JP5061296B2 - Flat double-side polishing method and flat double-side polishing apparatus - Google Patents

Description

  The present invention can perform polishing using a fluid in which abrasive grains used for brittle materials such as glass used in IT and the medical equipment industry are dispersed, and from high-precision to rough polishing that requires a large amount of processing. The present invention relates to a flat double-side polishing method and a flat double-side polishing apparatus that can be continuously applied to precision finish polishing that requires smoothness.

The planar workpiece is polished by adjusting the thickness by a rough polishing process, and further by surface finishing by a precision polishing process. A conventional double-side polishing apparatus is provided with a central axis, and a workpiece is attached to a carrier jig that rotates around the planet, and is sandwiched between upper and lower surface plates and is subjected to a polishing motion while giving a relative speed.
For example, in a method of polishing a flat plate-like workpiece that requires high accuracy in flatness and flatness, such as a glass plate for an image display plate or an optical filter glass plate, Patent Document 1 discloses, for example, The carrier holding the workpiece is rotated in parallel along the circular trajectory, and the polishing discs rotating with the carrier in between are placed in opposite directions with the center of the circular trajectory of the carrier as the distribution point. A reciprocating method is disclosed.
Japanese Examined Patent Publication No. 44-2277

However, in the above-described method, the method using a solid grindstone gives a certain evaluation as rough polishing, but has a disadvantage that fine scratch marks are generated. Further, in the grinding method using a grindstone, since the work piece is processed on one side, the work surface reversal operation requires an efficient problem such as requiring manual work.
On the other hand, in the polishing method using free abrasive grains (slurry) (for example, see FIGS. 4 and 5), the abrasive grains are scattered from the polishing area to the outside by the centrifugal force generated by the centrifugal force generated by the polishing surface plate. Occurs. Furthermore, the outer edge portion of the workpiece may be greatly shaved (edge fringed) by abrasive grains blown from the central portion by centrifugal force. Moreover, since each surface plate and the workpiece are controlled as described above, there is a problem that the mechanism of the drive unit is complicated. Furthermore, in the aspect of rotating the carrier that holds the workpiece, the centrifugal force hardly acts near the rotation axis, so that the relative movement is the smallest and the machining amount is also small. For this reason, there is an area where the work piece cannot be arranged (near the rotation axis), and the number of sheets that can be held on the carrier at a time is small. Thus, it has been known that a polishing method using loose abrasive grains (slurry) is a method with low processing efficiency.

  Therefore, the above-mentioned conventional problems can be solved, and can be appropriately applied from rough polishing requiring a processing amount to precision finishing polishing requiring high-precision smoothness, and a new apparatus that realizes an excellent polishing effect, Creation of processing methods was desired.

The present invention has been proposed in view of the above situation, and a polishing pad is attached to the lower surface to form an upper surface plate, a polishing pad is attached to the upper surface to form a lower surface plate, and each surface plate is made to face each polishing pad. In a state where the surface orientation is constant, and a carrier that enables reciprocal sliding or circular orbital motion with one surface or two axes reciprocating in the space facing the polishing pad. An arbitrary number (multiple pieces) of workpieces are held and faced, and each surface plate is eccentrically swung while supplying slurry in which dielectric abrasive grains are dispersed to the processing surface from each surface plate. In addition, the present invention relates to a planar double-side polishing method characterized by sliding the carrier in a reciprocating manner, applying a slight vibration of 10 kHz to 100 kHz perpendicular to the direction of gravity, and supplying a relative speed to the abrasive grains .
Note that “the surface orientation is constant” means that the surface itself turns without rotating (spinning).

  Further, in the polishing method according to the present invention, the eccentric swivel movement is performed by rotating a ring weight provided on the outer peripheral portion to maintain an eccentric swivel movement while maintaining a parallel balance between the upper and lower surface plates. Also proposed is a planar double-side polishing method characterized by

  The present invention also proposes a planar double-side polishing apparatus characterized in that, in the polishing method, the polishing pad is used for lapping or polishing.

