CN109306487A - Electromagnetic shielding material and the preparation method and application thereof based on Kapton - Google Patents
Electromagnetic shielding material and the preparation method and application thereof based on Kapton Download PDFInfo
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- CN109306487A CN109306487A CN201710628117.8A CN201710628117A CN109306487A CN 109306487 A CN109306487 A CN 109306487A CN 201710628117 A CN201710628117 A CN 201710628117A CN 109306487 A CN109306487 A CN 109306487A
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- copper
- kapton
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- 239000000463 material Substances 0.000 title claims abstract description 109
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 65
- 238000000576 coating method Methods 0.000 claims abstract description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000011159 matrix material Substances 0.000 claims abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 31
- 238000007747 plating Methods 0.000 claims description 27
- 238000005406 washing Methods 0.000 claims description 19
- 238000001035 drying Methods 0.000 claims description 18
- 238000012545 processing Methods 0.000 claims description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 11
- 229910017052 cobalt Inorganic materials 0.000 claims description 7
- 239000010941 cobalt Substances 0.000 claims description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 4
- 238000003912 environmental pollution Methods 0.000 abstract description 4
- 230000002045 lasting effect Effects 0.000 abstract description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 20
- 229910052759 nickel Inorganic materials 0.000 description 11
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 10
- 239000004327 boric acid Substances 0.000 description 10
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 10
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 10
- 239000011780 sodium chloride Substances 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 4
- 239000000908 ammonium hydroxide Substances 0.000 description 4
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 description 4
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- -1 For 200g~400g/L Chemical compound 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 229940005657 pyrophosphoric acid Drugs 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of electromagnetic shielding materials based on Kapton, the material includes the first alloy-layer of Kapton matrix and substrate surface, the copper coating of first alloyed layer, second alloy-layer of copper coating surface, wherein first alloy-layer with a thickness of 0.01~0.6 μm, the copper coating with a thickness of 0.5~8 μm, second alloy-layer with a thickness of 0.2~4 μm.Electromagnetic shielding material elasticity provided by the invention based on Kapton is preferable, high temperature resistant, while easy to process, can weld, resistivity is low, and shielding properties is high, and effect is lasting, and preparation method is simple, environmental pollution is smaller, can meet requirement of the people to electromagnetic shielding material.
Description
Technical field
The electromagnetic shielding material and preparation method and application based on Kapton that the present invention relates to a kind of.
Background technique
Electromagnetic shielding material can effectively reduce life in electromagnetic radiation (such as: mobile phone, computer, electromagnetic oven etc. produce
The radiation that product generate).Now electromagnetic shielding material mainly includes metal foil, conductive coating and fabric shielding material in the art, but
It is that metal foil machine-shaping is difficult, density is big；Copper powder and nickel powder used in conductive coating are easy to oxidize, hold during storage
It is easily settled；Fabric shielding material toughness is poor, and rubbing stretches, influences shield effectiveness after washing.At present, production electromagnetic shielding material
The technique of material mainly includes chemical plating, plating and Vacuum Deposition etc., and wherein chemical plating is at high cost, and environmental pollution is serious；Plating pair
Substrate electric conductivity requires high and unstable；Vacuum coating apparatus is expensive, and efficiency is lower and is difficult to be mass produced.
Accordingly, it is desirable to provide a kind of shielding properties is higher, the electromagnetic shielding material that effect is lasting is one urgently to be resolved
Problem.
Summary of the invention
The purpose of the present invention is to provide a kind of electromagnetic shielding material based on Kapton and preparation method thereof with
Using to overcome deficiency in the prior art.
For realization aforementioned invention purpose, the technical solution adopted by the present invention includes:
The embodiment of the present invention provides a kind of electromagnetic shielding material based on Kapton, including Kapton base
First alloy-layer of body and substrate surface, the copper coating of the first alloy-layer upper surface, the second alloy-layer of copper coating upper surface,
Wherein first alloy-layer with a thickness of 0.01~0.6 μm, the copper coating with a thickness of 0.5~8 μm, second alloy
Layer with a thickness of 0.2~4 μm.
