TW201300494A - 電路連接材料，連接構造體及其製造方法 - Google Patents

電路連接材料，連接構造體及其製造方法 Download PDF

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Publication number
TW201300494A
TW201300494A TW101129656A TW101129656A TW201300494A TW 201300494 A TW201300494 A TW 201300494A TW 101129656 A TW101129656 A TW 101129656A TW 101129656 A TW101129656 A TW 101129656A TW 201300494 A TW201300494 A TW 201300494A
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Taiwan
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circuit
electrode
connecting material
substrate
circuit member
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TW101129656A
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English (en)
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TWI480356B (zh
Inventor
Takashi Nakazawa
Motohiro Arifuku
Kazuyoshi Kojima
Nichiomi Mochizuki
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Hitachi Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
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Abstract

本發明之電路連接材料，其係將第一基板之主面上形成第一電路電極之第一電路構件與第二基板之主面上形成第二電路電極之第二電路構件，在使第一電路電極及第二電路電極予以對向配置的狀態下，進行連接用的電路連接材料，其係含有產生游離自由基的硬化劑、自由基聚合性物質、具有2級硫醇基的化合物。本發明之電路連接材料，能夠於低溫下短時間進行硬化，並且保存安定性較佳。

Description

電路連接材料，連接構造體及其製造方法
本發明係關於介於相對向的電路電極間，並且對相對向的電路電極進行加壓而將加壓方向的電極間進行電連接之電路連接材料，以及使用該電路連接材料之連接構造體及其製造方法。
前述作為半導體元件或液晶顯示元件用的電路連接材料，為人所知者，有使用顯現出高黏著性與高可靠度之環氧樹脂的熱硬化性樹脂(例如參考專利文獻1)。樹脂的構成成分，一般係使用環氧樹脂、與環氧樹脂具有反應性之酚類樹脂等的硬化劑、以及可促進環氧樹脂與硬化劑的反應之隱性硬化劑。隱性硬化劑為決定硬化溫度及硬化速度之重要因素，就室溫下的貯藏安定性及加熱時的硬化速度之觀點來看，可使用種種化合物。
