TW201300195A - Apparatus for rotation and revolution of polishing plate and polishing plate operating method using the same - Google Patents

Apparatus for rotation and revolution of polishing plate and polishing plate operating method using the same Download PDF

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Publication number
TW201300195A
TW201300195A TW101121533A TW101121533A TW201300195A TW 201300195 A TW201300195 A TW 201300195A TW 101121533 A TW101121533 A TW 101121533A TW 101121533 A TW101121533 A TW 101121533A TW 201300195 A TW201300195 A TW 201300195A
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Taiwan
Prior art keywords
gear
polishing plate
revolving
cylindrical member
driving force
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TW101121533A
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Chinese (zh)
Inventor
Koo-Ho Ma
Byung-Kyu Park
Wook Jeong
De-Yeon Lee
Jae-Ik Song
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Lg Chemical Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/242Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
    • B24B7/245Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass discontinuous
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/04Headstocks; Working-spindles; Features relating thereto
    • B24B41/047Grinding heads for working on plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/10Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

An apparatus for rotation and revolution of a polishing plate may enhance a polishing rate of a glass substrate since the polishing plate may rotate and revolve simultaneously.

Description

用於拋光板自轉及公轉之裝置以及使用其之拋光板 操作方法 Device for polishing and revolving of polishing plate and polishing plate using same Method of operation

本申請案依35 USC 119(a),優先權追溯至於2011年6月16日向韓國專利局提出之韓國專利第10-2011-0058532號申請案,其中該案所揭露之內容全部併入本案參考。 The application is based on 35 USC 119(a), the priority of which is the Korean Patent No. 10-2011-0058532 filed on June 16, 2011, to the Korean Patent Office, the disclosure of which is incorporated herein by reference. .

本發明係有關於一種用於拋光板自轉及公轉之裝置以及使用其之拋光板操作方法,特別係指一種藉由讓拋光板自轉及公轉而增強玻璃基板拋光率之拋光板自轉及公轉裝置以及使用其之拋光板操作方法。 The present invention relates to a device for rotating and revolving a polishing plate and a polishing plate using the same, and particularly to a polishing plate rotation and revolving device for enhancing the polishing rate of a glass substrate by rotating and rotating the polishing plate and Use its polishing plate method of operation.

一般而言,對應用在液晶顯示器上的玻璃基板來說,為了精確地表現影像,保持某種程度上的平坦度是非常重要的。因此,在玻璃基板表面上,細部的不均勻或起伏都應該藉由拋光程序來移除。 In general, for a glass substrate applied to a liquid crystal display, it is very important to maintain a certain degree of flatness in order to accurately represent an image. Therefore, unevenness or undulation of the details on the surface of the glass substrate should be removed by a polishing process.

玻璃基板的拋光程序可分為將各個玻璃基板一個接著一個拋光的所謂「奧斯卡」(Oscar)方法以及將一連串玻璃基板連續地拋光的所謂「直排」(inline)方法。拋光程序亦可分為只拋光玻璃基板一面的「單面拋光」(single surface polishing)以及兩面玻璃基板都拋光的「雙面拋光」(both surface polishing)。 The polishing process of the glass substrate can be divided into a so-called "Oscar" method in which each glass substrate is polished one by one, and a so-called "inline" method in which a series of glass substrates are continuously polished. The polishing process can also be divided into "single surface polishing" which polishes only one side of the glass substrate and "both surface polishing" which is polished on both sides of the glass substrate.

參考圖1,其顯示一習知玻璃基板拋光裝置,在玻璃基板G由載體4維持於較低板2上的情況下,拋光裝置10帶來設 置有拋光墊6的一較高板8(或拋光板),至與玻璃基板G接觸,並於旋轉拋光板8的同時,在拋光板8與玻璃基板G之間提供拋光液,進而研磨該玻璃基板G。為此,拋光裝置10使用形成於拋光板8內的複數個槽8a以及設置於拋光板8上方與拋光板8分隔開來的軟管3,藉由自由落體的方式提供拋光液。 Referring to Figure 1, there is shown a conventional glass substrate polishing apparatus in which the polishing apparatus 10 is provided with the glass substrate G held by the carrier 4 on the lower plate 2. A higher plate 8 (or polishing plate) provided with the polishing pad 6 is brought into contact with the glass substrate G, and while the polishing plate 8 is rotated, a polishing liquid is supplied between the polishing plate 8 and the glass substrate G, and the polishing is further performed. Glass substrate G. To this end, the polishing apparatus 10 uses a plurality of grooves 8a formed in the polishing plate 8 and a hose 3 disposed above the polishing plate 8 and separated from the polishing plate 8, to provide a polishing liquid by free fall.

拋光板8藉由傳輸自主軸7的旋轉力而自轉。然而,因為只有拋光板8進行自轉,在增加玻璃基板G的拋光率上將有所限制。 The polishing plate 8 is rotated by transmitting the rotational force of the autonomous shaft 7. However, since only the polishing plate 8 is rotated, there is a limit in increasing the polishing rate of the glass substrate G.