Further, the present invention provides an upper surface plate with a polishing pad attached to the lower surface, a lower surface plate with an abrasive pad attached to the upper surface, and each surface plate having a constant surface orientation with each polishing pad facing each other. One-axis or two-axis reciprocation of a carrier holding an arbitrary number of workpieces (a plurality of workpieces) in a facing space of the polishing pad with a constant surface orientation A sliding mechanism that enables a sliding motion or a circular orbital motion, a supply mechanism that supplies a slurry in which dielectric abrasive grains are dispersed from each surface plate to a processing surface, and 10 kHz to 100 kHz perpendicular to the direction of gravity. The present invention also proposes a flat double-side polishing apparatus using a fluid in which abrasive grains are dispersed, characterized by comprising a microvibration mechanism that provides the above-mentioned fine vibration and supplies a relative speed to the abrasive grains.

In the planar double-side polishing method of the present invention, the upper surface plate and the lower surface plate perform an eccentric swivel motion with the surface orientation being constant when the workpiece is polished and finished. In the polishing apparatus of the present invention, a mechanism for controlling the eccentric turning motion of each surface plate is a turning mechanism. The carrier holds an arbitrary number of workpieces (a plurality of workpieces) in the processing space, and performs a reciprocating sliding motion with a fixed surface orientation. In the polishing apparatus of the present invention, a mechanism for controlling the uniaxial or biaxial reciprocating sliding movement or circular orbital movement of the carrier is a sliding mechanism. Further, each of the surface plates can be opposed to each other with a processing space, and slurry in which abrasive grains are dispersed can be supplied from each surface plate to the processing surface. In the polishing apparatus of the present invention, a mechanism for controlling the supply of the slurry is a supply mechanism.
By appropriately controlling the three mechanisms, a suitable relative speed is given to the slurry in which abrasive grains are dispersed, and the upper and lower surface plates are swung eccentrically with respect to the workpiece held by the carrier. The surface of the workpiece can be finished with high quality and even better polishing efficiency from coarse polishing to precision finish polishing with the abrasive grains supplied from the surface plate to the processed surface. it can.

In addition, the method and apparatus of the present invention are superior to the conventional method in the following points.
1stly, in the said conventional method, since each surface plate and a workpiece are each controlled, there exists a problem that the mechanism of a drive part is complicated. On the other hand, in the present invention, the mechanism is simplified by relatively easily driving each surface plate and the carrier.
Second, in the conventional method, the relative momentum is small in the center area of the carrier corresponding to the rotation axis of the surface plate, but the relative momentum increases as it approaches the circumference, and the polishing amount by the abrasive grains becomes non-uniform. . On the other hand, in the present invention, the sliding of each surface plate and the sliding of the carrier are performed with the surface orientation being constant, so that there is basically no portion where there is no relative speed. Therefore, it is possible to uniformly polish a workpiece held in any place on the carrier. In short, in the conventional method, since the workpiece is rotated, the peripheral speed becomes zero at the center portion of the sample, and the abrasive grains do not move and are difficult to cut. On the other hand, in the present invention, since the workpiece does not rotate, the difference in peripheral speed is suppressed.
Third, in the conventional method, there is an area where the relative momentum around the rotation axis of the carrier is remarkably small, so there is an area where the work piece cannot be arranged, and therefore, the number of sheets that can be polished at one time is small. On the other hand, in the present invention, there is no area having a remarkably small momentum as in the conventional method, so the area of the carrier can be used effectively, and a large amount of workpiece can be held and polished at a time. The number of sheets that can be polished is extremely large.

  Further, the planar double-side polishing method of the present invention enables more efficient and highly efficient polishing by applying a slight vibration of 10 kHz to 100 kHz perpendicular to the direction of gravity and supplying a relative speed to the abrasive grains. . Such ultrasonic vibration may be applied to either the upper or lower surface plate or the carrier, or may be applied to both, as long as rolling occurs in the abrasive grains.

  Furthermore, in the planar double-side polishing method of the present invention, an eccentric swiveling motion can be performed while maintaining the parallel balance of the upper and lower surface plates by rotating a ring weight provided on the outer peripheral portion. In other words, when trying to maintain parallelism with a spring or wire, it may become difficult to maintain accuracy because it expands and contracts depending on the environmental temperature, but the ring weight provided on the outer peripheral part is configured to rotate in this way. By doing so, the parallel balance of the upper and lower surface plates can be easily maintained.