此外，最近受到矚目者，有併用丙烯酸酯衍生物或甲基丙烯酸酯衍生物與成為自由基聚合起始劑的過氧化物之自由基硬化型黏著劑。自由基硬化，由於作為反應活性物質之自由基具有充分的反應性，所以能夠於短時間進行硬化(例如參考專利文獻2、3)。
因此，目前有利於生產時間的縮短之短時間硬化型黏著劑，係逐漸普及。於更為提升自由基硬化型黏著劑的反應性之目的下，係有人開始探討連鎖轉移劑之適用(例如 參考專利文獻4)。藉由使用連鎖轉移劑，可獲得快速硬化的效果，且令人期待於低溫下的短時間硬化，以及對金屬等之無機物質的密著力提升。
專利文獻1：日本特開平1-113480號公報
專利文獻2：日本特開2002-203427號公報
專利文獻3：日本國際公開WO98/044067號公報
專利文獻4：日本特開2003-221557號公報
本發明之目的在於提供一種，能夠有效地獲得上述適用連鎖轉移劑的優點，亦即快速硬化、於低溫下短時間進行連接，以及對金屬等之無機物質的密著力提升等效果之電路連接材料，以及使用該電路連接材料之連接構造體及其製造方法。
本發明者們係為了達成上述目的而進行精心的探討，結果發現，藉由使用具有2級硫醇基的化合物作為連鎖轉移劑，可獲得黏著力提升的效果並維持保存安定性，因而完成本發明。
亦即，本發明係提供一種電路連接材料，其係將第一基板之主面上形成第一電路電極之第一電路構件與第二基板之主面上形成第二電路電極之第二電路構件，在使第一 電路電極及第二電路電極予以對向配置的狀態下，進行連接用的電路連接材料，其特徵係含有產生游離自由基的硬化劑、自由基聚合性物質、具有2級硫醇基的化合物。
於本發明之電路連接材料中，具有2級硫醇基的化合物之分子量，較佳為400以上。
此外，本發明係提供一種連接構造體，其特徵係具備：在第一基板之主面上形成第一電路電極之第一電路構件；在第二基板之主面上形成第二電路電極，且第二電路電極與第一電路電極予以相對向進行配置之第二電路構件；被設置於第一電路構件與第二電路構件之間，且將第一電路構件與第二電路構件進行電連接的黏著層；該黏著層為將上述本發明之電路連接材料介於第一電路構件與第二電路構件之間，在該狀態下藉由加壓所形成者。
此外，本發明係提供一種連接構造體之製造方法，其特徵係具備：將在第一基板之主面上形成第一電路電極之第一電路構件與在第二基板之主面上形成第二電路電極之第二電路構件，使第一電路電極與第二電路電極予以相對向進行配置，將上述本發明之電路連接材料介於第一電路構件與第二電路構件之間，該狀態下，藉由加壓，將第一電路電極與第二電路電極進行電連接的步驟。
根據本發明，可提供能夠於低溫下短時間進行硬化，並且保存安定性較佳之電路連接材料，以及使用該電路連 接材料之連接構造體及其製造方法。
以下詳細說明本發明之較佳實施型態。
本發明之電路連接材料，其係將第一基板之主面上形成第一電路電極之第一電路構件與第二基板之主面上形成第二電路電極之第二電路構件，在使第一電路電極及第二電路電極予以對向配置的狀態下，進行連接用的電路連接材料，其係含有產生游離自由基的硬化劑、自由基聚合性物質、具有2級硫醇基的化合物。
於本發明中所使用之產生游離自由基的硬化劑，較佳為過氧化化合物、偶氮系化合物等之可藉由加熱分解而產生游離自由基者，可藉由目的的連接溫度、連接時間等來適當地選定。調配量較佳為0.05~10重量%，更佳為0.1~5重量%。具體而言，可從過氧化雙乙醯基類、過氧二碳酸類、過氧酯類、過氧縮酮類、過氧化二烷基類、氫過氧化物類等當中選定。
過氧化雙乙醯基類，例如有過氧化2,4-二環苯甲醯、過氧化3,5,5-三甲基己醯基、過氧化辛醯基、過氧化十二醯基、過氧化十八醯基、過氧化丁二酸、苯甲醯過氧甲苯、過氧化苯甲醯等。
