conductive paste obtained by mixing silver particles having a primary average particle diameter of about 50 nm was used as a conductive filler, and the thickness after drying was 0.3 μm, and the temperature was 150. The conductive paste layer 3 was formed by firing at ° C to obtain an electromagnetic wave shielding material for FPC of Example 2. The volume resistivity of the dried conductive paste layer 3 was measured to be 1.5 × 10 -5 Ω. Below cm.
除了未使用支撐體薄膜6，並且使用由厚度為10μm的熱硬化型聚醯亞胺所構成的聚醯亞胺薄膜作為基材1以外，其 餘與實施例1同樣進行，得到比較例1的FPC用電磁波屏蔽材料。 Except that the support film 6 was not used, and a polyimide film composed of a thermosetting polyimine having a thickness of 10 μm was used as the substrate 1, In the same manner as in Example 1, the electromagnetic shielding material for FPC of Comparative Example 1 was obtained.
依照JIS-K-7194「導電性塑膠之4探針法的電阻率試驗方法」的規定，藉三菱化學(股)製之電阻率計(Loresta GP T600型)測定導電性膏層3的表面電阻率。 The surface resistance of the conductive paste layer 3 was measured by a Mitsui Chemicals Co., Ltd. resistivity meter (Loresta GP T600 type) in accordance with JIS-K-7194 "Resistance Test Method for Conductive Plastics 4 Probe Method". rate.
將於導電性膏層3上使用熱硬化性接著劑(Three Bond製，商品號：33A-798)，依乾燥後厚度成為12μm的方式進行調整、塗佈而成者，於設有測試圖案之可撓性印刷基板上，與FPC用電磁波屏蔽材料之導電性接著劑層4側相對向重疊，以160℃、2.54MPa熱壓30分鐘後，裁斷為12.7mm×160mm的尺寸，得到試驗片。 A thermosetting adhesive (manufactured by Three Bond, product number: 33A-798) is used for the conductive paste layer 3, and the thickness is 12 μm after drying, and the test pattern is provided. The flexible printed circuit board was placed on the side of the conductive adhesive layer 4 of the electromagnetic wave shielding material for FPC, and was hot-pressed at 160 ° C and 2.54 MPa for 30 minutes, and then cut into a size of 12.7 mm × 160 mm to obtain a test piece.
依照IPC規格TM-650「TEST METHODS MANUAL」(JIS-C-6471的參考3「耐彎曲性」)，使用裁斷的試驗片在R=1.5mm的設定條件下進行IPC彎曲試驗，計測導電性膏層的電阻值因導電層的重複彎曲動作而與初期時之電阻值相比增加至2倍時的彎曲試驗的次數，評價彎曲性能。 According to the IPC specification TM-650 "TEST METHODS MANUAL" (JIS-C-6471, reference 3 "Bending resistance"), the IPC bending test was performed using the cut test piece under the setting condition of R = 1.5 mm, and the conductive paste was measured. The bending resistance was evaluated by the number of times of the bending test when the resistance value of the layer was increased by two times compared with the resistance value at the initial stage due to the repeated bending operation of the conductive layer.
彎曲試驗結果的判定，係根據彎曲試驗，將導電性膏層的電阻值因導電層的重複彎曲動作而與初期時的電阻值相比增加至2倍時的彎曲試驗的次數超過30萬次的情況視為合格(○)、30萬次以下的情況視為不合格(×)。 The determination of the bending test result is based on the bending test, and the resistance value of the conductive paste layer is increased by two times compared with the resistance value at the initial stage due to the repeated bending operation of the conductive layer, and the number of bending tests exceeds 300,000 times. If the situation is deemed to be qualified (○) or less than 300,000 times, it is considered as unsatisfactory (×).
