JPH02220774A - Heating press-contacting device - Google Patents

Abstract

PURPOSE:To prevent a temperature of a heater chip from exceeding a heating temperature by controlling a temperature rise time extending from a start of heating to the heater chip to its arrival to the heating temperature by a heating current control means, based on an output of a rise time setting means. CONSTITUTION:To the lower part of a head unit 2, a heater chip 7 is attached, and a thermocouple 8 is provided. The thermocouple 8 outputs a voltage signal corresponding to a temperature of the heater chip 7 to a control unit 3, and the heater chip 7 is controlled by a heating current of the unit 3. A head driving means 9 allows a head to ascend and descend through an air cylinder by opening and closing a solenoid valve and moves upward and downward the heater chip. A cooling air supply device 11 cools forcibly a soldering part of a work 15 by opening and closing the solenoid valve 12. subsequently, by an ON-operation of a foot switch 16, a series of soldering work is executed. In such a way, a temperature of the heater chip reaches a heating temperature, when a temperature rise time elapses, therefore, it is prevented that the temperature of the chip exceeds the heating temperature, and a thermal influence exerted on the work can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a thermocompression bonding apparatus used for, for example, soldering flexible printed circuit boards, thermocompression bonding of resin films, and the like.

(Prior Art) A thermocompression bonding device is known that performs soldering work, thermocompression bonding work, etc. by heating and pressing a workpiece at a preset temperature and pressure.

In such a thermocompression bonding device, a thermocouple is attached to the heater chip that heats the workpiece, and the output voltage of this thermocouple is compared with a reference voltage corresponding to a preset temperature of the heater depth to determine the actual temperature of the heater chip. The temperature of the heater chip is controlled by raising the temperature to a set temperature (hereinafter referred to as heating temperature) and then controlling the heating current to the heater chip so that the temperature of the heater chip maintains the heating temperature. .

(Problem to be Solved by the Invention) However, in the conventional thermocompression bonding apparatus described above, the larger the temperature difference between the temperature of the heater chip at the start of heating and the heating temperature, the higher the rate of temperature rise of the heater chip. Therefore, when the temperature of the heater chip increases, the temperature of the heater chip may exceed the heating temperature, which may cause damage to the workpiece due to thermal effects, or the solder may become spherical. This caused problems such as the metal flowing into unnecessary areas and causing short circuits between the conductors of the workpiece.

In addition, the higher the temperature of the heater chip at the start of heating, the shorter the temperature rise time until the heating temperature is reached, so if the temperature of the heater chip at the start of heating is different, the temperature rise until the heating temperature is reached There was also room for improvement in terms of workability when soldering work and the like were performed continuously due to the different time periods.

Therefore, this invention was devised in consideration of the above-mentioned problems, and can prevent the temperature of the heater chip from exceeding the heating temperature when the temperature of the heater chip increases, and also prevents the temperature of the heater chip from exceeding the heating temperature when the temperature of the heater chip increases. An object of the present invention is to provide a thermocompression bonding device that can maintain a constant temperature rise time until the heating temperature is reached even if the temperature of the heater chip differs.

(Means for Solving the Problems) In order to solve the above problems, the present invention provides a heater chip A that heats a workpiece, and a ? temperature detection means B for detecting m degrees, heating temperature setting means C for setting the heating temperature when heating the workpiece, based on the output of the temperature detection means B and the output of the heating temperature setting means C. In a thermocompression bonding apparatus comprising a heating current control means for controlling a heating current supplied to the heater chip A, a temperature rise for setting a temperature rise time from the start of heating the heater chip A until reaching the heating temperature. It is characterized in that a time setting means E is provided, and the heating current control means is controlled based on the output of the temperature rise time setting means E.

(Function) In such a thermocompression bonding apparatus, a temperature rise time setting means is provided for setting the temperature rise time from the start of heating the heater chip until the heating temperature is reached, and the heating is performed based on the output of the temperature rise time setting means. Since the current control means is configured to be controlled, the temperature of the heater chip reaches the heating temperature when the temperature rise time has elapsed.

(Embodiments) Hereinafter, preferred embodiments of the present invention will be described based on the accompanying drawings.

FIG. 1 is a block diagram of a thermocompression bonding apparatus according to an embodiment of the present invention, and FIG. 2 is a block diagram of the thermocompression bonding apparatus.

First, the configuration of the thermocompression bonding apparatus will be explained based on FIG. 1.

As shown in the drawings, the thermocompression bonding apparatus 1 is comprised of a head unit 2, a control unit 3, an i-cooler injection device 4, and the like.

A heater chip 7 is attached to the lower part of the head 5 constituting the head unit 2 via a heater chip attachment member 6, and a thermocouple 8 is attached to the heater chip 7 as a temperature detection means.