過氧二碳酸類，例如有過氧二碳酸二正丙酯、過氧二碳酸二異丙酯、過氧二碳酸雙(4-三級丁基環己基)酯、過氧二碳酸二-2-乙氧基甲氧酯、二(過氧2-乙基己基) 二碳酸酯、過氧二碳酸二甲氧基丁酯、二(過氧3-甲基-3-甲氧基丁基)二碳酸酯等。
過氧酯類，例如有過氧1,1,3,3,-四甲基丁基新癸酸酯、過氧1-環己基-1-甲基乙基新癸酸酯、過氧三級己基新癸酸酯、過氧異丁酸三級丁酯、過氧1,1,3,3,-四甲基丁基-2-乙基己酸酯、2,5-二甲基-2,5-二(過氧2-乙基己醯基)己烷酯、過氧1-環己-1-甲基乙基-2-乙基己酸酯、過氧三級己基-2-乙基己酸酯、過氧三級丁基-2-乙基己酸酯、過氧三級丁基異丁酸酯、1,1-雙(過氧三級丁基)環己烷酯、過氧三級己基異丙基單碳酸酯、過氧三級丁基-3,5,5-三甲基己酸酯、過氧三級丁基十二酸酯、過氧2,5-二甲基-2,5-二(過氧間甲苯甲醯基)己烷酯、過氧三級丁基異丙基單碳酸酯、過氧三級丁基-2-乙基己基單碳酸酯、過氧三級己基苯甲酸酯、過氧三級丁基醋酸酯等。
過氧縮酮類，例如有1,1-雙(過氧三級己基)-3,3,5-三甲基環己烷酯、1,1-雙(過氧三級己基)環己烷酯、1,1-雙(過氧三級丁基)-3,3,5-三甲基環己烷酯、1,1-(過氧三級丁基)環十二烷酯、2,2-雙(過氧三級丁基)癸烷酯等。
過氧化二烷基類，例如有α,α’-雙(過氧三級丁基)二異丙基苯酯、過氧化二異丙苯、2,5-二甲基-2,5-二(過氧三級丁基)己烷酯、過氧化三級丁基二異丙苯等。
氫過氧化物類，例如有氫過氧化二異丙基苯、氫過氧化異丙苯等。
這些游離自由基產生劑可單獨或混合使用，亦可與分解促進劑或抑制劑等混合使用。此外，藉由聚胺甲酸酯系、聚酯系的高分子物質等來被覆這些硬化劑使成為微膠囊者，由於可延長保存性，因而較為理想。
於本發明中所使用之自由基聚合性物質，可在單體、低聚物的任一狀態下使用，亦可併用單體及低聚物。自由基聚合性物質的具體例，例如有乙二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、四羥甲基甲烷四丙烯酸酯、2-羥基-1,3-丙烯醯氧基丙烷、2,2-雙[4-(丙烯氧基甲氧基)苯基]丙烷、2,2-雙[4-(丙烯醯氧聚乙氧基)苯基]丙烷、二環戊烯基丙烯酸酯、三環癸烯基丙烯酸酯、三(丙烯醯氧基二乙基)異氰尿酸酯等。這些可單獨使用或併用。此外，可因應必要來適用對苯二酚、甲基醚對苯二酚等之聚合禁止劑。此外，當具有二環戊烯基及/或三環癸烯基及/或三氮雜苯環時，可提升耐熱性，因而較為理想。
於上述自由基聚合性物質中，若含有聚苯乙烯、聚乙烯、聚乙烯醇縮丁醛、聚乙烯醇縮甲醛、聚醯亞胺、聚醯胺、聚酯、聚氯乙烯、聚氧化二甲苯、尿素樹脂、三聚氰胺樹脂、酚類樹脂、二甲苯樹脂、環氧樹脂、聚異氰酸酯樹脂、苯氧樹脂等之聚合物，則處理性良好，且硬化時的應力緩和較佳，因而較為理想。當聚合物具烴基等官能基時，可提升黏著性，因而更為理想。更理想為以自由基聚合性的官能基對各聚合物進行變性。這些聚合物的重量平 均分子量較佳為10000以上，就混合性的觀點來看，更佳為10000以上，1000000以下。本申請案所規定之重量平均分子量，係依循下列條件，藉由凝膠滲透層析法(GPC：Gel Permeation Chromatography)並使用標準聚苯乙烯檢量線進行測定而得者。
[GPC條件]
使用機器：日立L-6000型[日立製作所股份有限公司]，管柱：凝膠包GL-R420+凝膠包GL-R430+凝膠包GL-R440(合計3管)[日立化成工業股份有限公司製、商品名稱]，解離液：四氫呋喃，測定溫度：40℃，流量：1.75ml/min，檢測器：L-3300RI[日立製作所股份有限公司]。
