201238710 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種 作件之貼附方法以及工作 件貼附裝置，為了將貼斛古 ^ 、寸有工作件之板盤搬入於研磨 裝置進行研磨’而將工作杜 1乍件貼附於該板盤者。 【先前技術】 於進行如晶圓等工作彼+ u Λ 乍件之片面研磨之場合，將工 作件貼附於板盤，使工作彳生 乍件之研磨面向定盤的研磨布 側，將板盤搬入研磨梦罟^ & w谐装置的定盤上，回轉定盤，並供 應研磨液，以研磨工作件的研磨面。 此時貼附工作件於板盤，專利文獻1等提供以下 之方法。 首先，將内藏有加熱器之加熱桌加熱至所需溫 度’搬入板盤於此加熱桌上而加熱。 其次，塗佈臘於該板盤上之工作件貼附位置。並 將工作件載置於受板盤之熱而熔融之臘上。 其次，在鄰設於加熱桌而具有冷卻機構之押壓桌 上’搬入該載有臘上工作件於板盤。 降下以可上下自由動作方式設於押壓桌上方的 押壓碩，並將工作件在押壓於板盤上之押壓桌與押壓 碩之間’使臘展延，同時供應冷卻水於押壓桌的冷卻 機構’以冷卻板盤及臘，使臘硬化而貼附工作件於板 盤上。 4 201238710 〔先行技術文獻〕：. 專利文獻1 :特開平第5一82493號公報 【發明内容】 在專利文獻1所示之方法中，當搬入加熱桌上被 加熱之板盤於押壓桌上之際，板盤熱被押壓桌所奪 取，於以押屢頭押壓之際，板盤温度降至所定溫度。 而且當押壓頭牴接於卫作件之瞬間，也會被押壓頭奪 取熱量。再者’此狀態下，因有冷卻水供應於押壓桌， 引起臘溫降下’將發生臘之展伸前先硬化的問題：為 此f能保賴厚度之均勾，工作件無法平坦的貼附，， 不此得到所要求之研磨精度。 為了解決上述課題，本發明之目 :::貼附方法及工作件貼附裝置，其能防止職:: 王展伸之前硬化，而得以高精度貼附。 為了達成上揭目的，本發明具有如下 發明之工作件貼附方法，使用具備加 押壓桌’及配設於該押壓桌上方，而； 署 桌自由接近與遠離之押壓頭的工作件貼附裝 丄俾在板盤上貼附工作件之卫作件貼时法。其過 ::含有將預先加熱至所需溫度之板盤搬入於該押 =，或將板盤鞍入該押壓桌上，而在該桌上加執 :需溫度之過程;將臘塗佈於加熱至所需溫度之該 上的所要位置之過程；载置工作件於被加熱而^ 5 201238710 融的臘上之過程；將該押壓頭加熱至所需溫度之過 程；使該押壓頭相對接近於該押壓桌，以經加埶之爷 押壓頭與該板盤，將該工作件押壓至所需時間之過 程，在以該押麗頭押壓工作件之狀態下，以該冷卻機 構冷卻該押壓桌及該板盤，使該臘硬化而貼附工作件 於該板盤上之過程；及使該押壓頭相對於該押壓桌遠 離，而從該押壓桌上搬出貼附有工作件的該板盤之過 程’為其特徵。 於以該押壓頭押壓I作件，而貼附工作件於該板 之輕中，最好檢出該押壓頭溫度，確認該溫度 下，所定溫度以下後，解除押壓頭的押壓。 藉由與該押壓桌另外砖罢工B + . ^ 力卜°又置而具有加熱器的加埶 桌’預先加熱該板盤後搬入於該押壓桌亦可。 使s亥押壓頭接觸於該押壓卓 亦可。 幵湮杲而加熱至所需溫度 或以内藏有該押摩頭之力也„„ 亦可。 頌之加熱态，加熱至所需溫度 以形成氮化物半導體層的藍 ^ @ , ^ 日幻監虞石基板，將氮化物 +導體層向板盤側安適的貼附於板盤亦可。 又，本發明的工作件貼.附裝置 配設於該押壓桌上方，：Μ桌’及 遠離的押愿頭，藉由今押· 1堅桌自由接近與 杯般w 亥押屋桌與押Μ頭的押麗’經由 板盤上的臘貼附工作件的 、！由 桌具備加熱器與冷卻機構雙方、〜押壓 再雙方，加熱於該押壓桌與該 201238710 押壓頭，夾著塗佈於板盤上的臘押壓工作件使臘展 延’然後以該冷卻機構冷卻該押壓桌及該板盤，由是 使臘硬化，而貼附工作件於該板盤上，為其特徵。 最好設置用以檢出該押壓頭溫度的溫度檢出 部，於冷卻該押壓桌而使臘硬化之際，藉由該溫度檢 出部檢出該押壓頭之溫度，確認該溫度降下至所定溫 度以下後’解除押壓頭之押壓。 最好藉由該溫度檢出部檢出接近該押壓頭押壓 該工作件之面部位的溫度。 使該押壓頭接觸於該押壓桌，而加熱至所需溫 亦可。 於該押壓頭中設置加熱器及冷卻機構雙者，以其 本身之加熱器及冷卻機構加熱或冷卻押壓頭亦可。 藉由與該押壓桌另外設置而具有加熱器的加熱 ”，以該加熱桌預先加熱該板盤後搬入於該押壓桌亦 般f好於該㈣桌_，配置料卻機餘搬入該板 碰之表面側位置。 的、4'=檢出搬入於該加熱桌上之該板盤溫度 卓:卜設置用以分別檢出該㈣桌及該加熱 杲，皿度的溫度檢出部亦可。 〔發明之效果〕 依照本發明，可以高精度貼附工作件於板盤。 7 it 201238710 【實施方式】 下文中參照附圖來詳細說明本發明之較佳實施 形態。 第1圖為工作件貼附裝置10之正面圖，第2圖 為押£桌18的斷面說明圖’第3圖為板盤的平面 圖。 第1圖中，12為具有加熱桌14的第一壇，16a、 16b為口又於第一壇12相鄰處且具有押壓桌的第二 壇。 加熱桌14内藏有第一加熱器（未圖示），在基台 2〇上藉由支持部材21水平固定。在加熱桌14上搬 入貼附工作件23用的板盤22。 24為定位用圓筒，配置於加熱桌14下方，且具 有連結於桿子之三支位置定位銷25(第！圖中僅圖示 2支)。定位銷25以上下方向插通設於加熱桌14的貫 L孔26後可伸出伸入加熱桌14上表面。板盤22 對應於定位銷25設有3個透孔27。 本實施形態中板盤22以人手搬入加熱桌14上。 此時載置定位銷25,使其可進入透孔27内二因而得 以定位於加熱桌14±。在板盤22上附有標示工作件 23之貼附位置。於本實施形態中，如第8圖所示， *所載置卫作件23外周緣之外側，設有周溝23a， 做為記號。載置卫作件23，使其能收納於此周溝23a 内，則可配置工作件23於板盤22上所需位置。又， 8 201238710 周溝23a於貼附工作件23之際，可當做容納多餘溢 出之臘流入。 加熱桌14設有溫度檢出部（未圖示），用以檢出 為第一加熱器所加熱之加熱桌14的溫度。藉由控制 部45,控制第一加熱器之開、閉，使溫度檢出部所 檢出之溫度落於所定設定溫度範圍内。 又，在加熱桌上方，配置有紅外線溫度感測 器（溫度檢出部）28，用以檢出載置於加熱桌14上之 板盤22表面溫度。 第二壇16a、16b的押壓桌18，亦藉由支持部材 3〇,分別水平支持於基台20上。如第2圖所示，押 壓桌18具有第二加熱器31及供應冷卻水之冷卻機構 32。將押壓桌18中流動冷卻水的被套32a，此第二 加熱器31設於更鄰近押壓桌μ表面側之位置，可使 搬入押壓桌18上板盤22之冷卻更加迅速，如此較為 妥當。 第1圖中表示冷卻機構32中冷卻水的回路，36 為貯留經調整溫度後之供應冷卻水槽（未圖示）連接 口，37為冷卻水，38為歸路，冷卻水經押壓桌18之 破套32a内通過後由排出口 39排出。又，4〇為淺閘， 該於未圖示之閥，以排出回路中冷卻水。 與第一壇12同樣。第二壇i6a、16t>亦設有定位 用圓筒24。有具三支定位銷25之定位機構，以進行 由加熱桌14搬入之板凳22的定位。 201238710 又，押壓桌18亦設有溫度檢出部（未圖示），用 以檢出經第二加熱器31所加熱之押壓桌18溫度。藉 由f制部45控制第二加熱器31之開、閉，使經此溫 度檢出器檢出之溫度，在所設定溫度範溫度範圍内。 在押壓桌18上方。設有押壓頭42,對押壓桌18, 可自由上下移動（接近移離）。押壓頭42，在第二壇 16a側設有3個，而在第二壇16b側設有5個（第^ 圖中只圖示3個）。亦即在第二壇恤側，可貼附較 大工作件23 ’每一板盤22貼附3張工作件23，另一 方面，於第二壇16b侧，則貼附較小工作件U，每 板盤22貼附5張工作件23。 各押壓頭42’可藉由分別支持於基纟2〇之圓筒 (驅動部）44上下移動。 汾体：押壓：42在加熱桌14上加熱，並在所需位置 丄佈職’而載置工作件23於兮_ 18上之搞们9 / 亥臘上，將搬入押麗桌 之板盤22上之工作件23,押屢於押遷桌18間。 檢出頭42設有由熱電偶46所形成的溫度 壓=禺46之先端可達於押壓頭42下部，以 之:度部側(近接於工作件押4面之部 述 本實施形態中之 工作件貼附裝置 1 〇之構成如上 同時說明本實施 接著說明貼附裝置10之動作 形態令之工作件貼附方法。 201238710 在第一壇12中通電於第一加熱器，以加熱於加 …2 14達到所需溫度（例如12〇〜125。〇。加熱桌14 之/皿度可由溫度檢出部檢出，而控制維持於所需溫度 内。 22’ 二熱於所需溫度的加熱桌14上搬入板盤 、’1疋位銷25定位（本實施形態中以人手搬 入。二來自加熱# 14之傳熱加熱至所需溫度(例如 1 1U c j 〇此板盤2 2夕、、田痒，—r I / 28檢出。 度可由紅外線溫度感測器 俟板盤22被加熱至所需溫度，即以所 於板盤22上所需位置（工作件 鼠 1讣仟貼附位置）。塗臘可以 人手進仃’但亦可適當利用塗佈 盤22業已預先加敎至所需、”機j動進订。由於板 以溶解。 …至所“度，所以所塗佈之臘可 另一方面，在第二壇16a、16b側，亦通電於第 二加熱器31’加熱押壓桌18至所需溫度(例如咖〜 125C)。此溫度亦以溫度檢出部檢出’並控制維持於 所需溫度範圍。又’冷卻機構32的冷卻水已 應，冷卻水亦被加熱。如此來自 ” 押壓桌㈣以均勻加熱。破加熱冷部水之傳熱 又，此時降下押壓頭42，使其接觸於押 利用來自押壓桌18之傳熱，加熱押壓頭42至所需j ;(例如膚)。押壓頭42之溫度係由熱電偶46: 出。 