本發明致力於解決先前技術之問題,因此,本發明之一目的係提供一種可讓拋光板(或主軸)自轉及公轉的裝置,以及使用其之拋光板操作方法。 SUMMARY OF THE INVENTION The present invention has been made in an effort to solve the problems of the prior art, and it is therefore an object of the present invention to provide a device for allowing a polishing plate (or spindle) to rotate and revolve, and a polishing plate operating method using the same.

本發明之另一目的係提供一種可增加玻璃基板拋光率之裝置以及使用其之拋光板操作方法。 Another object of the present invention is to provide an apparatus which can increase the polishing rate of a glass substrate and a polishing apparatus using the same.

一方面,本發明提供了一種用於拋光板自轉及公轉之裝置,其包含:一圓柱構件(20),其具有沿著長度方向形成之一中空區並於外側圓周面形成之一外環齒輪(26);一主軸(50),沿著該長度方向設置於該中空區內並藉由該圓柱構件(20)之支持而於該圓柱構件之中心軸偏心處自轉,且一軸齒輪(51)設置於該主軸(50)之外緣,該主軸(50)連接有一拋光板;以及一環齒輪(60),具有一內齒輪(61)形成於其內圓周面上以及一外齒輪(62)形成於其外圓周面上,該內齒輪(61) 係設置齧合於該軸齒輪(51)。當一驅動力傳輸到該圓柱構件(20)的情況下,會使得該圓柱構件(20)自轉,而該主軸(50)以偏心的方式公轉於該中空區,且是在該軸齒輪(51)與該內齒輪(61)齧合的情況下產生公轉。 In one aspect, the present invention provides an apparatus for spinning and revolving a polishing plate, comprising: a cylindrical member (20) having a hollow region formed along a length direction and an outer ring gear formed on an outer circumferential surface (26); a main shaft (50) disposed along the length direction in the hollow region and supported by the cylindrical member (20) to rotate at an eccentricity of a central axis of the cylindrical member, and a shaft gear (51) Arranging on the outer edge of the main shaft (50), the main shaft (50) is connected with a polishing plate; and a ring gear (60) having an internal gear (61) formed on the inner circumferential surface thereof and an outer gear (62) formed On the outer circumferential surface, the internal gear (61) The set is engaged with the shaft gear (51). When a driving force is transmitted to the cylindrical member (20), the cylindrical member (20) is caused to rotate, and the main shaft (50) revolves in an eccentric manner to the hollow portion, and the shaft gear (51) Rotation occurs in the case of meshing with the internal gear (61).

此時,在驅動力傳輸到外齒輪(62)而使環齒輪(60)自轉的情況下,軸齒輪(51)會自轉。 At this time, in the case where the driving force is transmitted to the external gear (62) and the ring gear (60) is rotated, the shaft gear (51) rotates.

環齒輪(60)可藉由使用傳輸自一自轉馬達的驅動力而自轉,而圓柱構件(20)可藉由使用傳輸自一公轉馬達的驅動力而旋轉。 The ring gear (60) can be rotated by using a driving force transmitted from a rotation motor, and the cylindrical member (20) can be rotated by using a driving force transmitted from a revolving motor.

此外,可安裝複數個齒輪(71)、(72)、(73)、(74)和(75)於環齒輪(60)和自轉馬達之間,以容許自轉馬達驅動力之傳輸,且使齒輪減速比為可調整。 In addition, a plurality of gears (71), (72), (73), (74), and (75) may be mounted between the ring gear (60) and the rotation motor to allow transmission of the driving force of the rotation motor, and the gear is made The reduction ratio is adjustable.

此外,可安裝複數個齒輪(22)、(23)和(24)於外環齒輪(26)和公轉馬達之間,以容許公轉馬達驅動力之傳輸,且使齒輪減速比為可調整。 In addition, a plurality of gears (22), (23), and (24) may be mounted between the outer ring gear (26) and the revolving motor to allow transmission of the driving force of the revolving motor, and the gear reduction ratio is adjustable.

同時,在另一方面,本發明也提供使用拋光板旋轉和公轉之裝置的拋光板操作方法,其中用於拋光一玻璃基板之拋光板藉由迫使連接於拋光板的主軸(50)進行自轉及公轉,而同時自轉及公轉。 Meanwhile, in another aspect, the present invention also provides a polishing plate operation method using a device for rotating and revolving a polishing plate, wherein a polishing plate for polishing a glass substrate is rotated by forcing a spindle (50) connected to the polishing plate and Revolution, while at the same time rotating and revolving.