將於導電性膏層3上使用熱硬化性接著劑(Three Bond製，商品號：33A-798)，依乾燥後厚度成為12μm的方式進行調整、塗佈而成者，於設有測試圖案之可撓性印刷基板上，與FPC用電磁波屏蔽材料之導電性接著劑層4側相對向重疊，以160℃、2.54MPa熱壓30分鐘後，裁斷為12.7mm×160mm的尺寸，得到試驗片。 A thermosetting adhesive (manufactured by Three Bond, product number: 33A-798) is used for the conductive paste layer 3, and the thickness is 12 μm after drying, and the test pattern is provided. The flexible printed circuit board was placed on the side of the conductive adhesive layer 4 of the electromagnetic wave shielding material for FPC, and was hot-pressed at 160 ° C and 2.54 MPa for 30 minutes, and then cut into a size of 12.7 mm × 160 mm to obtain a test piece.
依照IPC規格TM-650「TEST METHODS MANUAL」(JIS-C-6471的參考3「耐彎曲性」)，使用裁斷的試驗片在R=1.0mm的設定條件下進行IPC彎曲試驗，計測導電性膏層的電阻值因導電層的重複彎曲動作而與初期時之電阻值相比增加至2倍時的彎曲試驗的次數，評價彎曲性能。 According to the IPC specification TM-650 "TEST METHODS MANUAL" (JIS-C-6471, reference 3 "Bending resistance"), the IPC bending test was performed using the cut test piece under the setting condition of R = 1.0 mm, and the conductive paste was measured. The bending resistance was evaluated by the number of times of the bending test when the resistance value of the layer was increased by two times compared with the resistance value at the initial stage due to the repeated bending operation of the conductive layer.
彎曲試驗結果的判定，係根據彎曲試驗，將導電性膏層的電阻值因導電層的重複彎曲動作而與初期時的電阻值相比增加至2倍時的彎曲試驗的次數超過30萬次的情況視為合格(○)、30萬次以下的情況視為不合格(×)。 The determination of the bending test result is based on the bending test, and the resistance value of the conductive paste layer is increased by two times compared with the resistance value at the initial stage due to the repeated bending operation of the conductive layer, and the number of bending tests exceeds 300,000 times. If the situation is deemed to be qualified (○) or less than 300,000 times, it is considered as unsatisfactory (×).
使用彎曲試驗中使用的樣本(寬17mm×長160mm)，將樣本安裝於東洋精機製作所(股)製之環剛度試驗機並開始測定，將樣本彎曲為環狀，藉由朝該環之直徑方向進行壓扁時之負載，評價韌性強弱。具體而言，依將使用彎曲試驗中所使用之樣本彎曲成環狀的外側成為電磁波屏蔽材料的方 式，製作外周80mm的輪，由輪上側依3.3mm/sec的速度施加力直到樣本之短軸距離成為1.5mm，測定於此狀態保持5秒時之樣本的應力。 Using the sample used in the bending test (width 17 mm × length 160 mm), the sample was attached to a ring stiffness tester manufactured by Toyo Seiki Seisakusho Co., Ltd. and the measurement was started, and the sample was bent into a ring shape by the diameter direction of the ring. The load at the time of flattening was evaluated to evaluate the toughness. Specifically, the electromagnetic wave shielding material is formed by bending the outer side of the sample used in the bending test into a ring shape. In the formula, a wheel having an outer circumference of 80 mm was produced, and a force was applied from the upper side of the wheel at a speed of 3.3 mm/sec until the short-axis distance of the sample became 1.5 mm, and the stress of the sample held in this state for 5 seconds was measured.
針對實施例1~2、以及比較例1，按照上述的試驗方法進行導電性膏層的表面電阻率、彎曲試驗、以及柔軟性試驗，於表1表示所得之試驗結果。 With respect to Examples 1 to 2 and Comparative Example 1, the surface resistivity, the bending test, and the flexibility test of the conductive paste layer were carried out in accordance with the above test methods, and the test results obtained are shown in Table 1.
根據表1所示的彎曲試驗的結果可知，屬於基材1的聚醯亞胺薄膜的厚度對FPC用電磁波屏蔽材料之柔軟性試驗的結果有較大影響。 From the results of the bending test shown in Table 1, it is understood that the thickness of the polyimide film belonging to the substrate 1 has a large influence on the result of the flexibility test of the electromagnetic wave shielding material for FPC.
