JPH0483350A - Heating tip apparatus and temperature control method of heating tip - Google Patents

Abstract

PURPOSE:To prevent the abnormal temperature rise of a heating tip by receiving the output of a temperature-detecting thermocouple to monitor the temperature of the heating tip and by temperature-controlling the heating tip on the basis of the output of a temperature control thermocouple and the monitor results of a monitoring device. CONSTITUTION:When e.g. a temperature control thermocouple 7 comes off a heating tip 3, it is difficult to conduct an accurate temperature detection by the temperature control thermocouple 7. Also, the temperature control thermocouple 7 outputs a signal indicating a low temperature to a controller 8 irrespective of the temperature of the heating tip 3. Consequently, the heating tip 3 is supplied with a high current corresponding to the output of the temperature control thermocouple 7 to rapidly rise in the temperature, but the temperature of the heating tip 3 is detected by a temperature-detecting thermocouple 9 and monitored by a monitoring device 10. Then, when the temperature of the heating tip 3 reaches the upper limit of a preset range, the monitoring device 10 gives the controller 8 the output that the temperature has reached the upper limit. After that, the preset temperature-detecting contact of the controller 8 operates so that the conduction to the heating tip 3 is intercepted and the abnormal rise of the temperature of the heating tip 3 is hindered.

Description

Detailed Description of the Invention [Objective of the Invention] (Industrial Application Field) The present invention relates to a heating chip device that presses and thermocompresses a multi-terminal electronic component onto a substrate using a heating chip that generates heat when energized, for example; The present invention also relates to a heating chip temperature control method.

(Conventional technology) Generally, flat package ICs and TAB (Tape
2. Description of the Related Art A heating chip device is known that connects multi-terminal electronic components (hereinafter referred to as electronic components) such as Automated Bonding (Automated Bonding) components all at once to a substrate made of wood or metal. Among these heating chip devices, there is a type in which a current is directly passed through a heating chip made of molybdenum, nickel-chromium steel, or the like, and the Joule heat generated is used to raise the temperature of the heating chip.

Furthermore, the above-mentioned type of heating chip device presses a sufficiently high-temperature heating chip against terminals protruding from the multi-terminal electronic component to bond the multi-terminal electronic component to the substrate by thermocompression. There is. In addition, the heating chip device has a temperature control thermocouple attached to the surface of the heating chip, and based on the output of the temperature control thermocouple, determines the energization time etc. to the heating chip, thereby controlling the temperature of the heating chip. is under control.

(Problem to be Solved by the Invention) By the way, in the heating chip device and temperature control method that rely only on the temperature control thermocouple to control the temperature of the heating chip as described above, for example, when the temperature control thermocouple There is a problem in that accurate temperature detection cannot be performed if the heating chip begins to come off the chip, or comes off the heating chip and comes into contact with a metal frame or the like.

In such a case, even if the temperature of the heating chip reaches a value sufficient for connecting electronic components, an unnecessarily large current may be supplied to the heating chip. Then, the temperature of the heating chip rapidly rises above a predetermined temperature, and in some cases, electronic components, substrates, heating chips, etc. may be burnt out.

The purpose of the present invention is to prevent abnormal temperature rise of the heating chip and burnout of electronic components, and to
An object of the present invention is to provide a heating chip device and a method for controlling the temperature of a heating chip/knob, which can improve the durability of the heating chip.

[Structure of the Invention] (Means and Effects for Solving the Problems) In order to achieve the above object, the present invention includes a heating chip that generates heat when energized, and a thermoelectric device for temperature control attached to the heating chip. In a heating chip device that controls the temperature of a heating tip based on the output of the heating tip, at least one temperature detection thermocouple is attached to the heating tip and detects the surface temperature of the heating tip, and the output of this temperature detection thermocouple is attached to the heating tip. A monitor that monitors the temperature of the heating chip based on the temperature control thermocouple and a control section that controls the temperature of the heating chip based on the output of the temperature control thermocouple and the monitoring result of the monitor are provided.

