TW201243402A - Coating device and coating method - Google Patents

Coating device and coating method Download PDF

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Publication number
TW201243402A
TW201243402A TW101101393A TW101101393A TW201243402A TW 201243402 A TW201243402 A TW 201243402A TW 101101393 A TW101101393 A TW 101101393A TW 101101393 A TW101101393 A TW 101101393A TW 201243402 A TW201243402 A TW 201243402A
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TW
Taiwan
Prior art keywords
cleaning
platform
coating
wiping
coating liquid
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TW101101393A
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Chinese (zh)
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TWI550308B (en
Inventor
Miki Nishimoto
Sadahiko Ito
Satoru Uchiyama
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Toray Eng Co Ltd
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Publication of TWI550308B publication Critical patent/TWI550308B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/02Processes for applying liquids or other fluent materials performed by spraying
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells

Abstract

The subject of the invention is to provide an effective method with which a plurality of cleaning components are utilized for wiping the export mouth to obtain a steady coating film just before the mold-head coater is employed for coating, while it spends a lot of time for adjustment to match with export mouth when the cleaning component are replaced every time during the replacement of nozzle. To solve the problem, the invention provides a coating device, which is characterized in including: a plurality of cleaning units respectively supported on the support elements, each cleaning unit having a cleaning component; a θ platform having a rotation axle vertical to the top surface for supporting the plurality of cleaning units along the wiping direction; and a cleaning means having the cleaning units for supporting the table of the above-mentioned θ platform, wherein a height adjustment plane for holding the height adjustment member is formed on the supporting elements of the cleaning units and the θ platform.

Description

201243402 六、發明說明: 【發明所屬之技術領域】 [0001] 本發明是關於適合使用於彩色液晶顯示器(color liquid crystal display)用衫色遽光片(color filter)的製造等的塗佈裝置及塗佈方法’特別是關於具 有在對玻璃基板(Slass substrate)等的被塗佈構件一 邊吐出塗佈液,一邊形成塗媒時,清掃喷嘴(nozzle)的 頂端之清掃手段之塗佈裝置及塗佈方法。 0 【先前技術】 [0002] 彩色液晶用顯示器用的彩色濾光片是在玻璃基板上 具有3原色的精細的格子圖案。這'種格子圖案首先是在玻 璃基板上形成黑色的塗膜後,藉由紅、藍、綠的塗膜分 別塗佈而得到。亦即對於彩色濾光片的製造在玻璃基板 上塗佈黑、紅、藍、綠的塗佈液’依次形成該等塗膜的 塗佈製程必要不可或缺。在這種塗佈製程中,習知的塗 佈裝置是使用旋轉器(spinner)、棒式塗佈器(bar 〇 coater)、滚筒式塗佈器(roll c〇ater)等。但是近年 來以削減塗佈液的消耗量,且謀求塗膜的物理性質提高 為目的而使用模頭塗佈器(die CQatei^ 以這種目的而被使用的模頭塗佈器的/例例如揭示 於專利文獻卜在專敎獻1中模職佈H為具有作為塗 佈器的開縫模頭(sHt die)的構成,一邊由該開縫模頭 的吐出口吐出塗佈液,一邊在行走於一方向的薄片、膜 等的被塗佈構件形成塗膜。 10110139#單編號 A01〇l 第 4疋模頭塗佈器雖然適合均句塗怖媒的大量生產 ,,ιη但因塗佈液的吐出口成開縫(slit)狀,故不容易遍及 1 7 ^ 40 ^ 1013176365-0 201243402 開縫全長形成均句的塗佈液的吐出狀態。特別是一旦塗 佈結束,接著在新的被塗佈構件上塗佈時’若在吐出口 的周圍有塗佈液等的殘渣,則會因該殘渣而使塗佈狀態 變化。更具體為會發生在殘㈣留_近塗佈膜厚變厚 或者變薄,條紋含在塗佈膜上等的問題。 為了解決這種問題,在專利文獻1的模頭塗佈器包含 有清洗頭。該清洗頭-邊與開縫模頭的吐出口周邊部接 觸’-邊移動於該吐出口的縱向’伴隨該移動而擦拭附 著於吐出口周邊部的塗佈液。 在塗饰前擦拭吐出π的全長的方法在模頭塗佈器中 ’是對為了塗佈膜的均勻化有效的方法,之後也被改良 的發明已被公開。該塗佈前的吐出明擦倾稱為塗佈 器的初始化。 在專利文獻2中揭示有具有使清掃構件之與塗佈器的 滑動動作献化的敎化手段,錢即妓麵端具有 傾斜部分的塗佈器(模頭噴嘴(die⑽如) 分 擦执殘法的塗佈液等之塗佈裝置。此處清掃構件是指頂 面形成有略v字形狀的溝之高分子樹脂製的構件,v字形 狀的溝疋S己合擦栻的吐出σ的形狀而形成。 文獻3中揭示有具有準備清掃構件被排 :配置於前後(擦栻方向)的狀態,藉由前 排 件到除塗佈液等,外後將]的4構 的清掃構#1、, 喷射収“,後方側 不栻清洗液的手段之塗佈裝置。 了清掃H在專利文獻4中揭示有具有塗佈液固著於進行 *清掃構件自二了迴避擦拭能力的降低,清 如i〇〗39产單編號_01 身的手奴之塗佈裝置。 第4頁/共40頁 1013176365-0 201243402 [專利文獻1]曰本國特開平05_2081 54號公報 [專利文獻2]曰本國特開平09_192566號公報 [專利文獻3]曰本國特開平10-216598號公報 [專利文獻4]曰本國特開平11_3〇〇261號公報201243402 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a coating apparatus suitable for use in the manufacture of a color filter for a color liquid crystal display, and the like. In particular, the coating method of the cleaning means for cleaning the tip of the nozzle when the coating liquid is formed while the coating liquid is discharged to the member to be coated such as a glass substrate (Slass substrate) Cloth method. [Prior Art] [0002] A color filter for a color liquid crystal display is a fine lattice pattern having three primary colors on a glass substrate. This 'grid pattern is first obtained by forming a black coating film on a glass substrate and coating it by red, blue and green coating films, respectively. That is, it is necessary to apply a black, red, blue, and green coating liquid to the glass substrate for the production of a color filter, and the coating process for sequentially forming the coating film is indispensable. In this coating process, a conventional coating device uses a spinner, a bar coater, a roll coater, and the like. However, in recent years, a die coater (die CQatei^) which is used for such a purpose is used for the purpose of reducing the amount of the coating liquid consumed and improving the physical properties of the coating film. It is disclosed in the patent document that the mold cloth H is a sHt die having an applicator, and the coating liquid is discharged from the discharge port of the slit die. The coated member such as a sheet, a film, or the like that travels in one direction forms a coating film. 10110139#Single number A01〇l The fourth type of die coater is suitable for mass production of uniform coatings, but by coating Since the discharge port of the liquid is slit-shaped, it is not easy to form the discharge state of the coating liquid of the uniform sentence over the entire length of the slit of 1 7 ^ 40 ^ 1013176365-0 201243402. Especially after the coating is finished, the new one is When the coating member is coated, if there is a residue such as a coating liquid around the discharge port, the coating state changes due to the residue. More specifically, it occurs in the residual (four) remaining _ near coating film thickness. Thickening or thinning, streaks are included in the coating film, etc. The die applicator of Patent Document 1 includes a cleaning head which is in contact with the peripheral portion of the discharge port of the slit die, and moves in the longitudinal direction of the discharge port to wipe the adhesion accompanying the movement. The coating liquid in the peripheral portion of the discharge port. The method of wiping the entire length of the π before the coating is used in the die coater is a method effective for the uniformization of the coating film, and the improved invention has been The pre-coating discharge is referred to as the initialization of the applicator. Patent Document 2 discloses a deuteration means for providing a cleaning operation of the cleaning member and the applicator. An applicator having a slanted portion (die nozzle (such as)) is a coating device such as a coating liquid for rubbing the residual method. Here, the cleaning member refers to a polymer resin having a groove having a slightly v-shaped top surface. The member made of the v-shaped groove S is formed by the shape of the discharge σ of the wiper. Document 3 discloses that the cleaning member is arranged to be arranged in a front-rear direction (wiping direction) by the front row. 4 pieces of material except for the coating liquid, etc. The cleaning device #1, the spraying device, and the coating device for the cleaning liquid on the rear side. The cleaning H is disclosed in Patent Document 4, and the coating liquid is fixed to perform the cleaning function. Reduction, clear as i〇〗 39 production order number _01 body hand slave coating device. Page 4 / total 40 pages 1013176365-0 201243402 [Patent Document 1] 曰 特 特 05 05 05 _2 _2 _2 05 05 05 05 05 05 05 05 05 05 [Patent Document 3] [Patent Document 4] 曰 特 特 曰 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11

在利用模頭塗佈器進行的塗佈中,在即將塗佈之前 擦拭吐出口(進行初始化)是對為了得到穩定的塗佈膜有 效的方法。但是,塗佈器(模頭喷嘴)每一塗佈的塗佈液 或被塗佈構件上的塗佈膜存在各式各樣的種類的形狀或 材質&且,該等種類的形狀或材質僅在-樣的擦拭方 …、法充刀地使所有的塗佈器初始化》亦即每次更換 塗佈器也必須更換擦拭的清掃構件。 、但是’每次更換塗佈器要更換清掃構件,進行調整 以便恰好地配合吐出口此點很花時間,成為招致作業時In the coating by the die coater, wiping the discharge port (initialization) immediately before coating is a method effective for obtaining a stable coating film. However, the applicator (die nozzle) has a wide variety of shapes or materials and coatings for each applied coating liquid or coating film on the member to be coated; and these kinds of shapes or materials The wiping cleaning member must be replaced only every time the applicator is replaced, in the case of a wiping method. However, it is time consuming to change the cleaning member every time the applicator is replaced, so that it can take a good time to fit the spout.

