TW201246289A - Workholder - Google Patents
Workholder Download PDFInfo
- Publication number
- TW201246289A TW201246289A TW100149334A TW100149334A TW201246289A TW 201246289 A TW201246289 A TW 201246289A TW 100149334 A TW100149334 A TW 100149334A TW 100149334 A TW100149334 A TW 100149334A TW 201246289 A TW201246289 A TW 201246289A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- wafer
- step portion
- film
- jig
- Prior art date
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010294315A JP2012140681A (ja) | 2010-12-28 | 2010-12-28 | ヤトイ治具 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201246289A true TW201246289A (en) | 2012-11-16 |
Family
ID=46414234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100149334A TW201246289A (en) | 2010-12-28 | 2011-12-28 | Workholder |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2012140681A (ja) |
CN (1) | CN102569153A (ja) |
TW (1) | TW201246289A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6988358B2 (ja) * | 2017-10-16 | 2022-01-05 | Tdk株式会社 | ワーク保持治具、電子部品処理装置および電子部品の製造方法 |
CN110042358B (zh) * | 2019-04-15 | 2024-04-26 | 深圳菲比特光电科技有限公司 | 镀膜治具和镀膜设备 |
CN113211343A (zh) * | 2021-04-27 | 2021-08-06 | 延康汽车零部件如皋有限公司 | 一种新型标盘装夹系统 |
CN117428737B (zh) * | 2023-09-19 | 2024-04-16 | 井贝科技(浙江)有限公司 | 一种智能型多功能高速静音伺服机械手 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6275064U (ja) * | 1985-10-28 | 1987-05-14 | ||
JPH0322064U (ja) * | 1989-07-11 | 1991-03-06 | ||
JPH03191061A (ja) * | 1989-12-20 | 1991-08-21 | Mitsubishi Electric Corp | 成膜用治具 |
JPH04105544U (ja) * | 1991-02-21 | 1992-09-10 | ソニー株式会社 | ウエハクランパ |
DE10232731A1 (de) * | 2002-07-19 | 2004-02-05 | Aixtron Ag | Be- und Entladevorrichtung für eine Beschichtungseinrichtung |
US8951351B2 (en) * | 2006-09-15 | 2015-02-10 | Applied Materials, Inc. | Wafer processing hardware for epitaxial deposition with reduced backside deposition and defects |
JP5214176B2 (ja) * | 2007-06-08 | 2013-06-19 | 住友重機械工業株式会社 | プラズマガン |
-
2010
- 2010-12-28 JP JP2010294315A patent/JP2012140681A/ja active Pending
-
2011
- 2011-12-28 CN CN2011104463140A patent/CN102569153A/zh active Pending
- 2011-12-28 TW TW100149334A patent/TW201246289A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN102569153A (zh) | 2012-07-11 |
JP2012140681A (ja) | 2012-07-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201246289A (en) | Workholder | |
USD933725S1 (en) | Deposition ring for a substrate processing chamber | |
US9214559B2 (en) | Graphene-transferring member, graphene transferrer, method of transferring graphene, and methods of fabricating graphene device by using the same | |
TW533514B (en) | Physical vapor deposition target/backing plate assemblies; and methods of forming physical vapor deposition target/backing plate assemblies | |
WO2007032864A3 (en) | Multilayered nanostructured films | |
JP2000119843A (ja) | ダイヤモンドライクカーボン硬質多層膜成形体 | |
TWI552205B (zh) | 用以形成薄層體之方法與裝置 | |
US20030114016A1 (en) | Wafer carrier for semiconductor process tool | |
TW201232650A (en) | Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device | |
TW201116639A (en) | Evaporation device and evaporation method | |
TW201137158A (en) | Metal-organic chemical vapor deposition apparatus | |
KR102417528B1 (ko) | 서셉터 및 그 제조 방법 | |
CN201933149U (zh) | 晶圆片背面金层蒸镀工艺用的装片夹具 | |
TW466666B (en) | Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck | |
TW201125068A (en) | An electrostatic chuck with an angled sidewall | |
TW201131625A (en) | Bonded wafer manufacturing method | |
EP3620571A1 (fr) | Housse de repassage à "effet pressing" | |
JP2019522370A (ja) | 基板キャリア | |
CN106876316A (zh) | 压环及半导体加工设备 | |
JP4995306B2 (ja) | 成膜基板ホルダ及び成膜装置 | |
JP2001181845A5 (ja) | 成膜装置及び被処理体の処理方法 | |
JP2011098845A5 (ja) | ||
KR102035931B1 (ko) | SiC 플레이트 제조방법 | |
TW493221B (en) | Reaction tube for semiconductor manufacturing equipment, semiconductor manufacturing equipment, and semiconductor device manufacturing method | |
JP2019085652A5 (ja) | 構造体、水素吸蔵構造体、熱発生方法および熱発生装置 |