JP2012146988A - 回路接続材料、接続構造体及びその製造方法 - Google Patents
回路接続材料、接続構造体及びその製造方法 Download PDFInfo
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- JP2012146988A JP2012146988A JP2012029822A JP2012029822A JP2012146988A JP 2012146988 A JP2012146988 A JP 2012146988A JP 2012029822 A JP2012029822 A JP 2012029822A JP 2012029822 A JP2012029822 A JP 2012029822A JP 2012146988 A JP2012146988 A JP 2012146988A
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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Abstract
低温短時間硬化が可能で、かつ保存安定性に優れる回路接続用材料を提供すること。
【解決手段】
第一の基板の主面上に第一の回路電極が形成された第一の回路部材と、第二の基板の主面上に第二の回路電極が形成された第二の回路部材とを、前記第一の回路電極及び前記第二の回路電極を対向配置させた状態で接続するための回路接続材料であって、遊離ラジカルを発生する硬化剤と、ラジカル重合成物質と、2級チオール基を有する化合物とを含有し、2級チオール基を有する化合物の分子量が400以上2000未満である、回路接続材料。
【選択図】なし
Description
[GPC条件]
使用機器:日立L−6000 型〔(株)日立製作所]、カラム :ゲルパックGL−R420+ゲルパックGL−R430+ゲルパックGL−R440(計3本)〔日立化成工業(株)製商品名]、溶離液:テトラヒドロフラン、測定温度:40℃、流量:1.75ml/min、検出器:L−3300RI〔(株)日立製作所]
1,3,5−トリス(2−ヒドロキシエチル)−1,3,5−トリアジン−2,4,6−(1H,3H,5H)−トリオン120mmol(31.35g)、3−メルカプト酪酸(淀化学(株)製)378mmol(45.42g)、p−トルエンスルホン酸・1水和物(純正化学(株)製)8.1mmol(1.51g)、及び、トルエン63gを100mlナスフラスコに仕込み、Dean−Stark装置及び冷却管を装着した。内容物を撹拌しながらオイルバス温度140℃で加熱して4時間反応させた。その後放冷し、10%炭酸水素ナトリウム水溶液100mlで、反応液を中和した。さらに反応液をイオン交換水にて3回洗浄した後、無水硫酸マグネシウム(純正化学(株)製)にて脱水・乾燥を行った。次にトルエンを留去し、1,3,5−トリス(3−メルカプトブチルオキシエチル)−1,3,5−トリアジン−2,4,6(1H,3H,5H)−トリオン(上記式(1)で表される、チオール基を有する化合物)を得た。得られた化合物は高粘度の無色透明の液体であった。
2,2−ビス(ヒドロキシメチル)1,2−プロパンジオール(ペンタエリストール、広栄化学工業(株)製)60mmol(8.17g)、3−メルカプト酪酸(淀化学(株)製)252mmol(30.28g)、p−トルエンスルホン酸・1水和物(純正化学(株)製)5.2mmol(0.98g)、及び、トルエン40gを100mlナスフラスコに仕込み、Dean−Stark装置及び冷却管を装着した。内容物を撹拌しながらオイルバス温度140℃で加熱して4時間反応させた。その後放冷し、10%炭酸水素ナトリウム水溶液100mlで、反応液を中和した。さらに反応液をイオン交換水にて3回洗浄した後、無水硫酸マグネシウム(純正化学(株)製)にて脱水・乾燥を行った。次にトルエンを留去し、ペンタエリストール テトラキス(3−メルカプトブチレート)(上記式(2)で表される、チオール基を有する化合物)を得た。得られた化合物は高粘度の無色透明の液体であった。