[0003] time)的長時間化的結果。特別是在配置複數 π構件時,各自的高度調整不容易,很花時間。 :發明是鑑於上述的課題所想到的創作,其目的為 '、種塗佈裝置與塗佈方法,具有可容 1 J奋易進打複數個 β掃構件的高相整之清掃手段。 更具體為本發明的塗佈裝置,包含: 供給塗佈液之塗佈液供給手段; 連通於前述塗佈液供給手段, 佈液之開縫狀的吐出口之塗佈器;具有用以吐出前述塗 •以】目對地使前述塗佈器與被塗佈構件移動之移動手段 I0I10I39#單編號 Α0】01 移動於沿著_吐^口的開縫 第5頁/共40頁 方向的擦拭方向,一 1013176365-0 201243402 邊除去附著 邊滑動接觸前述塗佈器的吐出口周邊部 物之清掃手段,其特徵為·· 前述清掃手段包含: 平台 以及 破支撐於切構件上之具有清_構件 可將前述料單元承載複數赌前麵拭方向 包含支擇前述Θ平台的台座之擦 成有用在Γ述料單元时述支#構件‘心平台步 夾持向度調節構件的高度調節面。 " 而且 平、,白於e本古發明的塗佈裝置其特徵為配置有將前“ 。k+直於别述台座的方向的垂直方向推迫手段 [0004] 【發明的功效】 本發明的塗佈裝置因清掃 掃構件的切構件,包含具備具mu切清 :θ平台的擦拭單元,在支擇構件與Θ平 2高度調節用的墊片(shlm)的高度調整;有: ==安著裝複數—^ 件的高度調整;==的墊“夹持’使得清掃構 於垂言方A被切於台座上的19平台因透過對台座推迫 、青掃構侔/垂直推迫手段切’故在Θ平台上配設的 樣=件間的高度即使將擦栻單元按屢於塗佈昭 =!卢此㈣由將擦栻單元驗塗佈器而迴避 〜不同的清掃構件都接觸吐出口。亦即針對複 隱#單編號删 10131: 第6頁/共40頁 201243402 數個清掃構件,使任一個抵接吐出口,使其他的清掃構 件不接觸吐出口之設定成為可能。 【實施方式】 [0005] 以下根據圖面說明本發明的較佳的實施形態。此外 ,以下的說明是舉例說明實施形態的一態樣,在不脫離 本發明的旨趣的範圍,實施形態的變更為可能。 在圖1顯示本發明的塗佈裝置1的構成。在塗佈裝置1 的基台2上配設有一對導軌(guide rail)4。在導軌4上 配置有被塗佈構件之基板A的承載台的平台6。平台6藉由 未圖示的線性馬達(linear mo tor)驅動且自在地往復運 動於在圖1以箭頭表示的X方向。平台6的頂面成為由吸附 孔構成的真空吸附面,可吸附保持基板A。 在基台2配置有門型的支柱10。在支柱10包含有上 下升降單元70。進行塗佈的塗佈器(以後也稱為[開縫喷 嘴(slit nozzle)])20被安裝於上下升降單元70。因此 ,搭載了被塗佈構件的平台6可對開縫喷嘴2 0相對地移動 ,稱此為移動手段。 在圖2顯示開縫喷嘴20的斜視圖。開縫喷嘴20為透 過墊片32使延伸於正交於X方向的方向(垂直於圖1的紙面 的方向)之Y方向的前唇(front lip)22及後唇(rear lip)24重疊於X方向,透過未圖示的複數個連結螺栓被一 體結合。在開縫喷嘴20内的中央部形成有歧管 (raanifold)26。該歧管26也延伸於開縫喷嘴20的縱向 (Y方向)。 在歧管26的下方形成有與歧管26連通的開縫28。該 開缝28也延伸於開縫喷嘴20的縱向,其下端在開缝喷嘴 10110139#單編號 A_ 第7頁/共40頁 1013176365-0 201243402 2〇的最下端面之吐出口面36開口 開縫喷嘴20在最下 ° 一在 C— 面二二接::出。面36:兩惻的兩接鄰面有唇形斜 卜因開縫28藉由塾片3 的間隙(在x方向·)與塾⑽的厚度相等奶 7〇:Γ圖1,使開縫喷嘴20升降的上下升降單元 7;疋精由如下的構件構成:使吐出口30朝下 : 喷嘴20之懸掛保掊 朝卜側而仟待開_ 料縣遍&掛保持帥的-端被鎖緊且 =:台8〇升降之升降台78 ;將升降台78導^ 成件(gUide)74;將馬物的旋轉運動轉換 成升降肩、临u s⑽)76。、 升降單TC7G支撑開縫噴嘴2()的縱向的兩端部而 有—對’因可各自獨立升降,故可任意設定對開 縫喷嘴2G的縱向的水平的傾斜角度。據此,可使開縫嘴 嘴2〇的吐出口面36與基板A遍及開縫嘴侧的縱向成略 行。再者,可透過該上下升降單元7()將平台6上的基板 與開縫喷嘴2G的吐出口面36之間的間隙亦即餘隙 (clearance)設定成任意的大小。 、 而且’開縫噴嘴20的歧管26的上游側是經由内部通 路(未圖不)始終連接於連通於塗佈液供給裝置4q的供給 官60。據此’可由塗佈液供給裝置40將塗佈液66供給至 歧管26。包含塗伟液供給裝置4〇至供給管6〇為塗佈液供 給手段。進入岐管26的塗佈液被均等地擴寬於開縫噴嘴 20的縱向’經過開縫28被由吐出口30吐出。 此外,塗佈液供給裝置4〇在供給管60的上游側具備 1011013#早編號删1 第8頁/共40頁 1013176365-0 201243402 :過濾器(filter)46、供給閥42、注射泵(syringe Pump)5〇、吸引閥44、吸引管62、槽(tank)64。在槽 儲存有塗佈液6 6,被連結於壓縮空氣源68並可將任意大 小的背壓(backpressure)附加於塗佈液66。槽64内的 塗佈液66透過吸引管62被供給至注射泵50。 在注射栗50中注射器(syringe)52、活塞 (Pist0n)54被安裝於本體56。此處活塞54可藉由未圖示 的驅動源自在地往復運動於上下方向。注射泵5〇為將塗 0 佈液66填充於具有一定的内徑的注射器52内,透過活塞 54將塗佈液66擠出,僅將塗佈一片基板八的份供給至開縫 噴嘴20的定容量型的泵。將塗佈液66填充於注射器52内 時是令吸引閥44為開,令供給閥42為關,使活塞54移動 至下方。 而且,藉由將被填充於注射器52内的塗佈液66朝開 縫喷嘴20供給時是令吸引閥44為關,令供給閥42為開, 使活塞54移動至上方,以活塞54將注射器52内部的塗佈 液66往上推並排出。活塞54的移動速度乘以注射器刳面 積成為塗佈液66的供給速度’亦即泵供給速度。 在基台2的左側,測定基板A的厚度的厚度感測器9〇 被女裝於支撐台92。厚度感測器9〇使用雷射者較佳。藉 由以厚度感測器90測定基板A的厚度,對任意厚度的基板 A也能使開縫喷嘴20的吐出口面36與基板A之間的間隙之 餘隙始終一定。 在基台2的右側端部,包含清掃構件2〇〇被固定於頂 端的擦拭單元120的清掃手段在導軌4上移動自如地被 安裝於X方向。清掃手段100包含:台車1〇2、托架 1013176365-0 削關产單編號删1 第9頁/共40頁 201243402 (braket) 1 04、滑件(s 1 i der) 1 06、驅動單元 1 08、托 盤(tray) 110、擦拭單元120、清洗單元140。擦拭單元 120被固定於托架104。 透過滑件106使擦拭單元120移動的驅動單元108與 托盤110被固定於台車102上。托盤110是用以回收藉由 擦拭單元120除去的塗佈液等的構件。因此,被連接於未 圖示的排出線,可將積存於内部的塗佈液等的液體排出 、回收到外部。而且,托盤11 0也能使用於用以回收由開 縫喷嘴20透過抽去空氣等而吐出的塗佈液。 台車102位於導軌4上,被導執4導引,可藉由未圖 示的線性馬達自在地往復運動於X方向。因此,擦拭單元 120全體可往復運動於X方向。而且,喷射溶劑並清洗清 掃構件200的清洗單元140具備如下:於X方向在基台2的 右側端部,於Y方向在不與開缝喷嘴20的縱向端部干涉的 位置,藉由未圖示的托架固定。 清洗單元140藉由喷射清洗液之溶劑的溶劑喷嘴142 ,與由未圖示的溶劑供給源將溶劑供給至溶劑喷嘴142的 配管144構成。此外,溶劑喷嘴142除了可將溶劑喷射成 柱狀外,若可將溶劑喷射成喷淋(shower)狀、扇形狀等 可喷射溶劑的話,則任何形態的都能適用。 以上述擦拭單元120為首,以及透過控制信號動作的 線性馬達、馬達72、塗佈液供給裝置40、洗淨單元140等 都被電性連接於控制裝置94。而且,依照被安裝於控制 裝置94的自動運轉程式而將控制指令信號傳送至各機器 ,進行預先決定的動作。此外,條件變更時若適宜將變 更參數輸入到操作盤96,則包含變更參數的控制指令信 10110139#早編號 A〇101 第10頁/共40頁 1013176365-0 201243402 號被傳達至控制裝置94,可實現運轉動作的變更。 可對擦拭單元120任意控制清掃構件200的開缝噴嘴 20的縱向中的移動速度及/或清掃開始、結束位置等,可 實現所給予的任意的清掃動作。而且,可對清洗單元140 任意控制來自溶劑喷嘴142的溶劑的喷射速度或噴射時間 ,進行清掃構件2 0 0之預先被決定的清洗動作。 在圖3顯示擦拭單元120的詳細的構成。擦拭單元 120具有:台座122 '調整部124、0平台126、固定有清 掃構件200的支撐構件128。此外,整合支撐構件128與 清掃構件200稱為清掃單元250。台座122直接被固定於 托架104。為了說明的統一起見,以由台座朝配置有清掃 構件200的方向為0軸,以托架104延伸於滑件106的方 向為X軸,以滑件1 06行走的方向為Y軸。X軸及Y軸與在圖 1的塗佈裝置的軸方向一致。 在被固定於托架104的台座122的上方承載有調整部 124。調整部124的詳細於後述,旋轉於X- 0面的傾斜角 調整手段130,與推迫於垂直方向的垂直方向推迫手段 132,與可位移於X方向的位置調整手段136依此順序被疊 層配置。 而且,在調整部124的上方配置有0平台126。在6> 平台126上配置有被固定於支撐構件128的清掃構件200 清掃構件200為具有配合開縫喷嘴20的唇形斜面34A 、34B的略V字形狀的板狀構件。而且,為了配合開縫喷 嘴20的唇形斜面34A、34B,需進行精密的定位,故安裝 於支撐構件128的安裝面被精度佳地形成。其他的形狀則 1013176365-0 10110139#單編號A0101 第11頁/共40頁 201243402 無特別限制。 在圖4顯示清掃構件_的形狀的例子。參照圖4(a) ,清掃構件2GGa在板形狀的上邊形成有略v字形狀的溝 204。¥字的開度或溝的底寬的形狀是配合開鏠喷嘴20的 頂端形狀而形成。 在圖4(b)顯示其他的清掃構件的例子。清掃構件 2〇〇b是在同為略V字形狀的溝204的溝底206形成有缺口 (notch)208。該缺口 208是用以有效地進行所擦拭的塗 佈液等的附著物或清洗液等的排出之使液體落下用的溝 缺的大小無特別限定,為遍及溝寬2 0 4 ψ全體程度的 大的缺口即可。在本發明中也可以組合該等複數個清掃 構件而使用,且僅使用一種類的清掃構件也可以。此外 ,稱圖4(a)的類型為無缺口清掃構件2〇〇a,稱圖4(b)的 類型為附有缺口清掃構件2〇〇b。 清掃構件2〇〇至少略v字形狀的溝2〇4的表面由高分 子樹脂構成。更具體為可使用鐵氟龍(tefl〇n)(註冊商 標)樹脂、胺曱酸乙酯樹脂(urethane resin)、丙婦樹 月曰(acrylic resin)、聚醋樹脂(polyester resin) 、聚丙稀樹脂(p〇lypr〇pylene resin)、氟樹脂 (fluororesin)、聚丁二婦樹脂(p〇lybutadiene resin)、腈橡膠(nitrile rubber)、石夕氧橡膠 (silicone rubber)、乙烯-乙酸乙烯酯共聚物 (ethylene-vinylacetate copolymer)等的一種或使 用混合兩種以上者。而且,乙烯-丙烯橡膠 (ethylene-propylene rubber)、石夕氧橡膠(silicon rubber)、丁基橡膠(butyl rubber)、全氟橡膠 1013176365-0 10110139#單編號A0101 第12頁/共40頁 201243402 (perfluoro rubber)(商品名” kalrez”等)也較佳。 其中對開缝喷嘴20密著性,或對包含於塗佈液中的溶劑 (N-曱基。比咯嗣(N-methy卜2-Pyrrolidone)等)的抗性 ,進而耐久性優良者較佳,若考慮這些點,則矽氧橡膠 最佳。 此外,清掃構件200的略V字形狀的溝2〇4的表面以 外的部分為與其表面一樣的高分子樹脂也可以,且為完 全不同的材質也可以。而且,為了充分地確保與開縫噴 嘴20的密著性’清掃構件200其厚度被設定為2mm以上, 使規定的硬度被確保。乃因確保安襞於支撐構件128的精 度。更具體為再針對表示彈性的程度的橡膠硬度,使用c 型的彈簧型硬度試驗機(spring type hardness tester)測定,較佳為50°〜90°,更佳為6〇。〜8〇。β 而且,為了除去產生於清掃構件200的表面的靜電, 防止塵埃的附著,使導電粉末混入被使用於其表面的高 分子樹脂中也可以。導電粉末以導電性碳、鉑、金、錄 、銀、銅、钻、錫、銘及Is等的一種或兩種以上的混合 物較佳,該等導電粉末對高分子樹脂被混合40重量%~ι〇〇 重量%左右 在圖4(c)顯示清掃單元250的側視圖。清掃單元250 包含清掃構件200與支撐構件128。清掃構件2〇〇藉由能 以螺旋(screw)鎖緊的壓板129固定於支撐構件128的安 裝面128a。支撐構件128的安震面128a也與清掃構件2〇〇 的安裝面201—樣,被以十分高的精度形成。 參照圖3及圖4(c),支撐構件128為支撐清掃構件 2〇〇 ’更在底面128b具有可固定配設於0平台126的頂面 1013176365-0 10110139#單編號A〇101 第13頁/共4〇頁 201243402 的平面128c之構件。由X轴方向看的側面形狀為略五角形 ,在上部具有清掃構件200的安裝面128a。由最上邊 128t朝下方延續於誘導面128i、前斜面128f。 底面128b具有平面128c,惟為了進行在與0平台 126之高的精度下的連結而具有嵌合用的段差等也可以。 安裝清掃構件200的安裝面128a對底面128b約傾斜10度 至15度左右。乃因使清掃構件200的V字形狀溝204線接 觸開縫喷嘴20。支撐構件128分別對一個清掃構件200而 被準備。因此,種類不同的清掃構件200能每一支撐構件 進行更換。 再度參照圖3,6>平台126為搭載清掃單元250的平 台。在其中央具有垂直於0平台126的頂面之一個旋轉軸 126 6»。因此,0平台126繞旋轉軸126 <9旋轉。乃因關 於清掃構件200的姿勢可調整於旋轉軸126 6»方向。0平 台可在規定的範圍的角度内自由地旋轉。此乃為了實現 後述的自動調芯功能。0平台126的旋轉的範圍是透過微 調節螺旋(未圖示)進行。 而且,在0平台126上具有與支撐構件128的底面 128b的平面128c—樣的平面126c。亦即若在支撐構件 128的平面128c與0平台126上的平面12 6c之間夾持兩面 平行的墊片等,則由0平台126的頂面126a到支撐構件 128的高度可調節。此外,稱兩面平行的墊片等的構件為 高度調整構件,都稱支撐構件128及0平台126上的該平 面(126c及128c)為高度調節面。[0003] The result of long time. In particular, when configuring a plurality of π members, the respective height adjustments are not easy and take time. The invention is based on the above-mentioned problems, and the object of the invention is that the coating device and the coating method have a high-level cleaning means that can accommodate a plurality of β-scanning members. More specifically, the coating apparatus of the present invention includes: a coating liquid supply means for supplying a coating liquid; an applicator which is connected to the coating liquid supply means and a slit-shaped discharge port of the cloth liquid; and has a discharge means for discharging The above-mentioned coating means that the moving means I0I10I39# single number Α0]01 for moving the applicator and the member to be coated is moved in the direction of the fifth page/total 40 pages along the slit of the _ spout Direction: 1013176365-0 201243402 A cleaning means for slidingly contacting the peripheral portion of the discharge port of the applicator while removing the attachment edge, wherein the cleaning means includes: a platform and a member having a clearing member supported on the cutting member The above-mentioned material unit may be loaded with a pedestal in which the front squeezing direction includes a pedestal that supports the sputum platform, and is used to illuminate the height adjustment surface of the directional member. " Moreover, the coating apparatus of the invention of the present invention is characterized in that it is arranged with a vertical direction pushing means for the front direction ".k+ straight to the direction of the pedestal [0004] [Effect of the invention] The present invention The coating device includes a wiping unit having a mu cutting: θ platform for cleaning the cutting member of the scanning member, and adjusting the height of the spacer (shlm) for adjusting the height of the adjusting member and the leveling unit; The height of the dressing-^ is adjusted; the pad of the == “clamping” makes the 19 platform that is cut on the pedestal, and the 19 platform is cut by the pedestal, the green sweeping/vertical pushing means 'Therefore, the sample placed on the Θ platform = the height between the pieces even if the rubbing unit is repeatedly applied to the coating = 卢 此 (4) by the rubbing unit to test the applicator and avoiding ~ different cleaning members are exposed to spit Export. That is, it is possible to set a number of cleaning members so that one of the cleaning members can abut the spout and make the other cleaning members not touch the discharge port. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Further, the following description is illustrative of an embodiment, and modifications of the embodiments are possible without departing from the scope of the invention. The configuration of the coating device 1 of the present invention is shown in Fig. 1 . A pair of guide rails 4 are disposed on the base 2 of the coating device 1. A platform 6 of a stage of the substrate A to which the member is coated is disposed on the guide rail 4. The platform 6 is driven by a linear motor (not shown) and reciprocally moves in the X direction indicated by an arrow in Fig. 1. The top surface of the stage 6 is a vacuum adsorption surface composed of adsorption holes, and the substrate A can be adsorbed and held. A gate-shaped pillar 10 is disposed on the base 2 . The upper and lower lifting unit 70 is included in the stay 10. An applicator (hereinafter also referred to as a [slit nozzle]) 20 to be applied is attached to the upper and lower lifting unit 70. Therefore, the platform 6 on which the member to be coated is mounted can relatively move the slit nozzle 20, which is referred to as a moving means. An oblique view of the slit nozzle 20 is shown in FIG. The slit nozzle 20 is a transparent lip 22 that overlaps the front lip 22 and the rear lip 24 in the Y direction extending in the direction orthogonal to the X direction (the direction perpendicular to the paper surface of FIG. 1). The X direction is integrally joined by a plurality of connecting bolts (not shown). A raanifold 26 is formed in a central portion of the slit nozzle 20. The manifold 26 also extends in the longitudinal direction (Y direction) of the slit nozzle 20. A slit 28 that communicates with the manifold 26 is formed below the manifold 26. The slit 28 also extends in the longitudinal direction of the slit nozzle 20, and the lower end thereof is opened at the discharge end surface 36 of the lowermost end surface of the slit nozzle 10110139# single number A_ 7th page/to 40 pages 1013176365-0 201243402 2〇 The nozzle 20 is at the lowermost one, and is connected to the C-plane 2:2. Face 36: The two adjacent sides of the two sides have a lip-shaped slant. The slit 28 is equal to the thickness of the 塾 (10) by the gap of the cymbal 3 (in the x direction). 