JP2006224227A - Magnetic polishing method - Google Patents
Magnetic polishing method Download PDFInfo
- Publication number
- JP2006224227A JP2006224227A JP2005039391A JP2005039391A JP2006224227A JP 2006224227 A JP2006224227 A JP 2006224227A JP 2005039391 A JP2005039391 A JP 2005039391A JP 2005039391 A JP2005039391 A JP 2005039391A JP 2006224227 A JP2006224227 A JP 2006224227A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- workpiece
- polishing
- polishing tool
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
本発明は研磨技術に関し、特に、光学素子自身や光学素子の成形型の成形面等の高精度な加工に好適である、磁気研磨の技術に関する。 The present invention relates to a polishing technique, and more particularly to a magnetic polishing technique suitable for high-precision processing of an optical element itself or a molding surface of a molding die of the optical element.
磁性及び研磨性を有する磁性砥粒を磁気研磨ヘッドで保持して被研磨物の研磨を行う磁気研磨装置における磁気研磨ヘッドに関し、例えば特許文献１に開示されている技術が知られている。 For example, a technique disclosed in Patent Document 1 is known regarding a magnetic polishing head in a magnetic polishing apparatus that polishes an object to be polished by holding magnetic abrasive grains having magnetism and polishability with a magnetic polishing head.
この磁気研磨ヘッドを用いて行う従来の研磨の方法について、図６、図７、及び図８を用いて説明する。
図６はこの磁気研磨ヘッドを備えた研磨装置の構成を示している。同図において、磁気研磨工具１０１の先端には複数の毛状部材１０３が植設されている。毛状部材１０３は樹脂繊維、動物毛、金属繊維等であり、長さは１ｍｍ〜２０ｍｍ、太さは１０μｍ〜１ｍｍ、植設の間隔は０．２ｍｍ〜２ｍｍとされている。
A conventional polishing method performed using this magnetic polishing head will be described with reference to FIGS. 6, 7, and 8. FIG.
FIG. 6 shows the configuration of a polishing apparatus provided with this magnetic polishing head. In the figure, a plurality of bristle members 103 are implanted at the tip of the magnetic polishing tool 101. The hair-like member 103 is resin fiber, animal hair, metal fiber or the like, and has a length of 1 mm to 20 mm, a thickness of 10 μm to 1 mm, and an implantation interval of 0.2 mm to 2 mm.
図７及び図８は磁気研磨工具１０１の先端部の構造の例を示したものである。図７に示す第一の例では、磁気研磨工具１０１の先端部に植設穴１０６が設けられており、この植設穴１０６に接着剤１０５を流し込んで毛状部材１０３を植設している。図８に示す第二の例では、磁気研磨工具１０１の先端に接着剤層１０７を設けておき、そこへ毛状部材１０３を刺して植設している。このいずれの例においても、毛状部材１０３は接着剤１０５若しくは接着剤層１０７を硬化させることによって磁気研磨工具１０１の先端に固定されている。 7 and 8 show examples of the structure of the tip of the magnetic polishing tool 101. FIG. In the first example shown in FIG. 7, the planting hole 106 is provided at the tip of the magnetic polishing tool 101, and the bristle member 103 is implanted by pouring the adhesive 105 into the planting hole 106. . In the second example shown in FIG. 8, the adhesive layer 107 is provided at the tip of the magnetic polishing tool 101, and the hair-like member 103 is pierced and implanted therein. In any of these examples, the bristle member 103 is fixed to the tip of the magnetic polishing tool 101 by curing the adhesive 105 or the adhesive layer 107.
この磁気研磨工具１０１を用いて磁性研磨加工を行うには、まず、磁化させた磁気研磨工具１０１の先端に磁性流体１０２を接触させて、磁気ブラシを形成する。この磁気ブラシは、磁力のみでは小さい復元力が毛状部材１０３によって強化されている。 In order to perform magnetic polishing using the magnetic polishing tool 101, first, the magnetic fluid 102 is brought into contact with the tip of the magnetized magnetic polishing tool 101 to form a magnetic brush. This magnetic brush is strengthened by the hair-like member 103 so that the restoring force is small only by the magnetic force.
この磁気研磨工具１０１を回転させながら、図６に示すように、磁気研磨工具１０１の先端に形成された磁気ブラシをワークＷの加工面に直接接触させてワークＷの加工を行う。毛状部材１０３は磁気研磨工具１０１の先端に植設されているので、磁気研磨工具１０１を回転させれば毛状部材１０３もそれに追随して回転する。このとき、磁性流体１０２は毛状部材１０３に追従してワークＷの加工面上を動くので、磁気研磨工具１０１の回転数に応じた磁気ブラシの相対速度が確保される。
上述した従来の研磨方法は、磁性流体が磁化して形成される磁気ブラシを、複数の毛状部材を植設した磁気研磨工具の先端に形成させることで、磁気ブラシの弱い復元力を強化して効率良く研磨加工を行うというものである。 The conventional polishing method described above enhances the weak restoring force of a magnetic brush by forming a magnetic brush formed by magnetizing a magnetic fluid at the tip of a magnetic polishing tool in which a plurality of bristle members are implanted. Thus, polishing is performed efficiently.
