JPH11309669A - Both-surface polishing machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To polish by the small circular movement of polishing discs, without the rotation of the polishing disc. SOLUTION: Polishing discs 15, 25 are contacted to both surfaces of a work 68, while separating them relatively by an approach/separate means 30 and approaching relatively after setting the work 68 to a holding carrier 60. The polishing discs 15, 25 are rotated eccentically by an eccentically turning means 50 and polish both surfaces simultaneously. By the eccentically rotating means 50, eccentric axial centers 14A, 24A can be displacingly rotated around the support axial centers 10A, 20A and the polishing discs 15, 25 are displacingly rotated by a small circle around the support axial centers 10A, 20A without rotating and the contact of the polishing discs 15, 25 for the work 68 is carried out uniformly at entire both surfaces and with a constant polishing speed. The polishing discs 15, 25 can offset the lateral direction load by processing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-side polishing apparatus used for polishing both surfaces of various workpieces such as a liquid crystal glass plate, a metal plate, a semiconductor silicon substrate, and a ceramic substrate. is there.

[0002]

2. Description of the Related Art Conventionally, as a double-side polishing apparatus of this kind,
For example, a polishing apparatus disclosed in Japanese Patent Application Laid-Open No. 6-206159 is provided. In this conventional configuration, each vertical axis is revolved around a revolving axis by rotating the upper and lower support members in opposite directions by a revolving drive device, and each vertical axis is revolved about a revolving axis by a revolving drive device. Then, the polishing body group is rotated while revolving. Further, the holding carrier in which the object to be polished is penetrated is moved laterally, and is rotated around the axis displaced by the lateral movement. Therefore, the desired double-side polishing can be performed by moving the upper and lower polishing bodies close to each other in the direction along the revolving axis and bringing them into contact with both surfaces of the object to be polished.

After the intended double-side polishing is performed in this manner, the polished work is taken out from the fitting hole of the holding carrier by raising and separating the upper support member, and a new work is performed. It is set by fitting into the fitting hole.

[0004]

In the conventional structure described above, the polishing body group revolves or rotates with a large circular motion, so that the polishing rate over the entire surface of the object to be polished is not constant, and therefore, the polishing rate is not uniform. Polishing cannot be performed sufficiently.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a double-side polishing apparatus capable of performing polishing by a polishing disk while making a small circular motion without rotating the polishing disk. is there.

[0006]

In order to achieve the above-mentioned object, a double-side polishing apparatus according to the first aspect of the present invention is provided with a pair of workpieces held by a holding carrier in a state where both faces are sandwiched. Along with disposing the polishing discs, providing an approaching / separating means for relatively moving these polishing discs toward and away from each other, both polishing discs are provided so as to be freely rotatable on an eccentric axis rotatable around the support axis. An eccentric rotation means is provided for rotating these eccentric shafts around the support shaft while the eccentric shaft is displaced.

Therefore, according to the first aspect of the present invention, in a state where the two polishing machines are relatively separated by the approach / separation means,
The workpiece is set on the holding carrier. In this state, the two polishing discs are brought closer to each other by the approaching / separating means, whereby each polishing disc can be brought into contact with both surfaces of the workpiece.
Before and after such contact, both polishing machines are eccentrically rotated by the eccentric rotating means, and the desired simultaneous polishing on both surfaces is performed.

That is, the eccentric shaft can be displaced and rotated (revolved) around the support shaft by the rotation of the eccentric rotation means, so that both polishing machines do not rotate, and a small circle around the support shaft is formed. In this manner, the polishing disk can be brought into contact with both surfaces of the workpiece in a uniform manner and at a constant polishing rate over both surfaces. At that time, the two polishing machines are displaced and rotated with the two eccentric shafts displaced from each other, so that the lateral load due to the processing can be offset.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. Reference numeral 1 denotes a frame, which comprises a box-frame-shaped lower frame 3 forming a lower space 2 and a box-frame-shaped upper frame 5 erected from one upper surface of the lower frame 3 to form an upper space 4. . The lower frame 3 has an opening 6 formed at the center of the upper plate, and the lower space 2 communicates with the upper space 4.

