JP5628563B2 - Polishing equipment - Google Patents

Polishing equipment Download PDF

Info

Publication number
JP5628563B2
JP5628563B2 JP2010135260A JP2010135260A JP5628563B2 JP 5628563 B2 JP5628563 B2 JP 5628563B2 JP 2010135260 A JP2010135260 A JP 2010135260A JP 2010135260 A JP2010135260 A JP 2010135260A JP 5628563 B2 JP5628563 B2 JP 5628563B2
Authority
JP
Japan
Prior art keywords
polishing pad
polishing
slurry
workpiece
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010135260A
Other languages
Japanese (ja)
Other versions
JP2012000689A (en
Inventor
松井　伸介
伸介 松井
阿部　宜輝
宜輝 阿部
小林　潤也
潤也 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP2010135260A priority Critical patent/JP5628563B2/en
Publication of JP2012000689A publication Critical patent/JP2012000689A/en
Application granted granted Critical
Publication of JP5628563B2 publication Critical patent/JP5628563B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Description

本発明は、様々な部品を研磨するための研磨装置に関する。   The present invention relates to a polishing apparatus for polishing various parts.

近年、シリコン基板、液晶パネル等の被加工部品の大型化に伴い部分高速研磨を複合させて、被加工部品の全体を研磨することによって、研磨装置の小型化、高精度化を達成しようとする考え方が出てきている。これは、部分高速研磨を行う研磨装置を、被加工部品の表面上のＸ軸とＹ軸の方向に移動させることにより、被加工部品の表面が広い場合でも、高精度研磨を実行可能とするものである。また、被加工部品の表面上での研磨装置のＸ軸とＹ軸方向の移動量に加えて、その移動速度および加工圧をも制御することにより、被加工部品の表面が広くて、自由局面を有する場合にも、高精度研磨が可能となる。また、多層配線基板の平坦化等では、必要な部分のみを研磨することにより加工の高速化、部材、研磨材の省資源化等が図られている。これは環境への配慮からも必要な技術となってきている。さらには、従来は超精密研削で仕上げられていたマイクロ光学部品等において、更なる高品位面を求めるために、マイクロ研磨の導入等、高品位高速部分研磨技術が重要になりつつある。例えば、このような研磨技術として、特許文献１には、揺動可能に保持された工具保持部材のバランスをとることが容易な研磨装置および研磨方法が開示されている。   In recent years, with the increase in the size of parts to be processed such as silicon substrates and liquid crystal panels, it is intended to achieve downsizing and high precision of the polishing apparatus by combining partial high-speed polishing and polishing the entire part to be processed. The idea has come out. This is because a polishing apparatus that performs partial high-speed polishing is moved in the X-axis and Y-axis directions on the surface of the workpiece, thereby enabling high-precision polishing even when the surface of the workpiece is wide. Is. In addition to the amount of movement of the polishing apparatus in the X-axis and Y-axis directions on the surface of the workpiece, the movement speed and machining pressure are also controlled, so that the surface of the workpiece is wide and free Even in the case of having high accuracy, high-precision polishing is possible. Further, in the flattening of the multilayer wiring board and the like, only a necessary part is polished to increase the processing speed and save resources of the members and abrasives. This has become a necessary technology for environmental considerations. Furthermore, high-quality high-speed partial polishing techniques such as the introduction of micro-polishing are becoming important in order to obtain even higher quality surfaces in micro optical parts and the like that have been finished by ultra-precision grinding. For example, as such a polishing technique, Patent Document 1 discloses a polishing apparatus and a polishing method that make it easy to balance a tool holding member that is swingably held.

特開２００７−２７６０８１号公報JP 2007-276081 A

従来は研磨パッドを自転させ、自転する研磨パッドを含む研磨装置を、被加工部品の表面上のＸ軸とＹ軸の方向に移動し研磨する方法が取れられていた。図１は、このような方法を用いた研磨装置を示す図である。図１において、加工圧５０１４が研磨装置に加圧され、モータ５０１３により研磨パッド５０１１が方向５０１２の方向に自転して、被加工部品５０１５の研磨が行われる。図１に示されている研磨装置の場合には研磨パッド５０１１の中心部で自転による被加工部品５０１５に対する相対速度が0となり加工力が無くなる。このため、研磨パッド５０１１の自転機構をわずかに傾けて、研磨パッド５０１１の回転中心が被加工部品５０１５と干渉しないようにした方法もあった。図２は、このような方法を用いた研磨装置を示す図である。   Conventionally, the polishing pad is rotated, and a polishing apparatus including the rotating polishing pad is moved in the X-axis and Y-axis directions on the surface of the workpiece to be polished. FIG. 1 is a diagram showing a polishing apparatus using such a method. In FIG. 1, a processing pressure 5014 is applied to the polishing apparatus, and a polishing pad 5011 is rotated in a direction 5012 by a motor 5013 to polish the workpiece 5015. In the case of the polishing apparatus shown in FIG. 1, the relative speed with respect to the workpiece 5015 due to rotation at the center of the polishing pad 5011 becomes zero, and the processing force is lost. Therefore, there has been a method in which the rotation mechanism of the polishing pad 5011 is slightly tilted so that the center of rotation of the polishing pad 5011 does not interfere with the workpiece 5015. FIG. 2 is a view showing a polishing apparatus using such a method.

