JP2005347303A - Thermocompression bonding machine - Google Patents

Thermocompression bonding machine Download PDF

Info

Publication number
JP2005347303A
JP2005347303A JP2004161570A JP2004161570A JP2005347303A JP 2005347303 A JP2005347303 A JP 2005347303A JP 2004161570 A JP2004161570 A JP 2004161570A JP 2004161570 A JP2004161570 A JP 2004161570A JP 2005347303 A JP2005347303 A JP 2005347303A
Authority
JP
Japan
Prior art keywords
thermocompression bonding
heat insulating
bonding apparatus
fluid passage
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004161570A
Other languages
Japanese (ja)
Other versions
JP2005347303A5 (en
Inventor
Takashi Yamashita
敬 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2004161570A priority Critical patent/JP2005347303A/en
Publication of JP2005347303A publication Critical patent/JP2005347303A/en
Publication of JP2005347303A5 publication Critical patent/JP2005347303A5/ja
Pending legal-status Critical Current

Links

Images

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To uniformly keep a pressure to be applied to a thermocompression bonding surface even if a heater tool is heated at a high temperature, and to insulate a heat transmitting to the main body from the heater tool. <P>SOLUTION: A heating member 3 provided with a heat generating source 4 is pressed down to a workpiece 5 so as to crimp the workpiece by heat. Such the thermocompression bonding machine is provided with a supporting member 1 to support the heating member on the main body of the thermocompression bonding machine and an insulating member 2 that is arranged between the supporting member and the heating member, and is provided with a first fluid passage 7 allowing a cooling medium to pass through. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、電子部品や基板などのワークを熱圧着して接合する熱圧着装置に関するものである。   The present invention relates to a thermocompression bonding apparatus that joins a workpiece such as an electronic component or a substrate by thermocompression bonding.

電子部品や基板などのワークを相互に接合する方法としては、熱圧着による方法が知られている。この方法は、ワークの接合部を被接合部に対して所定の荷重で押しながらワークを加熱することにより、接合部を半田もしくは熱硬化性接着剤により接合するものである。従来の熱圧着装置は、図4に示す様に、高温に加熱した状態のヒーターツール103をワーク105に短時間押し当てて接合し、これを繰り返し行う様に構成されている。その場合、ヒーターツール103の熱が圧着装置本体に伝達されると、圧着装置本体の精度等に悪影響が出るため、ヒーターツール103から熱圧着装置本体側(保持部材101側)へ伝わる熱を断熱するために、断熱材102を備えている。
特開2001−358455号公報 特開平10−41340号公報 特開平8−274131号公報
As a method for joining workpieces such as electronic components and substrates, a method using thermocompression bonding is known. In this method, the work part is heated while pressing the work joint part against the part to be joined with a predetermined load, thereby joining the joint part with solder or a thermosetting adhesive. As shown in FIG. 4, the conventional thermocompression bonding apparatus is configured such that the heater tool 103 heated to a high temperature is pressed against the work 105 for a short time and joined, and this is repeated. In that case, if the heat of the heater tool 103 is transmitted to the main body of the crimping device, the accuracy of the main body of the crimping device is adversely affected. In order to do so, a heat insulating material 102 is provided.
JP 2001-358455 A Japanese Patent Laid-Open No. 10-41340 JP-A-8-274131

しかしながら、上記の従来例では、断熱材102として樹脂性の断熱材を使用しているために、経時熱劣化を起こし、組み付け精度が変化(熱収縮/割れ)する場合がある。また、耐久性においても、370℃という高温のもとで、繰り返し圧力を加えるために、断熱材102が炭化し、30日間に1回程度の割合で断熱材の耐久の限界に至り割れが生じるため、断熱材102の交換が必要であった。また、工程管理上では、熱圧着されたワークの定時抜き取りによる手動電気検査及び、圧着面の感圧紙チェックを実施しているが、断熱材の熱劣化収縮等の精度変化による圧着不良は検出が困難な状況で、主に断熱材を定期的に交換することで対応していた。   However, in the above conventional example, since a resinous heat insulating material is used as the heat insulating material 102, heat deterioration with time may occur, and the assembly accuracy may change (heat shrinkage / cracking). Also, in terms of durability, in order to repeatedly apply pressure at a high temperature of 370 ° C., the heat insulating material 102 is carbonized, reaching the limit of the durability of the heat insulating material at a rate of about once every 30 days, and cracking occurs. Therefore, the heat insulating material 102 needs to be replaced. For process management, manual electrical inspection by periodic sampling of thermocompression-bonded workpieces and pressure-sensitive paper check of the crimping surface are carried out, but crimping defects due to changes in accuracy such as thermal deterioration and shrinkage of heat insulating material can be detected. In difficult situations, we mainly responded by regularly replacing the insulation.