熱可塑性樹脂としてビスフェノールA・F共重合型フェノキシ樹脂(ZX−1356−2, 東都化成製)をトルエン/酢酸エチル=50/50の混合溶媒に溶解して得られた40重量%溶液を87.5重量部(固形分換算で35重量部)、ポリウレタン樹脂(T−6075N、ディーアイシーバイエル ポリマー(株)製)をメチルエチルケトンに溶解して得られた15重量%溶液を100重量部(固形分換算で15重量部)、スチレンー無水マレイン酸共重合体(D−250、ノヴァケミカル・ジャパン(株)製)をトルエンに溶解して得られた20重量%溶液を25重量部(固形分換算で5重量部)、ラジカル重合性物質として、ウレタンアクリレートオリゴマー(UA5500T、新中村化学製)のトルエン溶解品70重量%溶液を42.86重量部(不揮発分換算で30重量部)、ジシクロペンタジエン型ジアクリレート(DCP−A、東亞合成製)を15重量部、2−メタクリロイロキシエチルアシッドホスフェート(P−2M、共栄社化学製)を3重量部、2級チオール基を有する化合物として1,3,5−トリス(3−メルカプトブチルオキシエチル)−1,3,5−トリアジン−2,4,6(1H,3H,5H)−トリオン(分子量567.7)を2重量部、遊離ラジカルを発生する硬化剤として、2,5−ジメチル−2,5−ジ(2−エチルヘキサノイル)ヘキサン(パーヘキサ25O,日本油脂(株)製)を4重量部(パーヘキサ25Oは50%溶液であり、2,5−ジメチル−2,5−ジ(2−エチルヘキサノイル)ヘキサンの実際の配合は8重量部)配合し、さらに、毬栗状の表面形状を有する、平均粒径2〜3.3μmのNi粉体を5重量部配合した。この混合溶液をアプリケータでPETフィルム上に塗布し、70℃10分の熱風乾燥により、接着剤層の厚み35μmの回路接続材料を得た。
1,3,5−トリス(3−メルカプトブチルオキシエチル)−1,3,5−トリアジン−2,4,6(1H,3H,5H)−トリオンに代えてペンタエリストール テトラキス(3−メルカプトブチレート)(分子量:544.77)2重量部を用いたこと以外は、実施例1と同様にして回路接続材料を得た。
1,3,5−トリス(3−メルカプトブチルオキシエチル)−1,3,5−トリアジン−2,4,6(1H,3H,5H)−トリオン(分子量567.7)の使用量を3重量部としたこと以外は、実施例1と同様にして回路接続材料を得た。
2級チオール基を有する化合物を用いなかったこと以外は、実施例1と同様にして回路接続材料を得た。
1,3,5−トリス(3−メルカプトブチルオキシエチル)−1,3,5−トリアジン−2,4,6(1H,3H,5H)−トリオンに代えて、1級チオール基を有する化合物であるトリス[(3−メルカプトプロピオニロキシ)−エチル]イソシアヌレート(TEMPIC、分子量:525.62、堺化学工業(株)製)2重量部を用いたこと以外は、実施例1と同様にして回路接続材料を得た。
1,3,5−トリス(3−メルカプトブチルオキシエチル)−1,3,5−トリアジン−2,4,6(1H,3H,5H)−トリオンに代えて、1級チオール基を有する化合物であるペンタエリスリトールテトラキス(3−メルカプトプロピオネート)(PEMP、分子量:488.66、堺化学工業(株)製)2重量部を用いたこと以外は、実施例1と同様にして回路接続材料を得た。
1,3,5−トリス(3−メルカプトブチルオキシエチル)−1,3,5−トリアジン−2,4,6(1H,3H,5H)−トリオンに代えて、3級チオール基を有する化合物であるエチレングリコールビス(2−メルカプトイソブチレート)(EGMIB、特開2004−149755号公報に記載の合成法に従い合成、分子量:266.38)2重量部を用いたこと以外は、実施例1と同様にして回路接続材料を得た。
1,3,5−トリス(3−メルカプトブチルオキシエチル)−1,3,5−トリアジン−2,4,6(1H,3H,5H)−トリオンに代えて、ジスルフィド化合物であるジフェニルジスルフィド(住友精化(株)製、分子量:218.34)2重量部を用いたこと以外は、実施例1と同様にして回路接続材料を得た。