しかし、上記の方法では、仮に一定の圧力が研磨パッドに作用していたとしても、被加工部品との相対摺動速度が自転の内側方向と外側方向では異なる。したがって、研磨パッド面内で均一な加工量を得ることが難しく、結果として被加工部品全体での加工量の制御が難しくなるという問題があった。また、充分早い加工速度を実現するために高速に研磨パッドを自転させようとすると研磨パッド自体の遠心力によって研磨パッドの近傍にある研磨液（スラリー）が飛散し、研磨に必要な部位にスラリーが進入しないという問題が起こる。たとえば、直径数センチの円形の研磨パッドを500 min-1程度で回転させるとスラリーは飛散してしまうことがある。 However, in the above method, even if a certain pressure is applied to the polishing pad, the relative sliding speed with the workpiece is different between the inner direction and the outer direction of rotation. Therefore, there is a problem that it is difficult to obtain a uniform processing amount in the polishing pad surface, and as a result, it becomes difficult to control the processing amount in the entire workpiece. In addition, when trying to rotate the polishing pad at a high speed in order to realize a sufficiently high processing speed, the polishing liquid (slurry) in the vicinity of the polishing pad is scattered by the centrifugal force of the polishing pad itself, and the slurry is removed at the site necessary for polishing. The problem that does not enter. For example, when a circular polishing pad having a diameter of several centimeters is rotated at about 500 min −1 , the slurry may be scattered.

本発明は、上記課題を解決するものであり、部分高速研磨において均一な加工速度が得られ、なおかつ高速に研磨パッドを駆動しても研磨可能な研磨装置を提供することを目的とする。   An object of the present invention is to solve the above-described problems, and to provide a polishing apparatus that can obtain a uniform processing speed in partial high-speed polishing and can polish even when a polishing pad is driven at high speed.

上記課題を解決するために、本発明は、被加工部品を研磨する研磨装置であって、被加工部品の表面を研磨する研磨パッドであって、前記研磨パッドが前記被加工部の表面に接触する面の大きさは前記被加工部品の表面の大きさより小さい研磨パッドを備え、前記研磨パッドは、自転せずに前記研磨パッドより小さい半径で公転し、前記研磨パッドの近傍にスラリーが供給され、前記研磨パッドが前記被加工部品に接触した状態で前記研磨装置自体あるいは前記研磨パッドに加工圧が付加され、前記研磨パッドが移動することにより前記被加工部品を研磨するように構成され、前記研磨パッドの側面には、前記スラリーが当該研磨パッド近傍に保持されるように、段差が設けられ、前記研磨パッドの周辺に前記研磨パッドの公転運動を妨げずに、前記被加工部品の表面にスラリーを保持する円盤状のスラリー保持部をさらに備え、前記スラリー保持部にスラリーが供給される。
また、上記課題を解決するために、本発明は、被加工部品を研磨する研磨装置であって、被加工部品の表面を研磨する研磨パッドであって、前記研磨パッドが前記被加工部の表面に接触する面の大きさは前記被加工部品の表面の大きさより小さい研磨パッドを備え、前記研磨パッドは、前記研磨パッドより小さい半径で公転し、前記研磨パッドの近傍にスラリーが供給され、前記研磨パッドが前記被加工部品に接触した状態で前記研磨装置自体あるいは前記研磨パッドに加工圧が付加され、前記研磨パッドが移動することにより前記被加工部品を研磨するように構成され、前記研磨パッドの側面は、当該研磨パッドの底面と接触しない前記被加工部品の上面部において段差を有しており、前記段差は、研磨時の前記スラリーが前記研磨パッド近傍に保持されるように、前記スラリーにより前記研磨パッドの側面周辺において湾曲して形成されるメニスカスの最上部よりも低い位置に設けられる。 In order to solve the above-described problems, the present invention provides a polishing apparatus for polishing a workpiece, which is a polishing pad for polishing the surface of a workpiece, and the polishing pad contacts the surface of the workpiece. The polishing pad has a polishing pad smaller than the surface of the workpiece, and the polishing pad revolves at a radius smaller than the polishing pad without rotating, and slurry is supplied in the vicinity of the polishing pad. A polishing pressure is applied to the polishing apparatus itself or the polishing pad in a state where the polishing pad is in contact with the workpiece, and the polishing pad is moved to polish the workpiece. the side surface of the polishing pad such that said slurry is maintained in the vicinity of the polishing pad, step is provided, without interfering with the revolving motion of the polishing pad around the polishing pad , Further comprising a disc-shaped slurry holding portion for holding the slurry on the surface of the processed part, the slurry is supplied to the slurry holding portion.
In order to solve the above problems, the present invention is a polishing apparatus for polishing a workpiece, and is a polishing pad for polishing a surface of a workpiece, the polishing pad being a surface of the workpiece. A polishing pad smaller in size than a surface of the workpiece, the polishing pad revolves with a smaller radius than the polishing pad, and slurry is supplied in the vicinity of the polishing pad, A polishing pressure is applied to the polishing apparatus itself or the polishing pad in a state where the polishing pad is in contact with the workpiece, and the polishing pad moves to polish the workpiece, and the polishing pad side surface of the not contact the bottom surface of the polishing pad has a stepped in the upper surface portion of the processed part, the step, the polishing pad is the slurry during polishing To be held alongside, provided at a position lower than the top of the meniscus formed by bending the side surface near the polishing pad by the slurry.