在使用溶劑可溶性聚醯亞胺而形成的聚醯亞胺薄膜的厚度為4μm的薄膜時，由於FPC用電磁波屏蔽材料富有柔軟性，因而即使彎曲半徑小至R=1.0mm，亦可得到優越的彎曲性能。另外，在使用溶劑可溶性聚醯亞胺而形成的聚醯亞胺薄膜的厚度為8μm時，若彎曲半徑為R=1.5mm，則彎曲性能較佳，但若彎曲半徑小至R=1.0mm，則彎曲性能不良。 When a polyimide film having a thickness of 4 μm formed using a solvent-soluble polyimine is rich in flexibility, the electromagnetic shielding material for FPC is rich in flexibility, so that even if the bending radius is as small as R = 1.0 mm, it is excellent. Bending performance. Further, when the thickness of the polyimide film formed using the solvent-soluble polyimine is 8 μm, if the bending radius is R = 1.5 mm, the bending property is better, but if the bending radius is as small as R = 1.0 mm, The bending performance is poor.
由此等試驗結果可知，具有優越彎曲性能的FPC用電磁波屏蔽材料，必須將由使用溶劑可溶性聚醯亞胺而形成的聚 醯亞胺薄膜所構成的基材的厚度形成為1~9μm的薄膜。但是，目前日本國內銷售的由熱固性聚醯亞胺所構成的聚醯亞胺薄膜的厚度，7.5μm為最薄規格產品的厚度。在本發明的FPC用電磁波屏蔽材料中，基材中需要使用較該厚度更薄的聚醯亞胺薄膜。因此，僅藉由在基材中使用藉由較薄地流延塗佈溶劑可溶性聚醯亞胺的塗佈液而得到的厚度為1~9μm的聚醯亞胺薄膜，即可獲得具有優越彎曲性能的FPC用電磁波屏蔽材料。 From these test results, it is known that the electromagnetic wave shielding material for FPC having superior bending properties must be formed by using solvent-soluble polyimine. The thickness of the base material composed of the quinone imine film is formed into a film of 1 to 9 μm. However, the thickness of the polyimide film composed of thermosetting polyimine currently sold in Japan is 7.5 μm, which is the thickness of the thinnest product. In the electromagnetic wave shielding material for FPC of the present invention, it is necessary to use a polyimide film which is thinner than the thickness in the substrate. Therefore, superior flexural properties can be obtained by using only a polyimide film having a thickness of 1 to 9 μm obtained by coating a coating solution of a solvent-soluble polyimine by thin casting in a substrate. The FPC uses electromagnetic wave shielding materials.
本發明的FPC用電磁波屏蔽材料可作為電磁波屏蔽構件而使用於行動電話、筆記型電腦、行動終端等各種電子機器。 The electromagnetic wave shielding material for FPC of the present invention can be used as an electromagnetic wave shielding member for various electronic devices such as mobile phones, notebook computers, and mobile terminals.
1‧‧‧基材 1‧‧‧Substrate
2‧‧‧接著劑層 2‧‧‧ adhesive layer
3‧‧‧導電性膏層 3‧‧‧ Conductive paste layer
4‧‧‧導電性接著劑層 4‧‧‧ Conductive adhesive layer
5、10、11‧‧‧FPC用電磁波屏蔽材料 5, 10, 11‧‧‧FPC electromagnetic shielding materials
6‧‧‧支撐體薄膜 6‧‧‧Support film
7‧‧‧剝離薄膜 7‧‧‧Release film
圖1為表示本發明之FPC用電磁波屏蔽材料之一例的概略剖面圖。 Fig. 1 is a schematic cross-sectional view showing an example of an electromagnetic wave shielding material for FPC of the present invention.
圖2為表示本發明之FPC用電磁波屏蔽材料之另一例的概略剖面圖。 Fig. 2 is a schematic cross-sectional view showing another example of the electromagnetic wave shielding material for FPC of the present invention.
圖3為表示由圖2之FPC用電磁波屏蔽材料除去了支撐體薄膜及剝離薄膜而使用之狀態的概略剖面圖。 3 is a schematic cross-sectional view showing a state in which the support film and the release film are removed by the electromagnetic wave shielding material for FPC of FIG. 2 .