双 201238710 俟押壓頭42之溫度昇 上昇押屋頭42，使其遠離 加熱桌14上’而且將載置 位搬入。 至所需溫度’從押壓卓Ί ，在押壓㈣上，加U 有工作件23的板盤22定 其-人降下押壓頭12，使其接近押壓桌Μ，經由 板盤22在加熱至所需溫度之押壓頭與押壓桌18 之間，押壓工作件23至所需時間（例如1分鐘）。由 於在押㈣42及板盤22雙方加熱至所f溫度狀態下 押麗工作_ 23’臘得以充份以均句厚度伸展。 在以押壓頭42押壓所需時間的過程中，停止通 電於第二加熱H 31，同時供應冷卻水予冷卻機構 32以冷卻押壓桌18，更以傳熱方式冷卻板盤a及 押壓頭42 ’由此將臘硬化，貼附工作件23於板盤 上。 於此冷卻過程中，押壓頭42之溫度係由熱電偶 46所檢出，在此押壓頭42之溫度降下至所需溫度（例 如35°C)的時點，終止押壓頭42之押壓，上昇押壓頭 42，從押壓桌18上取出板盤22，完成工作件％之 貼附。 以押壓頭42押壓工作件23的管理，只限於押壓 時間亦可’但亦可如上揭情形，檢出押壓頭42的溫 度，而於押壓頭42溫度降下至所需溫度以下之階段 終止，俾使臘確實硬化。亦即檢出距離押壓桌18最 遠的押壓頭42的溫度，更低於臘之硬化溫度時，終 201238710 止押壓頭42的押壓，以確實硬化臘。 又’並非將加熱桌14，板盤22，押壓桌18，押 壓頭42之加熱溫度與冷卻溫度限定如上，當然亦可 依照臘之種類加以適當選用。又於上述實施形態中， 係臘之塗佈，此將塗佈臘上供應工作件23等工作在 加熱桌14上進行。然而視情況，可以在加熱桌14上 -進行板盤22的加熱’搬入經加熱之板盤22於押壓 、 桌18上後’在押壓桌18上進行臘之塗佈與工作件 23之供應。 在本實施形態中’工作件的種類並不特別限定於 矽晶圓等，但這特別適用於形成氮化半導體層（GaN 等）藍寶石基板的貼附。 如屬於在藍寶石基板上將氮化物半導體層 等）磊晶成長的工作件時，由於係由熱膨脹係數相異 之2層所成等原因，容易有反蹺現象。在本實施形態 中係以加熱至所定溫度的板盤22與押壓頭42以所 、定時間押壓工作件23，押壓至臘成熔融狀態而消除 反芯，接下去加以冷卻。於是如上揭情形，檢出押壓 ”頭42溫度’以押壓頭42押壓工作件’直至該溫度成 為所需溫度以下，而使臘完全硬化，如此不生反蹺， 而且可以高精度貼附厚度均勻而平坦的臘進行工作 件的貼附。X ’此時藍寶石基板被研磨，應將氣化物 半導體層向著板盤22側貼附於板盤22。 又於上揭貫把形態中，係將押壓頭42對押壓201238710 VI. Description of the Invention: [Technical Field] The present invention relates to a method for attaching a workpiece and a device attaching device, in order to carry a plate that has a workpiece and a working piece into a grinding device Grinding 'and attaching the work piece to the plate. [Prior Art] In the case of performing one-side grinding of a workpiece such as a wafer, the workpiece is attached to the plate, so that the workpiece is polished to the side of the polishing cloth of the fixed plate, and the plate is plated. The disc is loaded into the stationary plate of the grinding nightmare ^ & w w device, the plate is rotated, and the polishing liquid is supplied to grind the polished surface of the workpiece. At this time, the work piece is attached to the plate, and Patent Document 1 or the like provides the following method. First, the heating table in which the heater is housed is heated to the desired temperature. Next, the work piece attached to the plate is coated. The workpiece is placed on a wax that is heated by the plate and melted. Next, on the press table adjacent to the heating table and having the cooling mechanism, the work piece carrying the wax is carried in the plate. Lowering the pressure on the table with the upper and lower free movements, and pressing the work piece between the pressure table on the plate and the pressing pressure to make the wax stretch, while supplying cooling water The cooling mechanism of the pressing table 'cools the plate and the wax to harden the wax and attach the working piece to the plate. 4 201238710 [Prior Art Document]: Patent Document 1: Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. At the same time, the heat of the plate was taken by the pressure table, and the temperature of the plate was lowered to the predetermined temperature when the pressure was repeatedly pressed. Moreover, when the pressure head is connected to the guard piece, it will be taken by the indenter to take heat. In addition, in this state, because the cooling water is supplied to the pressing table, causing the wax temperature to drop, the problem of hardening before the stretching of the wax will occur: for this, the thickness of the hook can be kept, and the working piece cannot be flat. Attached, this does not result in the required grinding accuracy. In order to solve the above problems, the object of the present invention is: the attachment method and the attachment device for the workpiece, which can prevent the post:: Wang Zhanshen hardens before, and can be attached with high precision. In order to achieve the above object, the present invention has the following method for attaching a work piece, which is provided with a press table and a table which is disposed on the table, and the table is freely accessible and away from the press head. Attached to the plate, the work piece attached to the plate is attached. It has:: contains a plate that has