  Further, the planar double-side polishing method of the present invention can further improve the efficiency of polishing by attaching lapping or polishing polishing pads to the lower surface of the upper surface plate and the upper surface of the lower surface plate, respectively. Processing can be carried out continuously with a single device until precision finishing.

In the present invention, since the lower surface of the upper surface plate and the upper surface of the lower surface plate are opposed to each other with a processing space therebetween, the upper surface plate is disposed so as to face downward, and the lower surface plate is disposed so as to face upward. The mechanisms (machines and devices) that control these behaviors (movements) are provided on the opposite sides of the machining space (upper on the upper platen and lower on the lower platen).
Further, a lapping (rough polishing) pad or a polishing (precision polishing) pad may be appropriately attached to the processing surface side of each surface plate.

  The eccentric turning motion of each surface plate in the present invention is that the surface plate itself does not rotate but rotates eccentrically so as to draw a circular orbit parallel to the XY plane, that is, turns with a constant surface orientation. Specifically, the rotational motion is converted into an eccentric swivel motion with a fixed surface orientation by applying a mechanism using a known eccentric cam or eccentric shaft. The phrase “the surface orientation is constant” means that, as described above, the surface itself turns without rotating (spinning). Further, the turning speed of each surface plate in the turning mechanism for controlling the eccentric turning motion is not particularly limited, but the drive of each surface plate is made independent. For example, a turning speed of about 5 to 200 rpm is desirable.

The carrier in the present invention may be reciprocally slid linearly in the radial direction of the turning track of the surface plate, for example, the X-axis one axis direction, or may be simultaneously reciprocated in the XY-axis two axis directions, with the surface orientation being constant. It may be moved, or may be moved so as to draw a circular orbit, and specifically, a known mechanism can be applied.
As described above, in any case, the abrasive grains sufficiently roll and contribute to the polishing. However, when the carrier is uniaxially or biaxially reciprocated, the abrasive grains move in a straight line. In some cases, such as excavation, the carrier moves in a circular orbit, and the abrasive grains constantly move at different points. It occurs uniformly and the amount of polishing by the abrasive becomes more uniform. The carrier is also driven independently from each surface plate.
Further, the moving speed of the carrier in the sliding mechanism for controlling the sliding motion or the circular orbital motion is not particularly limited, but a moving speed of about 10 to 300 mm / second is desirable, for example. In addition, what is necessary is just to hold | maintain the one or several arbitrary number of workpieces to this carrier. The carrier in the finishing method and the finishing apparatus of the present invention does not have a region having a very small momentum such as the central area (near the rotation axis) in the conventional double-side polishing apparatus, so that the occurrence of variations in flatness is suppressed and efficiency is improved. It can be polished well and can hold a large number of workpieces.

The slurry in which the abrasive grains used in the finishing method and the finishing apparatus of the present invention are dispersed is preferably a slurry in which dielectric abrasive grains are dispersed in water, but is not particularly limited thereto. It may be dispersed.
Since water as a dispersion medium is excellent in the ease and stability of waste liquid treatment, it is environmentally friendly and is also suitable in terms of high affinity with glass as a workpiece.

  In addition, we are considering applying an electric field to the system in the future. In this respect, silicone oil has a dielectric constant of about 3, but water has a high dielectric constant of 80. Improvement was expected. That is, by using a slurry in which water and abrasive grains are mixed for polishing, it is expected that a reasonable polishing effect can be obtained by the polishing assistance effect by the mechanochemical phenomenon and the polishing phenomenon by the abrasive grains. In addition, the slurry containing abrasive grains is dominated by water having a high dielectric constant by using an electric field, and it is expected that the water itself suppresses scattering of the abrasive grains. And when silicone oil is used instead of slurry water, since it contains the same component Si as glass, Si of silicone oil adheres to the glass, and scattering of abrasive grains is suppressed, but polishing efficiency decreases. It is expected that.