1‧‧‧基材 1‧‧‧Substrate
2‧‧‧接著劑層 2‧‧‧ adhesive layer
3‧‧‧導電性膏層 3‧‧‧ Conductive paste layer
5‧‧‧FPC用電磁波屏蔽材料 5‧‧‧FPC electromagnetic shielding materials
6‧‧‧支撐體薄膜 6‧‧‧Support film
Claims (10)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011098430A JP5707216B2 (en) | 2011-04-26 | 2011-04-26 | Electromagnetic wave shielding material for FPC |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201309111A true TW201309111A (en) | 2013-02-16 |
| TWI468084B TWI468084B (en) | 2015-01-01 |
Family
ID=47056364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101114506A TWI468084B (en) | 2011-04-26 | 2012-04-24 | Electromagnetic wave shielding material for FPC |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5707216B2 (en) |
| KR (2) | KR101407684B1 (en) |
| CN (2) | CN102762083A (en) |
| TW (1) | TWI468084B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI508855B (en) * | 2013-03-13 | 2015-11-21 | Dainippon Ink & Chemicals | A layered product, a conductive pattern, and a laminate method |
| CN109306487A (en) * | 2017-07-28 | 2019-02-05 | 苏州思锐达新材料有限公司 | Electromagnetic shielding material and the preparation method and application thereof based on Kapton |
| TWI800485B (en) * | 2016-07-11 | 2023-05-01 | 日商藤森工業股份有限公司 | Electromagnetic wave shielding material |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6081819B2 (en) * | 2013-02-28 | 2017-02-15 | 藤森工業株式会社 | Electromagnetic wave shielding material for FPC |
| JP6139284B2 (en) * | 2013-06-11 | 2017-05-31 | 住友電工プリントサーキット株式会社 | Shield film and printed wiring board |
| KR101498140B1 (en) * | 2013-07-31 | 2015-03-04 | (주)창성 | Manufacturing method of cover layer for FPC and Manufacturing method of FPC and cover layer for FPC and FPC using the methods |
| JP2015065343A (en) * | 2013-09-25 | 2015-04-09 | タツタ電線株式会社 | Shield housing body, printed circuit board, electronic apparatus and method for manufacturing shield housing body |
| JP2015065342A (en) * | 2013-09-25 | 2015-04-09 | タツタ電線株式会社 | Shield housing body, printed circuit board and electronic apparatus |
| JP2015159214A (en) * | 2014-02-25 | 2015-09-03 | 住友ベークライト株式会社 | Electromagnetic wave shield film, and flexible printed board |
| KR20170084672A (en) * | 2016-01-12 | 2017-07-20 | 후지모리 고교 가부시키가이샤 | Coverlay film |
| JP6883400B2 (en) * | 2016-10-04 | 2021-06-09 | 藤森工業株式会社 | Coverlay film |
| JP6932498B2 (en) * | 2016-12-08 | 2021-09-08 | デュポン帝人アドバンスドペーパー株式会社 | Electromagnetic wave suppression sheet |
| CN106531344A (en) * | 2016-12-26 | 2017-03-22 | 南昌联能科技有限公司 | Electromagnetic shielding film for cable, manufacturing method for electromagnetic shielding film and manufacturing method for wire rod |
| JP7012446B2 (en) * | 2017-03-17 | 2022-01-28 | 藤森工業株式会社 | Coverlay film and its manufacturing method |
| CN107953648A (en) * | 2017-12-27 | 2018-04-24 | 太仓金煜电子材料有限公司 | A kind of mute black laminated film of flame retardant grade and its production method |
| CN108718518B (en) * | 2018-05-21 | 2020-02-07 | 深圳昌茂粘胶新材料有限公司 | Electromagnetic wave shielding film material and preparation method thereof |
| TWI699279B (en) | 2018-10-22 | 2020-07-21 | 長興材料工業股份有限公司 | Electromagnetic-wave shielding film, preparation method, and use thereof |
| KR20220025706A (en) * | 2019-06-27 | 2022-03-03 | 닛토덴코 가부시키가이샤 | transparent conductive film |