そこで、本発明は、上記事情に鑑みてなされたものであり、その目的は、ヒーターツールを高温に加熱しても熱圧着面に加わる圧力を均一に保ちつつ、ヒーターツールから装置本体へ伝わる熱を断熱することができるようにすることである。   Therefore, the present invention has been made in view of the above circumstances, and its purpose is to provide heat transmitted from the heater tool to the apparatus main body while maintaining a uniform pressure applied to the thermocompression bonding surface even when the heater tool is heated to a high temperature. Is to be able to insulate.

上述した課題を解決し、目的を達成するために、本発明に係わる熱圧着装置は、発熱源を備える加熱部材をワークに押し付け、該ワークを熱圧着する熱圧着装置において、前記加熱部材を前記熱圧着装置の本体部に支持するための支持部材と、該支持部材と前記加熱部材との間に配置され、冷却媒体を通過させるための第1の流体通路を備える断熱部材と、を具備することを特徴とする。   In order to solve the above-described problems and achieve the object, a thermocompression bonding apparatus according to the present invention is a thermocompression bonding apparatus that presses a heating member having a heat generation source against a workpiece and thermocompression-bonds the workpiece. A support member for supporting the main body portion of the thermocompression bonding apparatus; and a heat insulating member that is disposed between the support member and the heating member and includes a first fluid passage for allowing a cooling medium to pass therethrough. It is characterized by that.

また、この発明に係わる熱圧着装置において、前記第1の流体通路を通過した冷却媒体は、前記断熱部材に接続された配管により外部に排出されることを特徴とする。
また、この発明に係わる熱圧着装置において、前記支持部材は、前記第1の流体通路に連通する第2の流体通路を備え、前記冷却媒体は、前記第2の流体通路から前記第1の流体通路に供給されることを特徴とする。
In the thermocompression bonding apparatus according to the present invention, the cooling medium that has passed through the first fluid passage is discharged to the outside through a pipe connected to the heat insulating member.
In the thermocompression bonding apparatus according to the present invention, the support member includes a second fluid passage that communicates with the first fluid passage, and the cooling medium is supplied from the second fluid passage to the first fluid. It is supplied to the passage.

また、この発明に係わる熱圧着装置において、前記断熱部材は、前記加熱部材との間の中央部に空間を備え、前記支持部材と前記断熱部材と前記加熱部材とはそれらの端部で互いに固定されていることを特徴とする。   Further, in the thermocompression bonding apparatus according to the present invention, the heat insulating member includes a space in a central portion between the heating member and the support member, the heat insulating member, and the heating member are fixed to each other at their end portions. It is characterized by being.

また、この発明に係わる熱圧着装置において、前記冷却媒体は空気であることを特徴とする。   In the thermocompression bonding apparatus according to the present invention, the cooling medium is air.

また、この発明に係わる熱圧着装置において、前記断熱部材は、金属材料から形成されていることを特徴とする。   In the thermocompression bonding apparatus according to the present invention, the heat insulating member is made of a metal material.

本発明によれば、ヒーターツールを高温に加熱しても熱圧着面に加わる圧力を均一に保ちつつ、ヒーターツールから装置本体へ伝わる熱を断熱することが可能となる。   ADVANTAGE OF THE INVENTION According to this invention, even if a heater tool is heated to high temperature, it becomes possible to insulate the heat | fever transmitted from a heater tool to an apparatus main body, maintaining the pressure added to a thermocompression bonding surface uniformly.

以下、本発明の好適な一実施形態について、図面を参照して詳細に説明する。   Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings.

図1は本発明の一実施形態に係わる電子部品のワーク熱圧着装置の斜視図であり、図2は熱圧着ヘッドの正面断面図、図3は熱圧着ヘッドの保持部部分の側断面図である。   1 is a perspective view of a thermocompression bonding apparatus for electronic parts according to an embodiment of the present invention, FIG. 2 is a front sectional view of a thermocompression bonding head, and FIG. 3 is a side sectional view of a holding portion of the thermocompression bonding head. is there.