Further, in a heating chip temperature control method in which the temperature of a heating chip that generates heat when energized is controlled based on the output of a temperature control thermocouple attached to the heating chip, at least one temperature detecting thermocouple attached to the heating chip is used. The surface temperature of the heating chip is detected by a thermocouple, and the temperature of the heating chip is monitored by a monitor that receives the output of this temperature detection thermocouple, and based on the output of the temperature control thermocouple and the monitoring result of the monitor. The temperature of the heating chip was controlled by

By doing so, the present invention can prevent abnormal temperature rise of the heating chip and burnout of electronic components, etc., and can further improve the durability of the heating chip.

(Example) Hereinafter, an example of the present invention will be described based on FIGS. 1 and 2.

FIG. 1 shows an embodiment of the present invention, and the reference numeral 1 in the figure shows an embodiment of the present invention.
is, for example, a flat package IC or T A B (T
1 shows a heating chip device that connects a multi-terminal electronic component 2 such as an APE Automated Bonding component to a substrate (not shown) made of resin or metal. The heating chip device 1 includes, for example, a heating chip 3 attached to the tip of a bonding tool that can be raised and lowered.
have.

The heating chip 3 is formed by molding a heater material such as molybdenum or nickel φ chromium steel. The heating chip 3 is connected to an AC power source 5 via a power transformer 4, and is supplied with transformed power by the power transformer 4 to generate heat. Then, the heating chip 3 descends toward the electronic component 2, and presses, for example, the terminals 6 of the electronic component 2 against the substrate, thereby bonding the electronic component 2 to the substrate by thermocompression.

Furthermore, a temperature control thermocouple 7 is attached to the heating chip 3. This temperature control thermocouple 7 is a heating chip 3
The thermal current generated is output to the control section 8 provided between the power transformer 4 and the AC power source 5. The temperature control thermocouple 7 causes the control section 8 to control the amount of current supplied according to the surface temperature of the heating chip 3.

Further, reference numeral 9 in FIG. 1 indicates a temperature detection thermocouple. This temperature detection thermocouple 9 is connected to the surface of the heating chip 3. The temperature detection thermocouple 9 detects the surface temperature of the heating chip 3 and outputs the detection result to a temperature monitor (hereinafter referred to as a monitor) 10 as a monitor.

Here, in FIG. 1, the reference numeral 11 indicates the connection part between the temperature control thermocouple 7 and the heating chip 3, and the reference numeral 12
indicates a connection portion between the temperature detection thermocouple 9 and the heating chip 3.

Further, the monitor 10 is connected to the control section 8 and is located between the control section 8 and the temperature detection thermocouple 9. Furthermore, the monitor 10 monitors the surface temperature of the heating chip 3 in response to the detection result of the temperature detection thermocouple 9. and,
The temperature range of the monitor 10 can be set arbitrarily, for example.

Then, the monitor 10 outputs an output signal corresponding to the temperature of the heating chip 3 to the control unit 8 based on the output of the temperature control thermoelectric pair 9.

The control unit 8 includes a set temperature detection contact (alarm contact) that is opened and closed based on the output of the monitor 10. When the controller 8 is informed by the monitor 10 that the heating chip 3 has reached, for example, the upper limit of the set temperature, the controller 8 shuts off the power to the heating chip 3 using the set temperature detection contact.

Here, for example, the heating chip 3 may always emit an output signal to the control unit 8 according to the temperature of the heating chip 3, or the heating chip 3 may be monitored only when the temperature reaches the upper or lower limit of the set temperature. The device 10 may operate the set temperature detection contact of the control section 8.

Further, the temperature detection thermocouple 9 is connected to the heating chip 3 as shown in FIG. That is, the temperature detection thermocouple 9 and the heating tip 3 are sandwiched between the electrodes 14 and 14 and welded together with the nickel plate 13 interposed therebetween.

Further, the temperature control thermocouple 7 may be connected to the heating chip 3 in the same manner as the temperature detection thermocouple 9.

Furthermore, it is desirable to arrange the re-thermocouple 7.9 in the vicinity of the pressing surface 15 of the heating chip 3 that contacts the terminals of the electronic component.

Next, a method for controlling the temperature of the heating chip 3 will be explained.