The frame 1 is provided with an upper rotating shaft 10 and a lower rotating shaft 20 in the vertical direction.
Reference numerals 0 and 20 are configured to be rotatable around rotation axes (an example of a support axis) 10A and 20A located on the same line. That is, the upper rotation shaft 10 is rotatably supported by the upper cylinder 11 via the bearing 12, and the upper cylinder 11 is fixed to the free end of the upper support 13 from the upper frame 5 side. I have. The lower rotation shaft 20 is rotatably supported by a lower cylinder 21 via a bearing 22.
The lower cylinder 21 is fixed to a free end of a lower support 23 provided continuously from the lower frame 3.

Eccentric shafts 14 and 24 are integrally provided on the opposite ends of the rotating shafts 10 and 20, respectively, and these eccentric shafts 14 and 24 are configured to be rotatable around the rotating shafts 10A and 20A. Is done. An upper polishing machine 15 is supported on the upper eccentric shaft 14 via a bearing 16 so as to freely rotate on an eccentric shaft 14A, and a lower polishing machine 25 is mounted on the lower eccentric shaft 24 with a bearing 26. And is freely rotatably supported on the eccentric shaft center 24A through the shaft.

An approach / separation means 30 for relatively moving the polishing machines 15 and 25 toward / away from each other is provided. The approach / separation means 30 includes a cylinder device 31 interposed between the upper end of the upper frame 5 and the base end of the upper support 13, and a guide rod (or guide rail) 32 for guiding the upper support 13 to move up and down. Constitutes one example. Therefore, by moving the cylinder device 31 in and out, the upper polishing plate 15 is moved closer to and away from the lower polishing plate 25.

The polishing machines 15 and 25 are provided with abrasive supply means 34 and 37, respectively. That is, the upper abrasive supply means 34 includes a supply passage 35 formed in the upper polishing plate 15,
An abrasive (a polishing liquid such as water or oil) is supplied by a supply hose 36 connected to the supply passage 35, for example, and is supplied by gravity. The lower abrasive supply means 37 includes a supply passage 38 formed in the lower polishing plate 25, a supply hose 39 connected to the supply passage 38, and the like. The abrasive is supplied, for example, by press-fitting. At that time, the polishing material is configured to be uniformly supplied to the surfaces of both polishing disks 15 and 25.

[0014] The eccentric shafts 14, 24 are connected to the rotating shaft center 10A,
The upper polishing disc regulating means 40 which supports and regulates the eccentric rotation of the upper polishing disc 15 around the rotation axis 10A when rotating around the 20A, and the rotation axis 2 of the lower polishing disc 25.
Lower polishing disc regulating means 46 for supporting and regulating the eccentric rotation about 0A is provided.

That is, a rectangular support plate 41 is provided on the lower surface side of the upper cylindrical body 11, and the upper rotary shaft 10 is inserted into a central through portion 42 of the support plate 41. 9 is provided between the lower surface of the support plate 41 and the upper surface of the upper polishing plate 15.
Upper slide units 43 are provided at four positions at 0-degree intervals. Here, each upper slide unit 43 is a
It comprises a direction sliding section (front-back direction sliding section) 44 and a lower Y-direction sliding section (left-right direction sliding section) 45. By means of the above 41 to 45, etc., the upper polishing disc regulating means 4
0 is configured.

Further, between the upper surface of the upper plate of the lower frame 3 and the lower surface of the lower polishing plate 25, lower slide units 47 are provided at four positions at intervals of 90 degrees. Here, each lower slide unit 47 includes a lower X-direction slide unit (front-rear slide unit) 48 and an upper Y-direction slide unit (left-right slide unit) 49. An example of the lower polishing disc regulating means 46 is constituted by the above 47 to 49 and the like.

The two eccentric shafts 14A and 24A are connected to the rotating shaft 1
With the eccentric shafts 14A and 24A displaced by 180 degrees relative to 0A and 20A, the eccentric shafts 14A and 24A are
An eccentric rotation means 50 is provided for rotating and displacing at the same speed in the same direction around 20A.

That is, the rotary drive shaft 51 is provided from the lower space 2 to the upper space 4, and the rotary drive shaft 51 is provided.
Is rotatably supported on the frame 1 side via a bearing 52. A rotation drive device (motor) 53 is provided on the frame 1 side, and an output shaft 54 and the rotation drive shaft 51 are linked and connected via a winding link device 55.

The upper part of the upper rotary shaft 10 and the rotary drive shaft 51 are linked and connected via a winding link device 56 such as a timing belt type. Further, the lower portion of the lower rotary shaft 20 and the rotary drive shaft 51 are interlockingly connected via a winding interlocking device 57 such as a timing belt type. An example of the eccentric rotation means 50 is configured by the above 51 to 57 and the like.