再者，自由基聚合性物質亦可含有填充材、軟化劑、促進劑、老化防止劑、著色劑、難燃劑、搖變減黏劑、偶合劑、及酚類樹脂或三聚氰胺樹脂、異氰酸酯類等。當含有填充材時，可提升連接可靠度，因而較為理想。可使用填充材的最大徑未滿導電粒子的粒徑者，較佳為5~60體積%的範圍。於60體積%以上時，可靠度提升效果會到達飽和。作為偶合劑，含有乙烯基、丙烯酸基、胺基、環氧基及異氰酸酯基者，就黏著性提升的觀點來看，乃較為理想。
於本發明中所使用之具有2級硫醇基的化合物，較適合為下列式(1)~(5)所表示之化合物。
此外，具有2級硫醇基的化合物之較佳例子，例如有丙烯基苯硫醇磺酸鹽、苯硫醇、鄰乙氧基苯硫醇、對乙氧基苯硫醇、2-苯並咪唑硫醇、鄰氫硫基苯甲酸、鄰氫硫基苯甲酸甲基酯、2-苯並噻唑硫醇、2級的丁烷硫醇、2,3-丁烷二硫醇、己-5-烯-3-硫醇、2級的十二烷硫醇、2級的庚烷硫醇、2級的己烷硫醇、萘甲烷硫醇、氫硫基苯並噁唑、萘硫醇、2級的十八烷硫醇、2級辛烷硫醇、2-甲基-2-丙烷硫醇、甲苯硫醇、硫代二苯硫醇、對甲氧基甲苯硫醇等。具有2級硫醇基的化合物，相較於醇類，其作為連鎖轉移劑之反應性較高，而具有較佳的實用性。
具有2級硫醇基的化合物之分子量，較佳為90以上且未滿5000，更佳為150以上且未滿2000。當分子量未滿90時，由於連接時的加溫，在到達化合物的沸點時會蒸發，而具有無法使充分的量之具有2級硫醇基的化合物投入於反應中之傾向。另一方面，當分子量為5000以上時，樹脂的排除性惡化，而具有連接電阻上升之傾向。
此外，具有2級硫醇基的化合物之硫醇當量，較佳為50以上且未滿500，更佳為120以上且未滿400。當硫醇當量未滿50時，架橋密度降低，而具有電路連接材料之電阻的可靠度降低之傾向。另一方面，當硫醇當量為500以上時，具有難以獲得黏著力提升效果之傾向。
此外，就製造時的作業性或製品的處理性之方面來看，具有2級硫醇基的化合物之分子量，較佳為400以上。當分子量未滿400時，於調配材料時或是進行製品的 處理時，臭氣變得較強，而具有作業性或處理性降低之傾向。另一方面，當分子量為400以上時，可抑制臭氣，使作業性．處理性不會受到影響。
具有2級硫醇基的化合物之添加量，對自由基聚合性物質的100重量份，較佳為1~20重量份，更佳為2~10重量份。當未滿1重量份時，難以獲得黏著力提升的效果，於20重量份以上時，架橋密度降低，而具有電路連接材料之電阻的可靠度降低之傾向。
本發明之電路連接材料，可僅由產生游離自由基的硬化劑、自由基聚合性物質、具有2級硫醇基的化合物所形成，但更可因應必要而含有下列成分。
本發明之電路連接材料，更可含有於分子內具有1個以上的氮氧(Aminoxyl)構造之化合物。當本發明之電路連接材料含有具有氮氧構造之化合物時，更能夠提升電路連接材料之保存安定性。
此外，本發明之電路連接材料，更可含有熱可塑性樹脂。熱可塑性樹脂，可使用聚乙烯醇縮丁醛樹脂、聚乙烯醇縮甲醛樹脂、聚醯胺樹脂、聚酯樹脂、酚樹脂、環氧樹脂、苯氧樹脂、聚苯乙烯樹脂、二甲苯樹脂、聚胺甲酸酯樹脂等。這些熱可塑性樹脂的重量平均分子量，就製膜性等觀點來看，較佳為10000以上，就混合性等觀點來看，更佳為10000以上且未滿1000000。熱可塑性樹脂的重量平均分子量，係以與可包含於自由基聚合性物質之聚合物的重量平均分子量為相同的方式進行測定。
此外，熱可塑性樹脂較佳為使用Tg(玻璃轉移溫度)為40℃以上，重量平均分子量為10000以上之含羥基的樹脂(例如苯氧樹脂)。含羥基的樹脂，可藉由含環氧基的彈性體、自由基聚合性的官能基進行變性。藉由自由基聚合性的官能基進行變性者，可提升其耐熱性，因而較為理想。
苯氧樹脂，可藉由將二官能酚類與表鹵醇(Epihalohydrin)進行反應至高分子量為止，或是將二官能環氧樹脂與二官能酚類進行加成聚合反應而製得。