  As the dielectric abrasive grains, those having a hardness equal to or higher than the hardness of the workpiece or having a mechanochemical action with the workpiece are used. Specifically, diamond, corundum, emery, garnet, silica, calcined dolomite, fused alumina, artificial emery, silicon carbide, zirconium oxide, etc., or chromium oxide, silicon oxide, iron oxide, calcium oxide used for mechanochemical polishing , Magnesium oxide, cerium oxide, magnesium carbide, barium carbonate and the like.

Hereinafter, description will be given based on the embodiments of the drawings.
1 to 3 are schematic views showing the principle of a finishing apparatus for carrying out the finishing method of the present invention.
The upper surface plate 1 is positioned above the processing space A (where the carrier 7 is disposed) shown in the center of FIGS. 1 and 2 and is disposed so as to face downward. As shown in FIG. 2, a polishing pad 2 having a large number of fine holes is attached to the lower surface of the upper surface plate 1, and a storage portion 4 for slurry 3 in which abrasive grains are dispersed is formed therein. ing. The slurry reservoir 4 is supplied with the slurry 3 in which abrasive grains are dispersed at any time through an eccentric cam shaft 5 from a supply mechanism including a pump (not shown).
As the polishing pad 2, a lapping pad may be used for rough polishing, and a polishing pad may be used for precision finishing.
The lower surface plate 6 positioned so as to face the lower surface across the processing space A with respect to the upper surface plate 1 is upside down from the upper surface plate 1, but has substantially the same structure. The same reference numerals are attached to the drawings and the description is omitted.

  As shown in FIG. 3, the upper and lower surface plates 1 and 6 perform an eccentric swivel motion with the surface orientation being constant. That is, if the left-right direction in FIG. 3 is the X-axis direction and the up-down direction is the Y-axis direction, the surface plates 1 and 6 themselves rotate so as to draw a circular orbit parallel to the XY plane without rotating. In FIGS. 1 to 3, the X-axis direction is the left-right direction. The turning of these surface plates 1 and 6 is controlled by converting the rotation into eccentric turning by a known mechanism using an eccentric cam.

  Further, the carrier 7 disposed in the processing space A so as to be positioned between the upper surface plate 1 and the lower surface plate 6 has a rectangular shape that is long in the X-axis direction as shown in FIG. A plurality of fitting empty portions 8 having a shape are provided, and a workpiece 9 such as an optical filter glass plate can be fitted into the fitting empty portions 8.

As shown in FIG. 3, the movement of the carrier 7 is a sliding movement that reciprocates with a constant surface orientation in the radial direction of the circular orbit, for example, the X-axis direction. That is, the carrier 7 performs a sliding motion that reciprocates in the left-right direction indicated by the arrows in FIG.
Further, the carrier 7 may be controlled so as to perform a reciprocating sliding motion or a circular orbit motion on the XY plane in the XY direction.
Such movement of the carrier 7 is controlled by applying a known reciprocating mechanism.

  In FIG. 3, the path of the sliding motion of the surface plates 1 and 6 is elliptical and eccentric. The reciprocating motion of the carrier 7 overlaps the eccentric turning motion of the surface plates 1 and 6. Thus, if the carrier 7 is fixed (stopped), it means that the surface plates 1 and 6 are swung so as to draw an elliptical shape and an eccentric shape.