For example, the temperature control thermocouple 7 may come off or almost come off the heating tip 3, or come off the heating tip 3 and come into contact with a metal frame (not shown) located near the heating tip 3. In this case, it becomes difficult to accurately detect temperature using the temperature control thermocouple 7. The temperature control thermocouple 7 outputs a signal indicating a low temperature to the control section 8 regardless of the temperature of the heating chip 3.

For this reason, the heating chip 3 is supplied with a large current according to the output of the temperature control thermocouple 7, and the temperature rises rapidly. However, the temperature of the heating chip 3 is detected by the temperature detection thermocouple 9, and the temperature is It is monitored by 10. Then, when the temperature of the heating chip 3 reaches the upper limit of the set range, the monitor 1
0 outputs to the control unit 8 that the temperature has reached the upper limit. Then, the set temperature detection contact of the control unit 8 is activated, the power supply to the heating chip 3 is cut off, and an abnormal rise in the temperature of the heating chip 3 is prevented.

In addition, for example, if the temperature detection thermocouple 9 comes off or almost comes off the heating chip 3, or comes off from the heating chip 3 and comes into contact with a metal frame part (not shown) located near the heating chip 3, etc. In this case, the temperature value at which the temperature detection thermocouple 9 outputs drops rapidly. For this reason, by utilizing the change in the temperature value generated by the output of the temperature detection thermocouple 9, when the above temperature reaches the lower limit of the set temperature, the set temperature detection contact is activated and the heating chip 3 is energized. Cut off.

In other words, in the heating chip device 1 and heating chip temperature control method, since the temperature of the heating chip 3 is detected using the temperature detection thermocouple 9 in addition to the temperature control thermocouple 7, temperature control is not possible. Even if the temperature detection thermocouple 7 cannot accurately detect the temperature, the temperature of the heating chip 3 can be maintained at a value suitable for connecting electronic components based on the detection result of the temperature detection thermocouple 9. can.

Further, the temperature of the heating tip 3 is monitored by the monitor 10 based on the detection result of the temperature detection thermocouple 9, and when the temperature of the heating tip 3 reaches the upper limit of the setting range, the control unit 8 is set. The temperature detection contact is activated to cut off the power supply to the heating chip 3. therefore,
An abnormally large current will not flow through the heating chip 3.
Abnormal temperature rise of the heating chip 3 can be prevented. Furthermore, it is possible to prevent burnout of the electronic component, the board, the connecting portion between the terminal of the electronic component and the board, the heating chip, and the like.

And from these things, it becomes possible to always perform stable thermocompression bonding by the heating chip 3, and furthermore, the durability of the heating chip 3 can be improved.

When molybdenum is used as the material for the heating tip 3, generally molybdenum, which is a sintered metal, is rolled and then formed into the heating tip 3. For this reason, according to the heating chip device and temperature control method that always maintains the temperature of the heating chip 3 at an appropriate value as described above, the structure of the heating chip 3 will not change to the state before rolling due to excessive temperature rise. You can prevent it from coming back.

It is also possible to provide a plurality of thermocouples for temperature detection, as shown in FIG. 3 by connecting portions 11, 12, and 12. By providing a plurality of thermocouples for temperature detection in this way and arranging them appropriately on the surface of the heating chip 3, the temperature distribution on the surface of the heating chip 3 can be monitored. The temperature state at each location of the heating chip 3 during thermocompression bonding can be measured and confirmed, and stable thermocompression bonding can always be performed.

Furthermore, in this embodiment, since the heating chip 3 and the temperature detection thermocouple 9 are connected by spot welding with a nickel plate 13 interposed, the temperature detection thermocouple 9 can accurately detect the temperature. It can be carried out.

That is, to connect the heating chip 3 and the temperature detection thermocouple 9, for example, as shown in FIG. 4, one end of the temperature detection thermocouple 9 is inserted into the connection hole 16 provided in the heating chip 3.
This may be done by filling the connection hole 16 with silver solder 17 or the like and brazing the temperature detection thermocouple 9 to the heating chip 3.