使用於上述方法之裝置可包括:一圓柱構件(20),其具有沿著長度方向形成之一中空區並於外側圓周面形成之一外環齒輪(26);一主軸(50),沿著該長度方向設置於該中空區內並藉由該圓柱構件(20)之支持而於該圓柱構件之中心軸偏心處自轉,且一軸齒輪(51)設置於該主軸(50)之外 緣,該主軸(50)連接有一拋光板;以及一環齒輪(60),具有一內齒輪(61)形成於其內圓周面上及一外齒輪(62)形成於其外圓周面上,該內齒輪(61)係設置齧合於該軸齒輪(51)。當該圓柱構件(20)藉由一驅動力自轉時,該主軸(50)以偏心的方式公轉於該中空區,且是在該軸齒輪(51)與該內齒輪(61)齧合的情況下產生公轉。此外,在一驅動力傳輸到該外齒輪(62)的情況下,會使得該環齒輪自轉,(60)並使得該軸齒輪(51)自轉。 The apparatus for use in the above method may include: a cylindrical member (20) having a hollow portion formed along the length direction and an outer ring gear (26) formed on the outer circumferential surface; a main shaft (50) along The length direction is disposed in the hollow region and is rotated by the central member of the cylindrical member by the support of the cylindrical member (20), and the shaft gear (51) is disposed outside the main shaft (50) a spindle (50) is coupled to a polishing plate; and a ring gear (60) having an internal gear (61) formed on an inner circumferential surface thereof and an external gear (62) formed on an outer circumferential surface thereof. A gear (61) is provided to be meshed with the shaft gear (51). When the cylindrical member (20) is rotated by a driving force, the main shaft (50) revolves in an eccentric manner to the hollow portion, and the shaft gear (51) is engaged with the internal gear (61). A revolution occurs. Further, in the case where a driving force is transmitted to the external gear (62), the ring gear is caused to rotate, (60) and the shaft gear (51) is rotated.

該自轉之驅動力可傳自於一自轉馬達,而該公轉之驅動力可傳自於一公轉馬達,複數個齒輪(71)、(72)、(73)、(74)及(75)係設置於該環齒輪(60)與該自轉馬達之間,以容許該自轉馬達驅動力之傳輸,且使齒輪減速比為可調整,而複數個齒輪(22)、(23)及(24)係設置於該外環齒輪(26)與該公轉馬達之間,以容許該自轉馬達驅動力之傳輸,且使齒輪減速比為可調整。 The driving force of the rotation can be transmitted from a rotation motor, and the driving force of the revolution can be transmitted from a revolution motor, a plurality of gears (71), (72), (73), (74) and (75) Provided between the ring gear (60) and the rotation motor to allow transmission of the driving force of the rotation motor, and the gear reduction ratio is adjustable, and the plurality of gears (22), (23) and (24) It is disposed between the outer ring gear (26) and the revolving motor to allow transmission of the driving force of the anti-rotation motor, and the gear reduction ratio is adjustable.

根據本發明之用於拋光板自轉及公轉之裝置以及使用其之拋光板操作方法有以下效果。 The apparatus for rotating and revolving the polishing plate according to the present invention and the polishing plate operating method using the same have the following effects.

首先,拋光板(或主軸)可同時自轉及公轉。 First, the polishing plate (or spindle) can rotate and revolve at the same time.

再者,玻璃基板拋光率可藉由容許拋光板(或主軸)同時自轉及公轉而增加。 Furthermore, the polishing rate of the glass substrate can be increased by allowing the polishing plate (or spindle) to simultaneously rotate and revolve.

以下,請參考所附圖示並將更詳細描述本發明之較佳實施例。在先前的描述中,應該可以理解,在說明書中所 使用的名詞及所附專利範圍,不應限於一般及字典之含義解釋,但基於相應本發明原則之技術方面意義及概念,發明人允許適當地將名詞定義為最好的解釋。因此,本文提出的描述僅僅為了描述目的而提出之較佳範例,並非用以限制本發明之範圍,所以應該理解可在不違背本發明精神及範圍的前提下達到其他等價的修改。 Hereinafter, the preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings. In the previous description, it should be understood that in the specification The nouns used and the scope of the accompanying patents are not to be construed as limited to the meaning of the general and dictionary, but the inventor allows the proper definition of the term as the best explanation based on the technical meaning and concept of the corresponding principles of the present invention. Therefore, the descriptions of the present invention are intended to be illustrative only, and are not intended to limit the scope of the present invention, and it should be understood that other equivalent modifications may be made without departing from the spirit and scope of the invention.

圖2是說明根據本發明一較佳實施例之用於拋光板自轉及公轉之裝置之立體圖。 2 is a perspective view illustrating an apparatus for rotating and revolving a polishing plate in accordance with a preferred embodiment of the present invention.

參照圖2,裝置100包括用於使主軸50公轉的公轉單元,以及用於使主軸50自轉的自轉單元。 Referring to Fig. 2, the apparatus 100 includes a revolving unit for revolving the main shaft 50, and a rotation unit for rotating the main shaft 50.

