JP2006520273A5 - - Google Patents

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Publication number
JP2006520273A5
JP2006520273A5 JP2006507667A JP2006507667A JP2006520273A5 JP 2006520273 A5 JP2006520273 A5 JP 2006520273A5 JP 2006507667 A JP2006507667 A JP 2006507667A JP 2006507667 A JP2006507667 A JP 2006507667A JP 2006520273 A5 JP2006520273 A5 JP 2006520273A5
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Prior art keywords
polishing
polishing pad
pad
fixed
polished
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JP2006507667A
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Japanese (ja)
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JP2006520273A (en
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Priority claimed from PCT/JP2004/003378 external-priority patent/WO2004080654A1/en
Publication of JP2006520273A publication Critical patent/JP2006520273A/en
Publication of JP2006520273A5 publication Critical patent/JP2006520273A5/ja
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Claims (19)

研磨対象物を研磨する研磨工具であって、
上面に複数の凹部を有する研磨テーブルと、
前記研磨テーブルの上面に固定される研磨パッドであって、前記凹部内に収容されて前記研磨テーブルに固定される複数の研磨パッド片を有する研磨パッドと、
を備えた、研磨工具。 A polishing tool for polishing an object to be polished,
A polishing table having a plurality of recesses on the upper surface ;
A polishing pad fixed to the upper surface of the polishing table, the polishing pad having a plurality of polishing pad pieces housed in the recess and fixed to the polishing table;
A polishing tool equipped with. 研磨対象物を研磨する研磨工具であって、
内部に複数の貫通穴を設けた保持プレートを有する研磨テーブルと、
前記研磨テーブルの上面に固定される研磨パッドであって、前記保持プレートの貫通穴内に収容されて前記研磨テーブルに固定される複数の研磨パッド片を有する研磨パッドと、
を備えた、研磨工具。 A polishing tool for polishing an object to be polished,
A polishing table having a holding plate provided with a plurality of through holes therein ;
A polishing pad fixed to the upper surface of the polishing table, the polishing pad having a plurality of polishing pad pieces received in the through holes of the holding plate and fixed to the polishing table;
A polishing tool equipped with . 前記研磨パッド片は、前記凹部内に収容されて前記研磨テーブルに固定される台座の上面に固定されている、請求項１に記載の研磨工具。The polishing tool according to claim 1, wherein the polishing pad piece is fixed to an upper surface of a pedestal accommodated in the recess and fixed to the polishing table. 前記研磨パッド片は、前記保持プレートの貫通穴内に収容されて前記研磨テーブルに固定される台座の上面に固定されている、請求項２に記載の研磨工具。 The polishing tool according to claim 2 , wherein the polishing pad piece is fixed to an upper surface of a base that is received in the through hole of the holding plate and fixed to the polishing table . 前記研磨パッド片は、隣接する研磨パッド片の間に隙間を形成するように配置される、請求項１から４のいずれか一項に記載の研磨工具。 The said polishing pad piece is a polishing tool as described in any one of Claim 1 to 4 arrange | positioned so that a clearance gap may be formed between adjacent polishing pad pieces. 前記隙間に配置される少なくとも１つの堰をさらに備えた、請求項５に記載の研磨工具。 The polishing tool according to claim 5 , further comprising at least one weir disposed in the gap. 前記研磨パッド片は、それぞれ前記研磨対象物よりも寸法が小さい、請求項１から６のいずれか一項に記載の研磨工具。 The polishing tool according to any one of claims 1 to 6 , wherein each of the polishing pad pieces has a size smaller than that of the object to be polished. 前記複数の研磨パッド片は、
少なくとも１つの第１の研磨パッド片と、
前記少なくとも１つの第１の研磨パッド片の材料物性または表面形状とは異なる材料物性または表面形状を有する少なくとも１つの第２の研磨パッド片と、
を備えた、請求項１から７のいずれか一項に記載の研磨工具。 The plurality of polishing pad pieces are:
At least one first polishing pad piece;
At least one second polishing pad piece having a material property or surface shape different from a material property or surface shape of the at least one first polishing pad piece;
With a polishing tool according to any one of claims 1 to 7. 研磨テーブルに研磨パッドを固定する方法であって、
高温で軟化して接着力が低下し、常温で硬化して接着力が発現する感熱型接着剤を前記研磨テーブルと前記研磨パッドとの間に塗布し、
前記研磨パッドが前記研磨テーブル上に配置されたときに前記感熱型接着剤を加熱し、
前記加熱後に前記感熱型接着剤を冷却して前記研磨パッドを前記研磨テーブルに接着する、方法。 A method of fixing a polishing pad to a polishing table,
Applying a heat-sensitive adhesive that softens at high temperature and decreases in adhesive strength and cures at room temperature to develop adhesive force between the polishing table and the polishing pad,
Heating the thermosensitive adhesive when the polishing pad is placed on the polishing table;