まず、図1を参照してワーク熱圧着装置の構造について説明する。   First, the structure of the workpiece thermocompression bonding apparatus will be described with reference to FIG.

圧着作業を行うための受け台9の上に、プリント基板5−1が置かれ、重ねて異方性導電膜5−3が載せられ、フレキシブル基板5−2が重ねられる。これらのプリント基板5−1、フレキシブル基板5−2、異方性導電膜5−3を合わせてワーク5と呼ぶことにする。このワーク5の上方にあり、Z軸方向に昇降するシリンダロッド20には、熱圧着ヘッド16を保持する保持部1が固定されている。熱圧着ヘッド16は、保持部1に装着された断熱ブロック2と、断熱ブロック2の下端部に装着されたヒーターツール(加熱部材)3とを備えている。シリンダロッド20がZ軸方向に駆動されることによって、ヒーターツール3がワーク5に対して降下する。そして、ワーク5のフレキシブル基板5−2を所定の荷重で押圧しながら、異方性導電膜5−3を加熱することにより、フレキシブル基板5−2がプリント基板5−1に熱圧着される。   A printed circuit board 5-1 is placed on a cradle 9 for performing a crimping operation, and an anisotropic conductive film 5-3 is placed thereon, and a flexible board 5-2 is placed thereon. The printed circuit board 5-1, the flexible circuit board 5-2, and the anisotropic conductive film 5-3 are collectively referred to as a work 5. A holding portion 1 that holds the thermocompression bonding head 16 is fixed to a cylinder rod 20 that is above the workpiece 5 and moves up and down in the Z-axis direction. The thermocompression bonding head 16 includes a heat insulation block 2 attached to the holding portion 1 and a heater tool (heating member) 3 attached to the lower end portion of the heat insulation block 2. When the cylinder rod 20 is driven in the Z-axis direction, the heater tool 3 is lowered with respect to the workpiece 5. And the flexible substrate 5-2 is thermocompression-bonded to the printed circuit board 5-1, by heating the anisotropic conductive film 5-3, pressing the flexible substrate 5-2 of the workpiece | work 5 with a predetermined load.

図2及び図3を参照して、熱圧着ヘッドの構造について説明する。   The structure of the thermocompression bonding head will be described with reference to FIGS.

熱圧着ヘッドの正面断面図である図2及び側断面図である図3に示す様に、保持部1の内部には、通気孔6が設けられており、エアーを外部から流し込むための通路を形成している。通気孔6は、正面から下に向かって保持部1を貫通し、断熱ブロック2の空気溜まり(凹形状部2a)まで達している。断熱ブロック2は、保持部1と接する側の中央部分に空気溜まりとなる凹形状部2aを備えている。更に、通気孔7は、凹形状部2aとともに、保持部1の側面の開口部7aに連通する通路を形成しており、通気孔6から入ったエアーを配管8を介して外部に開放している。なお、配管8の後端には不図示のエアー吸引源が接続されている。この構成によれば、断熱ブロック2に従来のような樹脂材料でなく金属材料を使用した場合でも、断熱ブロック2内に常時冷却エアーを流すことにより、ヒーターツール3からの熱を断熱ブロック2と保持部1で分断することができ、ヒーターツール3の熱が熱圧着装置本体に伝達されることが防止される。   As shown in FIG. 2, which is a front sectional view of the thermocompression bonding head, and FIG. 3, which is a side sectional view, a ventilation hole 6 is provided inside the holding portion 1, and a passage for flowing air from the outside is provided. Forming. The ventilation hole 6 penetrates the holding part 1 from the front to the bottom and reaches the air reservoir (concave part 2a) of the heat insulating block 2. The heat insulating block 2 includes a concave portion 2 a that becomes an air reservoir in the central portion on the side in contact with the holding portion 1. Further, the vent hole 7 forms a passage that communicates with the concave portion 2 a and the opening 7 a on the side surface of the holding portion 1, and opens the air from the vent hole 6 to the outside through the pipe 8. Yes. An air suction source (not shown) is connected to the rear end of the pipe 8. According to this configuration, even when a metal material is used for the heat insulating block 2 instead of a conventional resin material, the heat from the heater tool 3 is transferred to the heat insulating block 2 by constantly flowing cooling air through the heat insulating block 2. It can be divided by the holding part 1, and the heat of the heater tool 3 is prevented from being transmitted to the thermocompression bonding apparatus main body.