been preheated to the required temperature, and puts the plate into the pressing table, and adds the plate on the table: the process of requiring temperature; coating the wax a process of heating to a desired position on the desired temperature; a process of placing the workpiece on the wax heated to melt; the process of heating the pressure head to a desired temperature; The head is relatively close to the pressing table, and the pressing head and the plate are pressed by the crowning master to press the working piece to the required time, and in the state in which the working piece is pressed by the beast head, Cooling the pressing table and the plate with the cooling mechanism to harden the wax and attaching the working piece to the plate; and moving the pressing head away from the pressing table, and pressing the pressing head The process of moving out the plate with the work piece attached to the table is characterized. When the pressure is pressed by the pressure head, and the work piece is attached to the light of the board, it is better to check the temperature of the pressure head, and confirm that the temperature is below the specified temperature, and then the pressure of the pressure head is released. Pressure. It is also possible to pre-heat the plate and then move it into the press table by means of a twisting table with a heater that is attached to the press table. It is also possible to bring the s-Hail head into contact with the pressure. It is also possible to heat it to the desired temperature or to have the force of the head. The heated state of the crucible is heated to a desired temperature to form a blue semiconductor layer of the nitride semiconductor layer, and the nitride + conductor layer may be attached to the plate on the side of the plate. In addition, the work piece attachment device of the present invention is disposed on the pressing table, and the table is 'away from the beating head, and the table is freely accessible by the present. The bet of the beggar's head attached to the work piece via the wax on the plate! The table is provided with both the heater and the cooling mechanism, and the two sides are pressed and pressed to heat the pressure table and the 201238710 pressure head, and the wax pressing work piece coated on the plate plate is used to stretch the wax. The cooling mechanism cools the press table and the plate, and is characterized in that the wax is hardened and the work piece is attached to the plate. Preferably, a temperature detecting portion for detecting the temperature of the pressing head is provided, and when the pressing table is cooled to harden the wax, the temperature of the pressing head is detected by the temperature detecting portion, and the temperature is confirmed. After lowering to the specified temperature, the pressure on the pressure head is released. Preferably, the temperature detecting portion detects a temperature close to a portion of the pressing member that presses the workpiece. The pressure head is brought into contact with the pressing table and heated to the desired temperature. The heater and the cooling mechanism are both disposed in the pressing head, and the heating head can be heated or cooled by its own heater and cooling mechanism. The heating of the heater is provided by separately setting the pressing table, and the heating table preheats the plate and then moves into the pressing table, which is better than the (four) table _, and the configuration material is moved into the table. 4' = the temperature of the plate that is loaded into the heating table is detected: the setting is used to separately detect the (four) table and the heating device, and the temperature detecting portion of the dish is also [Effects of the Invention] According to the present invention, the workpiece can be attached to the plate with high precision. 