In such a case, the temperature detection thermocouple 9 may detect the temperature of the protrusion 18 of the silver solder 17, or a cavity may be created inside the silver solder 17, causing the temperature of the heating tip 3 to become lower than the temperature. It is conceivable that the light is not transmitted to the detection thermocouple 9 reliably.

However, by spot welding the temperature detection thermocouple 9 to the heating chip 3 as described above, the temperature detection thermocouple 9
It is possible to accurately detect the temperature of the heating chip 3.

Note that a plate made of a material other than nickel may be interposed between the heating chip 3 and the temperature detection thermocouple 9.

Further, when soldering the electronic components 2' with the heating tip 3 made of molybdenum, solder is difficult to adhere to the heating tip 3. Therefore, even if the heating chip 3 made of molybdenum is heated by, for example, a pulse heating method, it is unlikely to be contaminated by solder adhesion.

Further, the present invention provides, for example, a heating chip device of a type in which the central part of the pressing surface 15 of the heating chip 3 is reinforced, and a type in which the thickness of the heating chip 3 is changed to make the temperature distribution of the heating chip uniform. It is also applicable to other heating chip devices.

[Effects of the Invention] As explained above, the present invention provides a heating chip device that includes a heating chip that generates heat when energized and controls the temperature of the heating chip based on the output of a temperature control thermocouple attached to the heating chip. at least one temperature detection thermocouple attached to the heating chip to detect the surface temperature of the heating chip; a monitor for monitoring the temperature of the heating chip in response to the output of the temperature detection thermocouple; and a temperature control device. A controller was provided to control the temperature of the heating chip based on the output of the thermocouple and the monitoring result of the monitor.

Further, in a heating chip temperature control method in which the temperature of a heating chip that generates heat when energized is controlled based on the output of a temperature control thermocouple attached to the heating chip, at least one temperature detecting thermocouple attached to the heating chip is used. The surface temperature of the heating chip is detected by a thermocouple, and the temperature of the heating chip is monitored by a monitor that receives the output of this temperature detection thermocouple, and based on the output of the temperature control thermocouple and the monitoring result of the monitor. The temperature of the heating chip was controlled by

Therefore, the present invention has the effect of being able to prevent abnormal temperature rise of the heating chip and burnout of electronic components, etc., and further improving the durability of the heating chip.

[Brief explanation of the drawing]

1 and 2 show an embodiment of the present invention,
Fig. 1 is a schematic configuration diagram, Fig. 2 is an explanatory diagram showing a method of connecting a heating chip and a thermocouple for temperature detection, Fig. 3 is an explanatory diagram schematically showing a modified example, and Fig. 4 is a general illustration. FIG. 2 is a cross-sectional view showing a connection between a heating chip and a temperature detection thermocouple. 1... Heating chip device, 3... Heating chip, 7...
- Thermocouple for temperature control, 8... Control unit, 9... Thermocouple for temperature detection, 10... Temperature monitor (monitor). Applicant's agent Patent attorney Takehiko Suzue M 3 Figure 1 Figure 4 Figure 2M

Claims (2)

[Claims] (1) A heating chip device that includes a heating chip that generates heat when energized and controls the temperature of the heating chip based on the output of a temperature control thermocouple that is attached to the heating chip. at least one temperature detection thermocouple for detecting the surface temperature of the chip;
A monitor that monitors the temperature of the heating chip in response to the output of the temperature detection thermocouple, and a control that controls the temperature of the heating chip based on the output of the temperature control thermocouple and the monitoring result of the monitor. A heating chip device characterized in that it is provided with a section. (2) In a temperature control method for a heating chip, in which the temperature of a heating chip that generates heat when energized is controlled based on the output of a temperature control thermocouple attached to the heating chip, the temperature of at least one of the heating chips attached to the heating chip is controlled. In addition to detecting the surface temperature of the heating chip using a detection thermocouple,
The temperature of the heating chip is monitored by a monitoring device that receives the output of the temperature detection thermocouple, and the temperature of the heating chip is controlled based on the output of the temperature control thermocouple and the monitoring result of the monitoring device. Characteristic heating chip temperature control method.