再者，於本發明之電路連接材料中，亦可含有填充材、軟化劑、促進劑、老化防止劑、著色劑、難燃劑、搖變減黏劑、偶合劑、及酚類樹脂或三聚氰胺樹脂、異氰酸酯類等。
作為偶合劑，含有乙烯基、丙烯酸基、胺基、環氧基及異氰酸酯基的至少1種之化合物，就黏著性提升的觀點來看，乃較為理想。
本發明之電路連接材料，雖然在不含有導電性粒子下能夠藉由相對向之電路電極的直接接觸來進行連接，但若更含有導電性粒子時，更能夠獲得安定的連接。
導電性粒子，例如有Au、Ag、Ni、焊錫等金屬粒子或碳等。此外，亦可為以Au等貴金屬類來被覆Ni等轉移金屬類的表面而成者。為了獲得充分的適用期，表層較佳並非為Ni、Cu等轉移金屬類，而是Au、Ag、鉑族等貴金屬類，更佳為Au。此外，亦能夠藉由以前述導電性 物質來被覆玻璃、陶瓷、塑膠等非導電性粒子的表面等之方法，於非導電性粒子表面形成導通層，再以貴金屬類來構成最外層，或者是在熱熔融金屬粒子時，由於具有可藉由加熱加壓進行變形之特性，因此在連接時可增加與電極之接觸面積並提升可靠度，因而較為理想。
導電性粒子的調配量，可因應用途來適當地設定，一般對於黏著劑樹脂成份的100體積份，係位於0.1~30體積份的範圍。為了防止因過剩的導電性粒子導致鄰接電路的短路，更佳為0.1~10體積份。
此外，當將電路連接材料分割為2層以上，而分離為含有硬化劑之層與含有導電性粒子之層時，可獲得適用期的提升效果。
接下來說明本發明之連接構造體及其製造方法。
第1圖為顯示連接構造體的一實施型態之模式剖面圖。第1圖所示之連接構造體1，係具備：具有第一電路基板21及形成於該主面21a上之第一電路電極(第一連接端子)22之第一電路構件20；及具有第二電路基板31及形成於該主面31a上之第二電路電極(第二連接端子)32之第二電路構件30；以及介於第一電路構件20與第二電路構件30之間，並將兩者予以黏著之黏著層10。第二電路構件30，係以第二電路電極32與第一電路電極22相對向之方式，與第一電路構件20對向配置。
黏著層10，係使上述本發明之電路連接材料介於第一電路構件20與第二電路構件30之間，並在該狀態下藉 由加壓所形成者。於本實施型態中，係顯示使用具有導電性之電路連接材料來形成黏著層10之情況的一例，黏著層10係由絕緣層11以及於絕緣層11內所分散之導電性粒子7所構成。絕緣層11係來自黏著層當中導電性粒子以外的成分，為藉由自由基聚合性化合物的自由基聚合所形成之硬化體。
對向的第一電路電極22及第二電路電極32，係介於導電性粒子7進行電連接。另一方面，形成於同一電路基板上之第一電路電極22彼此，以及第二電路電極32彼此，係形成絕緣。
第一電路基板21及第二電路基板31，例如為半導體晶片、電阻體晶片、電容器晶片等之晶片零件；以及印刷電路基板等之基板等。一般，係於電路構件設置多數個連接端子，連接端子可視情況的不同而為單個。
具體而言，可使用半導體、玻璃及陶瓷等之無機材料的基板、塑膠基板、或是玻璃/環氧基板。塑膠基板例如有聚醯亞胺薄膜、聚碳酸酯薄膜及聚酯薄膜。第一電路電極及第二電路電極，係由銅等的金屬所形成。為了獲得更良好的電連接，較佳為將第一電路電極及第二電路電極之至少一方的表面，形成為從金、銀、錫、及鉑族中所選出之金屬。表面層可從金、銀、鉑族或錫中的任一種所選擇，或是組合使用這些金屬。此外，亦可如銅/鎳/金般之組合複數種金屬而形成多層構成。
此外，第一電路構件20及第二電路構件30中之一 方，可為具有玻璃基板或塑膠基板作為電路基板，並且具有由ITO等所形成之連接端子之液晶顯示面板。此外，第一電路構件20及第二電路構件30中之一方，可為具有聚醯亞胺薄膜作為電路基板之軟性印刷配線基板(FPC)、捲帶式封裝(TCP)或薄膜覆晶封裝(COF)、或是具有半導體基板作為電路基板之半導體矽晶片。可因應必要，適當地組合這些各種電路構件來構成連接構造體。