同時,主軸50連接於拋光板8(見圖1)(圖2未示出)。因此,在本發明中,如果主軸50自轉,拋光板8亦自轉。此外,如果主軸50公轉,拋光板8亦公轉。再者,如果主軸50同時自轉及公轉,拋光板8亦同時自轉及公轉。因此,在本發明中,主軸50的自轉就代表拋光板8的自轉,主軸50的公轉就代表拋光板8的公轉。 At the same time, the main shaft 50 is coupled to the polishing plate 8 (see Fig. 1) (not shown in Fig. 2). Therefore, in the present invention, if the spindle 50 is rotated, the polishing plate 8 also rotates. In addition, if the spindle is 50 revolutions, the polishing plate 8 also revolves. Furthermore, if the spindle 50 rotates and revolves at the same time, the polishing plate 8 also rotates and revolves at the same time. Therefore, in the present invention, the rotation of the spindle 50 represents the rotation of the polishing plate 8, and the revolution of the spindle 50 represents the revolution of the polishing plate 8.

公轉單元包括一圓柱構件20、一公轉馬達21用於提供驅動力以容許圓柱構件20旋轉、以及複數個齒輪22、23、24,其係用於傳輸自公轉馬達21至圓柱構件20的驅動力。公轉單元允許主軸50穿過圓柱構件20而設置,並基於圓柱構件20的中心而公轉。 The revolution unit includes a cylindrical member 20, a revolving motor 21 for providing a driving force to allow the cylindrical member 20 to rotate, and a plurality of gears 22, 23, 24 for transmitting the driving force from the revolving motor 21 to the cylindrical member 20. . The revolution unit allows the main shaft 50 to be disposed through the cylindrical member 20 and revolves based on the center of the cylindrical member 20.

如圖4所示,圓柱構件20包括沿著其長度方向形成的一中空區25、設置於其外緣的外環齒輪26,以及用於支撐主軸50的軸承27。圓柱構件20係固定於框架30中。 As shown in FIG. 4, the cylindrical member 20 includes a hollow portion 25 formed along its length direction, an outer ring gear 26 disposed at an outer edge thereof, and a bearing 27 for supporting the main shaft 50. The cylindrical member 20 is fixed in the frame 30.

中空區25係透過圓柱構件20並沿著圓柱構件20的長度方向而形成,且外環齒輪26接收來自公轉馬達21驅動力而旋轉。 The hollow region 25 is formed through the cylindrical member 20 and along the longitudinal direction of the cylindrical member 20, and the outer ring gear 26 receives the driving force from the revolving motor 21 to rotate.

軸承27支撐著通過中空區25而設置的主軸50,以使主軸50可自轉。主軸50是與圓柱構件20的中心距離一預定距離d而偏心設置。因此,如果圓柱構件20自轉,則主軸50公轉,同時繪出一個以偏心距離d為半徑的圓。 The bearing 27 supports the main shaft 50 provided through the hollow portion 25 so that the main shaft 50 can rotate. The main shaft 50 is eccentrically disposed a predetermined distance d from the center of the cylindrical member 20. Therefore, if the cylindrical member 20 is rotated, the main shaft 50 revolves while drawing a circle having an eccentric distance d as a radius.

公轉馬達21透過複數個齒輪22、23和24而將驅動力傳送到外環齒輪26。複數個齒輪22、23和24,較佳地具有不同的齒數以減少公轉馬達21的旋轉速度(R.P.M)。圖3顯示三齒輪22、23和24互相囓合設置,亦可更換多種不同方式的齒輪組合以獲得所需的減速比。 The revolution motor 21 transmits the driving force to the outer ring gear 26 through the plurality of gears 22, 23, and 24. The plurality of gears 22, 23 and 24 preferably have different numbers of teeth to reduce the rotational speed (R.P.M) of the revolution motor 21. Figure 3 shows that the three gears 22, 23 and 24 are in meshing engagement, and a plurality of different combinations of gears can be replaced to achieve the desired reduction ratio.

自轉單元容許主軸50基於主軸50的中心軸自轉。如圖5所示,自轉單元包括主軸50,其具有軸齒輪51設置於其上、環齒輪60與軸齒輪51係互相齧合、自轉馬達70、以及複數個齒輪71、72、73、74和75,其係用以傳輸自轉馬達70的驅動力至環齒輪60。 The rotation unit allows the spindle 50 to rotate based on the central axis of the spindle 50. As shown in FIG. 5, the rotation unit includes a main shaft 50 having a shaft gear 51 disposed thereon, the ring gear 60 and the shaft gear 51 meshing with each other, a rotation motor 70, and a plurality of gears 71, 72, 73, 74 and 75, which is used to transmit the driving force of the rotation motor 70 to the ring gear 60.

主軸50沿著圓柱構件20設置於中空區25。主軸50是與圓柱構件20的中心距離一預定距離d而偏心設置。主軸50由軸承27支撐而能夠自轉。 The main shaft 50 is disposed along the cylindrical member 20 in the hollow region 25. The main shaft 50 is eccentrically disposed a predetermined distance d from the center of the cylindrical member 20. The main shaft 50 is supported by the bearing 27 and is capable of rotating.