Next, a description will be given of a mechanism in which the upper and lower surface plates perform an eccentric turning motion with the surface orientation being constant. 4 is an overall slope view, and FIG. 5 is an exploded view of the polishing surface plate.
With reference to FIG. 4, reference numeral 16 denotes a carrier for holding a workpiece 17. This carrier 16 is a glass epoxy resin flat plate with a rectangular punched hole for fitting the workpiece 17, and the XY plane is repeated in the Y-axis direction (from the right front to the left back direction in the drawing). Reciprocate. The carrier 16 may be controlled so as to reciprocate in the XY plane in the X · Y2 axis direction. Or you may control to perform circular orbital motion. This is sandwiched between an upper surface plate 15 and a lower surface plate 18 to which a polishing pad (not shown in the figure) is attached. The upper polishing platen 15 is lowered in the pressurizing direction to give a processing pressure necessary for polishing. The surface plate support shaft 11 is fixed through an eccentric shaft 12 incorporated in each of the upper and lower eccentric shaft holders 14, and this surface portion is rotated by a driving gear 13 so that the surface plate support shaft 11 is an eccentric shaft. 12 Move on the line of distance R from the center. Accordingly, the surface plates 15 and 18 also move on the line of the distance R. Further, by passing the rotation control shaft 19, which is vertically connected to the surface plate support shaft 11, through the rotation control block 20 on the rail 21, the block 20 reciprocates on the rail 21 in conjunction with the rotation of the eccentric shaft 12. It moves and controls the rotation of the platen support shaft 11. By this mechanism, when the eccentric shaft 12 rotates, the entire side surface A of the upper surface plate 15 of the shaded portion rotates with respect to the workpiece 17 while maintaining a parallel relationship with the side surface A ′ of the carrier 16.

FIG. 5 is an exploded view of the (upper) surface plate 15. As shown in the drawing, the upper surface plate 15 has a hollow structure, and an insulating material and a vibration isolating material (having two functions) 22 are fitted to the bottom to prevent leakage of abrasive grains from the side surface. Abrasive grains that have passed through the surface plate support shaft 11 accumulate in the upper surface plate 15 and are supplied from the abrasive particle supply holes 23 at the bottom of the upper surface plate 15 to the polishing region. Further, the upper surface plate 15 is provided with an ultrasonic vibrator connecting shaft (shaking shaft) 24, and the upper surface plate 15 itself is finely vibrated (ultrasonic vibration) between 25 kHz and 50 kHz via this shaft. .
The above-mentioned rotation control mechanism of the surface plate support shaft 11 and the structure of the upper surface plate 15 and the fine vibration mechanism are the same in both the upper and lower sides. In other words, high-efficiency polishing can be achieved by relative movement of sliding between the upper and lower surface plates 15 and 18 by the isotope-homogeneous eccentric movement (turning movement), fine vibration by ultrasonic waves, and reciprocating movement of the carrier 16.

In contrast, FIGS. 6 and 7 show a polishing apparatus for performing a conventional polishing method.
In the polishing apparatus shown in FIG. 6, it is assumed that the upper and lower surface plates 31 and 32 rotate in opposite directions as illustrated. The carrier 33 arranged so as to be sandwiched between the surface plates 31 and 32 has a sun gear (center axis) at the center, and the carrier 33 is revolved by driving the sun gear and the internal gear. However, since the sun gear is in the center, the polishing region is narrowed. That is, in FIG. 7, although the center part where the said sun gear exists is made into the center area 35, by the presence, only a total of five fitting empty parts are provided in the part near a circle edge, and it can grind at once. The number of workpieces 34 is also small. Further, even in each workpiece 34, a difference between the portion close to the central axis and the portion near the circumference is caused by relative movement with the surface plates 31 and 32, and uniform processing cannot be performed.
Further, when each work piece 34 fitted in the fitting empty part is rotated in the fitting empty part, the mechanism of the driving part becomes extremely complicated, and the center axis of the rotation exists. Therefore, only a new difference occurs and uniform processing cannot be performed.

When the apparatus of the present invention shown in FIGS. 1 to 3 is compared with the conventional apparatus shown in FIGS. 6 and 7, there are the following differences.
In the conventional apparatus, since the carrier 33 is revolved and rotated by driving the sun gear at the center, there is a central area 35 where the workpiece 34 cannot be disposed, and therefore, the number of sheets that can be polished at one time is small.
On the other hand, as described above, in the present invention, the carrier 7 is not rotated, and therefore there is no area with a relatively small relative momentum. Therefore, the area of the carrier 7 can be used effectively, a large amount of the workpiece 9 can be held and polished, and the number of sheets that can be polished at one time is extremely large.