しかし、この研磨方法では、磁気ブラシが毛状部材にからまって形成されているため、加工中に砥粒の交換が行なわれ難く、一定の研磨能力を加工の終了まで維持することが難しい。 However, in this polishing method, since the magnetic brush is formed around the hair-like member, it is difficult to replace the abrasive grains during processing, and it is difficult to maintain a certain polishing ability until the end of processing.
また、ワーク加工面に毛状部材を接触させながら研磨を行うときに、ワーク加工面への毛状部材の当たり方にバラツキが生じると不均一な面になってしまうことが考えられる。
面に、工具先端に毛状部材を植設するため、工具の形状が制限されてしまう。例えば、微小なワークを加工する場合には工具先端を微小にする必要があるが、微小な工具先端に毛状部材を植設することは難しい。
Further, when polishing is performed while bringing the hair-like member into contact with the workpiece processing surface, it may be considered that the surface becomes non-uniform if variations occur in the manner in which the hair-like member contacts the workpiece processing surface.
Since a bristle member is implanted on the surface at the tip of the tool, the shape of the tool is limited. For example, when processing a minute workpiece, it is necessary to make the tool tip minute, but it is difficult to implant a hairy member at the minute tool tip.
本発明は上述した問題に鑑みてなされたものであり、その解決しようとする課題は、加工精度が良好で効率の高い磁気研磨の手法を提供することである。 The present invention has been made in view of the above-described problems, and a problem to be solved is to provide a magnetic polishing technique with good processing accuracy and high efficiency.
本発明の態様のひとつである磁気研磨方法は、研磨砥粒と磁性粒と分散媒とからなる磁性流体を磁力により回転軸の先端に保持させておき、当該回転軸の先端とワークの表面との間に一定の距離の隙間を保ちつつ両者を相対移動させ、当該隙間に介在する当該磁性流体を当該ワークの表面に当接させ、当該回転軸が当該ワークの表面の加工点の接線に対して常に垂直な方向となるように当該回転軸と当該ワークとの位置関係を維持しながら当該回転軸を回転させて当該表面を研磨する、ことを特徴とするものであり、この特徴によって前述した課題を解決する。 In one embodiment of the present invention, a magnetic polishing method comprises holding a magnetic fluid composed of abrasive grains, magnetic particles, and a dispersion medium at the tip of a rotating shaft by a magnetic force, and the tip of the rotating shaft and the surface of a workpiece. The magnetic fluid intervening in the gap is brought into contact with the surface of the workpiece, and the rotation axis is tangent to the processing point on the surface of the workpiece. The surface is polished by rotating the rotating shaft while maintaining the positional relationship between the rotating shaft and the workpiece so that the direction is always vertical. Solve the problem.
なお、上述した本発明に係る磁気研磨方法において、コイルに電力を印加して発生させた磁界で当該回転軸を磁化させることにより当該磁力を発生させ、当該研磨を行いながら当該電力の印加を断接する、ようにしてもよい。 In the magnetic polishing method according to the present invention described above, the magnetic force is generated by magnetizing the rotating shaft with a magnetic field generated by applying electric power to the coil, and the application of the electric power is interrupted while performing the polishing. You may make it touch.
また、前述した本発明に係る磁気研磨方法において、当該回転軸の先端とワークの表面との相対移動量に応じ、所定の移動量毎に当該電力の印加の断接を切り替えるようにしてもよい。 In the above-described magnetic polishing method according to the present invention, the application / disconnection of the power may be switched for each predetermined movement amount according to the relative movement amount between the tip of the rotating shaft and the surface of the workpiece. .
また、前述した本発明に係る磁気研磨方法において、当該回転軸の先端は、Ｒ形状若しくは針形状であってもよい。
また、前述した本発明に係る磁気研磨方法において、当該回転軸の側面を非磁性体で被覆するようにしてもよい。
In the magnetic polishing method according to the present invention described above, the tip of the rotating shaft may be R-shaped or needle-shaped.
In the magnetic polishing method according to the present invention described above, the side surface of the rotating shaft may be covered with a nonmagnetic material.
本発明は、以上のようにすることにより、加工精度が良好で効率の高い磁気研磨が行えるようになるという効果を奏する。 The present invention has an effect that magnetic polishing can be performed with good processing accuracy and high efficiency.
以下、本発明の実施の形態を図面に基づいて説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
図１、図２、及び図３を用いて実施例１を説明する。
図１は本実施例で使用する研磨装置の概略構成を示している。
図１において、研磨工具部３０は、スピンドル１と、スピンドル１に連動するスピンドルモータ２と、スピンドル１にチャックされておりスピンドル１に対して着脱可能な研磨工具３とを有して構成されている。
Example 1 will be described with reference to FIGS. 1, 2, and 3.