Cooling the thermal adhesive after the heating to bond the polishing pad to the polishing table. 前記加熱または冷却は、温度調整された加熱または冷却媒体を前記研磨テーブル内部に導入することを含む、請求項９に記載の方法。 The method according to claim 9 , wherein the heating or cooling includes introducing a temperature-controlled heating or cooling medium into the polishing table. 前記加熱または冷却は、前記研磨パッドの非接着面近傍に設けられた加熱装置または冷却装置により前記感熱型接着剤を加熱または冷却することを含む、請求項９に記載の方法。 The heating or cooling includes heating or cooling the heat-sensitive adhesive by the non-adhesive surface is provided near the heating unit or cooling unit for the polishing pad The method of claim 9. 研磨対象物を研磨する研磨装置であって、
研磨テーブルと、
前記研磨テーブルの上面に固定される研磨パッドであって、前記研磨テーブルに固定される複数の研磨パッド片を有する研磨パッドと、
前記研磨対象物を前記研磨パッドに押圧するトップリングと、
前記研磨テーブルに設けられ、隣接する研磨パッド片の間に形成された開口を通して前記研磨対象物の表面に光を照射する光源と、
前記研磨テーブルに設けられ、前記研磨対象物から反射した光を受光する受光部と、
を備えた、研磨装置。 A polishing apparatus for polishing an object to be polished,
A polishing table;
A polishing pad fixed to the upper surface of the polishing table, the polishing pad having a plurality of polishing pad pieces fixed to the polishing table;
A top ring that presses the polishing object against the polishing pad;
A light source that is provided on the polishing table and irradiates light on the surface of the object to be polished through an opening formed between adjacent polishing pad pieces;
A light receiving portion that is provided on the polishing table and receives light reflected from the polishing object;
A polishing apparatus comprising: 研磨対象物を研磨する研磨装置であって、
研磨テーブルと、
前記研磨テーブルの上面に固定される複数の台座と、
前記複数の台座に固定される複数の研磨パッド片を有する研磨パッドと、
前記研磨対象物を前記研磨パッドに押圧するトップリングと、
前記研磨テーブルに設けられ、隣接する研磨パッド片の間に形成された開口を通して前記研磨対象物の表面に光を照射する光源と、
前記研磨テーブルに設けられ、前記研磨対象物から反射した光を受光する受光部と、
を備えた、研磨装置。 A polishing apparatus for polishing an object to be polished,
A polishing table;
A plurality of pedestals fixed to the upper surface of the polishing table;
A polishing pad having a plurality of polishing pad pieces fixed to the plurality of pedestals;
A top ring that presses the polishing object against the polishing pad;
A light source that is provided on the polishing table and irradiates light on the surface of the object to be polished through an opening formed between adjacent polishing pad pieces;
A light receiving portion that is provided on the polishing table and receives light reflected from the polishing object;
A polishing apparatus comprising: 研磨対象物を研磨する研磨装置であって、
研磨テーブルと、
前記研磨テーブルの上面に固定される研磨パッドであって、少なくとも１つの光透過片と前記研磨テーブルに固定される複数の研磨パッド片とを有する研磨パッドと、
前記研磨対象物を前記研磨パッドに押圧するトップリングと、
前記研磨テーブルに設けられ、前記少なくとも１つの光透過片を通して前記研磨対象物の表面に光を照射する光源と、
前記研磨テーブルに設けられ、前記研磨対象物から反射した光を受光する受光部と、
を備えた、研磨装置。 A polishing apparatus for polishing an object to be polished,
A polishing table;
A polishing pad fixed to the upper surface of the polishing table, the polishing pad having at least one light transmitting piece and a plurality of polishing pad pieces fixed to the polishing table;
A top ring that presses the polishing object against the polishing pad;
A light source that is provided on the polishing table and irradiates light onto the surface of the object to be polished through the at least one light transmitting piece;
A light receiving portion that is provided on the polishing table and receives light reflected from the polishing object;
A polishing apparatus comprising: 研磨対象物を研磨する研磨装置であって、
研磨テーブルと、
前記研磨テーブルの上面に固定される複数の台座と、
少なくとも１つの光透過片と前記複数の台座に固定される複数の研磨パッド片を有する研磨パッドと、
前記研磨対象物を前記研磨パッドに押圧するトップリングと、
前記研磨テーブルに設けられ、前記少なくとも１つの光透過片を通して前記研磨対象物の表面に光を照射する光源と、
前記研磨テーブルに設けられ、前記研磨対象物から反射した光を受光する受光部と、
を備えた、研磨装置。 A polishing apparatus for polishing an object to be polished,
A polishing table;
A plurality of pedestals fixed to the upper surface of the polishing table;
A polishing pad having at least one light transmitting piece and a plurality of polishing pad pieces fixed to the plurality of pedestals;
A top ring that presses the polishing object against the polishing pad;
A light source that is provided on the polishing table and irradiates light onto the surface of the object to be polished through the at least one light transmitting piece;
A light receiving portion that is provided on the polishing table and receives light reflected from the polishing object;
A polishing apparatus comprising: 研磨対象物を研磨する研磨装置であって、
研磨テーブルと、
前記研磨テーブルの上面に固定される研磨パッドであって、前記研磨テーブルに固定される複数の研磨パッド片を有する研磨パッドと、