Further, the electromagnetic shielding material further includes the blackening layer coated in the second alloy-layer upper surface, described black
Change layer with a thickness of 0.01~0.1 μm.
It is more preferred, first alloy layer material include in metallic nickel, metallic copper and crome metal any one or
Two or more combinations, but not limited to this.
It is more preferred, second alloy layer material include in metallic nickel, metallic cobalt and metallic iron any one or
Two or more combinations, but not limited to this.
The embodiment of the present invention also provides a kind of preparation method of electromagnetic shielding material based on Kapton, feature
Be the following steps are included:
Step 1: Kapton substrate is placed in protective gas environment, using magnetron sputtering technique in substrate table
Face sputters the first alloy-layer, and being formed has the first coating material；
Step 2: using cupric pyrophosphate copper-plating technique to first alloy-layer made from step 1 with the first coating material
Surface carries out copper plating treatment, carries out washing and drying and processing again later, and being formed has the second coating material；
Step 3: will have one layer of second alloy-layer of copper plate electroplating surface of the second coating material made from step 2,
Carry out washing and drying and processing again later, being formed has third coating material；
Step 4: carrying out Darkening process for the upper surface made from step 3 with third coating material, is made described
Electromagnetic shielding material based on Kapton.
Further, the first alloy-layer described in step 1 with a thickness of 0.01~0.6 μm.
Further, copper coating described in step 2 with a thickness of 0.5~8 μm.
Further, the second alloy-layer described in step 3 with a thickness of 0.2~4 μm.
Further, blackening layer described in step 4 with a thickness of 0.01~0.1 μm.
Further, it is provided by the invention based on the electromagnetic shielding material of Kapton in electromagnetic shielding material
Using.
The embodiment of the present invention also provides a kind of communication equipment, including above-mentioned electromagnetic shielding material.
Compared with prior art, the invention has the advantages that the electromagnetic screen provided by the invention based on Kapton
Cover material compared with the prior art in electromagnetic shielding material, elasticity is more preferable, high temperature resistant, while easy to process, can weld, resistance
Rate is low, and shielding properties is high, and effect is lasting, and preparation method is simple, and environmental pollution is smaller, can meet people to electromagnetic shielding material
The requirement of material.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described.
Fig. 1 is the structure of the electromagnetic shielding material obtained based on Kapton in an of the invention specific embodiment
Figure；
Fig. 2 is the structure of the electromagnetic shielding material obtained based on Kapton in an of the invention specific embodiment
Figure.
Specific embodiment
In view of deficiency in the prior art, inventor is studied for a long period of time and is largely practiced, and is able to propose of the invention
Technical solution.The technical solution, its implementation process and principle etc. will be further explained as follows.
The embodiment of the present invention provides a kind of electromagnetic shielding material (referring to Fig. 1) based on Kapton, including polyamides
First alloy-layer 2 of imines film matrix 1 and substrate surface, the copper coating 3 of the first alloy-layer upper surface, copper coating upper surface
The second alloy-layer 4, wherein first alloy-layer with a thickness of 0.01~0.6 μm, the copper coating with a thickness of 0.5~8 μ
M, second alloy-layer with a thickness of 0.2~4 μm.
Further, the electromagnetic shielding material based on Kapton with a thickness of 0.01-0.045mm.
Further, the electromagnetic shielding material further includes the blackening layer 5 coated in the second alloy-layer upper surface (referring to figure
2), the blackening layer with a thickness of 0.01~0.1 μm.
It is more preferred, first alloy layer material include in metallic nickel, metallic copper and crome metal any one or
Two or more combinations, but not limited to this.
It is more preferred, second alloy layer material include in metallic nickel, metallic cobalt and metallic iron any one or
Two or more combinations, but not limited to this.