また、本発明に係る研磨装置は、前記研磨パッドは、自転せずに公転することを特徴とする。   The polishing apparatus according to the present invention is characterized in that the polishing pad revolves without rotating.

また、本発明に係る研磨装置は、前記研磨パッドは、自転しながら公転することを特徴とする。   The polishing apparatus according to the present invention is characterized in that the polishing pad revolves while rotating.

また、本発明に係る研磨装置は、前記研磨パッドの周辺に前記研磨パッドの公転運動を妨げずに、前記被加工部品の表面にスラリーを保持する円盤状のスラリー保持部をさらに備え、前記スラリー保持部に、スラリーが供給されることを特徴とする。 In addition, the polishing apparatus according to the present invention further includes a disk-shaped slurry holding portion that holds slurry on the surface of the workpiece without hindering the revolving motion of the polishing pad around the polishing pad, and the slurry The slurry is supplied to the holding unit.

本発明によれば、高速に研磨パッドを駆動しても研磨可能な研磨装置を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the polisher which can grind | polish even if a polishing pad is driven at high speed can be provided.

従来技術を示す図である。It is a figure which shows a prior art. 従来技術を示す図である。It is a figure which shows a prior art. 本発明に係る研磨装置を示す図である。It is a figure which shows the grinding | polishing apparatus which concerns on this invention. 本発明に係る研磨装置における研磨パッド１１と被加工部品の相対運動の軌跡２１を示す図である。It is a figure which shows the locus | trajectory 21 of the relative motion of the polishing pad 11 and the workpiece to be processed in the polishing apparatus according to the present invention. 研磨パッドによりどのようにスラリーが保持されるかを示す図である。It is a figure which shows how a slurry is hold | maintained with a polishing pad. 研磨パッドに段差をつけることによりスラリー保持量が増大することを示す図である。It is a figure which shows that slurry holding amount increases by making a polishing pad a level | step difference. 公転する研磨パッドの周辺にスラリー保持部が設けられた研磨装置を示す図である。It is a figure which shows the polishing apparatus with which the slurry holding | maintenance part was provided in the periphery of the polishing pad to revolve. 本発明に係る大型平面研磨システムを示す図である。It is a figure which shows the large sized surface polishing system which concerns on this invention.

図３は、本発明に係る研磨装置を示す図である。図３において、加工圧１５が研磨装置に加圧され、モータ１４に連結された公転歯車機構部１３が、研磨パッド１１が公転運動軌跡１２を描くように公転して、被加工部品１６の加工が行われる。   FIG. 3 is a view showing a polishing apparatus according to the present invention. In FIG. 3, the processing pressure 15 is applied to the polishing apparatus, and the revolving gear mechanism 13 connected to the motor 14 revolves so that the polishing pad 11 draws the revolving motion locus 12, thereby processing the workpiece 16. Is done.