7 it 201238710 [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Front view of the attachment device 10, Fig. 2 is a cross-sectional explanatory view of the table 18, and Fig. 3 is a plan view of the plate. In Fig. 1, 12 is a first altar having a heating table 14, 16a, 16b is a second altar which is adjacent to the first altar 12 and has a pressing table. The heating table 14 houses a first heater (not shown), and the support member 21 is horizontally placed on the base 2 Fixed. The plate 22 for attaching the work piece 23 is carried on the heating table 14. 24 is a positioning cylinder, and is disposed in the addition. Below the table 14, there are three position positioning pins 25 connected to the poles (only two of them are shown in the figure). The positioning pins 25 are inserted into the through-holes 26 of the heating table 14 in the up-down direction and can be extended. The plate 22 extends into the upper surface of the heating table 14. The plate 22 is provided with three through holes 27 corresponding to the positioning pin 25. In the embodiment, the plate 22 is manually carried into the heating table 14. At this time, the positioning pin 25 is placed to make it The inside of the through hole 27 is thus positioned on the heating table 14±. The mounting position of the marking member 23 is attached to the plate 22. In the embodiment, as shown in Fig. 8, On the outer side of the outer periphery of the member 23, a circumferential groove 23a is provided as a mark. When the guard 23 is placed so as to be housed in the circumferential groove 23a, the workpiece 23 can be placed at a desired position on the plate 22. Further, 8 201238710 The circumferential groove 23a can be used as a flow for accommodating excess overflow when the workpiece 23 is attached. The heating table 14 is provided with a temperature detecting portion (not shown) for detecting the first heater. The temperature of the heating table 14 is heated. The control unit 45 controls the opening and closing of the first heater to cause the temperature detected by the temperature detecting unit to fall. Further, in the set temperature range, an infrared temperature sensor (temperature detecting portion) 28 is disposed on the heating table to detect the surface temperature of the plate 22 placed on the heating table 14. The second altar 16a The pressing table 18 of 16b is also horizontally supported on the base 20 by the supporting members 3, respectively. As shown in Fig. 2, the pressing table 18 has a second heater 31 and a cooling mechanism 32 for supplying cooling water. The quilt cover 32a of the cooling water flowing in the table 18 is pressed, and the second heater 31 is disposed closer to the surface side of the pressing table μ, so that the cooling of the plate 22 on the pressing table 18 can be performed more quickly. More appropriate. Fig. 1 shows a circuit for cooling water in the cooling mechanism 32, 36 is a connection port for supplying a cooling water tank (not shown) after the temperature is adjusted, 37 is cooling water, 38 is a return path, and the cooling water is pressed against the table 18 After passing through the breaking sleeve 32a, it is discharged by the discharge port 39. Further, 4 turns as a shallow gate, which is a valve (not shown) to discharge cooling water in the circuit. Same as the first altar 12. The second altar i6a, 16t> is also provided with a positioning cylinder 24. There is a positioning mechanism with three positioning pins 25 for positioning the bench 22 carried by the heating table 14. 