The embodiment of the present invention also provides a kind of preparation method of electromagnetic shielding material based on Kapton, feature
Be the following steps are included:
Step 1: Kapton substrate is placed in protective gas environment, using magnetron sputtering technique in substrate table
Face sputters the first alloy-layer, and being formed has the first coating material；
Step 2: using cupric pyrophosphate copper-plating technique to first alloy-layer made from step 1 with the first coating material
Surface carries out copper plating treatment, carries out washing and drying and processing again later, and being formed has the second coating material；
Step 3: will have one layer of second alloy-layer of copper plate electroplating surface of the second coating material made from step 2,
Carry out washing and drying and processing again later, being formed has third coating material；
Step 4: carrying out Darkening process for the upper surface made from step 3 with third coating material, is made described
Electromagnetic shielding material based on Kapton.
Further, it is in 1*10 that the process conditions of the magnetron sputtering, which include vacuum degree,-3~1*10-1Pa, fabric advance
Speed be 0.3~10m/min.
Further, the cupric pyrophosphate copper-plating technique condition includes that the quality of cupric pyrophosphate is 30-90g/L, pyrophosphoric acid
Potassium quality be 200g~400g/L, ammonium hydroxide volume be 2~3ml/L, ammonium citrate quality be 15~45g/L, pH value be 8.1~
8.8, temperature is 0~40 DEG C, and electric current is 0.5A~3A/dm2, movable cathode speed is 0.5~5m/h.
Further, plating uses sulfate depositing process, and wherein the quality of nickel sulfate is 70~270g/L, the matter of sodium chloride
Amount is 10~30g/L, and the quality of boric acid is 33~40g/L, and pH value is 6~7, and temperature is 35~50 DEG C, current density is 0.8~
5A/dm2；Movable cathode speed is 5~30m/h.
Further, the first alloy-layer described in step 1 with a thickness of 0.01~0.6 μm.
Further, copper coating described in step 2 with a thickness of 0.5~8 μm.
Further, the second alloy-layer described in step 3 with a thickness of 0.2~4 μm.
Further, blackening layer described in step 4 with a thickness of 0.01~0.1 μm.
Further, it is provided by the invention based on the electromagnetic shielding material of Kapton in electromagnetic shielding material
Using.
The embodiment of the present invention also provides a kind of communication equipment, including above-mentioned electromagnetic shielding material.
Elasticity is good for electromagnetic shielding material provided by the invention based on Kapton, high temperature resistant, can weld, resistivity
Low, shielding properties is higher, and effect is lasting, and preparation method is simple, and environmental pollution is smaller, can meet people to electromagnetic shielding material
The requirement of material.
Technological invention of the invention is further explained below in conjunction with attached drawing and several embodiments.
Embodiment 1
Step 1: it is 1*10 that Kapton, which is placed in vacuum degree,-2Vacuum environment in, and be filled with argon gas, utilize magnetic
It controls sputtering technology and sputters one layer 0.01~0.6 μm of nickel layer on Kapton surface, being formed has the first coating material, work
Skill condition: vacuum degree is in 1*10-3~1*10-1Pa, the speed that fabric advances are 0.3~10m/min；
Step 2: using cupric pyrophosphate copper-plating technique to made from step 1 with the first coating material nickel layer surface into
Row copper plating treatment, thickness of coated copper layer carries out washing and the drying and processing at 10~100 DEG C, formation after being 0.5~8 μm again to be had
Second coating material, it is 30-90g/L, potassium pyrophosphate quality that wherein cupric pyrophosphate copper-plating technique condition, which is the quality of cupric pyrophosphate,
For 200g~400g/L, ammonium hydroxide volume is 2~3ml/L, and ammonium citrate quality is 15~45g/L, and pH value is 8.1~8.8, temperature
It is 0~40 DEG C, electric current is 0.5A~3A/dm2, movable cathode speed is 0.5~5m/h；
Step 3: being 0.2~4 by copper plate electroplating surface a layer thickness made from step 2 with the second coating material
μm nickel layer, carry out again later washing and the drying and processing at 10~100 DEG C, formed have third coating material, nickel plating technology
Be: the quality of nickel sulfate is 70~270g/L, and the quality of sodium chloride is 10~30g/L, and the quality of boric acid is 33~40g/L, pH
Value is 6~7, and temperature is 35~50 DEG C, and current density is 0.8~5A/dm2；Movable cathode speed is 5~30m/h；
Step 4: the upper surface made from step 3 with third coating material is subjected to Darkening process, black treated layer
With a thickness of 0.01~0.1 μm, finally the electromagnetic shielding material based on Kapton is made in winding.