FIG. 1 shows a schematic configuration of a polishing apparatus used in this embodiment.
In FIG. 1, the polishing tool unit 30 includes a spindle 1, a spindle motor 2 that is linked to the spindle 1, and a polishing tool 3 that is chucked by the spindle 1 and detachable from the spindle 1. Yes.
研磨工具３は先端がＲ形状（球形状）に形成されており、スピンドルモータ２の回転に連動して当該先端部を回転させることができる。
また、磁性体である研磨工具３にはコイル４が巻かれており、コイル４には電源装置５から電力を供給することができる。この電源装置５は不図示のワークの位置を制御する装置と連動して、電力供給のＯＮ／ＯＦＦを切り替える（断接する）ことができる。
The tip of the polishing tool 3 has an R shape (spherical shape), and the tip can be rotated in conjunction with the rotation of the spindle motor 2.
Further, a coil 4 is wound around the polishing tool 3 that is a magnetic body, and power can be supplied to the coil 4 from a power supply device 5. The power supply device 5 can switch on / off the power supply in conjunction with a device that controls the position of a workpiece (not shown).
ワーク部４０は、移動テーブル６、ワークステージ７、ワークスピンドル８、ワーク軸モータ９、及び固定ネジ１０を有して構成されている。
移動テーブル６は、図示しないモータにより、図１の紙面における左右方向であるＸ軸、図１の紙面における上下方向であるＺ軸、及びＸ軸とＺ軸とで張られる平面上での回転方向であるＢ軸の３軸方向の各々での移動制御が可能である。移動テーブル６上にはワークステージ７が取り付けられており、ワークステージ７はワークスピンドル８と繋がっている。ワークスピンドル８は、ワーク軸モータ９を回転させることにより回転させることができる。ワークＷはワークステージ７上に着脱自在に取り付けることができ、固定ネジ１０によりワークステージ７に固定される。
The work unit 40 includes a moving table 6, a work stage 7, a work spindle 8, a work shaft motor 9, and a fixing screw 10.
The moving table 6 is rotated by a motor (not shown) in the horizontal direction on the plane of FIG. 1, the Z axis which is the vertical direction on the plane of FIG. It is possible to control movement in each of the three B axis directions. A work stage 7 is mounted on the moving table 6, and the work stage 7 is connected to a work spindle 8. The work spindle 8 can be rotated by rotating the work shaft motor 9. The workpiece W can be detachably mounted on the workpiece stage 7 and is fixed to the workpiece stage 7 by a fixing screw 10.
上記構成の研磨装置を使用して行う研磨の方法について、図１及び図２を用いて説明する。
図１において、まず凹形状である超硬性のワークＷをワークステージ７に取り付ける。このとき、ワークＷを回転させてもワークＷの加工面に振れが生じないように調整しながら固定ネジ７により固定する。続いて、ワークＷの加工面にスラリ状（泥状）の磁性流体１１を塗布する。
A polishing method performed using the polishing apparatus having the above configuration will be described with reference to FIGS.
In FIG. 1, first, a superhard workpiece W having a concave shape is attached to a workpiece stage 7. At this time, the workpiece W is fixed by the fixing screw 7 while adjusting so that the workpiece W does not shake even when the workpiece W is rotated. Subsequently, a slurry (mud) magnetic fluid 11 is applied to the processed surface of the workpiece W.
次に、スピンドルモータ２によりスピンドル１を５０ｒｐｍで回転させて研磨工具３を回転させると共に、ワーク軸モータ９によりワークスピンドル８を１００ｒｐｍで回転させてワークＷを回転させる。そして、電源装置５をＯＮにしてコイル４に２．５Ａの電流を流して研磨工具３を磁化する。 Next, the spindle 1 is rotated at 50 rpm by the spindle motor 2 to rotate the polishing tool 3, and the workpiece spindle 8 is rotated at 100 rpm by the workpiece shaft motor 9 to rotate the workpiece W. Then, the power supply device 5 is turned on and a current of 2.5 A is passed through the coil 4 to magnetize the polishing tool 3.
図２はこの研磨装置によるワークＷに対する研磨加工の様子を示している。
この研磨装置での研磨加工は、まず、図２（１）に示すように、研磨工具３がワークＷの端面の加工開始位置の上方に位置するように移動テーブル６を移動させておく。続いて、ワークＷと研磨工具３の先端との距離を０．２ｍｍに設定し、この距離の隙間を保持しつつ、且つ研磨工具３の回転軸とワークＷの加工面上の加工点の接線とが常に垂直に位置するように位置制御を行いながら移動テーブル６をＢ軸方向に移動して、図２（２）に示すようなワークＷの中心部へと研磨工具３の先端を走査させる。その後も続けて移動テーブル６をＢ軸方向へ移動して図２（３）に示すようなワークＷのもう一方の端面まで研磨工具３の先端を走査させる。そしてその後もワークＷと研磨工具３の先端との隙間の距離と接触角度とを維持しながら移動テーブル６をＢ軸の逆方向へと移動して研磨工具３の先端の走査を続け、図２（１）の位置へと戻す。この走査動作を１サイクルとし、所望の鏡面形状が得られるまでこのサイクルを繰り返すことで研磨加工が行われる。
FIG. 2 shows a state of polishing processing on the workpiece W by this polishing apparatus.