なお、保持部1と断熱ブロック2とヒーターツール3とをそれらの両端で固定して高温に加熱すると、熱膨張によりヒーターツール3の先端部中央が膨らんでしまう。これを回避するために、断熱ブロック2とヒーターツール3の間に切り欠いた空間2bを設けるとともに、エアーを保持部1の中央から流し込んで冷却する。これにより、ヒーターツール3の先端部中央の膨らみを緩和することができ、ヒーターツール3の先端部の全面でワーク5を均一に熱圧着することが出来る。   In addition, if the holding | maintenance part 1, the heat insulation block 2, and the heater tool 3 are fixed at those both ends and it heats to high temperature, the front-end | tip part center of the heater tool 3 will swell by thermal expansion. In order to avoid this, a notched space 2b is provided between the heat insulating block 2 and the heater tool 3, and air is poured from the center of the holding unit 1 to cool it. Thereby, the swelling at the center of the front end portion of the heater tool 3 can be alleviated, and the workpiece 5 can be uniformly thermocompression bonded over the entire front end portion of the heater tool 3.

更に、図4に示す従来の断熱ブロック102では、樹脂系の断熱材を使用していることにより、経時熱劣化で収縮してヒーターツール3の先端位置の精度変化が起こったり、断熱ブロック2が欠けたりしていたのに対して、本実施形態の断熱ブロック2では、金属で形成しているので、繰り返し動作をしても、先端位置の精度変化が起きないで熱圧着することが出来る。   Furthermore, in the conventional heat insulation block 102 shown in FIG. 4, since the resin-based heat insulating material is used, the accuracy of the tip position of the heater tool 3 is changed due to heat deterioration over time, or the heat insulation block 2 is In contrast, since the heat insulating block 2 of the present embodiment is made of metal, it can be thermocompression bonded without repeating the accuracy of the tip position even if it is repeatedly operated.

また、ヒーターツール3には、ヒーター4が挿入されており、例えば先端温度200℃の温度調整をするために、ヒーターツール3の先端部に配置された熱電対10(図1参照)により温度を検出しながら、ヒーター4を例えば370℃に加熱する。そして、ヒーターツール3の先端部でワーク5を全面均一に押圧して熱圧着する。   Moreover, the heater 4 is inserted in the heater tool 3, and the temperature is adjusted by a thermocouple 10 (see FIG. 1) disposed at the tip of the heater tool 3 in order to adjust the temperature at a tip temperature of 200 ° C., for example. While detecting, the heater 4 is heated to 370 ° C., for example. And the workpiece | work 5 is uniformly pressed by the front-end | tip part of the heater tool 3, and it thermocompression-bonds.

以上説明したように。本実施形態に係わるワーク熱圧着装置では、保持部に通気孔を設けて空気を流し込むことで断熱ブロックを冷却し、装置本体との熱分断を図ることができる。   As explained above. In the work thermocompression bonding apparatus according to the present embodiment, the heat insulating block can be cooled by providing a ventilation hole in the holding portion and flowing air, thereby dividing the heat from the apparatus main body.

また、従来の断熱材に比べて高温に加熱しても、熱収縮/割れを生ずることなくワークを均一に熱圧着できる。   Further, even when heated to a higher temperature than conventional heat insulating materials, the workpiece can be uniformly thermocompressed without causing thermal shrinkage / cracking.

また、保持部の中央部分からの冷却機能と断熱ブロックの中央部に空間を備えたことで、ヒーターツールの圧着面中央の出っ張りを緩和し、熱圧着面の位置精度を安定化させることができる。   In addition, by providing a cooling function from the central part of the holding part and a space in the central part of the heat insulation block, it is possible to relax the protrusion at the center of the crimping surface of the heater tool and stabilize the positional accuracy of the thermocompression bonding surface. .

これにより、本装置の設置時に、圧着面の位置出しを行えば、以後調整が不要になり、生産中の調整作業等の負荷低減ができ生産性向上につながる。   As a result, if the crimping surface is positioned at the time of installation of the present apparatus, no adjustment is necessary thereafter, and the load during adjustment work during production can be reduced, leading to improved productivity.

また、排気管(配管8)は、装置外部に引き回しているので、ゴミ等の進入もなく環境の清浄度を維持したまま生産を行なうことが出来る。   Further, since the exhaust pipe (pipe 8) is routed outside the apparatus, it is possible to carry out production while maintaining the cleanliness of the environment without entering dust.