201238710 Further, the pressure pressing table 18 is also provided with a temperature detecting portion (not shown) for detecting the temperature of the pressing table 18 heated by the second heater 31. The second heater 31 is controlled to open and close by the f-part 45, and the temperature detected by the temperature detector is within the set temperature range. Above the press table 18. The pressing head 42 is provided, and the pressing table 18 can be moved up and down (close to and away). The ram 42 has three on the side of the second altar 16a and five on the side of the second altar 16b (only three are shown in the figure). That is, on the second shirt side, a larger work piece 23 can be attached. Each plate 22 is attached with three work pieces 23, and on the other hand, on the second side 16b side, a small work piece U is attached. Each of the plates 22 is attached with five working pieces 23. Each of the pressing heads 42' can be moved up and down by a cylinder (driving portion) 44 respectively supported by the base. Carcass: Pressing pressure: 42 is heated on the heating table 14 and is placed in the desired position. The work piece 23 is placed on the 9 _ 18 on the 9/Hera, and will be moved into the banquet table. The work piece 23 on the tray 22 is repeatedly placed on the esport table 18. The detecting head 42 is provided with a temperature pressure=禺46 formed by the thermocouple 46, and the front end of the pressing head 42 can reach the lower portion of the pressing head 42, and the side of the degree portion (close to the working surface of the workpiece) is described in the embodiment. The work piece attaching device 1 is configured as described above, and the present embodiment will be described next with the operation of the attaching device 10. The method of attaching the workpiece to the first heater 12 is performed by heating the first heater to the first heater 12 ... 2 14 reaches the desired temperature (eg 12 〇 ~ 125. 〇. The heating table 14 / dish degree can be detected by the temperature detection part, and the control is maintained within the required temperature. 22' two heating at the required temperature The table 14 is moved into the plate and the '1 position pin 25 is positioned (in this embodiment, the hand is carried in. The heat from the heating # 14 is heated to the required temperature (for example, 1 1 U cj 〇 this plate 2 2, Itching, -r I / 28 is detected. The degree can be heated by the infrared temperature sensor 俟 plate 22 to the desired temperature, that is, at the desired position on the plate 22 (the workpiece 1 讣仟 attached position) ). The wax can be hand-in-handed, but the coating plate 22 can also be used in advance. Need to, "machine j move order. Since the plate is dissolved ... ... to the degree, so the coated wax can be on the other hand, on the second altar 16a, 16b side, also energized by the second heater 31 'heat Press the table 18 to the desired temperature (for example, coffee ~ 125C). This temperature is also detected by the temperature detection unit and controlled to maintain the required temperature range. In addition, the cooling water of the cooling mechanism 32 is already applied, and the cooling water is also Heating. So from the pressure table (4) to heat evenly. Break the heat transfer of the cold water, and then lower the pressure head 42 to make contact with the heat transfer from the pressure table 18, heating the pressure head 42 to the required j; (for example, skin). The temperature of the indenter 42 is determined by the thermocouple 46: Double 201238710 The temperature of the indenter 42 rises and raises the head 42 away from the heating table 14 ' Move the loading position. To the required temperature, 'from the pressing pressure, on the pressing pressure (four), add the plate 22 with the working piece 23 to set the person to lower the pressing head 12, so that it is close to the pressing table, Pressing the work piece 23 between the pressing head and the pressing table 18 heated to the desired temperature via the plate 22 to the required time (for example, 1 minute) 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 At the second heating H 31, the cooling water is supplied to the cooling mechanism 32 to cool the pressing table 18, and the plate a and the pressing head 42' are further cooled by heat transfer, thereby hardening the wax, and attaching the working member 23 to the plate. During the cooling process, the temperature of the pressing head 42 is detected by the thermocouple 46, and when the temperature of the