設置電路電極之基板，為了排除因連接時的加熱所產生之揮發成分對連接造成影響，較佳係在由電路連接材料所進行的連接步驟之前，預先進行加熱處理。
連接構造體1，例如以第一電路電極22及第二電路電極32相對峙之方式依序重疊第一電路構件20、薄膜狀的黏著劑及第二電路構件30，於該狀態下，藉由加壓或是更進一步加熱而形成。壓力只要對被黏著體不會造成損傷之範圍即可，並無特別限制，一般較佳為0.1~10MPa。加熱溫度並無特別限制，一般較佳為100~250℃。這些加壓及加熱，較佳係於0.5秒~120秒間的範圍內進行，亦可於140~200℃、3MPa、10秒的加熱下予以黏著。
實施例
以下係根據實施例及比較例更具體地說明本發明，但本發明並不限定於以下的實施例。
[1,3,5-三(3-氫硫基丁基氧基乙基)-1,3,5-三氮雜苯- 2,4,6(1H,3H,5H)-三酮之合成]
將1,3,5-三(2-羥乙基)-1,3,5-三氮雜苯-2,4,6(1H,3H,5H)-三酮120mmol(31.35g)、3-氫硫基丁酸(淀化學股份有限公司製)378mmol(45.42g)、對甲苯磺酸．1水合物(純正化學股份有限公司製)8.1mmol(1.51g)、及甲苯63g，裝入於100ml的茄形燒瓶內，並安裝Dean-Stark裝置及冷卻管。一邊攪拌內容物，一邊以油浴溫度140℃進行加熱並進行4小時的反應。之後放置冷卻，以10%碳酸氫鈉水溶液100ml來中和反應液。再以離子交換水將反應液洗淨3次後，以無水硫酸鎂(純正化學股份有限公司製)進行脫水．乾燥。之後餾除甲苯，而製得1,3,5-三(3-氫硫基丁基氧基乙基)-1,3,5-三氮雜苯-2,4,6(1H,3H,5H)-三酮(上述以式(1)所表示之具有硫醇基的化合物)。所製得之化合物為高黏度的無色透明液體。
[新戊四醇四(3-氫硫丁酸酯)之合成]
將2,2-雙(羥甲基)1,2-丙二醇(新戊四醇、廣榮化學工業股份有限公司製)60mmol(8.17g)、3-氫硫基丁酸(淀化學股份有限公司製)252mmol(30.28g)、對甲苯磺酸．1水合物(純正化學股份有限公司製)5.2mmol(0.98g)、及甲苯40g，裝入於100ml的茄形燒瓶內，並安裝Dean-Stark裝置及冷卻管。一邊攪拌內容物，一邊以油浴溫度140℃進行加熱並進行4小時的反應。之後放 置冷卻，以10%碳酸氫鈉水溶液100ml來中和反應液。再以離子交換水將反應液洗淨3次後，以無水硫酸鎂(純正化學股份有限公司製)進行脫水．乾燥。之後餾除甲苯，而製得新戊四醇四(3-氫硫丁酸酯)(上述以式(2)所表示之具有硫醇基的化合物)。所製得之化合物為高黏度的無色透明液體。
[實施例1]
將使作為熱可塑性樹脂之雙酚A．F共聚合型苯氧樹脂(ZX-1356-2、東都化成製)溶解於甲苯/醋酸乙酯=50/50之混合溶劑而得之40重量%的溶液，調配87.5重量份(固形分換算為35重量份)，將使聚胺甲酸酯樹脂(T-6075N、DIC Bayer Polymer股份有限公司製)溶解於丁酮而得之15重量%的溶液，調配100重量份(固形分換算為15重量份)，將使苯乙烯-順丁烯二酸酐共聚物(D-250、Nova Chemical