なお、上記の説明では、保持部と断熱ブロックの双方に通気孔を設けるように説明したが、断熱ブロックのみに通気孔を設けるようにしてもよい。   In the above description, the air holes are provided in both the holding portion and the heat insulating block, but the air holes may be provided only in the heat insulating block.

また、上記の説明では、冷却媒体として空気を使用する場合について説明したが、その他の気体や液体であってもよい。   In the above description, the case where air is used as the cooling medium has been described. However, other gases and liquids may be used.

本発明の一実施形態に係わる電子部品のワーク熱圧着装置の斜視図である。It is a perspective view of the workpiece | work thermocompression bonding apparatus of the electronic component concerning one Embodiment of this invention. 熱圧着ヘッドの正面断面図である。It is front sectional drawing of a thermocompression-bonding head. 熱圧着ヘッドの保持部部分の側断面図である。It is a sectional side view of the holding | maintenance part part of a thermocompression bonding head. 従来例を説明する図である。It is a figure explaining a prior art example.

符号の説明Explanation of symbols

1 保持部
2 断熱ブロック
3 ヒーターツール
4 ヒーター
5 ワーク
6 通気孔(供給)
7 通気孔(排出)
8 配管
9 受け台
10 熱電対
1 Holding part 2 Heat insulation block
3 Heater tool 4 Heater 5 Work 6 Vent hole (supply)
7 Vent (discharge)
8 Piping 9 Receiving base 10 Thermocouple

Claims (6)

発熱源を備える加熱部材をワークに押し付け、該ワークを熱圧着する熱圧着装置において、
前記加熱部材を前記熱圧着装置の本体部に支持するための支持部材と、
該支持部材と前記加熱部材との間に配置され、冷却媒体を通過させるための第1の流体通路を備える断熱部材と、
を具備することを特徴とする熱圧着装置。
In a thermocompression bonding apparatus that presses a heating member provided with a heat source against a work and thermocompression-bonds the work,
A support member for supporting the heating member on the main body of the thermocompression bonding apparatus;
A heat insulating member that is disposed between the support member and the heating member and includes a first fluid passage for passing a cooling medium;
A thermocompression bonding apparatus comprising:
前記第1の流体通路を通過した冷却媒体は、前記断熱部材に接続された配管により外部に排出されることを特徴とする請求項1に記載の熱圧着装置。   The thermocompression bonding apparatus according to claim 1, wherein the cooling medium that has passed through the first fluid passage is discharged to the outside through a pipe connected to the heat insulating member. 前記支持部材は、前記第1の流体通路に連通する第2の流体通路を備え、前記冷却媒体は、前記第2の流体通路から前記第1の流体通路に供給されることを特徴とする請求項1に記載の熱圧着装置。   The support member includes a second fluid passage communicating with the first fluid passage, and the cooling medium is supplied from the second fluid passage to the first fluid passage. Item 2. The thermocompression bonding apparatus according to item 1. 前記断熱部材は、前記加熱部材との間の中央部に空間を備え、前記支持部材と前記断熱部材と前記加熱部材とはそれらの端部で互いに固定されていることを特徴とする請求項1に記載の熱圧着装置。   The heat insulating member includes a space in a central portion between the heating member and the supporting member, the heat insulating member, and the heating member are fixed to each other at their end portions. The thermocompression bonding apparatus described in 1. 前記冷却媒体は空気であることを特徴とする請求項1に記載の熱圧着装置。   The thermocompression bonding apparatus according to claim 1, wherein the cooling medium is air. 前記断熱部材は、金属材料から形成されていることを特徴とする請求項1に記載の熱圧着装置。   The thermocompression bonding apparatus according to claim 1, wherein the heat insulating member is made of a metal material.
JP2004161570A 2004-05-31 2004-05-31 Thermocompression bonding machine Pending JP2005347303A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004161570A JP2005347303A (en) 2004-05-31 2004-05-31 Thermocompression bonding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004161570A JP2005347303A (en) 2004-05-31 2004-05-31 Thermocompression bonding machine

Publications (2)

Publication Number Publication Date
JP2005347303A true JP2005347303A (en) 2005-12-15
JP2005347303A5 JP2005347303A5 (en) 2007-07-12

Family

ID=35499434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004161570A Pending JP2005347303A (en) 2004-05-31 2004-05-31 Thermocompression bonding machine

Country Status (1)