7〇: Γ Figure 1, the slit nozzle is made 20 lifting up and down lifting unit 7; 疋 由 is composed of the following components: the discharge port 30 is facing downwards: the suspension of the nozzle 20 is kept on the side of the shovel and is to be opened _ _ _ _ _ _ _ _ _ _ _ _ _ _ Tightly and =: the platform 8 is lifted and lowered 78; the lifting platform 78 is guided into a piece (gUide) 74; the rotary motion of the horse is converted into a lifting shoulder, and a u s (10)) 76. The lift TC7G supports both ends in the longitudinal direction of the slit nozzle 2 (), and the pair of pairs can be independently raised and lowered, so that the horizontal tilt angle of the slit nozzle 2G can be arbitrarily set. According to this, the discharge port surface 36 of the slit nozzle 2 can be made to be slightly parallel to the longitudinal direction of the substrate A on the side of the slit. Further, the clearance between the substrate on the stage 6 and the discharge port surface 36 of the slit nozzle 2G, that is, the clearance can be set to an arbitrary size by the vertical lifting unit 7 (). Further, the upstream side of the manifold 26 of the squeezing nozzle 20 is always connected to the supplier 60 that communicates with the coating liquid supply device 4q via an internal passage (not shown). According to this, the coating liquid 66 can be supplied to the manifold 26 by the coating liquid supply device 40. The coating liquid supply device 4A is supplied to the supply pipe 6A as a coating liquid supply means. The coating liquid entering the manifold 26 is uniformly widened in the longitudinal direction of the slit nozzle 20, and is discharged from the discharge port 30 through the slit 28. Further, the coating liquid supply device 4 is provided on the upstream side of the supply pipe 60 with 1011013# early numbering 1 page 8 / total 40 pages 1013176365-0 201243402: filter 46, supply valve 42, syringe pump (syringe) Pump) 5 〇, suction valve 44, suction tube 62, tank 64. The coating liquid 666 is stored in the tank, and is connected to the compressed air source 68, and a back pressure of any size is added to the coating liquid 66. The coating liquid 66 in the tank 64 is supplied to the syringe pump 50 through the suction pipe 62. In the injection pump 50, a syringe 52 and a piston (Pist0n) 54 are attached to the body 56. Here, the piston 54 can be reciprocated in the vertical direction by the drive (not shown). The syringe pump 5 is filled with the coating liquid 66 in a syringe 52 having a certain inner diameter, and the coating liquid 66 is extruded through the piston 54, and only a portion of one substrate is applied to the slit nozzle 20. Fixed capacity pump. When the coating liquid 66 is filled in the syringe 52, the suction valve 44 is opened, the supply valve 42 is closed, and the piston 54 is moved downward. Further, when the coating liquid 66 filled in the syringe 52 is supplied to the slit nozzle 20, the suction valve 44 is closed, the supply valve 42 is opened, the piston 54 is moved upward, and the piston 54 is used to open the syringe. The coating liquid 66 inside 52 is pushed up and discharged. The moving speed of the piston 54 is multiplied by the filling area of the syringe to become the supply speed of the coating liquid 66, i.e., the pump supply speed. On the left side of the base 2, a thickness sensor 9 for measuring the thickness of the substrate A is worn on the support table 92. The thickness sensor 9 is preferably a laser. By measuring the thickness of the substrate A by the thickness sensor 90, the gap of the gap between the discharge port surface 36 of the slit nozzle 20 and the substrate A can always be constant for the substrate A of any thickness. At the right end portion of the base 2, a cleaning means including the wiping unit 120 to which the cleaning member 2 is fixed to the top end is movably attached to the guide rail 4 in the X direction. The cleaning means 100 includes: trolley 1 〇 2, bracket 1013176365-0 cutting off the number of the order number 1 page 9 / total 40 pages 201243402 (braket) 1 04, slider (s 1 i der) 1 06, the drive unit 1 08. A tray 110, a wiping unit 120, and a cleaning unit 140. The wiping unit 120 is fixed to the bracket 104. The drive unit 108 and the tray 110, which move the wiping unit 120 through the slider 106, are fixed to the carriage 102. The tray 110 is a member for recovering the coating liquid or the like removed by the wiping unit 120. Therefore, it is connected to a discharge line (not shown), and the liquid such as the coating liquid stored therein can be discharged and collected to the outside. Further, the tray 110 can also be used for collecting the coating liquid which is discharged by the slit nozzle 20 by evacuating air or the like. The carriage 102 is located on the guide rail 4 and guided by the guide 4, and is reciprocally reciprocated in the X direction by a linear motor not shown. Therefore, the entire wiping unit 120 can reciprocate in the X direction. Further, the cleaning unit 140 that ejects the solvent and cleans the cleaning member 200 is provided at a position on the right side end of the base 2 in the X direction and does not interfere with the longitudinal end portion of the slit nozzle 20 in the Y direction. The bracket shown is fixed. The cleaning unit 140 is constituted by a solvent nozzle 142 that ejects a solvent of the cleaning liquid, and a pipe 144 that supplies a solvent to the solvent nozzle 142 by a solvent supply source (not shown). Further, the solvent nozzle 142 can be used in any form as long as it can eject the solvent into a columnar shape and eject the solvent into a shower or a fan shape. The linear motor, the motor 72, the coating liquid supply device 40, the cleaning unit 140, and the like, which are operated by the wiping unit 120 and transmitted through the control signal, are electrically connected to the control device 94. Further, a control command signal is transmitted to each device in accordance with an automatic operation program attached to the control device 94, and a predetermined operation is performed. Further, if it is appropriate to input the change parameter to the operation panel 96 at the time of the condition change, the control command letter 10110139#, which includes the change parameter, is transmitted to the control device 94, which is numbered A〇101, page 10/40 pages 1013176365-0 201243402, It is possible to change the operation. The wiping unit 120 can arbitrarily control the moving speed in the longitudinal direction of the slitting nozzle 20 of the cleaning member 200, and/or the cleaning start and end positions, and the like, and can perform any cleaning operation given. Further, the cleaning unit 140 can arbitrarily control the ejection speed or the ejection timing of the solvent from the solvent nozzle 142, and perform the cleaning operation determined in advance by the cleaning member 200. The detailed configuration of the wiping unit 120 is shown in FIG. The wiping unit 120 has a pedestal 122' adjustment portion 124, a 0 platform 126, and a support member 128 to which the cleaning member 200 is fixed. Further, the integrated support member 128 and the cleaning member 200 are referred to as a cleaning unit 250. The pedestal 122 is directly fixed to the bracket 104. For the sake of unification of the description, the direction in which the cleaning member 200 is disposed from the pedestal is the 0-axis, the direction in which the bracket 104 extends in the slider 106 is the X-axis, and the direction in which the slider 106 travels is the Y-axis. The X-axis and the Y-axis coincide with the axial direction of the coating apparatus of Fig. 1. An adjustment portion 124 is carried above the pedestal 122 fixed to the bracket 104. The details of the adjustment unit 124 will be described later, and the inclination angle adjustment means 130 rotated on the X-zero plane is biased in the vertical direction by the vertical direction pressing means 132 and the position adjustment means 136 which is displaceable in the X direction. Laminated configuration. Further, a zero platform 126 is disposed above the adjustment unit 124. The cleaning member 200 fixed to the support member 128 is disposed on the 6> platform 126. The cleaning member 200 is a substantially V-shaped plate-like member having lip-shaped inclined faces 34A and 34B that match the slit nozzle 20. Further, in order to match the lip-shaped inclined faces 34A, 34B of the slit nozzle 20, precise positioning is required, so that the mounting surface mounted on the support member 128 is accurately formed. Other shapes are 1013176365-0 10110139#单号A0101 Page 11 of 40 201243402 No special restrictions. An example of the shape of the cleaning member_ is shown in FIG. Referring to Fig. 4(a), the cleaning member 2GGa is formed with a groove 104 having a substantially v-shape on the upper side of the plate shape. The opening of the word or the shape of the bottom width of the groove is formed in accordance with the shape of the tip end of the opening nozzle 20. An example of another cleaning member is shown in Fig. 4(b). The cleaning member 2b is formed with