Embodiment 2
Step 1: it is 1*10 that Kapton, which is placed in vacuum degree,-2Vacuum environment in, and be filled with argon gas, utilize magnetic
It controls sputtering technology and sputters one layer 0.01~0.6 μm of layers of copper on Kapton surface, being formed has the first coating material, work
Skill condition: vacuum degree is in 1*10-3~1*10-1Pa, the speed that fabric advances are 0.3~10m/min；
Step 2: using cupric pyrophosphate copper-plating technique to made from step 1 with the first coating material layers of copper surface into
Row copper plating treatment, thickness of coated copper layer carries out washing and the drying and processing at 10~100 DEG C, formation after being 0.5~8 μm again to be had
Second coating material, it is 30~90g/L, potassium pyrophosphate quality that wherein cupric pyrophosphate copper-plating technique condition, which is the quality of cupric pyrophosphate,
For 200g~400g/L, ammonium hydroxide volume is 2~3ml/L, and ammonium citrate quality is 15~45g/L, and pH value is 8.1~8.8, temperature
It is 0~40 DEG C, electric current is 0.5A~3A/dm2, movable cathode speed is 0.5~5m/h；
Step 3: being 0.2~4 by copper plate electroplating surface a layer thickness made from step 2 with the second coating material
μm nickel layer, carry out again later washing and the drying and processing at 10~100 DEG C, formed have third coating material, nickel plating technology
Be: the quality of nickel sulfate is 70~270g/L, and the quality of sodium chloride is 10~30g/L, and the quality of boric acid is 33~40g/L, pH
Value is 6~7, and temperature is 35~50 DEG C, and current density is 0.8~5A/dm2；Movable cathode speed is 5~30m/h；
Step 4: the upper surface made from step 3 with third coating material is subjected to Darkening process, black treated layer
With a thickness of 0.01~0.1 μm, finally the electromagnetic shielding material based on Kapton is made in winding.
Embodiment 3
Step 1: it is 1*10 that Kapton, which is placed in vacuum degree,-2Vacuum environment in, and be filled with argon gas, utilize magnetic
It controls sputtering technology and sputters one layer 0.01~0.6 μm of nickel-chrome alloy layer on Kapton surface, being formed has the first coating
Material, process conditions: vacuum degree is in 1*10-3~1*10-1Pa, the speed that fabric advances are 0.3~10m/min；
Step 2: using cupric pyrophosphate copper-plating technique to the nickel-chrome alloy layer made from step 1 with the first coating material
Surface carries out copper plating treatment, and thickness of coated copper layer carries out washing and the drying and processing at 10~100 DEG C, shape after being 0.5~8 μm again
At having the second coating material, it is 30-90g/L, pyrophosphoric acid that wherein cupric pyrophosphate copper-plating technique condition, which is the quality of cupric pyrophosphate,
Potassium quality be 200g~400g/L, ammonium hydroxide volume be 2~3ml/L, ammonium citrate quality be 15~45g/L, pH value be 8.1~
8.8, temperature is 0~40 DEG C, and electric current is 0.5A~3A/dm2, movable cathode speed is 0.5~5m/h；
Step 3: being 0.2~4 by copper plate electroplating surface a layer thickness made from step 2 with the second coating material
μm nickel layer, carry out again later washing and the drying and processing at 10~100 DEG C, formed have third coating material, nickel plating technology
Be: the quality of nickel sulfate is 70~270g/L, and the quality of sodium chloride is 10~30g/L, and the quality of boric acid is 33~40g/L, pH
Value is 6~7, and temperature is 35~50 DEG C, and current density is 0.8~5A/dm2；Movable cathode speed is 5~30m/h；
Step 4: the upper surface made from step 3 with third coating material is subjected to Darkening process, black treated layer
With a thickness of 0.01~0.1 μm, finally the electromagnetic shielding material based on Kapton is made in winding.