実施例1〜3及び比較例1〜5の各回路接続材料を用いて、厚み38μmのポリイミド上に直接形成された、ライン幅100μm、ピッチ200μm、厚み8μmの銅回路を有するフレキシブル回路板(COF−TEG)と、ライン幅100μm、ピッチ200μm、厚み35μmの銅回路を形成したガラスエポキシ多層プリント配線板(PWB−TEG)上とを、120℃−2MPa−10秒、幅2.0mmで接続した。この際、ガラスエポキシ多層プリント配線版上に、回路接続材料の接着面を貼り付けた後、70℃、1MPa,3秒間加熱加圧して仮接続し、その後、PETフィルムを剥離してCOF−TEGと接続した。上記の工程において、臭気の有無に基づき、各回路接続材料の作業性及び取扱性を評価した。得られた結果を表1に示す。
作製した回路部材の接続構造について、90°で剥離するときの接着強度を、剥離速度50mm/minで測定した。測定は、初期の回路接続材料、及び40℃で5日処理した後の回路接続材料のそれぞれについて行った。得られた結果を表1に示す。
回路の接続後、上記接続部を含むFPC−PWBの隣接回路間の抵抗値を初期と、回路接続材料を40℃で5日処理した後に、マルチメーターで測定した。抵抗値は隣接回路間の抵抗値150点のx+3σとした。初期抵抗に対する40℃5日処理後の抵抗の上昇倍率が1.2倍以内を保存安定性が良好なレベルとした。得られた結果を表1に示す。
Claims (4)
- 第一の基板の主面上に第一の回路電極が形成された第一の回路部材と、第二の基板の主面上に第二の回路電極が形成された第二の回路部材とを、前記第一の回路電極及び前記第二の回路電極を対向配置させた状態で接続するための回路接続材料であって、
遊離ラジカルを発生する硬化剤と、ラジカル重合成物質と、2級チオール基を有する化合物とを含有し、
前記2級チオール基を有する化合物の分子量が400以上2000未満である、回路接続材料。 - 導電性粒子をさらに含有する、請求項1に記載の回路接続材料。
- 第一の基板の主面上に第一の回路電極が形成された第一の回路部材と、
第二の基板の主面上に第二の回路電極が形成され、前記第二の回路電極と前記第一の回路電極とが対向するように配置された第二の回路部材と、
前記第一の回路部材と前記第二の回路部材との間に設けられ、前記第一の回路部材と前記第二の回路部材とを電気的に接続する接着層と、を備え、
前記接着層が、前記第一の回路部材と前記第二の回路部材との間に請求項1又は2に記載の回路接続材料を介在させ、その状態で加圧することにより形成されたものである接続構造体。 - 第一の基板の主面上に第一の回路電極が形成された第一の回路部材と、第二の基板の主面上に第二の回路電極が形成された第二の回路部材とを、前記第一の回路電極と前記第二の回路電極が相対向するように配置し、前記第一の回路部材と前記第二の回路部材との間に請求項1又は2記載の回路接続材料を介在させ、その状態で加圧することにより前記第一の回路電極と前記第二の回路電極とを電気的に接続する工程を備える接続構造体の製造方法。
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TWI480356B (zh) | 2015-04-11 |
US20100307805A1 (en) | 2010-12-09 |
WO2009057376A1 (ja) | 2009-05-07 |
KR20100019506A (ko) | 2010-02-18 |
TW201300494A (zh) | 2013-01-01 |
KR101145605B1 (ko) | 2012-05-16 |
EP2206756A1 (en) | 2010-07-14 |
CN104851474A (zh) | 2015-08-19 |
KR101238178B1 (ko) | 2013-02-28 |
TWI391465B (zh) | 2013-04-01 |
CN101835859A (zh) | 2010-09-15 |
JP5152191B2 (ja) | 2013-02-27 |
JP5348261B2 (ja) | 2013-11-20 |
KR20120027061A (ko) | 2012-03-20 |
CN101835859B (zh) | 2015-04-08 |
JPWO2009057376A1 (ja) | 2011-03-10 |
TW200932869A (en) | 2009-08-01 |
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