a notch 208 in the groove bottom 206 of the groove 204 having the same V shape. The notch 208 is not particularly limited as long as the groove width is 2 0 4 ψ, and the size of the groove for the liquid to be dropped is particularly limited. A big gap can be. In the present invention, the plurality of cleaning members may be used in combination, and only one type of cleaning member may be used. Further, the type of Fig. 4(a) is referred to as a non-notched cleaning member 2a, and the type of Fig. 4(b) is referred to as a notched cleaning member 2b. The surface of the cleaning member 2 沟 at least slightly v-shaped groove 2〇4 is composed of a polymer resin. More specifically, it is possible to use a teflon (registered trademark) resin, an urethane resin, an acrylic resin, a polyester resin, or a polypropylene. Resin (p〇lypr〇pylene resin), fluororesin, p〇lybutadiene resin, nitrile rubber, silicone rubber, ethylene-vinyl acetate copolymerization One type or the like (ethylene-vinylacetate copolymer) or a mixture of two or more types. Moreover, ethylene-propylene rubber, silicon rubber, butyl rubber, perfluororubber 1013176365-0 10110139# single number A0101 page 12 / total 40 pages 201243402 ( Perfluoro rubber) (trade name "kalrez", etc.) is also preferred. Among them, it is preferable that the slit nozzle 20 is adhesive or resistant to a solvent (N-methyl group, N-methyb 2-Pyrrolidone, etc.) contained in the coating liquid, and further excellent in durability. If these points are considered, the silicone rubber is the best. Further, the portion other than the surface of the slightly V-shaped groove 2〇4 of the cleaning member 200 may be the same polymer resin as the surface thereof, and may be a completely different material. Further, in order to sufficiently ensure the adhesion to the slit nozzle 20, the thickness of the cleaning member 200 is set to 2 mm or more, and the predetermined hardness is secured. This is to ensure the accuracy of the mounting member 128. More specifically, the rubber hardness indicating the degree of elasticity is measured by a spring type hardness tester of c type, preferably 50 to 90, more preferably 6 Torr. ~8〇. Further, in order to remove static electricity generated on the surface of the cleaning member 200, adhesion of dust is prevented, and the conductive powder may be mixed into the high molecular resin used on the surface. The conductive powder is preferably one or a mixture of two or more of conductive carbon, platinum, gold, nickel, copper, diamond, tin, tin, and Is, and the conductive powder is mixed with 40% by weight of the polymer resin. A side view of the cleaning unit 250 is shown in Fig. 4(c). The cleaning unit 250 includes a cleaning member 200 and a support member 128. The cleaning member 2 is fixed to the mounting surface 128a of the support member 128 by a screw plate 129 which can be screwed. The adamping surface 128a of the support member 128 is also formed with a very high precision as with the mounting surface 201 of the cleaning member 2A. Referring to FIGS. 3 and 4( c ), the support member 128 is a support cleaning member 2 〇〇 'and has a top surface that can be fixedly disposed on the 0 platform 126 on the bottom surface 128 b. 1013176365-0 10110139 #单号 A〇101 Page 13 / Total 4 〇 page 201243402 The structure of the plane 128c. The side surface shape seen from the X-axis direction is a slightly pentagonal shape, and the mounting surface 128a of the cleaning member 200 is provided at the upper portion. The uppermost side 128t continues downward from the induction surface 128i and the front slope 128f. The bottom surface 128b has a flat surface 128c, and may have a step or the like for fitting in order to achieve high precision with the 0 platform 126. The mounting surface 128a of the mounting cleaning member 200 is inclined by about 10 to 15 degrees with respect to the bottom surface 128b. The slit nozzle 20 is brought into contact with the V-shaped groove 204 of the cleaning member 200. The support members 128 are prepared for one cleaning member 200, respectively. Therefore, the cleaning members 200 of different types can be replaced with each of the supporting members. Referring again to Fig. 3, 6> platform 126 is a platform on which cleaning unit 250 is mounted. In its center there is a rotational axis 126 6» perpendicular to the top surface of the 0 platform 126. Therefore, the 0 platform 126 rotates about the rotation axis 126 <9. The position of the cleaning member 200 can be adjusted to the direction of the rotating shaft 126 6». The 0 platform is free to rotate within the specified range of angles. This is to achieve the automatic core adjustment function described later. The range of rotation of the 0 platform 126 is performed by a micro-adjusting spiral (not shown). Moreover, there is a plane 126c on the 0 platform 126 that is similar to the plane 128c of the bottom surface 128b of the support member 128. That is, if a double-sided parallel spacer or the like is sandwiched between the flat surface 128c of the support member 128 and the flat surface 12 6c of the 0-platform 126, the height from the top surface 126a of the 0-stage 126 to the support member 128 can be adjusted. Further, members such as spacers which are parallel on both sides are referred to as height adjustment members, and the planes (126c and 128c) on the support member 128 and the 0 platform 126 are referred to as height adjustment faces.

而且,0平台126具有可搭載複數個清掃單元250的 程度的寬度。搭載的方法是將擦拭單元120的擦拭方向(Y 腿〇13#單編號A0101 第14頁/共40頁 1013176365-0 201243402 軸方向)搭載於縱列。乃因使多重擦栻為可能。搭載的清 知單元250的數目不被限定。實用上因若以⑴個清掃構 件2〇〇擦拭的話就足夠,故如果0平台126也能搭載⑴ 個清掃單元25〇的話即可。 對於擦栻,最麟㈣清掃構件2_其跟前的清掃 構件⑽的安裝位置的決定很重要。因此,在本發明中的 擦拔單元120中’基於與0平台126的旋轉軸126㈣關 係而配設定位手段,以便對清掃單元㈣兩個位置 (叩^以011)成為可能.定位手段未被特別限定。最簡便 的方法是在Θ平台126或續構件128的—方形成凸形狀 的轂(boss),在他方形成接受轂的轂孔。第一個位置為 在Θ平台126的旋轉軸1260的正下方配置最末尾的支撐 構件128(清_件)㈣—讀構件設定位置。而且,第 -個位置為在最末尾的切構件與其跟前的支樓構件之 間配置有旋轉轴1260的第二支撑構件設定位置。 第-支撲構件設定位置是以被固定於最末尾的清掃 單元250的清掃構件2GG料位為域減方法。而且, 第-支樓構件設定位置是都解地㈣搭載於最末尾與 最末尾的跟前的清掃單元25q的清掃構件2⑽定位的搭載 方法。如後述,在本發明中藉由分別使用該等支撐構件 設定位置與來自0平台126的支撐構件128的高度,使複 數個擦栻方法為可能。 在0平台126之下配置有X方向(與擦拭方向成直角 的方向)的位置調整手段136。具體的構成未被特別限定 准若疋被使用於XY平台而線性進給(linear fee(j)為 可能的構成的話即可。位 10110139#·單編號 A0101 第 15 百 / 置調整手段136也能在規定的範 共40頁 1013176365-0 201243402 圍内自由地移動。乃因為了後述的自動調芯功能。χ方向 的位置調整手段136的自由可動域(free range of mot ion)也可藉由調整螺旋(未圖示)調整。 在X方向的位置調整手段136的下方配置有垂直方向 推迫手段132。垂直方向推迫手段132對本身所具有的基 板132b在垂直方向給予推迫。具體的構成可舉出彈簧等 的彈性體132e配置於基板132b與壓面132u之間的構成為 例0 垂直方向推迫手段132需在將清掃構件2〇〇按壓於開 縫喷嘴20時,在擦拭方向(γ方向)的前後不產生角度變化 。乃因本發明其特徵為為了使複數個清掃構件2〇〇的高度 調整為可能。使用圖5更詳細地進行說明。 圖5疋由X軸方向看擦拭單元120之概略圖。參照圖 5(a) ’現在在0平台126搭載有兩個清掃單元251、252 。擦拭方向(Y方向)的後方的清掃單元252在支撐構件 128之下夾入有墊片300,位於比前方的清掃單元251高 出以Θ平台126的頂面126a為基準的高度位置之位置。在 該狀態下按壓於開縫喷嘴20的頂端。若設垂直方向推迫 手段132在Y- 0面内可旋轉’則兩個清掃單元251、252 都會密著於開縫噴嘴20(圖5(b))。 本發明的垂直方向推迫手段132如圖5(c)所示,針 對Y- Θ面内的旋轉被限制。對基板132b(亦即台座122) 僅在垂直方向施予推迫。具體的構成可舉出在γ方向豎起 前後的導銷(guide pin)132g ’藉由彈性體i32e等推迫 對該導銷132g水平的壓面132u之構成。此外,垂直方向 推迫手段132特別是不配設調整螺旋也可以。但是配設鎖 1013176365-0 10110139#單編號Α〇1ίΠ 第16頁/共40頁 201243402 緊機構(1〇ckmechanisra),以便在調整x方向的位置調 整手段136時不會在上下移動較佳。 再度參照圖3,在垂直方向推迫手段132的下方配置 有裯整χ-β面的角度之傾斜角調整手段13〇。具體的構成 未被特別限定。最容易的實現方法為透過平行於γ抽的支 播鎖130ρ支撑上下的托架13〇u、13〇d之構成。使用旋轉 肀台(swivel stage)也可以。 傾斜角調整手段130可由垂直方向(Θ方向)朝左右 一(X方向)自由旋轉僅規定的角度。藉由該傾斜角度成 D 為自由’與X方向的位置調整手段136(如後述也加入0平 台126)的協同動作’在與開縫喷嘴2〇的接觸、嵌合時即 使在X方向有一些偏移,清掃構件2〇〇也能配合並抵接於 開鏠喷嘴20的吐出口面36與唇形斜面34A及34B。稱此為 擦试單元120的自動調芯功能。 針對自動調芯功能更詳細地說明。圖6是顯示由Y方 向看的開縫噴嘴20與擦拭單元12〇。擦拭單元12〇僅顯示 傾斜角調整手段130與X方向的位置調整手段丨36。亦即0 D 爭台126與垂直方向推迫手段丨32省略。此外,設位置調 整手段136為在被固定成下方侧的下板136d與被固定成上 方側的上板136u之間可移動而卡合的類型的構件。 參照圖6(a),傾斜角調整手段130與位置調整手段 136在規定的範圍内成為自由。亦即擦拭單元丨2〇與開縫 喷嘴20嵌合前某種程度地傾斜於X方向,位置調整手段 136也移動於傾斜的方向。 其次參照圖6(b),開縫喷嘴20 —下降到下方向(-0 方向)’就與擦拭單元12〇的清掃構件2〇〇接觸,擦拭單元 101觸#單編號删1 1013176365-0 第17頁/共40頁 201243402 120豎起來。更具體為位置調整手段136開始移動於箭頭 280的方向,傾斜角調整手段130開始旋轉於箭頭281的 方向。 最後參照圖6(c),開缝喷嘴20—下降到規定位置, 位置調整手段136就在清掃構件200的V字形狀的溝嵌合開 縫喷嘴20的唇形斜面34A、34B的位置停止,傾斜角調整 手段130也停止旋轉。再者,實際上0平台126也能旋轉 規定的角度,故即使是Y方向的偏移也能在規定的範圍吸 收。 如以上,擦拭單元120因具有傾斜角調整手段130與 位置調整手段136進而0平台126在規定的範圍自由地被 卡止的自動調芯功能,故即使開縫喷嘴20與擦拭單元120 的位置關係稍微偏移,擦拭單元120的清掃構件200也能 確實地嵌合於開縫喷嘴20。藉由如以上的各要素構成擦 拭單元120。 其次一邊參照圖1及圖7,一邊說明使用包含擦拭單 元120的清掃手段100的清掃方法。圖7是顯示以擦拭單元 120清掃開縫喷嘴20的狀態之由X方向看的侧視圖。被搭 載於擦拭單元120的清掃單元251、252為後方的清掃單 元252被配置於配置於(9軸上的第一支撐構件設定位置。 而且,在清掃單元25 2與0平台126之間夾持有墊片32。 乃因這種清掃單元的配置的情形是想藉由自動調芯功能 使後方的清掃單元252與開縫喷嘴20的接觸狀態良好。 首先清掃手段100在X方向被配置於初始位置(圖1的 基台2的右側端部)。此時擦拭單元120在Y方向位於清掃 開始位置(圖7(a))。若開始清掃,則使清掃手段100全 10110139#單編號 A〇101 第18頁/共40頁 i0iciiY63t)t)-u 201243402 體移動於X方向,以便來到卡合於開缝喷嘴20的吐出口面 36與唇形斜面34A、34B的位置的正下方(圖7(a))。 若清掃構件20 0來到開縫喷嘴20的頂端部的正下方 ,在Y方向稍微離開吐出口 30的清掃開始位置,則由開縫 喷嘴20的吐出口 30超過規定量地吐出塗佈液。所吐出的 塗佈液附著於開縫喷嘴20的吐出口面36及/或唇形斜面 34A、34B而成為附著的塗佈液150(圖7(b))。 其次使開縫喷嘴20下降並使其嵌合亦即接觸於清掃 構件200(圖7(c))。此時如以上所述藉由自動調芯功能 〇 ,開縫喷嘴20必定會配合清掃構件200。此時使開縫喷嘴 20下降直到垂直方向推迫手段132收縮較佳為0. 5〜5mm, 更佳為l~3mm的位置。若垂直方向推迫手段132在該範圍 内收縮,則清掃構件200可容易追蹤開縫喷嘴20的頂端部 的上下方向的位置變動。 然後驅動驅動單元108,在使清掃構件200接觸開縫 噴嘴20的吐出口面36與唇形斜面34A、34B的狀態下,使 其移動於箭頭方向(Y方向),除去、清掃分別附著於開縫 喷嘴20的吐出口面36與唇形斜面34A、34B的塗佈液150 與其他的附著物(圖7(d))。 此處,箭頭方向成為清掃構件200—邊接觸開縫喷嘴 20—邊移動,亦即滑動之滑動方向,與Y方向或開縫喷嘴 20的縱向一致。此外,被除去的塗佈液、其他的流體成 為順著清掃構件200或支撐構件128的誘導面128i、前斜 面128f流出的塗佈液152,進而落下到托盤110而被回收 〇 清掃構件200繼續移動於Y方向,在通過開縫喷嘴20 10110139#單編號纖01 第19頁/共40頁 1013176365-0 201243402 的縱向端部的位置,亦即不與開缝喷嘴20的縱向端部干 涉的位置停止。接著,擦拭單元120全體一移動至X方向 的初始位置,清掃構件200就在清洗單元140的正下方停 止。在該狀態下由溶劑喷嘴142喷射經由配管144供給的 溶劑,清洗清掃構件2 0 0 (圖7 (e))。若清洗完了,使清 掃構件200回到Y方向的清掃開始位置,之後每次塗佈重 複相同的清掃方法。 以上為清掃方法的概要,而參照圖8針對本發明中的 清掃方法更詳細地說明。圖8是由X方向看開缝喷嘴20與 本發明的擦拭單元120的清掃構件200的接觸狀態之放大 視圖。參照圖8(a),針對使用兩個清掃單元251、252的 情形進行說明。此為擦拭方向(Y方向)的前方的清掃單元 251及後方的清掃單元252都搭載有在圖4(a)顯示的無缺 口清掃構件200a。而且,後方的清掃單元252在與0平台 126之間夾持規定厚度的墊片300。再者,後方的清掃單 元252配置於6>平台126的旋轉軸126Θ上。亦即使用第 一支撐構件設定位置。 若在這種狀態下使開縫喷嘴20與擦拭單元120抵接 ,進而壓入,則後方的清掃單元252與開縫喷嘴20抵接。 但是,前方的清掃單元251因高度僅低墊片300的部分, 故不抵接開縫喷嘴20。參照圖8(a-l),在開縫喷嘴20與 清掃構件200b之間存在間隙302。另一方面參照圖 8(a-2),在開縫喷嘴20與清掃構件200a之間無間隙,成 為確實被擦拭的狀態。 亦即為藉由作成非接觸的無缺口清掃構件200a,預 先刮除附著於開縫喷嘴20的附著物,藉由後方的清掃構 10110139#單編號 A〇101 第20頁/共40頁 1013176365-0 201243402 件200a擦栻之清掃方法。這種清掃方法為對挪製的開縫 喷嘴且容易產生擦拭朗條紋的情形有效的擦拭方法。 而且此時若使用附有缺口清掃構件2〇〇b的話,因 可防止到除或擦拭過的附著物積存於V字形狀的溝底(圖 4(b)的206),故可迴避附著物再附著於開縫喷嘴2〇。特 別疋田由於使用的塗佈液的性狀而使許多附著物殘留於 開縫喷嘴20的吐出n3G(參照圖2)時,使用附有缺口清掃 構件200 b較佳。 0 如此,當改變複數個清掃單元25〇的高度,進行擦拭 時,具有本發明的擦拭單元120的塗佈裝置1可比較簡單 地進仃調整。如果想各自調整對滑件106獨立的兩個清掃 單元250的向度,則一方始終必須保持與他方的高度的差 仁如此在維持清掃構件全體的上下的追蹤性上,可以 說很難維持該關係。具有本發明的擦拭單元12〇的塗佈裝 置1在此點上非常有效。 