軸齒輪51安裝在主軸50的外緣,且拋光板8(見圖1)(圖5未示出)安裝於主軸50的下端。 The shaft gear 51 is mounted on the outer edge of the main shaft 50, and a polishing plate 8 (see Fig. 1) (not shown in Fig. 5) is attached to the lower end of the main shaft 50.

環齒輪60安裝於圓柱構件20的上側。環齒輪60包括形成於其內圓周面的內齒輪61及形成於其外圓周面的外齒輪 62。內齒輪61是與軸齒輪51互相齧合設置,而外齒輪62是與齒輪75互相齧合設置。 The ring gear 60 is attached to the upper side of the cylindrical member 20. The ring gear 60 includes an internal gear 61 formed on an inner circumferential surface thereof and an external gear formed on an outer circumferential surface thereof 62. The internal gear 61 is interengaged with the shaft gear 51, and the external gear 62 is interengaged with the gear 75.

環齒圈60和圓柱構件20是分別旋轉的。換句話說,環齒輪60藉由自轉馬達70的驅動力自轉,而圓柱構件20藉由公轉馬達21的驅動力旋轉。 The ring gear 60 and the cylindrical member 20 are respectively rotated. In other words, the ring gear 60 is rotated by the driving force of the rotation motor 70, and the cylindrical member 20 is rotated by the driving force of the revolving motor 21.

環齒圈60具有允許主軸50可同時自轉及公轉的內徑(環齒圈60的內圓周直徑)。換句話說,主軸50安裝於圓柱構件20中心的偏心位置上,且在公轉的同時畫出一個半徑為偏心距離d的圓。此時,環齒圈60具有一內徑,可使主軸50於如上所述公轉時與內齒輪61保持齧合,且因此,主軸50可同時自轉和公轉。 The ring gear 60 has an inner diameter (inner circumferential diameter of the ring gear 60) that allows the spindle 50 to simultaneously rotate and revolve. In other words, the main shaft 50 is mounted at an eccentric position of the center of the cylindrical member 20, and a circle having an eccentric distance d is drawn while revolving. At this time, the ring gear 60 has an inner diameter which allows the main shaft 50 to remain engaged with the internal gear 61 when revolving as described above, and therefore, the main shaft 50 can be rotated and revolved at the same time.

自轉馬達70透過複數個齒輪71、72、73、74和75而將驅動力傳送到外齒輪62。複數個齒輪71、72、73、74和75,較佳地具有不同的齒數以減少自轉馬達70的旋轉速度(R.P.M)。儘管圖5顯示五齒輪71、72、73、74和75互相齧合設置,但可更換多種不同方式的齒輪組合以獲得所需的減速比。 The rotation motor 70 transmits the driving force to the external gear 62 through a plurality of gears 71, 72, 73, 74, and 75. The plurality of gears 71, 72, 73, 74 and 75 preferably have different numbers of teeth to reduce the rotational speed (R.P.M) of the spinning motor 70. Although FIG. 5 shows that the five gears 71, 72, 73, 74, and 75 are in meshing engagement, a plurality of different combinations of gears can be replaced to achieve the desired reduction ratio.

現在,將介紹根據本發明較佳實施例裝置100之操作過程。本操作過程亦指拋光板的操作方法。同時,在本操作方法中,藉由使用載體4(見圖1)來定位玻璃基板G(見圖1)於一較低板2的上表面,並於拋光板8與玻璃基板G之間提供拋光液等,均屬本領域中之習知技術,於此不詳細說明。 Now, the operation of the apparatus 100 in accordance with a preferred embodiment of the present invention will be described. This procedure also refers to the method of operation of the polishing plate. Meanwhile, in the present operation method, the glass substrate G (see FIG. 1) is positioned on the upper surface of a lower plate 2 by using the carrier 4 (see FIG. 1), and is provided between the polishing plate 8 and the glass substrate G. The polishing liquid and the like are all known in the art and will not be described in detail herein.

首先,如果使自轉馬達70運行,自轉馬達70的驅動力將透過複數個齒輪71、72、73、74和75傳輸至外齒輪62, 而環齒輪60則相對應地自轉。如果環齒輪60自轉,則齧合於內齒輪61之軸齒輪51自轉,而因此主軸50亦自轉。如圖5所示,如果環齒輪60以逆時針方向自轉(從上方看,箭頭方向為逆時針方向),而主軸50亦以逆時針方向自轉(箭頭方向)。 First, if the rotation motor 70 is operated, the driving force of the rotation motor 70 is transmitted to the external gear 62 through the plurality of gears 71, 72, 73, 74, and 75, The ring gear 60 rotates correspondingly. If the ring gear 60 rotates, the shaft gear 51 meshed with the internal gear 61 rotates, and thus the spindle 50 also rotates. As shown in Fig. 5, if the ring gear 60 rotates in the counterclockwise direction (the direction of the arrow is counterclockwise as viewed from above), the main shaft 50 also rotates in the counterclockwise direction (arrow direction).