pressing head 42 is lowered to a desired temperature (for example, 35 ° C), the pressing head is terminated. At the pressure of 42, the pressure head 42 is raised, and the plate 22 is taken out from the pressing table 18 to complete the attachment of the work piece. The management of the pressing head 42 by the pressing head 42 is limited to the pressing time, but the temperature of the pressing head 42 can be detected, and the temperature of the pressing head 42 is lowered to the required temperature. The stage is terminated, so that the wax does harden. That is, the temperature of the pressing head 42 which is farthest from the pressing table 18 is detected, and when it is lower than the hardening temperature of the wax, the pressing pressure of the indenter 42 is finally stopped at 201238710 to surely harden the wax. Further, the heating temperature and the cooling temperature of the heating table 14, the plate 22, and the pressing table 18 are not limited to the above, and may of course be appropriately selected depending on the type of the wax. Further, in the above embodiment, the application of the wax is carried out, and the application of the upper wax supply working member 23 or the like is performed on the heating table 14. However, depending on the situation, the heating of the tray 22 can be performed on the heating table 14. After loading the heated plate 22 onto the table 18, the coating of the wax and the supply of the workpiece 23 are performed on the pressing table 18. . In the present embodiment, the type of the workpiece is not particularly limited to a tantalum wafer or the like, but this is particularly suitable for the attachment of a sapphire substrate on which a nitride semiconductor layer (GaN or the like) is formed. In the case of a work piece in which a nitride semiconductor layer or the like is epitaxially grown on a sapphire substrate, it is likely to have a ruthenium phenomenon due to the fact that two layers having different thermal expansion coefficients are formed. In the present embodiment, the plate 22 and the pressing head 42 heated to a predetermined temperature are pressed against the workpiece 23 for a predetermined period of time, and pressed to a molten state to eliminate the reverse core, followed by cooling. Therefore, as described above, the pressure of the head 42 is detected, and the pressure head 42 is pressed to press the workpiece until the temperature becomes lower than the required temperature, so that the wax is completely hardened, so that it is not ruthenium, and can be attached with high precision. A wax having a uniform thickness and a flatness is attached to the workpiece. At this time, the sapphire substrate is polished, and the vaporized semiconductor layer is attached to the plate 22 toward the side of the plate 22. The pressure head 42 will be pressed
S 201238710 桌18上下移動，但亦可將押壓頭42 相對接近或遠離的動作。 L 做 移動又；：亡揭實施形態中’各壇中，或壇間板盤的 移動’可设置移動裝置，自動搬出搬入。 12，第二壇台16 1圖所示者，故賦 第4圖表示各設一個第一壇台 的貫把形態。又’各元件相同於第 予同一符號，而省略說明。 於上揭各實施形態中， 第5圖所示實施形態者。第 明斷面圖。 可將押壓頭42變更為如 5圖為該押壓頭42的說 於本實施形態中，押廢頭42係設有第三加熱器 與冷卻機構48。第三加熱器47係透過可彎曲電覺 (未圖不）連接於電源’冷卻機構48亦透過可弯曲管 子（未圖示）連接至冷卻水供應源。 —於本實施形態中，押壓頭42的加熱可直接由第 二加熱器47 于’故加熱更為順利。又於臘硬化之 示藉由>fT止對第二加熱器47之通電，供應冷卻水 予冷卻機才冓48,故押壓帛42的冷卻更為順利。由於 王體之工作時間可以縮短’此一連串的控制係由控制 部45執行。 又，押壓頭42亦可只設第三加熱器，而省略冷 卻機構48。 第6圖為工作件貼附裝置10之其他實施形態中 的正面圖。 201238710 與第1圖所示之同一元件賦予同一符號，而省略 說明。 於本實施形態令，省略第一壇台12，只設第二 壇台16。在第二壇台16中的押壓桌18，與第2圖所 示者相同，設有加熱器31及冷卻機構32兩者。在此 第二壇16上，進行從板盤22加熱至工作件23之貼 附的全部過程。 下文中說明第6圖所示貼附裝置1〇的動作，同 時說明工作件貼附方法。 首先通電於押壓桌18之加熱器31，加熱押壓桌 18至所需溫度（例如120〜125°C )。 又，降下押壓頭42，使其與押壓桌18接觸，以 來自押壓桌18之傳熱加熱押壓頭42至所需溫度（例 如 11(TC )。 俟押壓頭42被加熱至所需溫度，上昇押壓頭 42，開放押壓桌18上面。 其次，將板盤22定位搬入於押壓桌28上，以來 自押壓桌18的傳熱加熱板盤22至所需溫度（例如11〇 C )s此板盤22之溫度，可利用紅外線溫度感測器（未 圖不' )檢出。 俟板盤22被加熱至所需溫度，在板盤22之所需 位置塗佈臘，並令其熔融。 俟臘熔融後，載置工作件23於臘上。 其次降下押壓頭42，令其接近押壓桌18，以加 201238710 熱至所需溫度的押壓頭@ ^ τ ^ ^ . 與押壓桌18經由板盤22 ::作件23歷所需時間(例如ρ 42及板盤22雙方加埶 T L頭 ^ 所而時間之狀態下押壓工作 件23,故臘可以均句厚度充分展延。 作 於以押壓頭42押屙所♦ η太日日 心所*時間之過程後，停止對 31之通電’同時供應冷卻水予冷卻機構32以 冷卻押壓桌18,更以傳熱冷卻板122及押壓頭42。 