図３に示されているように、本発明に係る研磨装置は、被加工部品１６の表面に接触する面の大きさが被加工部品１６の表面の大きさより小さい研磨パッド１１をコンパクトな歯車機構部１３により研磨パッド１１自体を自転させずに公転させる。この場合、研磨パッド１１の公転直径も小径とすれば、歯車機構部１３を非常にコンパクトにすることができる。このコンパクトな歯車機構部１３と小径小型の研磨パッド１１を用いると低消費電力の１つのモータでも高速に研磨パッドを駆動できる。   As shown in FIG. 3, the polishing apparatus according to the present invention uses a compact gear mechanism to connect the polishing pad 11 whose surface contacting the surface of the workpiece 16 is smaller than the surface of the workpiece 16. The polishing pad 11 itself is revolved by the part 13 without rotating. In this case, if the revolution diameter of the polishing pad 11 is also small, the gear mechanism 13 can be made very compact. When this compact gear mechanism 13 and small-diameter and small polishing pad 11 are used, the polishing pad can be driven at high speed even with a single motor with low power consumption.

例えば、図３の研磨パッド１１を、φ20 mm程度の発泡ポリウレタン製のものとしてもよい。また、例えば、図３の研磨パッドの公転運動の公転半径を、4 mm 程度としてもよい。この状態で、例えば、1500 min-1の高速で、研磨パッド１１を公転させても、スラリーは研磨パッド近傍に保持され、飛散することもないので、研磨部位をスラリーの液だめができるように囲う必要もない。 For example, the polishing pad 11 shown in FIG. 3 may be made of polyurethane foam having a diameter of about 20 mm. Further, for example, the revolution radius of the revolution movement of the polishing pad in FIG. 3 may be about 4 mm. In this state, for example, even if the polishing pad 11 is revolved at a high speed of 1500 min −1 , the slurry is held in the vicinity of the polishing pad and does not scatter, so that the polishing portion can be filled with slurry. There is no need to enclose.

図４は、本発明に係る研磨装置における研磨パッド１１と被加工部品の相対運動の軌跡２１を示す図である。本発明に係る研磨装置では、歯車機構部１３にカウンターウェートを設置することにより、研磨パッド１１の偏荷重による公転中の振動も抑制可能である。研磨パッド１１が自転せずに公転する場合、研磨パッド１１と被加工部品１６の相対運動ベクトル及び軌跡２１は、図４に示されているように、研磨パッド１１の全面で同一となる。また、図４に示されているように、全ての点で、研磨パッド１１の１公転で同一の半径の円が描かれるので、研磨パッド１１の均一な摺動距離および摺動速度が得られる。そして、研磨装置に均一な加工圧を負荷すれば研磨パッド１１の面内で均一な加工速度を得ることができ、高い研磨の制御性が確保される。   FIG. 4 is a diagram showing a locus 21 of relative movement between the polishing pad 11 and the workpiece to be processed in the polishing apparatus according to the present invention. In the polishing apparatus according to the present invention, by installing a counterweight in the gear mechanism portion 13, it is possible to suppress vibration during revolution due to an uneven load of the polishing pad 11. When the polishing pad 11 revolves without rotating, the relative motion vector and the locus 21 of the polishing pad 11 and the workpiece 16 are the same on the entire surface of the polishing pad 11 as shown in FIG. Further, as shown in FIG. 4, since a circle with the same radius is drawn by one revolution of the polishing pad 11 at all points, a uniform sliding distance and sliding speed of the polishing pad 11 can be obtained. . If a uniform processing pressure is applied to the polishing apparatus, a uniform processing speed can be obtained within the surface of the polishing pad 11, and high controllability of polishing can be ensured.

研磨パッド１１が自転せずに公転のみする場合には、例えば、研磨パッド１１にうねり等の特徴的な形状が存在した場合それがそのまま加工速度の違いとなり被加工部品に転写されてしまうことも起こりえる。これが高精度研磨において問題となる場合は、研磨パッド１１を、毎分数回から数十回の程度でゆっくり自転させてもよい。ここで、歯車機構部１３のかみ合う歯数の変更のみで、研磨パッド１１を自転させることができる。上記の場合に、研磨パッド１１の自転がゆっくりである必要性を次に述べる。   In the case where the polishing pad 11 does not rotate but only revolves, for example, if the polishing pad 11 has a characteristic shape such as waviness, it may be transferred to the workpiece as a result of the difference in processing speed. It can happen. If this becomes a problem in high-precision polishing, the polishing pad 11 may be slowly rotated about several to several tens of times per minute. Here, the polishing pad 11 can be rotated only by changing the number of teeth engaged with the gear mechanism portion 13. Next, the necessity for the rotation of the polishing pad 11 to be slow in the above case will be described.