Japan股份有限公司製)溶解於甲苯而得之20重量%的溶液，調配25重量份(固形分換算為5重量份)，將使作為自由基聚合性物質之丙烯酸胺甲酸酯低聚物(UA5500T、新中村化學製)的甲苯溶解品70重量%的溶液，調配42.86重量份(非揮發分換算為30重量份)，將二環戊二烯型二丙烯酸酯(DCP-A、東亞合成製)調配15重量份，將2-甲基丙烯醯氧基磷酸乙酯(P-2M、共榮社化學製)調配3重量份，將使作為具有2級硫醇基的化合物之1,3,5-三(3-氫硫基丁基氧基乙基)- 1,3,5-三氮雜苯-2,4,6(1H,3H,5H)-三酮(分子量567.7)調配2重量份，將使作為產生游離自由基的硬化劑之2,5-二甲基-2,5-二(2-乙基己醯基)己烷酯(Perhexa 25O、日本油脂股份有限公司製)調配4重量份(Perhexa 25O為50%溶液，2,5-二甲基-2,5-二(2-乙基己醯基)己烷酯的實際調配量為8重量份)，然後再將具有毛球狀的表面形狀之平均粒徑2~3.3μm之Ni粉體調配5重量份。藉由塗佈機將此混合溶液塗佈於PET薄膜上，於70℃進行10分鐘的熱風乾燥，藉此製得黏著的厚度為35μm之電路連接材料。
[實施例2]
除了使用新戊四醇四(3-氫硫丁酸酯)(分子量：544.77)2重量份來取代1,3,5-三(3-氫硫基丁基氧基乙基)-1,3,5-三氮雜苯-2,4,6(1H,3H,5H)-三酮之外，其他與實施例1相同而製得電路連接材料。
[實施例3]
除了將1,3,5-三(3-氫硫基丁基氧基乙基)-1,3,5-三氮雜苯-2,4,6(1H,3H,5H)-三酮(分子量567.7)的使用量設定為3重量份之外，其他與實施例1相同而製得電路連接材料。
[比較例1]
除了未使用具有2級硫醇基的化合物之外，其他與實施例1相同而製得電路連接材料。
[比較例2]
除了使用具有1級硫醇基的化合物之三[(3-氫硫基丙醯氧基)-乙基]異氰尿酸酯(TEMPIC、分子量：525.62、堺化學工業股份有限公司製)2重量份來取代1,3,5-三(3-氫硫基丁基氧基乙基)-1,3,5-三氮雜苯-2,4,6(1H,3H,5H)-三酮之外，其他與實施例1相同而製得電路連接材料。
[比較例3]
除了使用具有1級硫醇基的化合物之新戊四醇四(3-氫硫丙酸酯)(PEMP、分子量：488.66、堺化學工業股份有限公司製)2重量份來取代1,3,5-三(3-氫硫基丁基氧基乙基)-1,3,5-三氮雜苯-2,4,6(1H,3H,5H)-三酮之外，其他與實施例1相同而製得電路連接材料。
[比較例4]
除了使用具有3級硫醇基的化合物之乙二醇雙(2-氫硫異丁酸酯)(EGMIB、依循日本特開2004-149755號公報所記載之合成法進行合成、分子量：266.83)2重量份來取代1,3,5-三(3-氫硫基丁基氧基乙基)-1,3,5-三氮雜苯-2,4,6(1H,3H,5H)-三酮之外，其他與實施例1相同而 製得電路連接材料。
[比較例5]
除了使用二硫化物之二苯二硫化物(住友精化股份有限公司製、分子量：218.34)2重量份來取代1,3,5-三(3-氫硫基丁基氧基乙基)-1,3,5-三氮雜苯-2,4,6(1H,3H,5H)-三酮之外，其他與實施例1相同而製得電路連接材料。
[連接構造體之製作(COF與PWB之連接)]
使用實施例1~3及比較例1~5的各電路連接材料，將具有直接形成於厚度38μm的聚醯亞胺上之線寬100μm、間距200μm、厚度8μm的銅電路之軟性電路板(COF-TEG)，與形成有線寬100μm、間距200μm、厚度35μm的銅電路之玻璃環氧多層印刷配線基板(PWB-TEG)，以120℃-2MPa-10秒、寬度2.0mm來進行連接。此時，於玻璃環氧多層印刷配線基板上貼附電路連接材料的黏著面後，於70℃、1MPa進行3秒的加熱加壓予以暫時連接，之後剝離PET薄膜而與COF-TEG連接。於上述步驟中，係根據有無臭氣來評估各電路連接材料的作業性及處理性。所得之結果如第1表所示。