同時,如果使公轉馬達21運行,公轉馬達70的驅動力將透過複數個齒輪22、23和24傳輸至外環齒輪26,而因此圓柱構件20亦自轉。 Meanwhile, if the revolving motor 21 is operated, the driving force of the revolving motor 70 is transmitted to the outer ring gear 26 through the plurality of gears 22, 23, and 24, and thus the cylindrical member 20 also rotates.

如果圓柱構件20自轉,主軸50將圍繞著圓柱構件20的中心公轉並繪出以偏心距離d為半徑的圓。此時,為了獲得所需的減速比,可更換齒輪22、23和24以改變減速比。 If the cylindrical member 20 is rotated, the main shaft 50 will revolve around the center of the cylindrical member 20 and draw a circle having a radius eccentricity d. At this time, in order to obtain the desired reduction ratio, the gears 22, 23, and 24 can be replaced to change the reduction ratio.

如圖3所示,如果圓柱構件20以順時針方向自轉(從上方看,箭頭方向為順時針方向),而主軸50亦以順時針方向「公轉」(從上方看)。 As shown in Fig. 3, if the cylindrical member 20 is rotated in a clockwise direction (the direction of the arrow is clockwise as viewed from above), the spindle 50 is also "revolved" in a clockwise direction (as viewed from above).

因為公轉被執行時主軸51仍與內齒輪61保持齧合,所以在公轉期間,自轉仍繼續執行。 Since the main shaft 51 remains engaged with the internal gear 61 when the revolving is performed, the rotation continues to be performed during the revolution.

如上所述,根據本發明的裝置100,因公轉馬達21及自轉馬達70同時運行使得拋光板8可同時自轉及公轉,因此可以提高拋光速率。例如,本發明的裝置100可提高玻璃基板G的拋光速率超過0.3微米/分(μm/min)。 As described above, according to the apparatus 100 of the present invention, since the revolving motor 21 and the rotation motor 70 are simultaneously operated, the polishing plate 8 can be rotated and revolved at the same time, so that the polishing rate can be improved. For example, the apparatus 100 of the present invention can increase the polishing rate of the glass substrate G by more than 0.3 micrometers per minute (μm/min).

同時,即便已經說明,公轉馬達21及自轉馬達70同時運行使得主軸50(即拋光板8)可同時自轉及公轉,但根據本發明的裝置100中,拋光板8亦可僅藉由公轉馬達21運行而自轉馬達70為關閉的狀態下,同時自轉及公轉。即使自轉 馬達70關閉,當主軸50公轉時,因軸齒輪51與內齒輪61仍保持齧合使得主軸50能自轉。 Meanwhile, even though it has been explained that the revolving motor 21 and the rotation motor 70 are simultaneously operated so that the main shaft 50 (i.e., the polishing plate 8) can be rotated and revolved at the same time, in the apparatus 100 according to the present invention, the polishing plate 8 can also be used only by the revolving motor 21 When the self-rotating motor 70 is turned off, it is rotated and revolved at the same time. Even rotation The motor 70 is closed, and when the main shaft 50 revolves, the main shaft 50 can be rotated since the shaft gear 51 and the internal gear 61 remain engaged.

此外,也有可能藉由僅運行自轉馬達70而關閉公轉馬達21使得拋光板8只自轉。這是對於所屬領域中具有通常知識者所顯而易見的,因此不在此詳述。 Further, it is also possible to close the revolving motor 21 by operating only the rotation motor 70 so that the polishing plate 8 rotates only. This is apparent to those of ordinary skill in the art and is therefore not described in detail herein.

