TW201305290A - 帶胺基之矽烷偶合劑與金屬烷氧化物之縮合物、以其為主成分之積層基板用材料、積層基板及導電性構件、以及該等之製造方法 - Google Patents

帶胺基之矽烷偶合劑與金屬烷氧化物之縮合物、以其為主成分之積層基板用材料、積層基板及導電性構件、以及該等之製造方法 Download PDF

Info

Publication number
TW201305290A
TW201305290A TW101116482A TW101116482A TW201305290A TW 201305290 A TW201305290 A TW 201305290A TW 101116482 A TW101116482 A TW 101116482A TW 101116482 A TW101116482 A TW 101116482A TW 201305290 A TW201305290 A TW 201305290A
Authority
TW
Taiwan
Prior art keywords
condensate
group
coupling agent
substrate
metal
Prior art date
Application number
TW101116482A
Other languages
English (en)
Chinese (zh)
Inventor
Koji Iura
Akihiro Matsubayashi
Kenji Fukunaga
Original Assignee
Ube Nitto Kasei Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Nitto Kasei Co filed Critical Ube Nitto Kasei Co
Publication of TW201305290A publication Critical patent/TW201305290A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/54—Nitrogen-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0709—Catalytic ink or adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Silicon Polymers (AREA)
TW101116482A 2011-06-01 2012-05-09 帶胺基之矽烷偶合劑與金屬烷氧化物之縮合物、以其為主成分之積層基板用材料、積層基板及導電性構件、以及該等之製造方法 TW201305290A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011123516 2011-06-01
JP2011247309 2011-11-11

Publications (1)

Publication Number Publication Date
TW201305290A true TW201305290A (zh) 2013-02-01

Family

ID=47258945

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101116482A TW201305290A (zh) 2011-06-01 2012-05-09 帶胺基之矽烷偶合劑與金屬烷氧化物之縮合物、以其為主成分之積層基板用材料、積層基板及導電性構件、以及該等之製造方法

Country Status (3)

Country Link
JP (1) JP5884823B2 (ja)
TW (1) TW201305290A (ja)
WO (1) WO2012165081A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11325926B2 (en) 2019-03-11 2022-05-10 Evonik Operations Gmbh VOC-free, aqueous and storage-stable N-vinylbenzylaminoalkyl-functional siloxanol and process for the production thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6486053B2 (ja) * 2014-10-03 2019-03-20 株式会社コムラテック 電子回路基板の製造方法
US20220220331A1 (en) 2019-08-01 2022-07-14 University Of Massachusetts Printable mixture, manufacture, and use
CN115678018B (zh) * 2022-11-04 2023-10-20 海洋化工研究院有限公司 一种聚氨酯-有机硅树脂预聚体及其制备方法和应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152984A (en) * 1990-11-20 1992-10-06 Dow Corning Corporation Hair fixatives
US6344520B1 (en) * 1999-06-24 2002-02-05 Wacker Silicones Corporation Addition-crosslinkable epoxy-functional organopolysiloxane polymer and coating compositions
JP4205890B2 (ja) * 2002-05-15 2009-01-07 パナソニック株式会社 インクジェット記録用インク、並びに該インクを備えたインクカートリッジ及び記録装置
JP2004279975A (ja) * 2003-03-18 2004-10-07 Ricoh Co Ltd 熱現像型ジアゾ複写材料
JP2005320472A (ja) * 2004-05-11 2005-11-17 Teijin Ltd プロトン伝導膜、触媒電極とプロトン伝導体との接合体、燃料電池
JP2008127405A (ja) * 2006-11-16 2008-06-05 Toyota Central R&D Labs Inc コアシェル型球状シリカ系メソ多孔体、それを用いた触媒及び吸着材
JP2008231170A (ja) * 2007-03-19 2008-10-02 Nagoya Industrial Science Research Inst 感光性多分岐ポリイミド系ハイブリッド前駆体
JP2010138422A (ja) * 2008-12-09 2010-06-24 Ube Nitto Kasei Co Ltd 機能膜付き金属箔、フレキシブル金属張り積層板、電子部品実装モジュールおよびその製造方法
JP2011108848A (ja) * 2009-11-17 2011-06-02 Ube Nitto Kasei Co Ltd 絶縁性機能膜付き金属箔、フレキシブル金属張り積層板、電子部品実装モジュールおよびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11325926B2 (en) 2019-03-11 2022-05-10 Evonik Operations Gmbh VOC-free, aqueous and storage-stable N-vinylbenzylaminoalkyl-functional siloxanol and process for the production thereof
TWI795636B (zh) * 2019-03-11 2023-03-11 德商贏創運營有限公司 不含ｖｏｃ的水性及儲存穩定之ｎ－乙烯基苄基胺基烷基官能性矽氧烷醇及其製造方法

Also Published As

Publication number Publication date
JPWO2012165081A1 (ja) 2015-02-23
WO2012165081A1 (ja) 2012-12-06
JP5884823B2 (ja) 2016-03-15

Similar Documents

Publication Publication Date Title
JP5864299B2 (ja) 樹脂組成物
TWI577556B (zh) Conductive material and manufacturing method thereof
TWI585184B (zh) 組成物套組、導電性基板及其製造方法以及導電性接著材組成物
JP6048193B2 (ja) 樹脂組成物
US20120277360A1 (en) Graphene Compositions
JP2014118563A (ja) 絶縁層組成物及びこれを用いる絶縁層を含む基板並びに基板製造方法
TWI738705B (zh) 預浸體、印刷線路板、半導體封裝體、及印刷線路板的製造方法
CN105612055A (zh) 氟树脂基材、印刷线路板和电路模块
TW201823148A (zh) 表面經粗糙化之六方晶氮化硼粒子與其製造方法、及組成物、樹脂片、預浸體、覆金屬箔疊層板與印刷電路板
CN105517788A (zh) 层叠体、导电性图案、电子电路及层叠体的制造方法
JP2014196556A (ja) 導電性材料の製造方法及び導電性材料
TW201305290A (zh) 帶胺基之矽烷偶合劑與金屬烷氧化物之縮合物、以其為主成分之積層基板用材料、積層基板及導電性構件、以及該等之製造方法
WO2007116649A1 (ja) ニッケルインク
JP2007138095A (ja) 樹脂組成物及び板状体
TWI707928B (zh) 積層體、使用其之印刷配線板、可撓性印刷配線板及成形品
TW201704373A (zh) 導電性被覆膜複合體及其製造方法
CN108602667A (zh) 用于使用官能化烷氧基硅烷添加剂和底漆层增强银纳米粒子墨水的粘附力的方法
JP5276152B2 (ja) 樹脂組成物及び板状体
TW201044463A (en) Transparent conductive film encapsulating mesh-like structure formed from metal microparticles, substrate on which transparent conductive film is laminated, and method for producing the same
TW201807103A (zh) 柔版印刷用金屬奈米粒子印墨及使用其之積層體之製造方法
JP5772480B2 (ja) インク受容膜およびそれを用いた積層基板、導電性部材
JP5231884B2 (ja) 多孔質膜、多孔質膜形成用塗工液、積層基板および配線材料
JP2013055156A (ja) 放熱基板
TW202233705A (zh) 樹脂組成物
JP2022190866A (ja) 積層体およびその製造方法