This thermocouple 8 detects the temperature of the heater chip 7 and outputs (feedback) a voltage signal corresponding to the temperature to the control unit 3, and the heater chip 7 is heated by the heating current output from the control unit 3. Temperature controlled.

The head driving means 9 is composed of an air cylinder, a solenoid valve, etc., and raises and lowers the head 5 by introducing air into the air cylinder or discharging air from the air cylinder by opening and closing the solenoid valve. As the head 5 rises and falls, the heater chip 7 rises and falls on the work tape 10. Note that this head driving means 9 is controlled by the control unit 3.

The cooling air injection device 4 includes a cooling air supply means 11, a solenoid valve 12, a cooling air supply vibe 13, a cooling air injection nozzle 14, etc. When the solenoid valve 12 is opened, cooling air is injected from the nozzle 14. The heater chip 7 and the soldered part of the workpiece 15 placed on the work tape 10 are forcibly cooled, and the heater chip 7 and the workpiece 1
The temperature of the soldered part No. 5 is lowered to a temperature below the melting point of the solder. Note that this cooling air injection device 4 is controlled by a control unit 3.

Further, in FIG. 1, reference numeral 16 indicates a foot switch, and by turning on this foot switch 16, a series of soldering operations to be described later are performed.

Next, the electrical configuration of the thermocompression bonding apparatus 1 will be explained based on FIG. 2.

The thermocompression bonding apparatus 1 is controlled by a central processing unit (hereinafter referred to as CPU) 17 provided in the control unit 3.

This CPU 17 includes a thermocouple 8, a foot switch 16,
A head position detection means 18 which is composed of a photoelectric sensor and detects the vertical position of the head 5 and a heating condition setting means 19 are connected via an input interface circuit 20 .

The heating condition setting means 19 includes a heating temperature setting means 19a for setting the heating temperature Ta, a cooling air stop temperature setting means 19b for setting the temperature Tb at which the injection of cooling air is stopped, and a cooling air stop temperature setting means 19b for setting the temperature Tb at which the injection of cooling air is stopped. It is comprised of a temperature rise time setting means 19c for setting the temperature rise time t1, and an energization time setting means 19d for setting the energization time tb from the start of heating to the stop of heating.

The CPU 17 also includes a head drive means control 121 that controls the head drive means 9-, a heating current control section 22 that controls the heating current supplied to the heater chip 7, and a solenoid valve control section 23 that controls the opening and closing of the solenoid valve 12. , preset heating temperature T a , A cooling air stop temperature Tb, temperature rise time t1
, a display device 24 that digitally displays the energization time tb, the actual temperature T of the heater chip 7, etc. is connected via an output interface circuit 25, and a timer 27 that measures the energization time of the heating current to the heater chip 7 is connected. It is connected.

The CPU 17 constitutes a microcomputer together with the RAM 25 and the ROM 26. Based on the ON operation of the foot switch 16, the CPU 17 controls the thermocouple 8 and the head position according to a program stored in the ROM 26 in advance while utilizing the temporary storage function of the RAM 25. Processes the output signal of the detection means 18 and outputs control signals to each of the head drive means control section 21, heating current control section 22, and electromagnetic valve control section 23 to execute a series of soldering operations to be described later, Display desired information on the display device 24.

Next, based on FIG. 3 and FIG.
The operation will be explained.

In addition, FIG. 3 is a flowchart for explaining the operation of the thermocompression bonding apparatus 1 according to the control program, 5751 to ST65 in the figure indicate each step of the flowchart, and FIG. FIG. 1 is a diagram showing the operating state of FIG.

First, turn on the power switch, then set the heating temperature Ta.
, the cooling air stop temperature Tb, the temperature rise time ta, and the energization time tb are set in the heating condition setting means 19, and the test heating switch is turned on. As a result, step 5T51
The determination of "Test heating switch: ON?" becomes YES, and test heating is performed in the following step 5T52.

In this test heating, the size of the heater chip 7 attached to the heater chip attachment member 6 and the preset heating temperature T
The optimum temperature rise curve for a and temperature rise time t1 is read from the ROM 26 and stored in the RAM 25.

Next, when the foot switch 16 is turned on (time to
), "Foot switch ON" in step 5T53
? The determination J is YES, and in the following step 5T54, the head drive means control section 21 is activated, and the head drive means 9 lowers the head 5 from the standby position H1.

As the head 5 descends, the heater chip 7 descends,
When the heater chip 7 descends to the position where it presses the workpiece 15 with a predetermined pressure (time 1+), the head 5 moves to the operating position H.
Head position detection means 17 for detecting that the head has descended to O
Based on the output signal, the determination of ``Heater chip presses workpiece?J'' in step 5T55 becomes YES.