Embodiment 4
Step 1, will be made from step 2 with the copper facing of the second coating material in step 3 to two same as Example 1
The nickel cobalt layer that a layer thickness is 0.2~4 μm is electroplated in layer surface, carries out washing and the drying and processing at 10~100 DEG C, shape again later
At with third coating material, nickel plating cobalt layers technique is: the quality of nickel sulfate is 70~270g/L, the quality of sodium chloride is 10~
30g/L, the quality of boric acid are 33~40g/L, and pH value is 6~7, and temperature is 35~50 DEG C, and current density is 0.8~5A/dm2；
Movable cathode speed is 5~30m/h；Step 4 is identical as in embodiment 1.
Embodiment 5
Step 1, will be made from step 2 with the copper facing of the second coating material in step 3 to two same as Example 2
The nickel cobalt layer that a layer thickness is 0.2~4 μm is electroplated in layer surface, carries out washing and the drying and processing at 10~100 DEG C, shape again later
At with third coating material, nickel plating cobalt layers technique is: the quality of nickel sulfate is 70~270g/L, the quality of sodium chloride is 10~
30g/L, the quality of boric acid are 33~40g/L, and pH value is 6~7, and temperature is 35~50 DEG C, and current density is 0.8~5A/dm2；
Movable cathode speed is 5~30m/h；Step 4 is identical as the step four in embodiment 2.
Embodiment 6
Step 1, will be made from step 2 with the copper facing of the second coating material in step 3 to two same as Example 3
The nickel cobalt layer that a layer thickness is 0.2~4 μm is electroplated in layer surface, carries out washing and the drying and processing at 10~100 DEG C, shape again later
At with third coating material, nickel plating cobalt layers technique is: the quality of nickel sulfate is 70~270g/L, the quality of sodium chloride is 10~
30g/L, the quality of boric acid are 33~40g/L, and pH value is 6~7, and temperature is 35~50 DEG C, and current density is 0.8~5A/dm2；
Movable cathode speed is 5~30m/h；Step 4 is identical as the step four in embodiment 3.
Embodiment 7
Step 1, will be made from step 2 with the copper facing of the second coating material in step 3 to two same as Example 1
The nifesphere that a layer thickness is 0.2~4 μm is electroplated in layer surface, carries out washing and the drying and processing at 10~100 DEG C, shape again later
At with third coating material, nickel-clad iron layer process is: the quality of nickel sulfate is 70~270g/L, the quality of sodium chloride is 10~
30g/L, the quality of boric acid are 33~40g/L, and pH value is 6~7, and temperature is 35~50 DEG C, and current density is 0.8~5A/dm2；
Movable cathode speed is 5~30m/h；Step 4 is identical as in embodiment 1.
Embodiment 8
Step 1, will be made from step 2 with the copper facing of the second coating material in step 3 to two same as Example 2
The nifesphere that a layer thickness is 0.2~4 μm is electroplated in layer surface, carries out washing and the drying and processing at 10~100 DEG C, shape again later
At with third coating material, nickel-clad iron layer process is: the quality of nickel sulfate is 70~270g/L, the quality of sodium chloride is 10~
30g/L, the quality of boric acid are 33~40g/L, and pH value is 6~7, and temperature is 35~50 DEG C, and current density is 0.8~5A/dm2；
Movable cathode speed is 5~30m/h；Step 4 is identical as in embodiment 2.