前記研磨対象物を前記研磨パッドに押圧するトップリングと、
前記研磨テーブルに設けられ、前記複数の研磨パッド片のうち少なくとも１つに形成された少なくとも１つの貫通孔を通して前記研磨対象物の表面に光を照射する光源と、
前記研磨テーブルに設けられ、前記研磨対象物から反射した光を受光する受光部と、
前記少なくとも１つの貫通孔に位置合わせされた、測定流体を供給する流体供給路と、
前記少なくとも１つの貫通孔に位置合わせされた、前記測定流体を排出する流体排出路と、
を備えた、研磨装置。 A polishing apparatus for polishing an object to be polished,
A polishing table;
A polishing pad fixed to the upper surface of the polishing table, the polishing pad having a plurality of polishing pad pieces fixed to the polishing table;
A top ring that presses the polishing object against the polishing pad;
A light source that is provided on the polishing table and that irradiates light on the surface of the object to be polished through at least one through-hole formed in at least one of the plurality of polishing pad pieces;
A light receiving portion that is provided on the polishing table and receives light reflected from the polishing object;
A fluid supply path for supplying a measurement fluid, which is aligned with the at least one through hole;
A fluid discharge path for discharging the measurement fluid, which is aligned with the at least one through hole;
A polishing apparatus comprising: 研磨対象物を研磨する研磨装置であって、
研磨テーブルと、
前記研磨テーブルの上面に固定される複数の台座と、
前記複数の台座に固定される複数の研磨パッド片を有する研磨パッドと、
前記研磨対象物を前記研磨パッドに押圧するトップリングと、
前記研磨テーブルに設けられ、前記複数の研磨パッド片のうち少なくとも１つに形成された少なくとも１つの貫通孔と前記複数の台座のうち少なくとも１つに形成された少なくとも１つの貫通孔とを通して前記研磨対象物の表面に光を照射する光源と、
前記研磨テーブルに設けられ、前記研磨対象物から反射した光を受光する受光部と、
前記複数の研磨パッド片のうち少なくとも１つに形成された少なくとも１つの貫通孔と前記複数の台座のうち少なくとも１つに形成された少なくとも１つの貫通孔とに位置合わせされた、測定流体を供給する流体供給路と、
前記複数の研磨パッド片のうち少なくとも１つに形成された少なくとも１つの貫通孔と前記複数の台座のうち少なくとも１つに形成された少なくとも１つの貫通孔とに位置合わせされた、前記測定流体を排出する流体排出路と、
を備えた、研磨装置。 A polishing apparatus for polishing an object to be polished,
A polishing table;
A plurality of pedestals fixed to the upper surface of the polishing table;
A polishing pad having a plurality of polishing pad pieces fixed to the plurality of pedestals;
A top ring that presses the polishing object against the polishing pad;
The polishing is performed through at least one through-hole provided in the polishing table and formed in at least one of the plurality of polishing pad pieces and at least one through-hole formed in at least one of the plurality of pedestals. A light source that irradiates light on the surface of the object;
A light receiving portion that is provided on the polishing table and receives light reflected from the polishing object;
Supplying measurement fluid aligned with at least one through hole formed in at least one of the plurality of polishing pad pieces and at least one through hole formed in at least one of the plurality of bases A fluid supply path to
The measurement fluid aligned with at least one through-hole formed in at least one of the plurality of polishing pad pieces and at least one through-hole formed in at least one of the plurality of pedestals. A fluid discharge passage for discharging;
A polishing apparatus comprising: 研磨対象物を研磨する研磨装置であって、
研磨テーブルと、
前記研磨テーブルの上面に固定される研磨パッドであって、
研磨液を流通させるための前記研磨パッドの上面の溝と、
前記研磨液の流れを阻害する、前記溝に設けられた堰と、
を含む研磨パッドと、
前記研磨対象物を前記研磨パッドに押圧するトップリングと、
を備えた、研磨装置。 A polishing apparatus for polishing an object to be polished,
A polishing table;
A polishing pad fixed to the upper surface of the polishing table,
A groove on the upper surface of the polishing pad for circulating a polishing liquid;
A weir provided in the groove to inhibit the flow of the polishing liquid;
A polishing pad comprising:
A top ring that presses the polishing object against the polishing pad;
A polishing apparatus comprising: 研磨対象物を研磨する研磨装置であって、
研磨テーブルと、
液晶材料からなる接着剤により前記研磨テーブルの上面に接着された研磨パッドと、
前記研磨対象物を前記研磨パッドに押圧するトップリングと、
を備えた、研磨装置。 A polishing apparatus for polishing an object to be polished,
A polishing table;
A polishing pad bonded to the upper surface of the polishing table with an adhesive made of a liquid crystal material;
A top ring that presses the polishing object against the polishing pad;
A polishing apparatus comprising:
JP2006507667A 2003-03-14 2004-03-12 Polishing tool and polishing apparatus Withdrawn JP2006520273A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003070894 2003-03-14
PCT/JP2004/003378 WO2004080654A1 (en) 2003-03-14 2004-03-12 Polishing tool and polishing apparatus