In the conventional apparatus, since the carrier 33 is rotated, the relative momentum is small in the central area 35 of the carrier 33 corresponding to the central axis thereof, and the relative momentum is increased as it approaches the circumference. Moreover, due to the difference in the relative momentum, the momentum of the abrasive grains affects the polishing amount in the vicinity of the central area 35 and the vicinity of the circumference, and therefore, the polishing amount varies depending on the polishing sample position and becomes non-uniform.
On the other hand, as described above, in the present invention, the sliding of each of the surface plates 1 and 6 and the sliding of the carrier 7 are performed with the surface direction being constant, so that centrifugal force or the like basically does not act. In addition, an area such as the vicinity of the central axis where the centrifugal force is small is not formed, and the portion held by the carrier 7 (the fitting empty portion 8) does not produce a non-uniform finish, and the object held in any place on the carrier 7 Even the workpiece 9 can be finished and polished uniformly.

Moreover, in the said conventional apparatus, since the rotation of the carrier 33 and the workpiece 34 is controlled, the mechanism of a drive part becomes complicated. In particular, from the viewpoint of improving the polishing efficiency, it is desired to provide a large number of fitting empty portions in one carrier 7, but each of them can be rotated even in five places as in the illustrated embodiment. The mechanism of the drive unit is extremely complicated.
On the other hand, as described above, in the apparatus of the present invention, the surface plates 1 and 6 are controlled by a mechanism using a known eccentric cam, and the carrier 7 is controlled by a known reciprocating mechanism. Since the drive is easy, the mechanism can be simplified.

  FIG. 8 is a diagram showing the principle of eccentric turning while maintaining the parallel balance of the upper and lower surface plates 26 by rotating the ring weight 25 provided on the outer peripheral portion. The distance indicates within 70% of the radius, 28 indicates a rotating rotor. When the parallelism is maintained with a spring or wire, it may become difficult to maintain accuracy because it expands and contracts depending on the environmental temperature. In this way, the ring weight 25 provided on the outer peripheral portion is configured to rotate. Thus, the parallel balance of the upper and lower surface plates 26 can be easily maintained.

[Example 1]
Rough polishing was performed using the flat double-side polishing apparatus of the present invention shown in FIGS.
The operation of the carrier 7 and the surface plates 1 and 6 will be described below.
The sliding range of the carrier 7 can be moved within a total range of 100 mm from 5 to 50 mm on one side from the center position in both the X-axis direction and the Y-axis direction by two-axis simultaneous driving.
The sliding speed of the carrier 7 was set to a range of 10 to 200 mm / sec in both the X-axis direction and the Y-axis direction.
The polishing pressure was in the range of 0 to 500N.
Furthermore, the turning speed of the surface plates 1 and 6 was set to 5 to 200 rpm in both the upper and lower sides.
The size of the surface plates 1 and 6 was 250 × 250 mm.
Then, the glass plate (material BK-7) 40 × 40 × 2 mm is formed as a workpiece by reciprocating the upper and lower surface plate in an eccentric manner and sliding the carrier holding the workpiece in a single-axis reciprocating manner. It was possible to polish 15 sheets (15 sheets / time) or more at a time, and it was possible to finish with a roughness of 200 nmRa → 1.6 nmRa in about 30 minutes.
Furthermore, by moving the carrier holding the workpiece in a reciprocating circular orbit along the X and Y axes, 15 sheets (15 sheets) of glass plate (material BK-7) 40 × 40 × 2 mm at a time. The above can be polished, and it was possible to finish with a roughness of 200 nmRa → 0,8 nmRa in about 30 minutes.
Moreover, the carrier comprised with the stainless steel material was prepared and the experiment which gives a minute vibration perpendicular | vertical to a gravity direction using the glass plate (material BK-7) as a to-be-processed object was done. When 50 KHz was applied as the applied frequency, it was possible to suppress the finishing roughness from 2.0 nmRa before application to 1.2 nmRa after application. Thus, it was confirmed that an effect of finishing a good finishing effect into a more excellent surface was found.
Furthermore, when polishing while rotating the ring weight at 100 rpm, the shape before rotation of the ring weight becomes 60.5 nm PV → 20.2 nm PV, and the shape accuracy can be improved, that is, the fluctuation of the polishing surface can be suppressed. It is expected.
The polishing pad may be used for lapping or polishing, and the current abrasive grains are used for polishing with an average particle diameter of 1.5 μm, but the same effect can be obtained with large lapping abrasive grains having an abrasive grain size of about 3 μm. It was possible to adopt any type.
On the other hand, in the existing 4-waY double-side polishing apparatus having the same size as the upper and lower polishing surface plates in the apparatus of the present invention, about 5 sheets / time due to the occupation area of the carrier at the polishing area diameter of 300 mm. I could only polish.
As for the removal amount of polishing, the removal amount of about 10 μm was obtained in 30 minutes with the existing double-side polishing apparatus, whereas it was 20 μm in 30 minutes by polishing while applying an electric field to the apparatus of the present invention. It was confirmed that the above polishing removal amount was obtained. Therefore, it was confirmed that the polishing ability is a double-side polishing method and apparatus having a capability of 4 times or more.