As a result, in step 5T56, time measurement by the timer 27 is started, and in step 5T57,
The heating current controller 22 operates based on the output signal of the thermocouple 8 and the temperature rise curve stored in the RAM 25, supplies heating current to the heater chip 7, and controls the temperature of the heater chip 7 during the temperature rise time t1. Temperature increase control is performed to raise the temperature to the heating temperature Ta.

Next, in step 5T5B, when the temperature T of the heater chip 7 reaches the heating temperature Ta (time t2), the temperature increase control is canceled, and in the subsequent step 5T59, the heating current control unit 22 operates, supplies heating current to the heater chip 7, maintains the temperature T of the heater chip 7 at the heating temperature Ta, and heats the workpiece 15.1.
The solder 15a between 5b is melted.

Next, when the timer 27 measures the energization time tb (time t
3) In step 5T60, “Is the energization time tb elapsed?
” becomes YES, and in the subsequent step ST61, the supply of heating current to the heater chip 7 is stopped, and in step 5T62, the electric tin valve control unit 23 is operated to open the solenoid valve 12, and the heater chip 7 is stopped. And cooling air is injected onto the workpiece 15°15a.

Next, when the temperature of the heater chip 7 falls to the cooling air stop temperature Tb (time t4), the determination in step 5T63 as to "Has the cooling air stop temperature Tb been reached?" is YES.
Then, in the following step 5T64, the solenoid valve control unit 23 operates to close the solenoid valve 12 and stop the injection of cooling air, and in step 5T65, the head drive means control unit 21 operates to stop the head drive. The head 5 is raised from the operating position HO to the standby position H1 by means 9, thereby completing a series of soldering operations.

A series of soldering work is performed through the above steps 5T51 to 5T65, and then the foot switch 16 is turned ON again.
When operated, the processes of steps 5T53 to 5T65 described above are executed, and the series of soldering operations is performed again.

As explained above, the thermocompression bonding apparatus 1 according to this embodiment
According to
Since the heating temperature Ta is reached when the temperature of the heater chip 7 has passed, it is possible to prevent the temperature of the heater chip 7 from exceeding the heating temperature Ta when the temperature of the heater chip 7 increases.
It is possible to prevent thermal influence on the workpieces 15° and 15b.

Furthermore, even if the temperature of the heater chip 7 at the start of heating (time 1+) differs, the temperature rise time t until reaching the heating temperature Ta remains constant, so when performing soldering work etc. Workability is improved and uniform products can be obtained.

Furthermore, since the temperature rise time setting means 19c is provided, the temperature rise time ta can be set between the heater chip 7, the workpiece 15, and the workpiece 15b.
, the optimum time can be set depending on the amount and components of the solder 15a.

Then, by changing the program in ROM26,
The temperature rise curve can be easily changed.

In this embodiment, the case where the thermocompression bonding device 1 is used for soldering work is illustrated, but the thermocompression bonding device 1 is
It is not limited to use only for soldering work.

(Effects of the Invention) As explained above, according to the thermocompression bonding apparatus according to the present invention, the temperature of the heater chip reaches the heating temperature when the temperature rise time has elapsed. It is possible to prevent the temperature of the chip from exceeding the heating temperature, thereby preventing thermal effects on the workpiece.

Also, even if the temperature of the heater chip at the start of heating is different,
Since the temperature rise time until reaching the heating temperature is constant, workability when performing soldering work etc. continuously is improved and uniform products can be obtained.

Further, since the temperature rise time setting means is provided, the one blackness rise time can be set to an optimal time depending on the heater chip, the workpiece, the amount and composition of the solder, and the like.

[Brief explanation of the drawing]

1 to 4 are diagrams showing a thermocompression bonding apparatus according to an embodiment of the present invention, in which FIG. 1 is a configuration diagram, FIG. 2 is a block diagram, FIG. 3 is a flowchart, and FIG. It is a figure which shows an operating state. Moreover, FIG. 5 is a diagram corresponding to claims of the present invention. In addition, in the drawing, 1 is a thermocompression bonding device, 7 is a heater chip, and 8
17 is a thermocouple, 17 is a CPLI, 19a is a heating temperature setting means, 19c is a temperature rise time setting means, 22 is a heating current control section, 25 is a RAM, and 26 is a ROM.

Claims (1)

[Claims] A heater chip that heats a workpiece, a temperature detection means that detects the temperature of the heater chip, a heating temperature setting means that sets a heating temperature when heating the workpiece, an output of the temperature detection means and the heating temperature setting. and a heating current control means for controlling a heating current supplied to the heater chip based on the output of the heating means, the temperature rise time from the start of heating the heater chip until reaching the heating temperature is A thermocompression bonding apparatus characterized in that a temperature rise time setting means is provided, and the heating current control means is controlled based on an output of the temperature rise time setting means.