由疋臘得以硬化’工作件23得以貼附於板盤Μ上。 藉此冷卻過程，押壓頭42的溫度係由熱電偶46 =檢出’在此押壓頭42溫度降下至所需溫度（例如35 c)之時點，終止押壓頭42的押壓，上昇押壓頭42， 從押壓桌18上取出板盤22’完成工作件23之貼附。 以押壓頭42押壓工作件23的管理，只限於押壓 夺間亦可，但亦可如上揭情形，檢出押壓頭a的溫 度，而於押壓頭42溫度降下至所須溫度以下之階段 終止，俾使臘確實硬化。亦即檢出距離押壓桌W最 遠的押壓頭42的溫度’更低於臘之硬化溫度時，終 止押壓頭42的押壓，以確實硬化臘。 _於本實施形態中，可在押壓頭42中設如第5圖 斤示之加熱器47及冷卻機構48。如此，押壓頭42 可用加熱器47直接加熱，加熱可以順利進行。又， 在臘硬化之際，可藉由對加熱器47停止通電，而供 應冷卻水予冷卻機構48，可更為順利進行押壓頭Μ 之冷卻。因此可縮短全體工作時間。 201238710 又，於冷卻押壓頭42時，並非檢出押壓頭之溫 度而決定押壓之終止。而係於可檢出板盤22之溫度 後決定。 此外5遇此場合，亦可在押壓頭42中只設第三 加熱器，而省略冷卻機構48。 201238710 【圖式簡單說明】 第1圖為工作件貼附裝置之正面圖。 第2圖為押壓桌的斷面說明圖。 第3圖為板盤的說明圖。 第4圖為設有第一壇及第二壇之工作件貼附裝 置正面圖。 第5圖為押壓頭在其他實施形態的說明用斷面 圖。 第6圖為再一實施形態中工作件貼附裝置的正 面圖。 【主要元件符號說明】 10 :工作件貼附裝置 12 ： 第一壇台 14 :加熱桌 16 ： 第二壇台 16a、16b :第二壇 18 :押壓桌 20 :基台 21 : 支持部材 22 :板盤 23 ： 工作件 23a :周溝 24 ： 動位用圓筒 25 :位置定位銷 26 ： 貫通孔 27 :透孔 28 ： 紅外線溫度感測器 30 :支持部材 31 ： 第二加熱器 32 :冷卻機構 32a :被套 36 :供應冷卻水槽 37 ： 冷卻水往路 38 :冷卻水歸路 39 :排出口 40 ： 44 : 46 : 48 : 201238710 洩閘 圆筒（驅動部） 電熱偶 冷卻機構 42 :押壓頭 45 :控制部 47 :第三加熱器 19S 201238710 Table 18 moves up and down, but can also move the pressing head 42 relatively close to or away from it. L is moved again; in the death-detonation embodiment, the movement of each of the altars or the altar between the altars can be set and the moving device can be automatically moved in and out. 12, the second altar 16 1 shown in the figure, so the fourth figure shows the shape of each of the first altars. Further, the same components are denoted by the same reference numerals, and the description thereof will be omitted. In the respective embodiments, the embodiment shown in Fig. 5 is shown. The first sectional view. The ram head 42 can be changed to the embossing head 42 as shown in Fig. 5. In the present embodiment, the escaping head 42 is provided with a third heater and a cooling mechanism 48. The third heater 47 is connected to the power supply through a bendable electrical sensation (not shown). The cooling mechanism 48 is also connected to the cooling water supply source via a bendable tube (not shown). - In the present embodiment, the heating of the pressing head 42 can be directly performed by the second heater 47, so that the heating is smoother. Further, in the case of the hardening of the wax, the second heater 47 is energized by >fT, and the cooling water is supplied to the cooler 48, so that the cooling of the pressing port 42 is smoother. Since the working time of the king body can be shortened, the series of control systems are executed by the control unit 45. Further, the pressing head 42 may be provided with only the third heater, and the cooling mechanism 48 may be omitted. Fig. 6 is a front elevational view showing another embodiment of the workpiece attaching device 10. 201238710 The same components as those shown in Fig. 1 are denoted by the same reference numerals and will not be described. In the present embodiment, the first stage 12 is omitted, and only the second stage 16 is provided. The pressing table 18 in the second stage 16 is provided with both the heater 31 and the cooling mechanism 32, as shown in Fig. 2. On this second altar 16, the entire process of heating from the plate 22 to the work piece 23 is performed. Next, the operation of the attaching device 1A shown in Fig. 6 will be described, and the attaching method of the working member will be described. First, the heater 31 is energized to the press table 18, and the table 18 is heated to the desired temperature (e.g., 120 to 125 ° C). Further, the pressing head 42 is lowered to bring it into contact with the pressing table 18, and the pressing head 42 is heated from the pressing table 18 to the desired temperature (for example, 11 (TC). The pressing head 42 is heated to The required temperature is raised to the pressure head 42 to open the top of the pressing table 18. Next, the plate 22 is positioned and loaded onto the pressing table 28 to transfer the heat transfer plate 22 from the pressing table 18 to the desired temperature ( For example, 11〇C)s the temperature of the plate 22 can be detected by an infrared