In the polishing process by this polishing apparatus, first, the moving table 6 is moved so that the polishing tool 3 is positioned above the processing start position of the end face of the workpiece W as shown in FIG. Subsequently, the distance between the workpiece W and the tip of the polishing tool 3 is set to 0.2 mm, and the tangent line between the rotation axis of the polishing tool 3 and the processing point on the processing surface of the workpiece W is maintained while maintaining a gap of this distance. The moving table 6 is moved in the B-axis direction while performing position control so that and are always positioned vertically, and the tip of the polishing tool 3 is scanned to the center of the workpiece W as shown in FIG. . Subsequently, the moving table 6 is moved in the B-axis direction, and the tip of the polishing tool 3 is scanned to the other end surface of the workpiece W as shown in FIG. Then, while maintaining the distance and contact angle between the workpiece W and the tip of the polishing tool 3, the moving table 6 is moved in the direction opposite to the B axis to continue scanning the tip of the polishing tool 3. FIG. Return to position (1). This scanning operation is defined as one cycle, and polishing is performed by repeating this cycle until a desired mirror surface shape is obtained.
なお、この研磨加工中、電源装置５は、ワークＷと研磨工具３との相対的な位置の制御を行う不図示の制御部により、ワークＷの揺動角に連動して０．５ｄｅｇ毎に１秒間、電源装置５からの電力供給をＯＦＦとする時間が設けられており、ワークＷと研磨工具３との相対的な移動が所定量に達する度に電力供給のＯＮ／ＯＦＦ（断接）が繰り返される。 During this polishing process, the power supply 5 is controlled every 0.5 deg in conjunction with the swing angle of the workpiece W by a control unit (not shown) that controls the relative position between the workpiece W and the polishing tool 3. A time for turning off the power supply from the power supply device 5 is provided for 1 second, and the power supply is turned on / off (connected / disconnected) every time the relative movement between the workpiece W and the polishing tool 3 reaches a predetermined amount. Is repeated.
次に、この研磨加工中の磁性流体１１の挙動について、図３を用いて説明する。
図３では磁性流体１１が模式的に示されている。磁性流体１１は、ダイヤモンド砥粒１２、磁性粒１３、及び分散媒１４からなる。
Next, the behavior of the magnetic fluid 11 during the polishing process will be described with reference to FIG.
FIG. 3 schematically shows the magnetic fluid 11. The magnetic fluid 11 includes diamond abrasive grains 12, magnetic grains 13, and a dispersion medium 14.
図３（１）は電源装置５によるコイル４への電力供給がＯＮの状態における磁性流体１１の状態を示しており、磁化されている研磨工具３の磁力により磁性流体１１中の磁性粒１３が研磨工具３側に引き寄せられることにより、その反力としてダイヤモンド砥粒１２が回転軸３から離れる力を受け、その結果としてダイヤモンド砥粒１２がワークＷの加工面に作用している状態を示している。 FIG. 3A shows a state of the magnetic fluid 11 in a state where the power supply to the coil 4 by the power supply device 5 is ON, and the magnetic particles 13 in the magnetic fluid 11 are caused by the magnetic force of the magnetized polishing tool 3. By being drawn toward the polishing tool 3 side, the diamond abrasive grains 12 receive a force separating from the rotary shaft 3 as a reaction force, and as a result, the diamond abrasive grains 12 are acting on the processed surface of the workpiece W. Yes.
一方、図３（２）は電源装置５によるコイル４への電力供給がＯＦＦの状態における磁性流体１１の状態を示しており、磁力の消失により磁性粒１３が研磨工具３から離れて、ワークＷの加工面に作用していたダイヤモンド砥粒１２やその他の砥粒と混じりあった状態を示している。 On the other hand, FIG. 3B shows a state of the magnetic fluid 11 in a state where the power supply to the coil 4 by the power supply device 5 is OFF. The magnetic particles 13 are separated from the polishing tool 3 due to the disappearance of the magnetic force, and the workpiece W This shows a state in which the diamond abrasive grains 12 and other abrasive grains acting on the processed surface are mixed.