On the frame 1 side, there is provided a holding carrier 60 through which a workpiece (polished object) 68 can be inserted. The holding carrier 60 is configured to be movable in the lateral direction. That is, the holding carrier 60 has a rectangular fitting hole 6.
A rectangular plate-shaped workpiece 68 can be inserted through the fitting hole 61. A pair of left and right guide rods 67 are disposed on the lower frame 3, and the holding carrier 60 is supported and guided by these guide rods 67 so as to be movable in the left and right directions.

Left and right moving means 62 for moving the holding carrier 60 right and left are provided. The left and right moving means 62 includes a moving motor 63 mounted on the lower frame 3 and an upward output shaft of the moving motor 63. And a link body 66 for connecting the eccentric position of the disc body 65 and the free end of the holding carrier 60 so as to be relatively swingable.
Etc.

The operation of the above embodiment will be described below. In a state where the upper support 13 is raised by the contraction movement of the cylinder device 31 in the approach / separation means 30 and the upper polishing plate 15 is moved up and away from the lower polishing plate 25,
A rectangular workpiece 68 is set in the fitting hole 61 of the holding carrier 60 by fitting. At this time, the workpiece 68 abuts on the lower polishing plate 25 via the lower surface thereof.

In this state, the cylinder device 31 is extended and the upper polishing plate 15 is lowered via the upper support 13 so that the upper polishing plate 15 can lightly contact the upper surface of the workpiece 68. Before and after such contact, the rotation driving device 53 is operated, and the polishing machines 15 and 25 are eccentrically rotated to perform intended polishing.

That is, the rotation of the rotation driving device 53 in the eccentric rotation means 50 is transmitted to the rotation driving shaft 51 via the winding interlocking device 55, and the rotation of the rotation driving shaft 51 is further transmitted through the winding interlocking device 56. And transmitted to the lower rotating shaft 20 via the winding interlocking device 57.

The rotation of the upper rotation shaft 10 causes the eccentric shaft 14A, ie, the upper eccentric shaft 14, to be displaced and rotated (revolved) A around the rotation shaft 10A. At the time of this displacement rotation A, the upper polishing machine 15
3 is supported by the support plate 41 in a state where sliding in the front-rear direction is allowed by the X-direction sliding portion 44 and sliding in the left-right direction is allowed by the Y-direction sliding portion 45. Without rotation, displacement A on a small circle around the rotation axis 10A
Will be done. At this time, relative rotation between the upper eccentric shaft 14 and the upper polishing machine 15 is allowed by the bearing 16.

The rotation of the lower rotary shaft 20 causes the eccentric shaft 24A, that is, the lower eccentric shaft 24, to be rotated by the rotary shaft 2
It is displaced and rotated around 0A in the same direction as the upper eccentric shaft 14 at a constant speed. In the case of this displacement rotation A, the lower polishing machine 2
5 is the X-direction slide portion 4 of the lower slide unit 47
8, the slide in the front-rear direction is allowed by the Y-direction slide portion 49, and the slide in the left-right direction is supported by the lower frame 3 side. Rotation axis 20
The displacement rotation A will be performed on a small circle around A.
At this time, the relative rotation between the lower eccentric shaft 24 and the lower polishing machine 25 is allowed by the bearing 26.

The rotation of the moving motor 63 is performed by a crank mechanism including a disc 65 and a link 66.
The holding carrier 60 is reciprocated B in the left-right direction by the support and guide of the guide rod 67 in response to the pushing and pulling movement of the link body 66.

Based on the operation of each part as described above, both surfaces of the workpiece 68 are polished simultaneously. That is, the upper and lower polishing disks 15 and 25 are displaced and rotated A at the same speed in the same direction while being displaced by 180 degrees from each other, and the holding carrier 60 in which the workpiece 68 is inserted is reciprocated B sideways. become.

Therefore, in this state, the cylinder device 3
By applying a load by extension of No. 1, the polishing machine 15,
Due to the combined movement of the revolution A on the small circle 25 and the reciprocating movement B of the workpiece 68, the abutment of the polishing plates 15, 25 on both surfaces of the workpiece 68 is uniform and polished over the entire area of both surfaces. The speed can be kept constant, so that a uniform polishing process can be performed without remaining polishing.

