TW201301962A - 配線體及配線體之製造方法 - Google Patents

配線體及配線體之製造方法 Download PDF

Info

Publication number
TW201301962A
TW201301962A TW101118688A TW101118688A TW201301962A TW 201301962 A TW201301962 A TW 201301962A TW 101118688 A TW101118688 A TW 101118688A TW 101118688 A TW101118688 A TW 101118688A TW 201301962 A TW201301962 A TW 201301962A
Authority
TW
Taiwan
Prior art keywords
electronic component
copper foil
flexible printed
wiring board
printed wiring
Prior art date
Application number
TW101118688A
Other languages
English (en)
Chinese (zh)
Inventor
Yoshihiro Akahane
Hirohisa Saito
Naota Uenishi
Masamichi Yamamoto
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW201301962A publication Critical patent/TW201301962A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structure Of Printed Boards (AREA)
TW101118688A 2011-06-17 2012-05-25 配線體及配線體之製造方法 TW201301962A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011135028A JP2013004775A (ja) 2011-06-17 2011-06-17 配線体及び配線体の製造方法

Publications (1)

Publication Number Publication Date
TW201301962A true TW201301962A (zh) 2013-01-01

Family

ID=47356931

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101118688A TW201301962A (zh) 2011-06-17 2012-05-25 配線體及配線體之製造方法

Country Status (3)

Country Link
JP (1) JP2013004775A (ja)
TW (1) TW201301962A (ja)
WO (1) WO2012172937A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6388297B2 (ja) * 2013-04-15 2018-09-12 Ｄｎライティング株式会社 照明装置
TWI611740B (zh) * 2015-02-05 2018-01-11 頎邦科技股份有限公司 可撓性基板
CN107768415B (zh) * 2017-10-30 2024-03-08 京东方科技集团股份有限公司 柔性显示器件、显示装置以及制造方法
TWI777760B (zh) * 2021-08-09 2022-09-11 頎邦科技股份有限公司 具散熱片之軟性電路板及其散熱片

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3834888B2 (ja) * 1996-09-13 2006-10-18 イビデン株式会社 電子部品搭載用基板の製造方法
JP2001127398A (ja) * 1999-10-27 2001-05-11 Hitachi Chem Co Ltd 金属板付き配線基板の製造法

Also Published As

Publication number Publication date
WO2012172937A1 (ja) 2012-12-20
JP2013004775A (ja) 2013-01-07

Similar Documents

Publication Publication Date Title
KR101992924B1 (ko) 마이크로-라디에이터로 인쇄회로기판을 제조하는 방법
EP2170024B1 (en) Backlight unit equipped with light emitting diodes
US20130092421A1 (en) Flexible circuit board
WO2013118478A1 (ja) 半導体装置
KR20160122853A (ko) 파워 모듈용 기판 유닛 및 파워 모듈
JP2009246258A (ja) 半導体装置および製造方法
US9024204B2 (en) Aresistive device with flexible substrate and method for manufacturing the same
JP6691137B2 (ja) 放熱性回路基板
JP2010153803A (ja) 電子部品実装モジュール及び電気機器
JP5630383B2 (ja) 配線体の接続構造、配線体、電子装置及び電子装置の製造方法
TW201301962A (zh) 配線體及配線體之製造方法
JP2023054285A (ja) 回路基板の製造方法
JP2006324542A (ja) プリント配線板とその製造方法
KR101118846B1 (ko) 방열 기판 및 이의 제조 방법
JP6421555B2 (ja) 電子機器
JP2017152108A (ja) Ｌｅｄ素子用基板及びｌｅｄ表示装置
JP2013239549A (ja) 配線板の取付構造、電子装置及び電子装置の製造方法
JP2015222795A (ja) 放熱板を備えた電子部品の実装構造
US20140340873A1 (en) Bendable heat readiating composite and backlight unit having the same
JP6922229B2 (ja) Ｌｅｄバックライト
JP5906621B2 (ja) 電子部品の製造方法及び固定治具
JP5751052B2 (ja) 放熱基板、半導体モジュール
JP2016189413A (ja) Ｌｅｄ実装モジュール及びｌｅｄ表示装置
TW201414376A (zh) 具散熱器之配線板、具散熱器之零件構裝配線板、及該等的製造方法（二）
JP2017174806A (ja) Ｌｅｄエッジライト用のフレキシブル基板