Publications (2)

Publication Number Publication Date
JP2006520273A JP2006520273A (en) 2006-09-07
JP2006520273A5 true JP2006520273A5 (en) 2007-04-26

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Family Applications (1)

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Country Status (3)

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US (1) US20060172665A1 (en)
JP (1) JP2006520273A (en)
WO (1) WO2004080654A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005294412A (en) * 2004-03-31 2005-10-20 Toyo Tire & Rubber Co Ltd Polishing pad
US20090258585A1 (en) * 2006-02-01 2009-10-15 Fred Miekka Sanding Surfaces Having High Abrasive Loading
EP2323808B1 (en) * 2008-07-18 2015-09-30 3M Innovative Properties Company Polishing pad with floating elements and method of making and using the same
JP5809816B2 (en) * 2011-03-08 2015-11-11 オリンパス株式会社 Lens polishing dish manufacturing method
CN102513906B (en) * 2011-12-20 2013-10-09 元亮科技有限公司 Sapphire substrate polishing process
EP3421180B1 (en) * 2017-06-30 2023-07-12 Guido Valentini Polishing pad of a hand-held power tool and power tool with such a polishing pad
EP3569360A1 (en) * 2018-05-16 2019-11-20 3M Innovative Properties Company Grinding wheel
USD1004393S1 (en) * 2021-11-09 2023-11-14 Ehwa Diamond Industrial Co., Ltd. Grinding pad