Further, since the upper and lower polishing disks 15 and 25 perform the movement, that is, the revolution A, supported by the regulating means 40 and 46, respectively, the movement of the polishing surfaces of these polishing disks 15 and 25 can be performed on the same plane. The uniform polishing can be further improved. Furthermore, the upper and lower polishing disks 15 and 25 are
By performing the displacement rotation A at the same speed in the same direction in the state of being displaced by 0 degrees, the lateral load due to the processing can be offset. Moreover,
Since both surfaces of the workpiece 68 are polished at the same time, in the case of polishing a plate, a distorted plate can be polished into a flat surface.

The polishing by the polishing plates 15 and 25 is performed while supplying (spreading) the abrasive by the upper abrasive supply means 34 and the lower abrasive supply means 37. Next, another embodiment of the present invention will be described with reference to FIGS.

That is, a plurality of fitting holes 61 are formed in the holding carrier 60, and a workpiece 68 is fitted into each of the fitting holes 61. According to this, a plurality of workpieces 68 can be polished simultaneously. The number and the size of the workpieces 68 to be polished at the same time are arbitrarily set.

In the above-described embodiments, the workpiece 68 having a rectangular plate shape is polished. However, the workpiece 68 can handle workpieces of various shapes such as a round shape. The shape of the hole 61 is determined.

In both of the above-described embodiments, the rotation speed of the rotary drive device 53, that is, the rotation speed of the polishing plates 15, 25 can be arbitrarily adjusted by operating the operation panel, for example.
As a result, a sliding speed as uniform as possible with respect to the workpiece 68 can be obtained.

In the above-described embodiments, a plurality of double-side polishing apparatuses are installed, and various operations such as supply and removal of the workpiece 68 are performed by a common (one) robot. Good.

In both of the above-described embodiments, the upper and lower polishing disks 15 and 25 are disposed so as to be displaced from each other by 180 °. This 180 ° is the most preferable angle, and
It is not limited to this angle.

[0037]

According to the first aspect of the present invention, after the two polishing disks are relatively separated by the approaching / separating means,
With the work piece set on the holding carrier, the two polishing machines are relatively approached by the approach / separation means,
Each polishing disc can be brought into contact with both surfaces of the workpiece, and before and after such contacting, by eccentrically rotating both polishing discs by the eccentric rotating means, it is possible to perform the desired simultaneous polishing on both sides. it can.

That is, the rotation of the eccentric shaft can be displaced and rotated (revolved) around the support shaft by the rotation of the eccentric rotation means, so that both polishing machines can be rotated on a small circle around the support shaft without rotating. , The contact of the polishing machine to both surfaces of the workpiece can be performed uniformly and the polishing speed is constant over the entire area of both surfaces, thereby performing a uniform polishing process with no remaining polishing. be able to. At that time, the lateral load due to the processing can be easily and suitably canceled by displacing and rotating the two polishing machines while the eccentric axes of the two polishing machines are mutually displaced.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention and is a partially cutaway side view of a double-side polishing apparatus.

FIG. 2 is a plan view of the double-side polishing apparatus.

FIG. 3 is a vertical sectional side view of a main part of the double-side polishing apparatus.

FIG. 4 is a plan view of a main part of the double-side polishing apparatus.

FIG. 5 shows another embodiment of the present invention and is a longitudinal sectional side view of a main part of a double-side polishing apparatus.

FIG. 6 is a plan view of a main part of the double-side polishing apparatus.

[Explanation of symbols]

 Reference Signs List 1 frame 10 upper rotation axis 10A rotation axis (support axis) 11 upper cylinder 14 upper eccentric axis 14A eccentric axis 15 upper polishing machine 20 lower rotation axis 20A rotation axis (support axis) 21 lower cylinder 24 lower Eccentric shaft 24A Eccentric shaft center 25 Lower polishing disc 30 Approaching / separating means 34 Upper polishing material supply means 37 Lower polishing material supply means 40 Upper polishing disc regulating means 46 Lower polishing disc regulating means 50 Eccentric rotating means 53 Rotary driving device 60 Holding carrier 61 Fitting hole 62 Left and right moving means 68 Workpiece A Displacement rotation B Reciprocation

Claims (1)

[Claims] 1. A pair of polishing disks are arranged in a state where both surfaces of a workpiece held by a holding carrier are sandwiched, and approaching / separating means for relatively moving the polishing disks toward / away from each other is provided. , Provided rotatably on an eccentric shaft rotatable around the support axis, with both eccentric shafts displaced,
A double-side polishing apparatus comprising eccentric rotating means for rotating these eccentric shafts around the support shaft.