20‧‧‧圓柱構件 20‧‧‧Cylindrical components

21‧‧‧公轉馬達 21‧‧‧ revolution motor

22‧‧‧齒輪 22‧‧‧ Gears

23‧‧‧齒輪 23‧‧‧ Gears

24‧‧‧齒輪 24‧‧‧ Gears

25‧‧‧中空區 25‧‧‧ hollow area

26‧‧‧外環齒輪 26‧‧‧Outer ring gear

30‧‧‧框架 30‧‧‧Frame

50‧‧‧主軸 50‧‧‧ spindle

51‧‧‧軸齒輪 51‧‧‧ shaft gear

60‧‧‧環齒輪 60‧‧‧ ring gear

61‧‧‧內齒輪 61‧‧‧Internal gear

62‧‧‧外齒輪 62‧‧‧External gear

70‧‧‧自轉馬達 70‧‧‧Rotary motor

71‧‧‧齒輪 71‧‧‧ Gears

72‧‧‧齒輪 72‧‧‧ Gears

73‧‧‧齒輪 73‧‧‧ Gears

74‧‧‧齒輪 74‧‧‧ Gears

75‧‧‧齒輪 75‧‧‧ Gears

100‧‧‧用於拋光板自轉及公轉之裝置 100‧‧‧Device for polishing plate rotation and revolution

G‧‧‧玻璃基板 G‧‧‧glass substrate

d‧‧‧偏心距 D‧‧‧eccentricity

2‧‧‧較低板 2‧‧‧lower board

3‧‧‧軟管 3‧‧‧Hose

4‧‧‧載體 4‧‧‧ Carrier

6‧‧‧拋光墊 6‧‧‧ polishing pad

7‧‧‧主軸 7‧‧‧ Spindle

8‧‧‧較高板 8‧‧‧high board

8a‧‧‧槽 8a‧‧‧ slot

10‧‧‧拋光裝置 10‧‧‧ polishing device

G‧‧‧玻璃基板 G‧‧‧glass substrate

27‧‧‧軸承 27‧‧‧ bearing

本發明其他目的及方面,將透過下面實施例的敘述並參考所附圖示,而更加清楚:圖1係為一習知玻璃基板拋光裝置之側面圖;圖2係為根據本發明一較佳實施例之用於拋光板自轉及公轉之裝置之立體圖;圖3係為圖2中之公轉單元之立體圖;圖4係為圖2中之圓柱構件及主軸隻崇直剖面圖;及圖5係為圖2中之自轉單元之立體圖。 BRIEF DESCRIPTION OF THE DRAWINGS Other objects and aspects of the present invention will become more apparent from the following description of the embodiments of the present invention. FIG. 1 is a side view of a conventional glass substrate polishing apparatus. FIG. 2 is a preferred embodiment of the present invention. 3 is a perspective view of the apparatus for rotating and revolving the polishing plate; FIG. 3 is a perspective view of the revolving unit of FIG. 2; FIG. 4 is a cross-sectional view of the cylindrical member and the main shaft of FIG. 2; It is a perspective view of the rotation unit in Fig. 2.

21‧‧‧公轉馬達 21‧‧‧ revolution motor

30‧‧‧框架 30‧‧‧Frame

50‧‧‧主軸 50‧‧‧ spindle

70‧‧‧自轉馬達 70‧‧‧Rotary motor

100‧‧‧用於拋光板自轉及公轉之裝置 100‧‧‧Device for polishing plate rotation and revolution

Claims (8)