[黏著強度的測定]
對所製作之電路構件的連接構造，係以剝離速度 50mm/min來測定90℃下進行剝離時之黏著強度。測定係分別對初期的電路連接材料，以及於40℃進行5天的處理後之電路連接材料來進行。所得之結果如第1表所示。
[連接電阻的測定]
於電路的連接後，對初期的電路連接材料，以及於40℃進行5天的處理後之電路連接材料，藉由萬用電表來測定其包含上述連接部之FPC-PWB的鄰接電路間之電阻值。電阻值係設定為鄰接電路間的電阻值150點之x+3 σ。於40℃進行5天的處理後之電阻相對於初期電阻之上升倍率為1.2倍以內者，將其保存安定性設定為良好水準。所得之結果如第1表所示。
如第1表所示，於實施例1~3中，於初期以及40℃、5天處理後，均可達成黏著力與電阻兩者的並存。另 一方面，於比較例1、4、5時，從初期開始其黏著力即較低。比較例4、5之較低的黏著力者，可考量為3級硫醇或二硫化二苯的立體阻礙較大，而缺乏作為連鎖移動劑的反應性之故。此外，於比較例2、3中，40℃、5天處理後之電阻值的上升倍率超過1.2倍，導致保存安定性惡化之結果。
1‧‧‧連接構造體
7‧‧‧導電性粒子
10‧‧‧黏著層
11‧‧‧絕緣層
20‧‧‧第一電路構件
21‧‧‧第一電路基板
22‧‧‧第一電路電極(第一連接端子)
30‧‧‧第二電路構件
31‧‧‧第二電路基板
32‧‧‧第二電路電極(第二連接端子)
第1圖為顯示連接構造體的一實施型態之模式剖面圖。
1‧‧‧連接構造體
7‧‧‧導電性粒子
10‧‧‧黏著層
11‧‧‧絕緣層
20‧‧‧第一電路構件
21‧‧‧第一電路基板
21a‧‧‧第一電路基板的主面
22‧‧‧第一電路電極(第一連接端子)
30‧‧‧第二電路構件
31‧‧‧第二電路基板
31a‧‧‧第二電路基板的主面
32‧‧‧第二電路電極(第二連接端子)

Claims (6)

  1. 一種電路連接材料，其係將第一基板之主面上形成第一電路電極之第一電路構件與第二基板之主面上形成第二電路電極之第二電路構件，在使前述第一電路電極及前述第二電路電極予以對向配置的狀態下，進行連接用的電路連接材料，其特徵係含有產生游離自由基的硬化劑、自由基聚合性物質、具有2級硫醇基的化合物，前述具有2級硫醇基的化合物之分子量為400以上，未達2000。
  2. 如申請專利範圍第1項之電路連接材料，其中前述具有2級硫醇基的化合物之硫醇當量為50以上，未達500。
  3. 如申請專利範圍第1項之電路連接材料，其係再含有導電性粒子。
  4. 如申請專利範圍第1項之電路連接材料，其係再含有熱可塑性樹脂。
  5. 一種連接構造體，其特徵係具備：在第一基板之主面上形成第一電路電極之第一電路構件；在第二基板之主面上形成第二電路電極，且前述第二電路電極與前述第一電路電極予以相對向進行配置之第二電路構件；被設置於前述第一電路構件與前述第二電路構件之間，且將前述第一電路構件與前述第二電路構件進行電連接的黏著層；前述黏著層為將申請專利範圍第1~3項中任一項之電路連接材料介於前述第一電路構件與前述第二電路構件 之間，在該狀態下藉由加壓所形成者。
  6. 一種連接構造體之製造方法，其特徵係具備：將在第一基板之主面上形成第一電路電極之第一電路構件與在第二基板之主面上形成第二電路電極之第二電路構件，使前述第一電路電極與前述第二電路電極予以相對向進行配置，將申請專利範圍第1或2項之電路連接材料介於前述第一電路構件與前述第二電路構件之間，該狀態下，藉由加壓，將前述第一電路電極與前述第二電路電極進行電連接的步驟。
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