Country Link
JP (1) JP2005347303A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012204604A (en) * 2011-03-25 2012-10-22 Fujikoshi Mach Corp Work sticking method and work sticking device
JP2014140032A (en) * 2013-01-21 2014-07-31 Vesi Switzerland Ag Bonding head having suction member capable of heating and cooling
CN104282586A (en) * 2013-07-02 2015-01-14 库利克和索夫工业公司 Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
JP2015233138A (en) * 2014-06-10 2015-12-24 セメス株式会社Semes Co., Ltd. Bonding head and die bonding device including the same
CN111390465A (en) * 2020-01-20 2020-07-10 武汉高芯科技有限公司 Hydraulic device for flip-chip welding

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1041355A (en) * 1996-07-24 1998-02-13 Toray Eng Co Ltd Thermocompression bonding tool
JP2001060757A (en) * 1999-06-14 2001-03-06 Sharp Corp Method for mounting external and thermocompression bonding device
JP2004031885A (en) * 2002-04-30 2004-01-29 Toray Eng Co Ltd Bonding method and apparatus therefor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1041355A (en) * 1996-07-24 1998-02-13 Toray Eng Co Ltd Thermocompression bonding tool
JP2001060757A (en) * 1999-06-14 2001-03-06 Sharp Corp Method for mounting external and thermocompression bonding device
JP2004031885A (en) * 2002-04-30 2004-01-29 Toray Eng Co Ltd Bonding method and apparatus therefor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012204604A (en) * 2011-03-25 2012-10-22 Fujikoshi Mach Corp Work sticking method and work sticking device
JP2014140032A (en) * 2013-01-21 2014-07-31 Vesi Switzerland Ag Bonding head having suction member capable of heating and cooling
CN104282586A (en) * 2013-07-02 2015-01-14 库利克和索夫工业公司 Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
JP2015233138A (en) * 2014-06-10 2015-12-24 セメス株式会社Semes Co., Ltd. Bonding head and die bonding device including the same
CN111390465A (en) * 2020-01-20 2020-07-10 武汉高芯科技有限公司 Hydraulic device for flip-chip welding
CN111390465B (en) * 2020-01-20 2022-03-22 武汉高芯科技有限公司 Hydraulic device for flip-chip welding

Similar Documents

Publication Publication Date Title
KR100993079B1 (en) Bonding apparatus
RU2333622C1 (en) Method and system of thermal connection and disconnection of components for surface mounting
US7667474B2 (en) Probe device
US9338935B2 (en) System for removing an electronic component from a substrate
US7425838B2 (en) Body for keeping a wafer and wafer prober using the same
JP4986830B2 (en) Substrate holder and method for manufacturing the same
CN111344855B (en) Chuck plate, chuck structure with chuck plate and welding device with chuck structure
JP2010129890A (en) Bonding head
US20080156789A1 (en) Platen for use with a thermal attach and detach system which holds components by vacuum suction
JP2005347303A (en) Thermocompression bonding machine
JP5257149B2 (en) Solder removing apparatus and solder removing method
JP2006324581A (en) Electronic component bonding device
JP4385895B2 (en) Bonding equipment
JP2007311679A (en) Thermocompression apparatus for electronic components
CN101193498A (en) Printed circuit board, printed circuit board assembly, manufacturing method of printed circuit board, warpage correcting method of printed circuit board and electronic device
JP4733441B2 (en) Electronic component joining equipment
JPH04364090A (en) Soldering jig
JP3539826B2 (en) Thermocompression tools
JP4323419B2 (en) Thermocompression bonding tool and thermocompression bonding apparatus
JP2001358455A (en) Thermo compression bonding device and method of electronic component
US20230321925A1 (en) Method for connecting a film to a substrate
JP2006222100A (en) Hot press heater
JP2007115924A (en) Method for manufacturing bonded structure
JP2812304B2 (en) Repair method for flip-chip type semiconductor device
JP2006102761A (en) Method for producing low melting point brazing clad plate

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070525

A621 Written request for application examination

Effective date: 20070525

Free format text: JAPANESE INTERMEDIATE CODE: A621

RD03 Notification of appointment of power of attorney

Effective date: 20070525

Free format text: JAPANESE INTERMEDIATE CODE: A7423

A977 Report on retrieval

Effective date: 20090511

Free format text: JAPANESE INTERMEDIATE CODE: A971007

A131 Notification of reasons for refusal

Effective date: 20090522

Free format text: JAPANESE INTERMEDIATE CODE: A131

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090716

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090807

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091005

A02 Decision of refusal

Effective date: 20100427

Free format text: JAPANESE INTERMEDIATE CODE: A02