接著參照圖8(b)。此情形也使用兩個清掃單元251 Ο 252。兩個與圖7(a)相同都是無缺口的清掃構件2〇〇a ° '青掃早凡251、252的配置方法為0平台126的旋轉轴 I26 0位於刖方的清掃單元251與後方的清掃單元252之 1之第一支撐構件設定位置。而且,在任一個清掃單元 未失者塾片。亦即前方的清掃構件與後方的清掃構件 位於距$平台126相同的高度。 &若在該狀態下使其抵接、壓入開缝喷嘴20的頂端, 則則後的凊掃構件同樣地分別接觸開缝喷嘴20的頂端(參 '、、、圖8(卜1)、(b_2))。若在該狀態下使擦拭單元12〇行 1013176365-0 ^ 走則可進行清掃構件的二次擦拭。此為對超硬合金製 1011013#單編號A0101 第21頁/共4〇頁 201243402 的開縫喷嘴的情形有效的方法。 即使是均等地使用複數個清掃構件2〇〇的情形,具有 本發明的擦找單元120的塗佈裝置1也能比較簡單地使清 掃構件抵接開縫喷嘴20。 其次參照圖8 (c )。此情形為在0平台i 2 6搭載一個 清掃單元250的情形,與以往所進行的方法相同。此情形 ’藉由清掃單元250配置於0平台126的旋轉軸1260的 正上方,與圖8(a)的情形一樣與開縫噴嘴2〇抵接,因此 擦拭成為可能。 其次,針對依照塗佈裝置1之使用與本發明有關的清 掃構件與清掃方法進行的塗佈方法進行詳述。首先,若 塗佈裝置1的各動作部的零點回復(Zer〇 return)被進行 ,則各動作部移動至待機位置^“加“ p〇siti〇n)。 亦即,平台6移動至圖丨的左側端部(以虛線表示的位置) 開縫喷嘴20移動至頂部的原點位置,並且擦拭單元12〇 由初始位置(基台2的右侧端部)移動’以便托盤11〇來到 開縫噴嘴20的下部位置。此時,清掃構件2qq在X方向中 位於開縫喷嘴2G的吐出口 30的正下方的位置,而在開縫 噴嘴20的縱向之γ方向,如圖7(a)所示位於稱為離開吐出 口 30的清掃開始位置。 此處由槽64到開縫喷嘴20為塗佈液66已經被填滿, 排出開縫喷嘴2Q内部的殘留空氣的作業已經結束。此時 的塗佈液供給裝置4G的狀態為塗佈液66被填充於注射器 52 ’吸引闕44關閉’供給閥42打開,然後活塞54位於最 下端的位置’成為始終替塗佈⑽供給關縫喷嘴2〇 的狀態。 第22頁/共40頁 i〇】10139#單編號 A0101 10Ϊ3176365-0 201243402 最初使未圖示的頂出銷(Hft pin)上升到平台^的 表面,基板A被由未圖示的裝載機(1〇ader)承載到頂出 銷的上部。接著,使頂出銷下降並將基板A承載到平台6 的頂面,同時進行吸附保持。與此同時進行使塗佈液供 給裝置40運轉,由注射泵5〇將預先決定的(過剩)量的塗 佈液66供給至開縫喷嘴,由開縫喷嘴20朝托盤11〇吐 出塗佈液6 6。 此時,清掃構件200因在γ方向中不在吐出口 3〇的正 下方的位置,故被由開縫喷嘴2G的吐出口 30吐出的塗佈 液66不會落下。塗佈液66的供給停止後,使開縫噴嘴2〇 下降並使清掃構件200接觸開縫噴嘴20的吐出口面36與唇 形斜面34A、34B後,使清掃構件200在γ方向滑動到終點 位置’遍及Y方向清掃成為開縫喷嘴2〇的吐出口抑附近的 吐出口面36與唇形斜面34A、34B。 Ο 1011013#^ 藉由該清掃,以塗佈液66完全填滿開縫噴嘴2〇的内 部通路直到吐出口30為止之初始化也完了。清掃完了後 ’使開縫喷嘴2〇上升到原點位置,並且使擦拭單元12〇移 動於X方向並使其返回到初始位i(基台2的右側端部)。 在由溶劍喷嘴142將溶劑喷射到此時在清洗單元14〇的正 下方停止的清掃構件2〇〇並對清掃構件2〇〇進行溶劑清洗 後’使清掃構件2〇〇移動於與滑動方向相反的方向,使清 掃構件200返回到γ方向的清掃開始位置。 月 在確認擦拭單元120移動到初始位置後,開始承載了 基板A的平台6的移動。此時職喷嘴2Q在上下方向位於 比塗佈被進行的位置還上方的原點位置,另_方面,注 射栗50停止並待機。然後’在基板a通過厚度感測器9〇下 0101 第23頁/共40頁 ^13176365-0 201243402 的時侯利疋基板厚度,若基板八的塗佈開始部到達開縫喷 嘴20的吐出口 3〇的正下方的話,使平台6停止。 此時,使用已測定的基板A的厚度資料,驅動上下升 降單元70並使開縫対2GT降並停止,以便騎喷物 的吐出口面36與基板A之間的㈣’亦即餘隙成為預先決 ^的值。在開縫噴嘴2〇與平台6完全停止的狀態下,以規 疋速度使;t射泵50的活塞54上升,由騎喷嘴2()吐出塗 佈液66。在開縫喷嘴2Q與基板A之間形成液珠(bead)B後 以規疋速度開始移動平台6於义方向開始將塗佈液Μ 塗佈於基板A,形成塗佈膜匸。 然後,比基板A的塗佈結束位置稍為跟前的位置來到 開縫喷嘴20的吐出σ3()的正下方的話,使活細停止並 停止塗佈液66的供給,接著,在基板Α㈣佈結束位置來 到開縫喷嘴20的吐出σ3()的正下方時,驅動上下升降單 元7〇,使開縫喷嘴20上升。據此,在基板績開縫喷嘴20 之間形成的液珠Β被斷絕,塗佈結束。 石判運終點位置就停止,解ρ 基板Α的吸附並使頂出鎖上升而將基板Α舉起。此時透過 未圖示的卸載機(—Μ⑴保持基板Α的底面,將基板八 運送至下-個製程。若將基板A遞送至卸載機的話,平台 6使頂出鎖下降返回到原點位置。平台6返回到原點位置 後,使擦拭單元12G移動,以便托盤1_到_噴嘴20 的吐出口 30的下部位置。 單編號 Α0101 第24頁/共4〇頁 在移動完了後,令吸制44為開,令供給閥42為關 ’使活塞町降,將塗騎66填纽注㈣咖。在填 充完了後,使活塞54停止,令”㈣為關,令供給閥 m m 够 λ - 一 ^ 1013176365-0 201243402 42為開,等待下一片基板A的到來,重複相同的動作。 此外,本發明可適用的塗佈液是以黏度卜l〇〇mpas ,更佳為1〜50mPas,基於塗佈性以牛頓流體 (Newtonian fluid)較佳,惟也能適用於具有觸變性 (thixotropy)的塗液。尤其在塗佈溶劑使用揮發性高者 ,例如PGMEA(Propylene Glycol Monomethyl Ether Acetate:丙二醇甲醚醋酸酯)、乙酸丁酯(butyl 〇 acetate)、乳酸乙酯(ethyl lactate)等的塗佈液時有 效。 具體上可適用的塗佈液的例子除了上述所舉的彩色 濾光片用的黑色矩陣(black matrix)、RGB色像素 (pixel)形成用塗佈液之外,有光阻液、平坦化材、柱形 成材料等。基板之被塗佈構件除了玻璃之外也能使用鋁 等的金屬板、陶瓷板、矽晶圓(silic〇n wafer)等。 再者,塗佈速度等的使用的塗佈條件,塗佈速度為 10mm/s 600mm/s,更佳為i〇〇fflm/s〜3〇〇ram/s,清掃構 〇 件200的滑動速度較佳為1〇〇~1〇〇〇mm/s,更佳為 200〜60〇mm/s,開縫噴嘴的唇形間隙為5〇 i〇〇(^m,更 佳為’’Μ ’㈣厚度在濕潤狀態下為卜50㈣,更 佳為2~20 /ζιη。 [0006]【產業上的可利用性】 本發明除了可適合利用於在製造料濾光片等的時 候使用的塗佈裝置外,也能利用於在陣列基板、電浆顯 示器用面板、滤光器等的基板上形成均勾且高品質的塗 佈膜的各種顯示器用構件的製造。 第25頁/共40頁 10110139#單編號 A0101 1013176365-0 201243402 【圖式簡單說明】 [000Ή 圖1是顯示本發明的塗佈裝置的構成之圖。 圖2是開縫喷嘴之斜視圖。 圖3是顯示本發明的擦拭單元的構成之圖。 圖4(a)、(b)、(c)是清掃構件之放大視圖。 圖5(a)、(b)、(c)是說明垂直方向推迫手段之圖。 圖6 (a)、( b)、( c)是說明自動調芯功能之圖。 圖7(a)、(b)、(c)、(d)、(e)是說明擦拭單元的 動作之圖。 圖8(a) 、 (b) 、 (c) 、 (a-Ι) 、 (b-Ι) 、 (c-Ι)、 (a-2)、(b-2)是說明使用擦拭單元的擦拭方法之圖。 【主要元件符號說明】 [0008] 1 :塗佈裝置 2:基台 4:導執 6:平台 10:支柱 20:開縫噴嘴(塗佈器) 22 :前唇 24:後唇 2 6 :歧管 28:開縫 30 :吐出口 32:墊片 34A、34B:唇形斜面 36 :吐出口面 1〇11013#單編號歷 第26頁/共4〇頁 1013176365-0 201243402 40:塗佈液供給裝置 42:供給閥 44:吸引閥 4 6 :過滤器 50:注射泵 52:注射器 54:活塞 56:本體 60:供給管 62:吸引管 64:槽 66:塗佈液 68:壓縮空氣源 70:上下升降單元 72:馬達 74:導件 76:滚珠螺桿 78:升降台 80:懸掛保持台 9 0 :厚度感測器 92:支撐台 94:控制裝置 96:操作盤 1〇〇:擦拭單元 102:台車 104:托架 10110139#單編號删1 第27頁/共40頁 1013176365-0 201243402 106:滑件 1 08 :驅動單元 110:托盤 120:擦拭單元 122:台座 124:調整部 126: 0平台 126a: 0平台的頂面 126c、128c:高度調節面 126 0 :旋轉軸 128:支撐構件 128a:支撐構件的安裝面 128b:支撐構件的底面 128f :支撐構件的前斜面 128i:支撐構件的誘導面 129:壓板 130:傾斜角調整手段 130d、130ικ 托架 130p:支撐銷 132:垂直方向推迫手段 132b:基板 132e:彈性體 132u:壓面 136:位置調整手段 140:清洗單元 142 :溶劑噴嘴 10110139# 單編號 A〇101 1013176365-0 第28頁/共40頁 201243402 1 4 4 :配管 150:附著的塗佈液 152:流出的塗佈液 154:被匯集的塗佈液 200、200a、200b:清掃構件 202、402 :底面 204:V字形狀溝 204w:溝寬 206:溝底 208 :缺口 210 :後面 250、251、252:清掃單元 300:墊片 302:間隙 A:基板(被塗佈構件) B:液珠 C:塗佈膜 Ds :滑動方向 1011013#^ A〇101 第29頁/共40頁 1013176365-0Further, the 0 stage 126 has a width to which a plurality of cleaning units 250 can be mounted. The mounting method is to mount the wiping unit 120 in the wiping direction (Y leg 〇 13# single number A0101 page 14 / total 40 pages 1013176365-0 201243402 axis direction) in the column. It is because of the possibility of multiple rubbing. The number of the smart units 250 to be mounted is not limited. Practically, it is sufficient if it is wiped by (1) cleaning member 2, so that the (1) cleaning unit 25 can be mounted on the 0 platform 126. For the rubbing, it is important to determine the mounting position of the cleaning member (10) of the most lining (4) cleaning member 2_. Therefore, in the wiping unit 120 of the present invention, the setting means is configured based on the relationship with the rotating shaft 126 (four) of the 0 platform 126, so that the two positions (叩^ with 011) of the cleaning unit (four) are possible. Specially limited. The easiest way is to form a convex shaped boss on the side of the weir platform 126 or the continuation member 128, and form a hub hole that receives the hub on the other side. The first position is to arrange the last support member 128 (clear) (four) - the reading member setting position directly below the rotary shaft 1260 of the cymbal platform 126. Further, the first position is a second support member setting position in which the rotating shaft 1260 is disposed between the last cutting member and the preceding branch member. The first-plier member setting position is a subtraction method of the cleaning member 2GG level of the cleaning unit 250 fixed to the end. Further, the first branch member setting position is a mounting method in which the cleaning member 2 (10) of the cleaning unit 25q mounted at the end and the last end is positioned in a stable manner. As will be described later, in the present invention, a plurality of wiping methods are possible by setting the positions of the supporting members 128 from the 0 platform 126 using the supporting members, respectively. A position adjustment means 136 having an X direction (a direction at right angles to the wiping direction) is disposed below the 0 stage 126. The specific configuration is not particularly limited. If the linear fee (j) is a possible configuration, the linear fee (j) is possible. The bit number 10110139#·single number A0101 15th/setting adjustment means 136 can also be used. It is freely moved within a predetermined range of 40 pages 1013176365-0 201243402. It is because of the automatic aligning function described later. The free range of mot ion of the position adjustment means 136 in the χ direction can also be adjusted. The spiral direction (not shown) is adjusted. The vertical direction pushing means 132 is disposed below the position adjusting means 136 in the X direction. The vertical direction pushing means 132 urges the substrate 132b which is provided in the vertical direction. The configuration in which the elastic body 132e such as a spring is disposed between the substrate 132b and the pressing surface 132u is an example. The vertical direction pushing means 132 is required to be in the wiping direction when the cleaning member 2 is pressed against the slit nozzle 20. The angle change is not generated before and after the gamma direction. The present invention is characterized in that the height of the plurality of cleaning members 2A is adjusted. This will be described in more detail with reference to Fig. 5. Fig. 5 A schematic view of the wiping unit 120 is seen in the X-axis direction. Referring to Fig. 5(a), two cleaning units 251 and 252 are mounted on the 0 platform 126. The cleaning unit 252 in the wiping direction (Y direction) is on the support member 128. The spacer 300 is sandwiched by the lower portion, and is located higher than the cleaning unit 251 of the front side with respect to the height position of the top surface 126a of the crucible platform 126. In this state, it is pressed against the top end of the slit nozzle 20. If the vertical direction is set The pushing means 132 is rotatable in the Y-0 plane, and the two cleaning units 251, 252 are adhered to the slit nozzle 20 (Fig. 5(b)). The vertical direction pushing means 132 of the present invention is as shown in Fig. 5 c), the rotation in the Y-plane is restricted. The substrate 132b (that is, the pedestal 122) is urged only in the vertical direction. The specific configuration may be a guide pin before and after the γ direction is erected ( Guide pin) 132g 'The pressing surface 132u of the guide pin 132g is urged by the elastic body i32e or the like. Further, the vertical direction pushing means 132 may not be provided with the adjustment screw. However, the lock 1013176365-0 is provided. 