このように、コイル４への電力供給のＯＮ／ＯＦＦを繰り返すことにより、ワークＷの加工面に作用するダイヤモンド砥粒１２が入れ替わるのである。
以上のように、本実施例によれば、磁化させた研磨工具３の先端に磁性流体１１を配し、ワークＷと研磨工具３とが直接接触しないように研磨工具３の先端とワークＷの加工面との間の隙間の距離を０．２ｍｍに保ちつつ相対移動して、ワークＷの加工面と研磨工具３との間に磁性流体１１を介在させて研磨を行うことにより、常にワークＷと研磨工具３とが一定の距離で研磨加工されるので、どの加工面においても研磨砥粒であるダイヤモンド砥粒１２が同じように作用する結果、面全体が均一に研磨される。
In this manner, the diamond abrasive grains 12 acting on the processed surface of the workpiece W are replaced by repeating ON / OFF of the power supply to the coil 4.
As described above, according to the present embodiment, the magnetic fluid 11 is disposed at the tip of the magnetized polishing tool 3, and the tip of the polishing tool 3 and the workpiece W are prevented from coming into direct contact with each other. The workpiece W is always moved by moving relative to the machining surface while maintaining a distance of 0.2 mm between the machining surface and the magnetic fluid 11 interposed between the machining surface of the workpiece W and the polishing tool 3. And the polishing tool 3 are polished at a constant distance, and as a result, the diamond abrasive grains 12 that are abrasive grains act in the same manner on any processed surface, so that the entire surface is uniformly polished.
また、研磨加工中にワークＷの揺動角に連動させてコイル４への電力供給を所定時間ＯＦＦとすることにより、ワークＷの加工面に作用する磁性流体１１中の研磨砥粒であるダイヤモンド砥粒１２が常に入れ替わるので、研磨加工中における研磨能力が一定に保たれる結果、効率良く研磨することができる。 In addition, diamond that is abrasive grains in the magnetic fluid 11 acting on the processed surface of the workpiece W is turned off for a predetermined time in conjunction with the swing angle of the workpiece W during the polishing process. Since the abrasive grains 12 are always replaced, the polishing ability during the polishing process is kept constant, so that the polishing can be efficiently performed.
図４及び図５を用いて実施例２を説明する。
図４は本実施例で使用する研磨装置の概略構成を示している。同図に示した研磨装置の構成は、研磨工具３の構成を除けば、図１に示した実施例１に係るものと同様であるので、詳細な説明は省略する。
A second embodiment will be described with reference to FIGS. 4 and 5.
FIG. 4 shows a schematic configuration of a polishing apparatus used in this embodiment. Since the configuration of the polishing apparatus shown in the figure is the same as that according to the first embodiment shown in FIG. 1 except for the configuration of the polishing tool 3, detailed description thereof will be omitted.
本実施例に使用される研磨工具３の構成は図５（１）に示されている。
図５（１）に示されている研磨工具３は、その先端が鋭利な針形状に成形されており、その側面はウレタン１５により被覆されている。
The configuration of the polishing tool 3 used in this embodiment is shown in FIG.
The polishing tool 3 shown in FIG. 5 (1) is formed into a sharp needle shape at its tip, and its side surface is covered with urethane 15.
上記構成の研磨装置を使用して行う研磨の方法について、図４を用いて説明する。
図４において、まず凹形状である超硬性のワークＷをワークステージ７に取り付ける。このとき、ワークＷを回転させてもワークＷの加工面に振れが生じないように調整しながら固定ネジ７により固定する。続いて、ワークＷの加工面にスラリー状（泥状）の磁性流体１１を塗布する。この磁性流体１１も、実施例１と同様、ダイヤモンド砥粒、磁性粒、及び分散媒からなる。
A polishing method performed using the polishing apparatus having the above configuration will be described with reference to FIG.
In FIG. 4, first, a superhard workpiece W having a concave shape is attached to the workpiece stage 7. At this time, the workpiece W is fixed by the fixing screw 7 while adjusting so that the workpiece W does not shake even when the workpiece W is rotated. Subsequently, a slurry-like (mud-like) magnetic fluid 11 is applied to the processed surface of the workpiece W. This magnetic fluid 11 is also composed of diamond abrasive grains, magnetic grains, and a dispersion medium, as in the first embodiment.
次に、研磨工具３をスピンドル１に取り付ける。研磨工具３は、根元の径が０．７ｍｍで先端角が２０°に成形され、側面がウレタン１５によって被覆されている。
次に、スピンドルモータ２によりスピンドル１を５０ｒｐｍで回転させて研磨工具３を回転させると共に、ワーク軸モータ９によりワークスピンドル８を１００ｒｐｍで回転させてワークＷを回転させる。そして、電源装置５をＯＮにしてコイル４に２．５Ａの電流を流して研磨工具３を磁化する。
Next, the polishing tool 3 is attached to the spindle 1. The polishing tool 3 has a root diameter of 0.7 mm, a tip angle of 20 °, and a side surface covered with urethane 15.