| KR20220131972A (en) * | 2020-04-01 | 2022-09-29 | 호쿠에츠 코포레이션 가부시키가이샤 | Electromagnetic wave shielding sheet manufacturing method and electromagnetic wave shielding sheet |
| JP7001187B1 (en) * | 2021-03-19 | 2022-01-19 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shield sheet and its manufacturing method, shielded wiring board, and electronic equipment |
| WO2023075652A1 (en) * | 2021-10-28 | 2023-05-04 | Telefonaktiebolaget Lm Ericsson (Publ) | A method of producing a printed circuit board, and a printed circuit board |
| KR102558248B1 (en) * | 2021-12-15 | 2023-07-26 | 한국지질자원연구원 | Electromagnetic interference shielding materials and manufacturing method thereof |
| CN115884506B (en) * | 2023-01-03 | 2023-06-09 | 苏州艾乐格电子科技有限公司 | Flexible thin film circuit and preparation method thereof |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4303462A (en) | 1979-11-09 | 1981-12-01 | Beloit Corporation | Roll wrapper header apparatus |
| JPS61222299A (en) | 1985-03-28 | 1986-10-02 | 日本光フアイバ株式会社 | Tape or sheet for shielding electromagnetic wave |
| JPH07122883A (en) * | 1993-10-21 | 1995-05-12 | Nitto Denko Corp | Electromagnetic-wave shielding material |
| JP4737656B2 (en) * | 2002-06-24 | 2011-08-03 | 大日本印刷株式会社 | Conductive decorative sheet |
| JP4174248B2 (en) | 2002-07-01 | 2008-10-29 | 群栄化学工業株式会社 | Polyimide resin, resin composition containing the same, coating material for electronic component, and adhesive for electronic component |
| JP2004364267A (en) * | 2003-05-09 | 2004-12-24 | Matsushita Electric Ind Co Ltd | Image pickup device |
| JP2005056906A (en) * | 2003-08-05 | 2005-03-03 | Reiko Co Ltd | Electromagnetic wave shielding transfer film |
| JP4363340B2 (en) | 2004-03-12 | 2009-11-11 | 住友電気工業株式会社 | Conductive silver paste and electromagnetic wave shielding member using the same |
| WO2005101941A1 (en) * | 2004-03-30 | 2005-10-27 | Geltec Co., Ltd. | Electromagnetic wave absorber |
| TWI360386B (en) * | 2005-02-18 | 2012-03-11 | Toyo Ink Mfg Co | Electro-magnetic wave shielding adhesive sheet, pr |
| JP4319167B2 (en) * | 2005-05-13 | 2009-08-26 | タツタ システム・エレクトロニクス株式会社 | Shield film, shield printed wiring board, shield flexible printed wiring board, shield film manufacturing method, and shield printed wiring board manufacturing method |
| KR20070019591A (en) * | 2005-08-11 | 2007-02-15 | 닛토덴코 가부시키가이샤 | Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board |
| JP2007045974A (en) * | 2005-08-11 | 2007-02-22 | Nitto Denko Corp | Heat curing-type pressure-sensitive adhesive composition, heat curing-type pressure-sensitive adhesive tape or sheet, and wiring circuit board |
| JP5119873B2 (en) * | 2007-11-13 | 2013-01-16 | 三菱瓦斯化学株式会社 | Noise suppression body and noise suppression film |
| TWI339465B (en) * | 2007-12-31 | 2011-03-21 | Hon Hai Prec Ind Co Ltd | Electromagnetic shielding layer and method for making the same |
| KR100840599B1 (en) | 2008-02-13 | 2008-06-23 | (주)에이치제이 | Electromagnetic shielding tape and manufacturing method thereof |
| CN102026795B (en) * | 2008-05-13 | 2013-08-07 | 三菱瓦斯化学株式会社 | Bendable polycarbonate resin laminate, optically transparent electromagnetic wave shield laminate, and manufacturing method thereof |
| JP5139156B2 (en) * | 2008-05-30 | 2013-02-06 | タツタ電線株式会社 | Electromagnetic shielding material and printed wiring board |
| WO2009157309A1 (en) * | 2008-06-26 | 2009-12-30 | Dic株式会社 | Silver-containing powder, method for producing the same, conductive paste using the same, and plastic substrate |