temperature sensor (not shown). The platen disk 22 is heated to the desired temperature and coated at the desired position of the plate 22. Wax, and let it melt. After melting the wax, place the work piece 23 on the wax. Secondly, lower the pressure head 42 and bring it close to the pressing table 18 to add 201238710 to the required temperature. @ ^ τ ^ ^ . and pressing the table 18 via the plate 22 :: the workpiece 23 for the required time (for example, ρ 42 and the plate 22 are twisted by the TL head ^ and the time is pressed, the work piece 23 is pressed. The thickness of the sentence can be fully extended. After the process of espressing the head of the 42 42 太 太 日 日 心 * 停止 停止 停止 停止 停止 停止 停止 停止 停止 停止 停止 31 31 31 31 31 31 31 31 The cooling mechanism 32 is used to cool the pressing table 18, and further to transfer the cooling plate 122 and the pressing head 42. The wax is hardened and the working member 23 is attached to the plate pan. By the cooling process, the pressing head 42 is pressed. The temperature is detected by the thermocouple 46 = 'At the time when the temperature of the pressure head 42 drops to the desired temperature (for example, 35 c), the pressure of the pressure head 42 is terminated, the pressure head 42 is raised, and the pressure is pressed. 18, the plate 22' is taken out to complete the attachment of the work piece 23. The management of the pressing work piece 23 by the pressing head 42 is only limited to pressing the hand, but it is also possible to detect the pressing head a. The temperature is terminated when the temperature of the pressure head 42 drops below the required temperature, so that the wax is hardened. That is, the temperature of the pressure head 42 which is farthest from the pressure table W is detected, which is lower than that of the wax. When the temperature is hardened, the pressing force of the pressing head 42 is terminated to surely harden the wax. In the present embodiment, the heater 47 and the cooling mechanism 48 as shown in Fig. 5 can be provided in the pressing head 42. The indenter 42 can be directly heated by the heater 47, and the heating can be smoothly performed. Further, when the wax is hardened, the heater 47 can be stopped. When the power is supplied and the cooling water is supplied to the cooling mechanism 48, the cooling of the pressing head 更为 can be performed more smoothly, so that the entire working time can be shortened. 201238710 Moreover, when the pressing head 42 is cooled, the temperature of the pressing head is not detected. The termination of the pressing force is determined, and is determined after the temperature of the plate 22 can be detected. In addition, in this case, only the third heater may be provided in the pressing head 42, and the cooling mechanism 48 may be omitted. 201238710 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front view of a work piece attaching device. Fig. 2 is a cross-sectional explanatory view of a press table. Fig. 3 is an explanatory view of a plate. Figure 4 is a front elevational view of the work piece attachment device with the first altar and the second altar. Fig. 5 is a cross-sectional view showing the other embodiment of the pressing head. Fig. 6 is a front elevational view of the workpiece attaching device in still another embodiment. [Main component symbol description] 10: Work piece attachment device 12: First stage 14: Heating table 16: Second stage 16a, 16b: Second stage 18: Press table 20: Abutment 21: Support member 22 : plate 23 : work piece 23a : circumferential groove 24 : moving cylinder 25 : position positioning pin 26 : through hole 27 : through hole 28 : infrared temperature sensor 30 : support member 31 : second heater 32 : Cooling mechanism 32a: Quilt cover 36: Supply cooling water tank 37: Cooling water path 38: Cooling water return path 39: Discharge port 40: 44 : 46 : 48 : 201238710 Venting cylinder (drive unit) Thermocouple cooling mechanism 42 : Pressing Head 45: control unit 47: third heater 19