10110139#单号Α〇1ίΠ Page 16 of 40 201243402 Tightening mechanism (1 The ckmechanisra) is not preferably moved up and down when the position adjustment means 136 in the x direction is adjusted. Referring again to FIG. 3, the inclination angle adjustment of the angle of the χ-β plane is arranged below the vertical direction pushing means 132. The specific configuration is not particularly limited. The easiest way to achieve this is to support the upper and lower brackets 13〇u and 13〇d by the anchor lock 130p parallel to the γ pumping. It is also possible to use a swivel stage. The tilt angle adjusting means 130 is freely rotatable by a predetermined angle from the vertical direction (Θ direction) toward the left and right (X direction). By the inclination angle D, the positional adjustment means 136 of the free 'X direction' (the 0-platform 126 is also added as will be described later) 'has some contact in the X direction when it comes into contact with the slit nozzle 2〇. Offset, the cleaning member 2A can also fit and abut against the discharge port surface 36 and the lip slopes 34A and 34B of the opening nozzle 20. This is called the automatic alignment function of the wiping unit 120. The auto-alignment function is explained in more detail. Fig. 6 is a view showing the slit nozzle 20 and the wiping unit 12A seen from the Y direction. The wiping unit 12A displays only the tilt angle adjusting means 130 and the position adjusting means 36 in the X direction. That is, the 0 D contention table 126 and the vertical direction pushing means 丨 32 are omitted. Further, the position adjusting means 136 is a member of a type that is movable and engaged between the lower plate 136d fixed to the lower side and the upper plate 136u fixed to the upper side. Referring to Fig. 6(a), the inclination angle adjusting means 130 and the position adjusting means 136 are free within a predetermined range. That is, the wiping unit 丨2〇 is inclined to the X direction to some extent before fitting with the slit nozzle 20, and the position adjusting means 136 is also moved in the inclined direction. Referring next to Fig. 6(b), the slit nozzle 20 is lowered to the lower direction (-0 direction) to be in contact with the cleaning member 2A of the wiping unit 12A, and the wiping unit 101 is touched by the #单编号1 1 1013176365-0 17 pages / a total of 40 pages 201243402 120 up. More specifically, the position adjustment means 136 starts moving in the direction of the arrow 280, and the inclination angle adjustment means 130 starts to rotate in the direction of the arrow 281. Finally, referring to FIG. 6(c), the slit nozzle 20 is lowered to a predetermined position, and the position adjusting means 136 is stopped at the position of the V-shaped groove of the cleaning member 200 that fits the lip slopes 34A, 34B of the slit nozzle 20. The tilt angle adjustment means 130 also stops rotating. Further, in practice, the zero platform 126 can also be rotated by a predetermined angle, so that even the offset in the Y direction can be absorbed in a predetermined range. As described above, since the wiping unit 120 has the auto-aligning function in which the tilt angle adjusting means 130 and the position adjusting means 136 and the 0-platform 126 are freely locked in a predetermined range, even if the positional relationship between the slitting nozzle 20 and the wiping unit 120 is obtained The cleaning member 200 of the wiping unit 120 can be surely fitted to the slit nozzle 20 with a slight offset. The wiping unit 120 is constituted by the above elements. Next, a cleaning method using the cleaning means 100 including the wiping unit 120 will be described with reference to Figs. 1 and 7 . Fig. 7 is a side view showing the state in which the wiping unit 120 cleans the slit nozzle 20 in the X direction. The cleaning unit 252 mounted on the cleaning unit 251 and 252 of the wiping unit 120 is disposed at the first support member setting position on the (9-axis). Further, the cleaning unit 25 2 and the 0 platform 126 are sandwiched. There is a spacer 32. Because of the arrangement of the cleaning unit, it is intended that the rear cleaning unit 252 and the slit nozzle 20 are in a good contact state by the automatic alignment function. First, the cleaning means 100 is placed in the initial direction in the X direction. Position (the right end of the base 2 of Fig. 1). At this time, the wiping unit 120 is located at the cleaning start position in the Y direction (Fig. 7(a)). If the cleaning is started, the cleaning means 100 is all 10110139# single number A〇 101 Page 18 of 40 i0iciiY63t) t)-u 201243402 The body moves in the X direction so as to come directly under the position of the discharge port 36 and the lip slopes 34A, 34B that are engaged with the slit nozzle 20 (Fig. 7(a)). When the cleaning member 20 comes directly below the distal end portion of the slit nozzle 20 and slightly leaves the cleaning start position of the discharge port 30 in the Y direction, the discharge liquid 30 of the slit nozzle 20 is discharged by a predetermined amount. The discharged coating liquid adheres to the discharge port surface 36 and/or the lip slopes 34A and 34B of the slit nozzle 20 to form an applied coating liquid 150 (Fig. 7(b)). Next, the slit nozzle 20 is lowered and fitted, that is, contacted with the cleaning member 200 (Fig. 7(c)). At this time, the slitting nozzle 20 is surely fitted to the cleaning member 200 by the automatic aligning function 〇 as described above. 5〜5毫米的优选优选为1~3毫米的位置。 At this time, the slit nozzle 20 is lowered until the vertical direction of the pressing means 132 is preferably 0. 5~5mm, more preferably l~3mm position. When the vertical direction pushing means 132 is contracted in this range, the cleaning member 200 can easily follow the positional fluctuation of the tip end portion of the slit nozzle 20 in the vertical direction. Then, the driving unit 108 is driven to move in the direction of the arrow (Y direction) while the cleaning member 200 is in contact with the discharge surface 36 of the slit nozzle 20 and the lip inclined surfaces 34A and 34B, and is removed and cleaned separately. The discharge liquid surface 36 of the nozzle 20 and the coating liquid 150 of the lip slopes 34A and 34B are attached to other deposits (Fig. 7(d)). Here, the direction of the arrow becomes the cleaning member 200 - which is moved while being in contact with the slit nozzle 20, that is, the sliding direction of the sliding, which coincides with the longitudinal direction of the Y direction or the slit nozzle 20. In addition, the removed coating liquid and other fluid become the coating liquid 152 which flows out along the induction surface 128i of the cleaning member 200 or the support member 128, and the front inclined surface 128f, and falls to the tray 110, and is recovered, and the cleaning member 200 continues. Moving in the Y direction, at the position of the longitudinal end passing through the slit nozzle 20 10110139# single number fiber 01 19th/40 pages 1013176365-0 201243402, that is, the position not interfering with the longitudinal end of the slit nozzle 20 stop. Then, the entire wiping unit 120 is moved to the initial position in the X direction, and the cleaning member 200 is stopped immediately below the cleaning unit 140. In this state, the solvent supplied through the pipe 144 is ejected from the solvent nozzle 142, and the cleaning member 200 is cleaned (Fig. 7(e)). When the cleaning is completed, the cleaning member 200 is returned to the cleaning start position in the Y direction, and then the same cleaning method is repeated each time. The above is an outline of the cleaning method, and the cleaning method in the present invention will be described in more detail with reference to Fig. 8 . Fig. 8 is an enlarged view of the contact state of the slit nozzle 20 with the cleaning member 200 of the wiping unit 120 of the present invention as seen from the X direction. Referring to Fig. 8(a), a case where two cleaning units 251 and 252 are used will be described. The cleaning unit 251 in front of the wiping direction (Y direction) and the cleaning unit 252 on the rear side are mounted with the defect-free cleaning member 200a shown in Fig. 4(a). Further, the rear cleaning unit 252 sandwiches the spacer 300 of a predetermined thickness between the 0 and the platform 126. Further, the rear cleaning unit 252 is disposed on the rotation shaft 126 of the 6> platform 126. That is, the position is set using the first support member. When the slit nozzle 20 is brought into contact with the wiping unit 120 in this state, and the press-fitting is performed, the rear cleaning unit 252 comes into contact with the slit nozzle 20. However, since the front cleaning unit 251 has only a low portion of the spacer 300, it does not abut against the slit nozzle 20. Referring to Fig. 8 (a-1), a gap 302 exists between the slit nozzle 20 and the cleaning member 200b. On the other hand, referring to Fig. 8 (a-2), there is no gap between the slit nozzle 20 and the cleaning member 200a, and it is in a state of being surely wiped. That is, by making the non-contact uncovered cleaning member 200a, the adhering matter attached to the slit nozzle 20 is scraped off in advance, and the rear cleaning structure is 10110139#单号A〇101 page 20/40 pages 1013176365- 0 201243402 Cleaning method for 200a rubbing. This cleaning method is an effective wiping method for a case where a slotted nozzle is moved and a wiping stripe is easily generated. Further, in this case, if the notch cleaning member 2〇〇b is used, it is possible to prevent the deposited or wiped deposit from accumulating in the bottom of the V-shaped groove (206 of Fig. 4(b)), so that the attachment can be avoided. Then attached to the slit nozzle 2〇. In particular, when a lot of deposits remain in the discharge nozzle 3 of the slit nozzle 20 (see Fig. 2) due to the properties of the coating liquid to be used, it is preferable to use the notched cleaning member 200b. Thus, when the height of the plurality of cleaning units 25A is changed and wiping is performed, the coating apparatus 1 having the wiping unit 120 of the present invention can be relatively easily adjusted. If it is desired to adjust the directionality of the two cleaning units 250 that are independent of the slider 106, the one must always maintain the difference with the height of the other side. Thus, it is difficult to maintain the tracking property of the entire cleaning member. relationship. The coating device 1 having the wiping unit 12A of the present invention is very effective at this point. Reference is next made to Fig. 8(b). In this case, two cleaning units 251 252 252 are also used. Two cleaning members that are unnotched as in Fig. 7(a) 2〇〇a ° 'The arrangement of the 252, 252 is 0. The rotation axis I26 0 of the 0 platform 126 is located at the rear cleaning unit 251 and the rear. The first support member of the cleaning unit 252 is set to a position. Moreover, in any cleaning unit, there is no missing piece. That is, the front cleaning member and the rear cleaning member are located at the same height from the platform 126. When the abutting nozzle 20 is abutted and pressed into the distal end of the slit nozzle 20 in this state, the subsequent sweeping