| JP5446222B2 (en) * | 2008-11-14 | 2014-03-19 | 住友電気工業株式会社 | Conductive paste, electromagnetic shielding film using the same, and electromagnetic shielding flexible printed wiring board |
| EP2412519A4 (en) * | 2009-03-25 | 2012-10-03 | Mitsui Du Pont Polychemical | Film with attached metal layer for electronic components, production method thereof, and applications thereof |
| JP2010238870A (en) * | 2009-03-31 | 2010-10-21 | Toyo Ink Mfg Co Ltd | Electromagnetic wave shielding coverlay film, method of manufacturing flexible printed wiring board, and flexible printed wiring board |
| JP5565764B2 (en) * | 2009-04-01 | 2014-08-06 | 東レフィルム加工株式会社 | Electromagnetic wave interference prevention transfer film |
| JP2010287662A (en) * | 2009-06-10 | 2010-12-24 | Dainippon Printing Co Ltd | Rear surface protective sheet for solar cell module, and solar cell module using the protective sheet |
-
2011
- 2011-04-26 JP JP2011098430A patent/JP5707216B2/en active Active
-
2012
- 2012-04-24 TW TW101114506A patent/TWI468084B/en active
- 2012-04-24 KR KR1020120042809A patent/KR101407684B1/en active IP Right Grant
- 2012-04-26 CN CN2012101264474A patent/CN102762083A/en active Pending
- 2012-04-26 CN CN201510489727.5A patent/CN105208843B/en active Active
-
2014
- 2014-04-21 KR KR1020140047701A patent/KR101602214B1/en active IP Right Grant
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI508855B (en) * | 2013-03-13 | 2015-11-21 | Dainippon Ink & Chemicals | A layered product, a conductive pattern, and a laminate method |
| TWI800485B (en) * | 2016-07-11 | 2023-05-01 | 日商藤森工業股份有限公司 | Electromagnetic wave shielding material |
| CN109306487A (en) * | 2017-07-28 | 2019-02-05 | 苏州思锐达新材料有限公司 | Electromagnetic shielding material and the preparation method and application thereof based on Kapton |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101602214B1 (en) | 2016-03-10 |
| KR101407684B1 (en) | 2014-06-17 |
| CN105208843B (en) | 2018-04-24 |
| KR20120121357A (en) | 2012-11-05 |
| JP2012231021A (en) | 2012-11-22 |
| CN102762083A (en) | 2012-10-31 |
| JP5707216B2 (en) | 2015-04-22 |
| CN105208843A (en) | 2015-12-30 |
| TWI468084B (en) | 2015-01-01 |
| KR20140063548A (en) | 2014-05-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI468084B (en) | Electromagnetic wave shielding material for FPC | |
| TWI547236B (en) | Electromagnetic wave shielding material for FPC | |
| TWI608788B (en) | Electromagnetic wave shield material for fpc | |
| KR101359474B1 (en) | Electromagnetic wave shield material for fpc | |
| JP5940279B2 (en) | Manufacturing method of electromagnetic shielding material for FPC | |
| JP5743500B2 (en) | Electromagnetic wave shielding material for FPC | |
| JP5993485B2 (en) | FPC with electromagnetic shielding material for FPC | |
| JP6202767B2 (en) | Manufacturing method of FPC provided with electromagnetic shielding material for FPC | |
| CN107613628B (en) | Electromagnetic wave shielding material | |
| JP6268221B2 (en) | Manufacturing method of electromagnetic shielding material for FPC | |
| JP2017115152A (en) | Conductive adhesive layer and electromagnetic wave shielding material for FPC | |
| WO2019010973A1 (en) | Novel nonmetal-system electromagnetic shielding film and preparation method therefor, and flexible printed circuit board |