Next, the spindle 1 is rotated at 50 rpm by the spindle motor 2 to rotate the polishing tool 3, and the workpiece spindle 8 is rotated at 100 rpm by the workpiece shaft motor 9 to rotate the workpiece W. Then, the power supply device 5 is turned on and a current of 2.5 A is passed through the coil 4 to magnetize the polishing tool 3.
この研磨装置でのワークＷの研磨加工は、まず、研磨工具３がワークＷの端面の加工開始位置の上方に位置するように移動テーブル６を移動させておく。続いて、ワークＷと研磨工具３の先端との間の距離を０．２ｍｍに設定し、この距離の隙間を保持しつつ、且つ研磨工具３の回転軸とワークＷの加工面上の加工点の接線とが常に垂直に位置するように位置制御を行いながら移動テーブル６をＢ軸方向に移動し、ワークＷの中心部を経てワークＷのもう一方の端面まで研磨工具３の先端を走査させる。そしてその後もワークＷと研磨工具３の先端との隙間の距離と接触角度とを維持しながら移動テーブル６をＢ軸の逆方向へと移動して研磨工具３の先端の走査を続けて元の位置へと戻す。この走査動作を１サイクルとし、所望の鏡面形状が得られるまでこのサイクルを繰り返すことで研磨加工が行われる。 In the polishing process of the workpiece W by this polishing apparatus, first, the moving table 6 is moved so that the polishing tool 3 is positioned above the processing start position of the end face of the workpiece W. Subsequently, the distance between the workpiece W and the tip of the polishing tool 3 is set to 0.2 mm, and a processing point on the processing surface of the rotating shaft of the polishing tool 3 and the workpiece W is maintained while maintaining a gap of this distance. The moving table 6 is moved in the B-axis direction while performing position control so that the tangent line is always vertically positioned, and the tip of the polishing tool 3 is scanned to the other end surface of the work W through the center of the work W. . Thereafter, while maintaining the distance and contact angle between the workpiece W and the tip of the polishing tool 3, the moving table 6 is moved in the direction opposite to the B axis to continue scanning the tip of the polishing tool 3. Return to position. This scanning operation is defined as one cycle, and polishing is performed by repeating this cycle until a desired mirror surface shape is obtained.
なお、この研磨加工中、電源装置５は、ワークＷと研磨工具３との相対的な位置の制御を行う不図示の制御部により、ワークＷの揺動角に連動して０．５ｄｅｇ毎に１秒間、電源装置５からの電力供給をＯＦＦとする時間が設けられており、ワークＷと研磨工具３との相対的な移動が所定量に達する度に電力供給のＯＮ／ＯＦＦ（断接）が繰り返される。 During this polishing process, the power supply 5 is controlled every 0.5 deg in conjunction with the swing angle of the workpiece W by a control unit (not shown) that controls the relative position between the workpiece W and the polishing tool 3. A time for turning off the power supply from the power supply device 5 is provided for 1 second, and the power supply is turned on / off (connected / disconnected) every time the relative movement between the workpiece W and the polishing tool 3 reaches a predetermined amount. Is repeated.
次に、この研磨加工中の磁性流体１１の挙動について、図５を用いて説明する。
図５（１）に示すように、本実施例で使用する研磨工具３は、側面がウレタン１５により被覆されているので、その側面部分では磁力が弱められる。そのため、この側面部分では、磁性流体１１の磁化によって形成される磁気チェーンが殆んど形成されない。一方、ウレタン１５の被覆がされていない研磨工具３先端の針状の部分では、磁性流体１１による磁気チェーンが形成されるので、この部分を微小な研磨工具と見ることができるのである。
Next, the behavior of the magnetic fluid 11 during the polishing process will be described with reference to FIG.
As shown in FIG. 5 (1), since the side surface of the polishing tool 3 used in this embodiment is covered with urethane 15, the magnetic force is weakened at the side surface portion. Therefore, the magnetic chain formed by the magnetization of the magnetic fluid 11 is hardly formed on this side surface portion. On the other hand, in the needle-like portion at the tip of the polishing tool 3 that is not covered with the urethane 15, a magnetic chain is formed by the magnetic fluid 11, and this portion can be regarded as a fine polishing tool.
これに対し、図５（２）に示すような、側面を被覆されていない研磨工具３では、研磨工具３全体に磁性流体１１による磁気チェーンが形成されてしまうため、ワークＷにおける研磨不要な部分までもが磁性流体１１で研磨されてしまう。 On the other hand, in the polishing tool 3 whose side surface is not coated as shown in FIG. 5 (2), a magnetic chain made of the magnetic fluid 11 is formed on the entire polishing tool 3, so that the portion of the workpiece W that does not require polishing is formed. Will be polished by the magnetic fluid 11.