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4560594A (en) * 1982-03-12 1985-12-24 Nordson Corporation Method for forming adhesive bond and a liquid crystal adhesive
JPH0236066A (en) * 1988-07-27 1990-02-06 Hitachi Ltd Abrasive cloth and polishing device
JP2985490B2 (en) * 1992-02-28 1999-11-29 信越半導体株式会社 Heat removal method of polishing machine
AU654901B2 (en) * 1992-03-16 1994-11-24 De Beers Industrial Diamond Division (Proprietary) Limited Polishing pad
JPH07142430A (en) * 1993-09-24 1995-06-02 Fujitsu Ltd Polishing apparatus for semiconductor substrate
JPH09115862A (en) * 1995-10-20 1997-05-02 Hitachi Ltd Polishing tool and polishing method and apparatus using this tool
JP3611404B2 (en) * 1996-06-21 2005-01-19 株式会社荏原製作所 Polishing device
US5888121A (en) * 1997-09-23 1999-03-30 Lsi Logic Corporation Controlling groove dimensions for enhanced slurry flow
JPH11320390A (en) * 1998-05-21 1999-11-24 Ibiden Co Ltd Surface plate for surface machining device and method of using same
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
JP2001062706A (en) * 1999-08-25 2001-03-13 Nikon Corp Polishing device
US6439986B1 (en) * 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
US6422921B1 (en) * 1999-10-22 2002-07-23 Applied Materials, Inc. Heat activated detachable polishing pad
US6520843B1 (en) * 1999-10-27 2003-02-18 Strasbaugh High planarity chemical mechanical planarization
JP2001150332A (en) * 1999-11-22 2001-06-05 Nec Corp Polishing pad and polishing method
JP3854056B2 (en) * 1999-12-13 2006-12-06 株式会社荏原製作所 Substrate film thickness measuring method, substrate film thickness measuring apparatus, substrate processing method, and substrate processing apparatus
US6241596B1 (en) * 2000-01-14 2001-06-05 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing using a patterned pad
US6383058B1 (en) * 2000-01-28 2002-05-07 Applied Materials, Inc. Adaptive endpoint detection for chemical mechanical polishing
JP2001354926A (en) * 2000-06-13 2001-12-25 Sekisui Chem Co Ltd Double-sided adhesive tape for fixing abrasive
DE60110225T2 (en) * 2000-06-19 2006-03-09 Struers A/S A GRINDING AND / OR POLISHING DISK WITH MULTIPLE ZONES
JP2002100592A (en) * 2000-09-20 2002-04-05 Rodel Nitta Co Abrasive pad
JP3826729B2 (en) * 2001-04-25 2006-09-27 Ｊｓｒ株式会社 Polishing pad for semiconductor wafer, polishing multilayer for semiconductor wafer provided with the same, and method for polishing semiconductor wafer
US7070480B2 (en) * 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
US7314402B2 (en) * 2001-11-15 2008-01-01 Speedfam-Ipec Corporation Method and apparatus for controlling slurry distribution
JP2004079663A (en) * 2002-08-13 2004-03-11 Jsr Corp Fixing agent of pad for cmp, fixing method and isolation method of pad for cmp, and working method of wafer
JP2004042163A (en) * 2002-07-09 2004-02-12 Ebara Corp Polishing device and methods for sticking and peeling off consumable/replaceable parts to/from polishing device
US7169014B2 (en) * 2002-07-18 2007-01-30 Micron Technology, Inc. Apparatuses for controlling the temperature of polishing pads used in planarizing micro-device workpieces

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