一種用於拋光板自轉及公轉之裝置,其包含:一圓柱構件(20),其具有沿著長度方向形成之一中空區,並於外側圓周面形成之一外環齒輪(26);一主軸(50),沿著該長度方向設置於該中空區內並藉由該圓柱構件(20)之支持而於該圓柱構件之中心軸偏心處自轉,且一軸齒輪(51)設置於該主軸(50)之外緣,該主軸(50)連接有一拋光板;以及一環齒輪(60),具有一內齒輪(61)形成於其內圓周面上以及一外齒輪(62)形成於其外圓周面上,該內齒輪(61)係設置齧合於該軸齒輪(51),其中,當一驅動力傳輸到該圓柱構件(20)的情況下,會使得該圓柱構件(20)自轉,該主軸(50)以偏心的方式公轉於該中空區,且是在該軸齒輪(51)與該內齒輪(61)齧合的情況下產生公轉。 A device for rotating and revolving a polishing plate, comprising: a cylindrical member (20) having a hollow region formed along a length direction and an outer ring gear (26) formed on an outer circumferential surface; a spindle (50), disposed along the length direction in the hollow region and supported by the cylindrical member (20) to rotate at an eccentricity of a central axis of the cylindrical member, and a shaft gear (51) is disposed on the main shaft (50) The outer edge, the main shaft (50) is connected with a polishing plate; and a ring gear (60) having an inner gear (61) formed on the inner circumferential surface thereof and an outer gear (62) formed on the outer circumferential surface thereof The internal gear (61) is provided to be meshed with the shaft gear (51), wherein when a driving force is transmitted to the cylindrical member (20), the cylindrical member (20) is rotated, the main shaft ( 50) revolving in the hollow region in an eccentric manner, and generating a revolution in the case where the shaft gear (51) is engaged with the internal gear (61). 如申請專利範圍第1項所述之用於拋光板自轉及公轉之裝置,其中,在一驅動力係傳輸到該外齒輪(62)的情況下,會使得該環齒輪(60)自轉,並使得該軸齒輪(51)自轉。 The apparatus for rotating and revolving a polishing plate according to claim 1, wherein a ring gear (60) is rotated when a driving force is transmitted to the external gear (62), and The shaft gear (51) is rotated. 如申請專利範圍第2項所述之用於拋光板自轉及公轉之裝置,其中,該環齒輪(60)藉由使用來自於一自轉馬達輸出之驅動力而旋轉,而該圓柱構件(20)藉由使用來自一公轉馬達輸出之驅動力而旋轉。 The apparatus for rotating and revolving a polishing plate according to claim 2, wherein the ring gear (60) is rotated by using a driving force from an output of a rotation motor, and the cylindrical member (20) Rotate by using the driving force from the output of one revolution motor. 如申請專利範圍第3項所述之用於拋光板自轉及公轉之裝置,其中,複數個齒輪(71)、(72)、(73)、(74)及(75) 係設置於該環齒輪(60)與該自轉馬達之間,以容許該自轉馬達驅動力之傳輸,而使齒輪減速比為可調整。 A device for rotating and revolving a polishing plate according to item 3 of the patent application, wherein a plurality of gears (71), (72), (73), (74) and (75) The gear is disposed between the ring gear (60) and the rotation motor to allow transmission of the driving force of the rotation motor, and the gear reduction ratio is adjustable. 如申請專利範圍第3項所述之用於拋光板自轉及公轉之裝置,其中,複數個齒輪(22)、(23)及(24)係設置於該外環齒輪(26)與該公轉馬達之間,以容許該公轉馬達驅動力之傳輸,而使齒輪減速比為可調整。 The apparatus for rotating and revolving a polishing plate according to claim 3, wherein a plurality of gears (22), (23) and (24) are disposed on the outer ring gear (26) and the revolving motor In order to allow the transmission of the driving force of the revolution motor, the gear reduction ratio is adjustable. 一種使用用於拋光板自轉及公轉之裝置之拋光板操作方法,其中,用於拋光一玻璃基板之該拋光板係藉由迫使連接於該拋光板之一主軸(50)進行自轉及公轉,而同時自轉及公轉。 A polishing plate operation method using a device for polishing and revolving a polishing plate, wherein the polishing plate for polishing a glass substrate is rotated and revolved by forcing a main shaft (50) connected to the polishing plate. At the same time, rotate and revolve. 如申請專利範圍第6項所述之使用用於拋光板自轉及公轉之裝置之拋光板操作方法,其中該裝置包含:一圓柱構件(20),其具有沿著長度方向形成之一中空區並於外側圓周面形成之一外環齒輪(26);一主軸(50),沿著該長度方向設置於該中空區內並藉由該圓柱構件(20)之支持而於該圓柱構件之中心軸偏心處自轉,且一軸齒輪(51)設置於該主軸(50)之外緣,該主軸(50)連接有一拋光板;以及一環齒輪(60),具有一內齒輪(61)形成於其內圓周面上以及一外齒輪(62)形成於其外圓周面上,該內齒輪(61)係設置齧合於該軸齒輪(51),其中,當該圓柱構件(20)藉由一驅動力自轉時,該主軸(50)以偏心的方式公轉於該中空區,且是在該軸齒輪(51)與該內齒輪(61)齧合的情況下產生公轉, 其中,在一驅動力係傳輸到該外齒輪(62)的情況下,會使得該環齒輪(60)自轉,並使得該軸齒輪(51)自轉。 A polishing plate operation method using a device for rotating and revolving a polishing plate according to claim 6, wherein the device comprises: a cylindrical member (20) having a hollow region formed along a length direction and Forming an outer ring gear (26) on the outer circumferential surface; a main shaft (50) disposed along the length direction in the hollow region and supported by the cylindrical member (20) on the central axis of the cylindrical member The eccentricity rotates, and a shaft gear (51) is disposed at an outer edge of the main shaft (50), the main shaft (50) is coupled with a polishing plate, and a ring gear (60) having an internal gear (61) formed at an inner circumference thereof An outer gear (62) is formed on an outer circumferential surface thereof, and the inner gear (61) is provided to be meshed with the shaft gear (51), wherein the cylindrical member (20) is rotated by a driving force The main shaft (50) revolves in the hollow region in an eccentric manner, and generates a revolution when the shaft gear (51) is engaged with the internal gear (61). Wherein, in the case where a driving force is transmitted to the external gear (62), the ring gear (60) is rotated and the shaft gear (51) is rotated. 如申請專利範圍第7項所述之使用用於拋光板自轉及公轉之裝置之拋光板操作方法,其中,該自轉之驅動力係傳自於一自轉馬達,而該公轉之驅動力係傳自於一公轉馬達,以及其中,複數個齒輪(71)、(72)、(73)、(74)及(75)係設置於該環齒輪(60)與該自轉馬達之間,以容許該自轉馬達驅動力之傳輸,而使齒輪減速比為可調整,而複數個齒輪(22)、(23)及(24)係設置於該外環齒輪(26)與該公轉馬達之間,以容許該公轉馬達驅動力之傳輸,而使齒輪減速比為可調整。 The method for operating a polishing plate using a device for rotating and revolving a polishing plate according to claim 7, wherein the driving force of the rotation is transmitted from a rotation motor, and the driving force of the revolution is transmitted from a one-turn motor, and wherein a plurality of gears (71), (72), (73), (74), and (75) are disposed between the ring gear (60) and the rotation motor to allow the rotation The transmission of the motor driving force makes the gear reduction ratio adjustable, and a plurality of gears (22), (23) and (24) are disposed between the outer ring gear (26) and the revolving motor to allow the The revolution of the motor drive force is transmitted, and the gear reduction ratio is adjustable.
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