以上のように、本実施例によれば、先端を鋭利にした研磨工具３を使用して研磨工具３の先端の微小な範囲で磁性流体１１を磁化させ、これで研磨加工を行うので、研磨範囲の狭い微小な形状のワークＷを効率良く研磨することができる。 As described above, according to the present embodiment, the polishing tool 3 having a sharp tip is used to magnetize the magnetic fluid 11 in a minute range at the tip of the polishing tool 3, and the polishing process is performed with this. It is possible to efficiently polish a work W having a small shape with a narrow range.
更に、研磨工具３における磁化させたい部分以外をウレタン１５等の非磁性体で被覆することにより、より微小な範囲で磁性流体１１を磁化できるので、研磨範囲の狭い微小な形状のワークＷの研磨が可能となり、より高精度な仕上げができるようになる。 Furthermore, since the magnetic fluid 11 can be magnetized in a finer range by coating a portion other than the portion to be magnetized in the polishing tool 3 with a non-magnetic material such as urethane 15, the work W having a fine shape with a narrow polishing range can be polished. This makes it possible to finish with higher accuracy.
その他、本発明は、上述した実施形態に限定されることなく、種々の改良・変更が可能である。 In addition, the present invention is not limited to the above-described embodiments, and various improvements and changes can be made.
１ スピンドル
２ スピンドルモータ
３ 研磨工具
４ コイル
５ 電源装置
６ 移動テーブル
７ ワークステージ
８ ワークスピンドル
９ ワーク軸モータ
１０ 固定ネジ
１１ 磁性流体
１２ ダイヤモンド砥粒
１３ 磁性粒
１４ 分散媒
１５ ウレタン
３０ 研磨工具部
４０ ワーク部
１０１ 磁気研磨工具
１０２ 磁性流体
１０３ 毛状部材
１０５ 接着剤
１０６ 植設穴
１０７ 接着剤層
Ｗ ワーク
DESCRIPTION OF SYMBOLS 1 Spindle 2 Spindle motor 3 Polishing tool 4 Coil 5 Power supply device 6 Moving table 7 Work stage 8 Work spindle 9 Work shaft motor 10 Fixing screw 11 Magnetic fluid 12 Diamond abrasive grain 13 Magnetic grain 14 Dispersion medium 15 Urethane 30 Polishing tool part 40 Workpiece Part 101 Magnetic polishing tool 102 Magnetic fluid 103 Hairy member 105 Adhesive 106 Planting hole 107 Adhesive layer W Workpiece
Claims (5)
前記回転軸の先端とワークの表面との間に一定の距離の隙間を保ちつつ両者を相対移動させ、
前記隙間に介在する前記磁性流体を前記ワークの表面に当接させ、
前記回転軸が前記ワークの表面の加工点の接線に対して常に垂直な方向となるように当該回転軸と当該ワークとの位置関係を維持しながら当該回転軸を回転させて当該表面を研磨する、
ことを特徴とする磁気研磨方法。 A magnetic fluid composed of abrasive grains, magnetic grains, and a dispersion medium is held at the tip of the rotating shaft by a magnetic force,
While maintaining a gap of a certain distance between the tip of the rotating shaft and the surface of the work, both are relatively moved,
Contacting the magnetic fluid interposed in the gap with the surface of the workpiece;
The surface of the workpiece is polished by rotating the axis of rotation while maintaining the positional relationship between the axis of rotation and the workpiece so that the axis of rotation is always perpendicular to the tangent to the processing point on the surface of the workpiece. ,
A magnetic polishing method.
前記研磨を行いながら前記電力の印加を断接する、
ことを特徴とする請求項１に記載の磁気研磨方法。 Generating the magnetic force by magnetizing the rotating shaft with a magnetic field generated by applying electric power to the coil;
Connecting and disconnecting the application of the power while performing the polishing,
The magnetic polishing method according to claim 1.