members are respectively brought into contact with the distal end of the slit nozzle 20 (refer to ',,,, Fig. 8 (b) , (b_2)). If the wiping unit 12 is limped 1013176365-0^ in this state, the second wiping of the cleaning member can be performed. This is a valid method for the slot nozzle of 1011013# single number A0101, page 21 of the hard alloy, 201243402. Even in the case where a plurality of cleaning members 2 are uniformly used, the coating device 1 having the wiping unit 120 of the present invention can relatively easily bring the cleaning member into contact with the slit nozzle 20. Referring next to Figure 8 (c). In this case, the case where one cleaning unit 250 is mounted on the 0 platform i 2 6 is the same as the method performed in the related art. In this case, the cleaning unit 250 is disposed directly above the rotating shaft 1260 of the 0 stage 126, and is in contact with the slit nozzle 2A as in the case of Fig. 8(a), so that wiping is possible. Next, the coating method by the cleaning member and the cleaning method according to the use of the coating device 1 will be described in detail. First, when the Zer〇 return of each of the operating units of the coating device 1 is performed, each of the operating units moves to the standby position ^ "plus" p〇siti〇n). That is, the platform 6 is moved to the left end of the figure (the position indicated by the broken line). The slit nozzle 20 is moved to the origin position of the top, and the wiping unit 12 is rotated from the initial position (the right end of the base 2) Move 'to allow the tray 11 to come to the lower position of the slit nozzle 20. At this time, the cleaning member 2qq is located directly below the discharge port 30 of the slit nozzle 2G in the X direction, and is located in the γ direction of the slit nozzle 20 in the longitudinal direction, as shown in Fig. 7(a). The cleaning start position of the outlet 30. Here, from the groove 64 to the slit nozzle 20, the coating liquid 66 has been filled, and the operation of discharging the residual air inside the slit nozzle 2Q has been completed. The state of the coating liquid supply device 4G at this time is that the coating liquid 66 is filled in the syringe 52, the suction 阙 44 is closed, the supply valve 42 is opened, and then the piston 54 is at the lowermost position, and the coating is always applied to the coating (10). The state of the nozzle 2〇. Page 22 of 40 i〇] 10139# Single No. A0101 10Ϊ3176365-0 201243402 Initially, an ejector pin (Hft pin) (not shown) is raised to the surface of the platform ^, and the substrate A is loaded by a loader (not shown) ( 1〇ader) is carried to the upper part of the ejector pin. Next, the ejector pin is lowered and the substrate A is carried to the top surface of the stage 6 while being adsorbed and held. At the same time, the coating liquid supply device 40 is operated, and a predetermined (excess) amount of the coating liquid 66 is supplied to the slit nozzle by the syringe pump 5, and the coating liquid is discharged from the slit nozzle 20 toward the tray 11 6 6. At this time, since the cleaning member 200 is not located immediately below the discharge port 3〇 in the γ direction, the coating liquid 66 discharged from the discharge port 30 of the slit nozzle 2G does not fall. After the supply of the coating liquid 66 is stopped, the slit nozzle 2 is lowered, and the cleaning member 200 is brought into contact with the discharge port surface 36 and the lip slopes 34A and 34B of the slit nozzle 20, and then the cleaning member 200 is slid to the end point in the γ direction. The position 'cleans in the Y direction is the discharge port surface 36 and the lip slopes 34A and 34B which are adjacent to the discharge port of the slit nozzle 2A. Ο 1011013#^ By this cleaning, the initialization of the inner passage of the slit nozzle 2 is completely filled until the discharge port 30 is completed by the coating liquid 66. After the cleaning is completed, the slit nozzle 2 is raised to the original position, and the wiping unit 12 is moved in the X direction and returned to the initial position i (the right end of the base 2). When the solvent is ejected by the lance nozzle 142 to the cleaning member 2 that is stopped immediately below the cleaning unit 14A, and the cleaning member 2 is subjected to solvent cleaning, the cleaning member 2 is moved in the sliding direction. In the opposite direction, the cleaning member 200 is returned to the cleaning start position in the γ direction. Month After confirming that the wiping unit 120 has moved to the initial position, the movement of the stage 6 carrying the substrate A is started. At this time, the nozzle 2Q is located at the origin position above the position at which the coating is performed in the vertical direction, and the injection pump 50 is stopped and stands by. Then, when the substrate a passes through the thickness sensor 9 and the 0101 page 23 / 40 pages ^ 13176365-0 201243402, the thickness of the substrate is increased, and if the coating start portion of the substrate 8 reaches the discharge port of the slit nozzle 20 Just below the 3 〇, the platform 6 is stopped. At this time, using the measured thickness data of the substrate A, the upper and lower lifting unit 70 is driven to lower and stop the slit 対2GT so that the (four)', that is, the clearance between the discharge surface 36 of the riding object and the substrate A becomes Pre-prerequisite ^ value. In a state where the slit nozzle 2 is completely stopped and the stage 6 is completely stopped, the piston 54 of the jet pump 50 is raised at a constant speed, and the coating liquid 66 is discharged by the riding nozzle 2 (). After the bead B is formed between the slit nozzle 2Q and the substrate A, the moving platform 6 is started at a constant speed, and the coating liquid is applied to the substrate A in the sense direction to form a coating film. Then, when the position immediately before the application end position of the substrate A is immediately below the discharge σ3 () of the slit nozzle 20, the flow of the coating liquid 66 is stopped and the supply of the coating liquid 66 is stopped, and then the substrate 四 (4) cloth is finished. When the position comes directly below the discharge σ3() of the slit nozzle 20, the vertical lift unit 7 is driven to raise the slit nozzle 20. As a result, the liquid bead formed between the substrate slit nozzles 20 is cut off, and the coating is completed. The end position of the stone is stopped, the adsorption of the substrate Α is solved, and the ejector lock is raised to lift the substrate. At this time, the unloader (not shown) holds the bottom surface of the substrate , and transports the substrate 八 to the next process. If the substrate A is delivered to the unloader, the platform 6 lowers the ejector lock back to the origin position. After the platform 6 returns to the original position, the wiping unit 12G is moved so that the lower position of the discharge port 30 of the tray 1_to_nozzle 20. Single number Α0101 Page 24/total 4 pages After the movement is finished, the suction is made The system 44 is open, so that the supply valve 42 is off, so that the piston is lowered, and the piston 66 is filled (4). After the filling is completed, the piston 54 is stopped, so that "(4) is off, and the supply valve mm is sufficient λ - A ^ 1013176365-0 201243402 42 is open, waiting for the arrival of the next substrate A, repeating the same action. Further, the coating liquid applicable to the present invention is based on viscosity b lmpas, more preferably 1 to 50 mPas, based on The coating property is preferably Newtonian fluid, but can also be applied to a thixotropy coating liquid, especially in a coating solvent, such as PGMEA (Propylene Glycol Monomethyl Ether Acetate: Propylene Glycol A). Ether acetate), acetic acid It is effective when a coating liquid such as butyl acetate or ethyl lactate is used. Specific examples of applicable coating liquids include the black matrix for the above-mentioned color filter, In addition to the coating liquid for forming an RGB color pixel, there may be a photoresist liquid, a flattening material, a pillar forming material, etc. The coated member of the substrate may be a metal plate such as aluminum or a ceramic plate in addition to glass. Sil wafer (silic〇n wafer), etc. Further, coating conditions such as application speed, coating speed is 10 mm/s 600 mm/s, more preferably i〇〇fflm/s~3〇〇ram /s, the sliding speed of the cleaning structure 200 is preferably 1 〇〇 to 1 〇〇〇 mm/s, more preferably 200 to 60 〇 mm/s, and the lip gap of the slit nozzle is 5 〇 i 〇〇 (^m, more preferably ''Μ' (4) The thickness is 50 (four), more preferably 2 to 20 / ζιη in the wet state. [0006] [Industrial Applicability] The present invention is not only suitable for use in manufacturing In addition to the coating device used for the material filter or the like, it can also be used for forming on a substrate such as an array substrate, a plasma display panel, or a filter. Manufacture of various display members for high-quality coating films. Page 25 of 40 10110139# Single No. A0101 1013176365-0 201243402 [Simplified Schematic] [000Ή Figure 1 shows the coating of the present invention. Fig. 2 is a perspective view of a slit nozzle. Fig. 3 is a view showing the configuration of a wiping unit of the present invention. 4(a), (b), and (c) are enlarged views of the cleaning member. 5(a), (b) and (c) are diagrams for explaining the vertical direction pushing means. Figures 6 (a), (b), and (c) are diagrams illustrating the auto-alignment function. 