研磨バッド１１の運動において自転せずに公転のみの構成であると、研磨パッド１１の近傍のスラリーもこの公転運動によりつれまわる。このとき、スラリーは、常に進行方向の変わる力を感じる。公転半径が小径であれば研磨パッド１１が自転運動のみをする場合の回転中心から離心する方向への常に一定の遠心力が働く場合と異なり、常に方向が変化する力によりスラリーの慣性力で液が研磨パッド１１の近傍に保持されやすい。したがってより高速に研磨パッド１１を駆動させても加工が可能となる。この理由で研磨パッド１１を公転にあわせ自転させる場合も低速が望ましい。   When the polishing pad 11 does not rotate in the motion of the polishing pad 11 but only revolves, the slurry in the vicinity of the polishing pad 11 is also entrained by this revolution motion. At this time, the slurry always feels a force that changes its traveling direction. If the revolution radius is small, unlike the case where a constant centrifugal force is always applied in the direction away from the center of rotation when the polishing pad 11 only rotates, the liquid is always applied by the inertial force of the slurry. Is easily held in the vicinity of the polishing pad 11. Therefore, processing is possible even if the polishing pad 11 is driven at a higher speed. For this reason, a low speed is also desirable when the polishing pad 11 is rotated in accordance with revolution.

図５は、研磨パッドによりどのようにスラリーが保持されるかを示す図である。図５において、被加工部品３１の上にある研磨パッド３３の側面にメニスカスを有するスラリー３２が保持されている。図５の場合において、スラリー３２は、研磨パッド３３の側面に、キャピラリー力(表面張力)により保持されている。   FIG. 5 is a diagram showing how the slurry is held by the polishing pad. In FIG. 5, a slurry 32 having a meniscus is held on the side surface of the polishing pad 33 on the workpiece 31. In the case of FIG. 5, the slurry 32 is held on the side surface of the polishing pad 33 by capillary force (surface tension).

図５に示されているように表面張力によりスラリー３２のメニスカスが公転運動する研磨パッド３３の側面に形成される。ここで、メニスカスが形成されたスラリーは、研磨パッド３３の小径公転により常に進行方向が変わり、それに従う駆動力方向の変化を受けるため慣性力によりかなり高速になっても飛散しない。   As shown in FIG. 5, the meniscus of the slurry 32 is formed on the side surface of the polishing pad 33 that revolves due to surface tension. Here, the slurry in which the meniscus is formed always changes its traveling direction due to the small-diameter revolution of the polishing pad 33, and receives a change in the driving force direction according to it, so that it does not scatter even if it becomes considerably high speed due to inertial force.

図６は、研磨パッドに段差をつけることによりスラリー保持量が増大することを示す図である。図６に示されているように、研磨パッド４２の側面に段差をつけることにより、キャピラリー力により研磨パッド４２の側面に保持されるスラリー４１の体積と保持量を増加させることができる。   FIG. 6 is a diagram showing that the amount of retained slurry increases by providing a step in the polishing pad. As shown in FIG. 6, by providing a step on the side surface of the polishing pad 42, the volume and holding amount of the slurry 41 held on the side surface of the polishing pad 42 by the capillary force can be increased.

研磨が進行するにつれて、スラリー中の粒子が破砕されたり被加工部品４３と結合したりする。また、研磨が進行するにつれて、被加工部品４４から加工により生成されるいわゆる切りくずもスラリー中に増えてくる。したがって、より長く初期の加工力をスラリーが維持するためには、図６に示されているように、研磨パッド４２の側面に段差４３がつけられることにより、段差４３がない場合より大きな体積のスラリーが、研磨パッドの側面に存在することが望ましい。   As the polishing progresses, particles in the slurry are crushed or combined with the workpiece 43. As the polishing progresses, so-called chips generated from the workpiece 44 by machining increase in the slurry. Therefore, in order to maintain the initial processing force for a longer time, the slurry has a larger volume than the case where there is no step 43 by providing the step 43 on the side surface of the polishing pad 42 as shown in FIG. Desirably, the slurry is present on the side of the polishing pad.

このため、本発明に係る研磨装置では、図６に示されているように、スラリーのメニスカスよりも小さい段差４３を研磨パッド４２の側面に設けることにより多くのスラリーが研磨パッドの近傍に保持されてもよい。スラリーのメニスカスの大きさは、スラリーと材料の濡れ性に影響されるので、研磨パッド４２を装着する部材の材料を選択し濡れ性を制御することによりメニスカスをより高くして、研磨パッド４２の側面に保持されるスラリーの量を大きくすることも可能である。   For this reason, in the polishing apparatus according to the present invention, as shown in FIG. 6, a large amount of slurry is held in the vicinity of the polishing pad by providing a step 43 smaller than the meniscus of the slurry on the side surface of the polishing pad 42. May be. Since the meniscus size of the slurry is affected by the wettability of the slurry and the material, the meniscus can be made higher by selecting the material of the member to which the polishing pad 42 is mounted and controlling the wettability. It is also possible to increase the amount of slurry held on the side.