  Although the present invention has been described based on the embodiments of the drawings, the present invention is not limited to the above-described embodiments, and may be implemented in any way as long as the configuration described in the claims is not changed. Can do.

It is a disassembled perspective view which shows an example of the planar double-side polish apparatus of this invention in principle. It is sectional drawing which shows the principal part of the planar double-side polish apparatus of FIG. It is a top view which shows the condition of the surface plate of the planar double-side polish apparatus of FIG. 1, and the movement of a carrier. It is a perspective view which shows in principle an example of the mechanism of the eccentric turning motion of an up-and-down surface plate. It is a perspective view which shows an example of the supply mechanism of an upper and lower surface plate. It is a front view which shows an example of the conventional plane polishing apparatus. It is a top view which shows the carrier of the planar polishing apparatus of FIG. (A) The top view which shows in principle an example of the turning mechanism in the planar double-side polish apparatus of this invention, (b) It is a side view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Upper surface plate 2 Polishing pad 3 Slurry 4 Storage part 5 Eccentric cam shaft 6 Lower surface plate 7 Carrier 8 Fitting empty part 9 Workpiece 11 Surface plate support shaft 12 Exen shaft 13 Drive gear 14 Exen shaft holder 15 Upper surface plate 16 Sample holding carrier 17 Work piece 18 Lower surface plate 19 Control shaft 20 Block 21 Rail 22 Insulating material and vibration isolator (having two functions)
23 Slurry or washing water supply hole 24 Shaking shaft 25 Ring weight 26 Surface plate 27 Distance from offset center position indicates within 70% of radius 28 Rotating rotor

Claims (4)

Equipped with a polishing pad attached to the lower surface to make an upper surface plate, and attached to the upper surface to make a lower surface plate. An arbitrary number of workpieces can be held on a carrier that enables sliding motion or circular orbital motion by reciprocating in one or two axes with a fixed surface orientation in the space facing the polishing pad. While supplying the slurry in which the dielectric abrasive grains are dispersed from each surface plate to the processing surface, the surface plate is eccentrically swung and the carrier is slid in a reciprocating manner to A flat double-side polishing method characterized by vertically applying a fine vibration of 10 kHz to 100 kHz and supplying a relative speed to the abrasive grains . 2. The flat surface according to claim 1, wherein the eccentric turning motion is an eccentric turning motion while maintaining a parallel balance between the upper and lower surface plates by rotating a ring weight provided on an outer peripheral portion. 3. Double-side polishing method. The planar double-side polishing method according to claim 1 or 2, wherein the polishing pad is used for lapping or polishing . Equipped with a polishing pad attached to the lower surface to make an upper surface plate, and attached to the upper surface to make a lower surface plate. Enables a revolving mechanism and a circular orbital motion in which the carrier holding an arbitrary number of workpieces is reciprocated in one or two axes with a fixed surface orientation in the space facing the polishing pad. A sliding mechanism, a supply mechanism for supplying slurry in which dielectric abrasive grains are dispersed from each surface plate to the processing surface, and a slight vibration of 10 kHz to 100 kHz perpendicular to the direction of gravity, A flat double-side polishing apparatus using a fluid in which abrasive grains are dispersed, comprising a fine vibration mechanism for supplying a speed.

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