7(a), (b), (c), (d), and (e) are views for explaining the operation of the wiping unit. Figures 8(a), (b), (c), (a-Ι), (b-Ι), (c-Ι), (a-2), (b-2) are instructions for wiping using a wiping unit Diagram of the method. [Main component symbol description] [0008] 1 : Coating device 2: Abutment 4: Guide 6: Platform 10: Pillar 20: Slot nozzle (applicator) 22: Front lip 24: Rear lip 2 6 : Dissimilarity Tube 28: slit 30: discharge port 32: gasket 34A, 34B: lip slope 36: discharge port surface 1〇11013# single number calendar page 26/total 4 page 1013176365-0 201243402 40: coating liquid supply Device 42: Supply valve 44: Suction valve 4 6 : Filter 50: Syringe pump 52: Syringe 54: Piston 56: Body 60: Supply tube 62: Suction tube 64: Tank 66: Coating liquid 68: Source of compressed air 70: Up and down lifting unit 72: motor 74: guide 76: ball screw 78: lifting table 80: suspension holding table 90: thickness sensor 92: support table 94: control device 96: operating panel 1: wiping unit 102: Pallet 104: bracket 10110139# single number deletion 1 page 27 / total 40 pages 1013176365-0 201243402 106: slider 1 08: drive unit 110: tray 120: wiping unit 122: pedestal 124: adjustment unit 126: 0 platform 126a : 0 top surface 126c, 128c of the platform: height adjustment surface 126 0 : rotation axis 128: support member 128a: mounting surface 128b of the support member: bottom surface 128f of the support member: front bevel of the support member 128i: induction surface 129 of support member: pressure plate 130: inclination angle adjustment means 130d, 130ικ bracket 130p: support pin 132: vertical direction pushing means 132b: substrate 132e: elastic body 132u: pressing surface 136: position adjustment means 140: Cleaning unit 142: solvent nozzle 10110139# single number A 〇 101 1013176365-0 page 28 / total 40 pages 201243402 1 4 4 : piping 150: attached coating liquid 152: flowing coating liquid 154: coated coating Liquid 200, 200a, 200b: cleaning members 202, 402: bottom surface 204: V-shaped groove 204w: groove width 206: groove bottom 208: notch 210: rear surface 250, 251, 252: cleaning unit 300: spacer 302: gap A : substrate (coated member) B: liquid bead C: coating film Ds : sliding direction 1011013 #^ A〇101 Page 29 of 40 page 1013176365-0

Claims (1)

201243402 七、申請專利範圍: 1 . 一種塗佈裝置,包含: 供給塗佈液之塗佈液供給手段; 連通於該塗佈液供給手段,具有用以吐出該塗佈液 之開縫狀的吐出口之塗佈器; 相對地使該塗佈器與被塗佈構件移動之移動手段; 以及 移動於沿著該吐出口的開縫方向的擦拭方向,一邊 滑動接觸該塗佈器的吐出口周邊部,一邊除去附著物之清 掃手段,其特徵為: 該清掃手段包含: 被支撐於支撐構件上之具有清掃構件之清掃單元; 可將該清掃單元承載複數個於該擦拭方向之0平台 :以及 包含支撐該0平台的台座之擦拭單元, 在該清掃單元的該支撐構件與該0平台形成有用 以夾持高度調節構件的高度調節面。 2 .如申請專利範圍第1項之塗佈裝置,其中配置有將該0平 台推迫於垂直於該台座的方向的垂直方向推迫手段。 3.如申請專利範圍第1項或第2項之塗佈裝置,其中該0平台 具有垂直於頂面的旋轉轴, 該0平台包含: 在與該擦拭方向成直角的方向可調節位置之位置調 整手段;以及 調整對該擦拭方向的傾斜角度之傾斜角調整手段。 單編號A_ 第30頁/共40頁 1013176365-0 201243402 4 .如申請專利範圍第1項至第3項中任一項之塗佈裝置,其中 該0平台包含: 該旋轉軸配置於該擦拭方向的最末尾的該清掃單元 的正下方之第一支撐構件設定位置;以及 該旋轉軸配置於該擦拭方向的最末尾的該清掃單元 與該最末尾的該清掃單元的跟前的清掃單元之間之第二支 撐構件設定位置。 5.如申請專利範圍第4項之塗佈裝置,其中在該0平台,兩 個該清掃單元被搭載於該第一支撐構件設定位置,在該擦 Γ) 拭方向的後方的該支撐構件的高度調節面與該0平台的高 度調節面之間夾持有高度調節構件, 在該擦拭方向中’在該後方的支撐構件的rfj度位置 比前方的該支撐構件高出距該0平台的頂面的高度位置之 位置被支撐,被該擦拭方向的前方的該支撐構件支撐的清 掃構件不接觸該吐出口。 6 . —種塗佈方法,是藉由具有開縫上的吐出口的塗佈器將塗 佈液塗佈於被塗佈構件上之方法,包含: 〇 將過剩的該塗佈液送入該塗佈器中並釋放該塗佈器 中的空氣之程序; 除去該吐出口的周邊的附著物之程序;以及 由該塗佈器將塗佈液塗佈於該被塗佈構件上之程序 y 除去該附著物的程序是由如下的程序構成: 藉由不接觸該吐出口的刮除構件刮除該附著物的一 部分之程序;以及 藉由接觸該吐出口的擦拭構件擦拭該附著物之程序 1011013#單織 A〇101 第31頁/共40頁 1013176365-0 201243402 1〇li〇139#單編號 A0101 第32頁/共40頁 1013176365-0201243402 VII. Patent application scope: 1. A coating device comprising: a coating liquid supply means for supplying a coating liquid; and a coating liquid supply means connected to the discharge liquid for discharging the coating liquid An applicator for exporting; a moving means for relatively moving the applicator and the member to be coated; and a moving direction of the wiping direction along the slit direction of the discharge port, and slidingly contacting the periphery of the discharge port of the applicator The cleaning means for removing the deposits, wherein the cleaning means comprises: a cleaning unit having a cleaning member supported on the support member; the cleaning unit can carry a plurality of platforms in the wiping direction: A wiping unit including a pedestal supporting the 0 platform, and the support member of the cleaning unit and the 0 platform form a height adjusting surface for clamping the height adjusting member. A coating apparatus according to claim 1, wherein a vertical direction pushing means for pushing the 0 platform in a direction perpendicular to the pedestal is disposed. 3. The coating device of claim 1 or 2, wherein the 0 platform has a rotation axis perpendicular to the top surface, the 0 platform comprising: an adjustable position at a right angle to the wiping direction The adjusting means; and the tilt angle adjusting means for adjusting the tilt angle of the wiping direction. The coating device according to any one of the items 1 to 3, wherein the 0 platform comprises: the rotating shaft is disposed in the wiping direction. a first support member setting position directly below the cleaning unit at the end; and the rotating shaft is disposed between the cleaning unit at the end of the wiping direction and the cleaning unit of the cleaning unit at the end of the cleaning unit The second support member sets the position. 5. The coating device of claim 4, wherein in the 0 platform, two of the cleaning units are mounted at the first support member setting position, and the support member is rearward of the wiping/wiping direction A height adjustment member is sandwiched between the height adjustment surface and the height adjustment surface of the 0 platform, and in the wiping direction, the rfj degree position of the support member at the rear is higher than the front support member from the top of the 0 platform. The position of the height position of the face is supported, and the cleaning member supported by the support member in front of the wiping direction does not contact the discharge port. 6. A coating method for applying a coating liquid onto a member to be coated by an applicator having a discharge port on a slit, comprising: feeding the excess coating liquid into the coating solution a procedure for releasing the air in the applicator in the applicator; a procedure for removing the deposits around the spout; and a procedure for applying the coating liquid to the coated member by the applicator The procedure for removing the deposit is constituted by a procedure of scraping off a part of the deposit by a scraping member that does not contact the discharge port; and a procedure of wiping the deposit by a wiping member that contacts the discharge port 1011013#单织A〇101 Page 31 of 40 Page 1013176365-0 201243402 1〇li〇139#单号A0101 Page 32 of 40 1013176365-0
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Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014176812A (en) * 2013-03-15 2014-09-25 Dainippon Screen Mfg Co Ltd Nozzle cleaning device, applying device, nozzle cleaning method, and applying method
CN103286090B (en) * 2013-05-09 2016-01-13 深圳市华星光电技术有限公司 Clean device and the Photoresisting coating machines of erasing rubber in light blockage coating processing procedure
TWM477382U (en) * 2013-12-11 2014-05-01 三緯國際立體列印科技股份有限公司 Cleaning device
JP6251062B2 (en) * 2014-01-30 2017-12-20 タツモ株式会社 Slit nozzle cleaning device and workpiece coating device
JP6426491B2 (en) * 2015-02-13 2018-11-21 中外炉工業株式会社 Coating apparatus and coating method
JP6697324B2 (en) * 2016-05-26 2020-05-20 株式会社Screenホールディングス Nozzle cleaning device, coating device and nozzle cleaning method
JP6824673B2 (en) * 2016-09-13 2021-02-03 株式会社Screenホールディングス Nozzle cleaning member, nozzle cleaning device, coating device
KR101877515B1 (en) * 2016-10-05 2018-07-11 한국기계연구원 Slot die system and a slot die control system using the same
CN206425274U (en) * 2017-01-05 2017-08-22 惠科股份有限公司 A kind of cleaning device of nozzle
JP6337184B2 (en) * 2017-06-22 2018-06-06 株式会社Screenホールディングス NOZZLE CLEANING DEVICE, COATING DEVICE, NOZZLE CLEANING METHOD, AND COATING METHOD
CN110124952B (en) * 2018-02-02 2024-02-13 深圳市曼恩斯特科技股份有限公司 Sliding table, coating machine and gluing method
CN108427223B (en) * 2018-03-23 2020-11-13 京东方科技集团股份有限公司 Color film substrate, display panel and display method thereof
CN108672214A (en) * 2018-07-25 2018-10-19 朱浩东 Optical cement coating apparatus
CN108816660A (en) * 2018-08-04 2018-11-16 伍先春 Optics gum coating apparatus
JP7111565B2 (en) * 2018-09-06 2022-08-02 株式会社Screenホールディングス SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
JP7094635B2 (en) * 2018-11-28 2022-07-04 東レエンジニアリング株式会社 Cleaning device
JP6904583B2 (en) * 2018-12-18 2021-07-21 株式会社飯沼ゲージ製作所 Slit coater
JP7344533B2 (en) * 2019-05-14 2023-09-14 Aiメカテック株式会社 Coating equipment and coating method
JP7312204B2 (en) * 2021-02-22 2023-07-20 株式会社Screenホールディングス NOZZLE CLEANING DEVICE, NOZZLE CLEANING METHOD, AND COATING DEVICE
JP7279096B2 (en) * 2021-02-26 2023-05-22 株式会社Screenホールディングス NOZZLE CLEANING DEVICE, NOZZLE CLEANING METHOD, AND COATING DEVICE
CN113070184B (en) * 2021-06-07 2021-09-07 成都拓米电子装备制造有限公司 Cleaning device and cleaning method for slit extrusion coating head
CN113649225B (en) * 2021-09-07 2022-10-04 深圳市曼恩斯特科技股份有限公司 Coating die head and coating equipment
CN114394391A (en) * 2021-12-06 2022-04-26 昆山可腾电子有限公司 Automatic UV optical equipment of crossing of carrier

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2982092B2 (en) 1991-08-29 1999-11-22 富士写真フイルム株式会社 Coater edge cleaning method and cleaning device
JP3306838B2 (en) * 1993-12-14 2002-07-24 東レ株式会社 CLEANING METHOD FOR CURTAIN FLOW COATER AND METHOD FOR PRODUCING COATING FILM FOR COLOR FILTER
JPH09187710A (en) * 1996-01-09 1997-07-22 Toray Ind Inc Coating apparatus and coating method and apparatus and method for manufacturing color filter
JP3757992B2 (en) * 1996-01-18 2006-03-22 東レ株式会社 Coating apparatus and coating method, and color filter manufacturing method and manufacturing apparatus
JPH09189910A (en) * 1996-10-28 1997-07-22 Seiko Epson Corp Color display device
JPH10216598A (en) 1997-02-04 1998-08-18 Toray Ind Inc Method and device for coating and method and device for manufacture of color filter
JPH11300261A (en) * 1998-04-22 1999-11-02 Toray Ind Inc Apparatus for cleaning die for coating, method for coating using the same, and apparatus of and method for preparing color filter
JP2002177848A (en) * 2000-12-15 2002-06-25 Toray Ind Inc Apparatus and method for cleaning coating die, and apparatus and method for manufacturing color filter using them
JP3966261B2 (en) * 2003-09-26 2007-08-29 ブラザー工業株式会社 Inkjet printer
JP4489480B2 (en) * 2004-03-25 2010-06-23 東京応化工業株式会社 Slit nozzle cleaning device
JP5127127B2 (en) * 2005-09-15 2013-01-23 東京応化工業株式会社 Coating method
JP4787040B2 (en) * 2006-03-17 2011-10-05 株式会社リコー Coating film forming device

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