また、公転する研磨パッドの周辺にリング状のスラリー保持機構（保持リング）を装着することによりスラリー保持量を増大させることも可能である。   It is also possible to increase the slurry holding amount by mounting a ring-shaped slurry holding mechanism (holding ring) around the revolving polishing pad.

図７は、公転する研磨パッドの周辺にスラリー保持部が設けられた研磨装置を示す図である。図７において、研磨パッド５５は、公転軌跡５２を描くように公転し、スラリー供給ノズル５４からスラリー液滴５３がスラリー保持部５１に供給される。   FIG. 7 is a diagram illustrating a polishing apparatus in which a slurry holding unit is provided around a revolving polishing pad. In FIG. 7, the polishing pad 55 revolves so as to draw a revolution locus 52, and the slurry droplet 53 is supplied from the slurry supply nozzle 54 to the slurry holding unit 51.

図７において、小径公転する小径の研磨パッド５５の外側に円盤状のスラリー保持部５１が設けられており、スラリー保持部５１と被加工部品５６との間に比較的小さな隙間が形成されており、この隙間にメニスカス力によってスラリーが保持される。そして、この隙間からスラリーが研磨パッド５５に供給される。また、スラリー保持部５１の近傍にスラリー液滴５３が滴下されることにより、新しいスラリーの供給も容易に行うことができる。ここで、スラリー保持部５１は、研磨パッド５５の周辺に研磨パッド５５の公転運動を妨げずに、被加工部品５６の表面にスラリーを保持することができる。   In FIG. 7, a disk-shaped slurry holding portion 51 is provided outside a small-diameter polishing pad 55 that revolves around a small diameter, and a relatively small gap is formed between the slurry holding portion 51 and the workpiece 56. The slurry is held in the gap by the meniscus force. Then, the slurry is supplied to the polishing pad 55 from this gap. In addition, since the slurry droplet 53 is dropped in the vicinity of the slurry holding unit 51, a new slurry can be easily supplied. Here, the slurry holding unit 51 can hold the slurry on the surface of the workpiece 56 without disturbing the revolution movement of the polishing pad 55 around the polishing pad 55.

図７の場合もスラリー保持部５１の部材の材料の選択により濡れ性を向上させ、スラリーの保持量を増大させることも可能である。また、図７のようにスラリー供給ノズル５４によりスラリーを少量ずつ滴下すれば定常的なスラリーの成分状況の維持も可能となる。ここで、スラリーとしては、コロイダルシリカのような非常に分散性の良いものを前提としているが、スラリーは、ある程度の分散性があればコロイダルなものでなくてもよい。   In the case of FIG. 7 as well, the wettability can be improved and the amount of slurry retained can be increased by selecting the material of the slurry retaining portion 51. Further, if the slurry is dropped little by little by the slurry supply nozzle 54 as shown in FIG. 7, it is possible to maintain a steady slurry component state. Here, the slurry is premised on a highly dispersible material such as colloidal silica, but the slurry may not be colloidal if it has a certain degree of dispersibility.

図８は、本発明に係る大型平面研磨システムを示す図である。図８において、ステージコントロール部６６の指示を受けて動作可能なステージドライブ部６５の上に被加工部品６４が載せられており、研磨パッド６７が研磨パッド駆動部６３に駆動され、Ｘ軸ステージ６１に連結された加圧部６２により研磨パッド６７に圧力が加えられる。研磨パッド６７は、上述したように、公転運動軌跡６８を描くように公転する。その際、研磨パッド６７は、自転してもよいし、自転しなくてもよい。   FIG. 8 is a view showing a large surface polishing system according to the present invention. In FIG. 8, a workpiece 64 is placed on a stage drive unit 65 that can operate in response to an instruction from the stage control unit 66, and a polishing pad 67 is driven by a polishing pad drive unit 63, thereby causing an X-axis stage 61. A pressure is applied to the polishing pad 67 by the pressurizing unit 62 connected to. As described above, the polishing pad 67 revolves so as to draw a revolving motion locus 68. At that time, the polishing pad 67 may rotate or may not rotate.