The magnetic polishing method according to claim 1, wherein a side surface of the rotating shaft is covered with a nonmagnetic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005039391A JP2006224227A (en) | 2005-02-16 | 2005-02-16 | Magnetic polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005039391A JP2006224227A (en) | 2005-02-16 | 2005-02-16 | Magnetic polishing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2006224227A true JP2006224227A (en) | 2006-08-31 |
Family
ID=36986027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005039391A Pending JP2006224227A (en) | 2005-02-16 | 2005-02-16 | Magnetic polishing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006224227A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100861775B1 (en) | 2007-07-20 | 2008-10-08 | 중앙대학교 산학협력단 | Circulation type polishing device using magneto-rheological fluid |
| KR100891176B1 (en) * | 2007-07-20 | 2009-04-01 | 중앙대학교 산학협력단 | Multi wheel type polishing device using magneto-rheological fluid |
| KR101176695B1 (en) | 2009-01-19 | 2012-08-23 | 연세대학교 산학협력단 | Curve grinding method by using magnetorheological fluid |
| JP2014018875A (en) * | 2012-07-12 | 2014-02-03 | Institute Of National Colleges Of Technology Japan | Magnetic polishing method |
| CN107775516A (en) * | 2017-12-01 | 2018-03-09 | 辽宁科技大学 | The burnishing device of complicated ceramic workpiece |
| CN109551310A (en) * | 2018-12-10 | 2019-04-02 | 上海理工大学 | A kind of electromagnet type magnetic coupling fluid polishing device |
| JP2020116722A (en) * | 2019-01-28 | 2020-08-06 | 独立行政法人国立高等専門学校機構 | Fluid polishing device and fluid polishing method |
| CN115401530A (en) * | 2022-08-30 | 2022-11-29 | 大连理工大学 | Shape-controlled flexible polishing method for microarray mold |
| WO2023000414A1 (en) * | 2021-07-23 | 2023-01-26 | 广东工业大学 | Method and apparatus for curvature-adaptive cluster magnetorheological polishing of free curved surface |
| KR20230057750A (en) * | 2021-10-22 | 2023-05-02 | 한양대학교 에리카산학협력단 | Precision grinding apparatus |
-
2005
- 2005-02-16 JP JP2005039391A patent/JP2006224227A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100861775B1 (en) | 2007-07-20 | 2008-10-08 | 중앙대학교 산학협력단 | Circulation type polishing device using magneto-rheological fluid |
| KR100891176B1 (en) * | 2007-07-20 | 2009-04-01 | 중앙대학교 산학협력단 | Multi wheel type polishing device using magneto-rheological fluid |
| KR101176695B1 (en) | 2009-01-19 | 2012-08-23 | 연세대학교 산학협력단 | Curve grinding method by using magnetorheological fluid |
| JP2014018875A (en) * | 2012-07-12 | 2014-02-03 | Institute Of National Colleges Of Technology Japan | Magnetic polishing method |
| CN107775516A (en) * | 2017-12-01 | 2018-03-09 | 辽宁科技大学 | The burnishing device of complicated ceramic workpiece |
| CN109551310A (en) * | 2018-12-10 | 2019-04-02 | 上海理工大学 | A kind of electromagnet type magnetic coupling fluid polishing device |
| JP2020116722A (en) * | 2019-01-28 | 2020-08-06 | 独立行政法人国立高等専門学校機構 | Fluid polishing device and fluid polishing method |
| JP7203618B2 (en) | 2019-01-28 | 2023-01-13 | 株式会社フェローテックマテリアルテクノロジーズ | Fluid polishing apparatus and fluid polishing method |
| WO2023000414A1 (en) * | 2021-07-23 | 2023-01-26 | 广东工业大学 | Method and apparatus for curvature-adaptive cluster magnetorheological polishing of free curved surface |
| KR20230057750A (en) * | 2021-10-22 | 2023-05-02 | 한양대학교 에리카산학협력단 | Precision grinding apparatus |
| KR102618726B1 (en) | 2021-10-22 | 2023-12-28 | 주식회사 대영파워펌프 | Precision grinding apparatus |
| CN115401530A (en) * | 2022-08-30 | 2022-11-29 | 大连理工大学 | Shape-controlled flexible polishing method for microarray mold |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2006224227A (en) | Magnetic polishing method | |
| US6506103B1 (en) | ELID centerless grinding apparatus | |
| JPH07314309A (en) | Spherically finishing device and method | |
| JP3344558B2 (en) | Electric dressing grinding method and apparatus | |
| JPH0343145A (en) | Grinding device | |
| JP4104199B2 (en) | Molded mirror grinding machine | |
| JP2007098541A (en) | Polishing tool and polish method | |
| JP2002263995A (en) | Method and device for grinding spherical surface | |
| JP2008194771A (en) | Method and device for grinding lens sphere | |
| JP2009107055A (en) | Polishing tool and polishing device | |
| JP2011083827A (en) | Magnetic fluid polishing method and polishing device | |
| JPH08192348A (en) | Grinding and polishing method and device therefor | |
| JP4341801B2 (en) | ELID grinding machine for fine shape processing | |
| JP2000246634A (en) | Plasma discharge trueing device and fine machining method using this device | |
| EP1078714B1 (en) | Method and apparatus for grinding curved surfaces | |
| JP5376647B2 (en) | Concave spherical grinding apparatus and method | |
| JP2008264920A (en) | Grinding tool, magnetic grinding method, and magnetic grinding device | |
| JP5025275B2 (en) | Polishing tool | |
| JP2006082213A (en) | Method of cutting work and cutting work/mirror polishing device | |
| KR100323065B1 (en) | A poplshing apparatus based on the magnetic field forming principale of electromagnet | |
| KR940006010Y1 (en) | Grinding device | |
| JP2006088283A (en) | Method and device for polishing and coating mirror surface | |
| JP2000052218A (en) | Magnetic polishing device and magnetic polishing method | |
| JPH06335853A (en) | Grinding and device therefor | |
| JP3671250B2 (en) | Diamond grinding wheel and its truing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070216 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081024 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081104 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090303 |