Embodiment 9
Step 1, will be made from step 2 with the copper facing of the second coating material in step 3 to two same as Example 3
The nifesphere that a layer thickness is 0.2~4 μm is electroplated in layer surface, carries out washing and the drying and processing at 10~100 DEG C, shape again later
At with third coating material, nickel-clad iron layer process is: the quality of nickel sulfate is 70~270g/L, the quality of sodium chloride is 10~
30g/L, the quality of boric acid are 33~40g/L, and pH value is 6~7, and temperature is 35~50 DEG C, and current density is 0.8~5A/dm2；
Movable cathode speed is 5~30m/h；Step 4 is identical as in embodiment 3.
It should be appreciated that the technical concepts and features of above-described embodiment only to illustrate the invention, its object is to allow be familiar with this
The personage of item technology cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all
Equivalent change or modification made by Spirit Essence according to the present invention, should be covered by the protection scope of the present invention.
Claims (9)
1. a kind of electromagnetic shielding material based on Kapton, it is characterised in that including Kapton matrix and base
First alloy-layer of bottom surface, the copper coating of the first alloy-layer upper surface, the second alloy-layer of copper coating upper surface, wherein described
First alloy-layer with a thickness of 0.01~0.6 μm, the copper coating with a thickness of 0.5~8 μm, the thickness of second alloy-layer
It is 0.2~4 μm.
2. material according to claim 1, it is characterised in that: the electromagnetic shielding material further includes table on the second alloy-layer
The blackening layer in face, the blackening layer with a thickness of 0.01~0.1 μm.
3. material according to claim 1, it is characterised in that: first alloy layer material includes metallic nickel, metallic copper
With any one or the two or more combinations in crome metal.
4. material according to claim 1, it is characterised in that: second alloy layer material includes metallic nickel, metallic cobalt
With any one or the two or more combinations in metallic iron.
5. the preparation method of material described in any one of -4 according to claim 1, it is characterised in that the following steps are included:
Step 1: Kapton substrate is placed in protective gas environment, is splashed using magnetron sputtering technique in substrate surface
The first alloy-layer is penetrated, being formed has the first coating material；
Step 2: using cupric pyrophosphate copper-plating technique to first alloyed layer made from step 1 with the first coating material
Copper plating treatment is carried out, carries out washing and drying and processing again later, being formed has the second coating material；
Step 3: will there is one layer of second alloy-layer of copper plate electroplating surface of the second coating material made from step 2, later
Washing and drying and processing are carried out again, and being formed has third coating material；
Step 4: carrying out Darkening process for the upper surface made from step 3 with third coating material, be made it is described based on
The electromagnetic shielding material of Kapton.
6. preparation method according to claim 5, it is characterised in that: the first alloy-layer described in step 1 with a thickness of
0.01~0.6 μm；And/or copper coating described in step 2 with a thickness of 0.5~8 μm；And/or the second conjunction described in step 3
Layer gold with a thickness of 0.2~4 μm；And/or blackening layer described in step 4 with a thickness of 0.01~0.1 μm.
7. preparation method according to claim 5, it is characterised in that: first alloy layer material includes metallic nickel, gold
Belong to any one in copper and crome metal or two or more combinations；And/or second alloy layer material include metallic nickel,
Metallic cobalt with any one or the two or more combinations in metallic iron.
8. by the material of any one of material of any of claims 1-4 and claim 5-7 preparation in electromagnetism
Application in shielding material.
9. a kind of communication equipment, it is characterised in that including electromagnetic shielding material according to any one of claims 8.
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Application publication date: 20190205 |