加圧部６２が用いる加圧方式としては、デッドウエイト、平行板バネ、空圧方式等を用いてもよい。加圧部６２、Ｘ軸ステージ６１は、ステージコントロール部６６の指示により駆動され、Ｘ軸ステージ６１を、被加工部品６４の平面上のＸ軸方向およびＹ軸方向、および被加工部品６４の平面に垂直な方向にも移動可能なものとすれば、被加工部品６４の高精度平面加工のみならず曲面加工も可能となる。また、図８に示されている大型平面研磨システムとオンマシン計測を組み合わせて、フィードバック制御を用いた高度な加工システムの構築も可能である。   As a pressurization method used by the pressurization unit 62, a dead weight, a parallel leaf spring, a pneumatic method, or the like may be used. The pressurizing unit 62 and the X-axis stage 61 are driven by an instruction from the stage control unit 66, and the X-axis stage 61 is moved in the X-axis direction and the Y-axis direction on the plane of the workpiece 64 and the plane of the workpiece 64. If it is possible to move also in a direction perpendicular to the direction, not only high-precision plane machining of the workpiece 64 but also curved surface machining becomes possible. Further, it is possible to construct an advanced machining system using feedback control by combining the large surface polishing system shown in FIG. 8 with on-machine measurement.

１１ 研磨パッド
１２ 公転運動軌跡
１３ 歯車機構部
１４ モータ
１５ 加工圧 11 Polishing pad 12 Revolving motion locus 13 Gear mechanism 14 Motor 15 Processing pressure

Claims (5)

被加工部品を研磨する研磨装置であって、
被加工部品の表面を研磨する研磨パッドであって、前記研磨パッドが前記被加工部品の表面に接触する面の大きさは前記被加工部品の表面の大きさより小さい研磨パッドを備え、
前記研磨パッドは、自転せずに前記研磨パッドより小さい半径で公転し、前記研磨パッドの近傍にスラリーが供給され、前記研磨パッドが前記被加工部品に接触した状態で前記研磨装置自体あるいは前記研磨パッドに加工圧が付加され、前記研磨パッドが移動することにより前記被加工部品を研磨するように構成され、
前記研磨パッドの側面には、前記スラリーが当該研磨パッド近傍に保持されるように、段差が設けられ、
前記研磨パッドの周辺に前記研磨パッドの公転運動を妨げずに、前記被加工部品の表面にスラリーを保持する円盤状のスラリー保持部をさらに備え、
前記スラリー保持部にスラリーが供給されることを特徴とする研磨装置。 A polishing apparatus for polishing a workpiece,
A polishing pad for polishing the surface of the processed part, the size of the surface on which the polishing pad contacts the surface of the processed part article has a size smaller than the polishing pad of the processed part of the surface,
The polishing pad does not rotate and revolves with a smaller radius than the polishing pad, slurry is supplied in the vicinity of the polishing pad, and the polishing apparatus itself or the polishing is in a state where the polishing pad is in contact with the workpiece. A processing pressure is applied to the pad, and the polishing pad is configured to polish the workpiece by moving,
On the side surface of the polishing pad, a step is provided so that the slurry is held near the polishing pad ,
Without further hindering the revolving motion of the polishing pad around the polishing pad, further comprising a disk-shaped slurry holding portion for holding slurry on the surface of the workpiece,
A polishing apparatus, wherein a slurry is supplied to the slurry holding unit . 被加工部品を研磨する研磨装置であって、
被加工部品の表面を研磨する研磨パッドであって、前記研磨パッドが前記被加工部品の表面に接触する面の大きさは前記被加工部品の表面の大きさより小さい研磨パッドを備え、
前記研磨パッドは、前記研磨パッドより小さい半径で公転し、前記研磨パッドの近傍にスラリーが供給され、前記研磨パッドが前記被加工部品に接触した状態で前記研磨装置自体あるいは前記研磨パッドに加工圧が付加され、前記研磨パッドが移動することにより前記被加工部品を研磨するように構成され、
前記研磨パッドの側面は、当該研磨パッドの底面と接触しない前記被加工部品の上面部において段差を有しており、前記段差は、研磨時の前記スラリーが前記研磨パッド近傍に保持されるように、前記スラリーにより前記研磨パッドの側面周辺において湾曲して形成されるメニスカスの最上部よりも低い位置に設けられることを特徴とする研磨装置。 A polishing apparatus for polishing a workpiece,
A polishing pad for polishing the surface of the processed part, the size of the surface on which the polishing pad contacts the surface of the processed part article has a size smaller than the polishing pad of the processed part of the surface,
The polishing pad revolves with a radius smaller than the polishing pad, slurry is supplied in the vicinity of the polishing pad, and the polishing pad itself or the polishing pad is subjected to a processing pressure while the polishing pad is in contact with the workpiece. And is configured to polish the workpiece by moving the polishing pad,
Side surface of the polishing pad has a step at the upper surface of the processed part which is not in contact with the bottom surface of the polishing pad, the step is such that the slurry during polishing is maintained in the vicinity of the polishing pad Further, the polishing apparatus is provided at a position lower than the uppermost part of the meniscus formed by the slurry so as to be curved around the side surface of the polishing pad . 前記研磨パッドは、自転せずに公転することを特徴とする請求項２に記載の研磨装置。   The polishing apparatus according to claim 2, wherein the polishing pad revolves without rotating. 前記研磨パッドは、自転しながら公転することを特徴とする請求項２に記載の研磨装置。   The polishing apparatus according to claim 2, wherein the polishing pad revolves while rotating. 前記研磨パッドの周辺に前記研磨パッドの公転運動を妨げずに、前記被加工部品の表面にスラリーを保持する円盤状のスラリー保持部をさらに備え、
前記スラリー保持部にスラリーが供給されることを特徴とする請求項２乃至４のいずれかに記載の研磨装置。 Without further hindering the revolving motion of the polishing pad around the polishing pad, further comprising a disk-shaped slurry holding portion for holding slurry on the surface of the workpiece,
The polishing apparatus according to claim 2, wherein a slurry is supplied to the slurry holding unit.
JP2010135260A 2010-06-14 2010-06-14 Polishing equipment Expired - Fee Related JP5628563B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010135260A JP5628563B2 (en) 2010-06-14 2010-06-14 Polishing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010135260A JP5628563B2 (en) 2010-06-14 2010-06-14 Polishing equipment

Publications (2)

Publication Number Publication Date
JP2012000689A JP2012000689A (en) 2012-01-05
JP5628563B2 true JP5628563B2 (en) 2014-11-19

Family

ID=45533287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010135260A Expired - Fee Related JP5628563B2 (en) 2010-06-14 2010-06-14 Polishing equipment

Country Status (1)

Country Link
JP (1) JP5628563B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111469028A (en) * 2019-01-23 2020-07-31 湖南安冠智能科技有限公司 Multi-directional polishing device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0957606A (en) * 1995-08-23 1997-03-04 Nikon Corp Polishing device
JPH10329012A (en) * 1997-03-21 1998-12-15 Canon Inc Polishing device and polishing method
JP2000233363A (en) * 1999-02-16 2000-08-29 Ebara Corp Polishing device and method therefor
JP2001148361A (en) * 1999-09-07 2001-05-29 Nikon Corp Grinding apparatus, grinding pad replacing apparatus and replacing method

Also Published As

Publication number Publication date
JP2012000689A (en) 2012-01-05

Similar Documents

Publication Publication Date Title
CN104209862B (en) Ultra-smooth plane grinding polishing device and method for online trimming flexible polishing pad
CN101204786A (en) High accuracy ball double autorotation grinding tray high-efficiency grinding device
JP2010172996A (en) Dressing apparatus, device and method of chemical mechanical polishing
JP5061296B2 (en) Flat double-side polishing method and flat double-side polishing apparatus
CN104786111A (en) Gas-liquid-solid three-phase abrasive particle flow polishing device for large ultra-smooth surface
CN113579987A (en) Method and device for polishing free-form surface by curvature self-adaptive cluster magneto-rheological process
CN204525053U (en) A kind of gas-liquid-solid three-phase abrasive Flow burnishing device for large area super-smooth surface
CN105364640B (en) A kind of chemical mechanical classification composite manufacturing method of micro- semi-ring cavity plate array
JP5628563B2 (en) Polishing equipment
CN108723993A (en) The air bag flexibility polishing tool for degree of freedom of doing more physical exercises
US7597034B2 (en) Machining method employing oblique workpiece spindle
JP4702765B2 (en) Vibration polishing method and apparatus
JPH08192348A (en) Grinding and polishing method and device therefor
KR102068538B1 (en) Polishing system using magnetorheological fluid and polishing method using the same
JP4384954B2 (en) Processing method, processing device, and rectangular flat plate processed product processed by this processing method
WO2013091208A1 (en) Polishing device for fork type support
CN115401530A (en) Shape-controlled flexible polishing method for microarray mold
JP2011031371A (en) Compound surface grinding device
JPH1126404A (en) Polishing apparatus
JP2009248234A (en) Holding device and polishing device
JP2016137553A (en) Polishing apparatus and polishing method
JP2015064920A (en) Manufacturing method of glass substrate for magnetic disk
CN110774168B (en) Coupling mechanism provided with spherical bearing, method for determining bearing radius of spherical bearing, and substrate polishing device
JPH1126405A (en) Polishing device
JPH0531669A (en) Grinding device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120927

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131015

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20131017

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131213

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140430

RD13 Notification of appointment of power of sub attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7433

Effective date: 20140616

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140625

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20140616

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140930

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141002

R150 Certificate of patent or registration of utility model

Ref document number: 5628563

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees