CN111185858B - Method for processing high-precision superhard abrasive material integral cutting grinding wheel - Google Patents
Method for processing high-precision superhard abrasive material integral cutting grinding wheel Download PDFInfo
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- CN111185858B CN111185858B CN202010131470.7A CN202010131470A CN111185858B CN 111185858 B CN111185858 B CN 111185858B CN 202010131470 A CN202010131470 A CN 202010131470A CN 111185858 B CN111185858 B CN 111185858B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
Abstract
The invention provides a processing method of a high-precision superhard abrasive integral cutting grinding wheel, aiming at the problems of low efficiency, low yield and easy operation condition and environmental pollution when a grinding process is adopted to process a thin cutting grinding wheel in the prior art, the method is that the cutting grinding wheel is a sintering body formed by blending a binding agent and a superhard abrasive, a cutting grinding wheel blank is fixed on a carrier through a thermoplastic material, then the carrier is fixed on a workbench of a grinding machine tool, the blank is processed by a grinding method of the grinding wheel to remove materials, and a finished product with required form and position tolerance and dimensional precision is obtained.
Description
Technical Field
The invention relates to the technical field of manufacturing of high-precision sheet-type superhard abrasive tools, in particular to a method for processing a high-precision integral cutting grinding wheel.
Background
The high-precision integral cutting grinding wheel is commonly called as a scribing cutter or a soft cutter, is widely applied to cutting of precision materials such as optical glass, semiconductor materials, magnetic materials and the like, and has the characteristics of high cutting precision and small cut. The thickness of a cutting grinding wheel used by the grinding wheel is generally 0.1mm-0.5mm, the thinnest can reach 0.05mm, the thickness uniformity of a product is required to be less than or equal to 0.01mm, and the warping deformation is less than 0.2mmm, so that the cutting grinding wheel used by the grinding wheel is called as a high-precision superhard abrasive integral cutting grinding wheel, and the material of the cutting grinding wheel is generally a sintered body formed by blending a metal bonding agent and a superhard abrasive, and a sintered body formed by blending a resin bonding agent and the superhard abrasive; a sintered body of a ceramic bond blended with a superabrasive. The high-precision superhard abrasive material integral cutting grinding wheel is very thin, and the material is high in hardness and difficult to remove, so that the superhard abrasive material integral cutting grinding wheel has the characteristic of hardness and brittleness; therefore, the processing process is easy to damage and deform, so that the processed product has the defects of incompleteness, warping, uneven thickness and the like, and the yield of the product is low; therefore, in the industry, the cutting grinding wheel is processed by a free abrasive grinding method to obtain the cutting grinding wheel with required processing precision.
At present, when high-precision superhard abrasive integral cutting grinding wheels are produced and processed domestically, a double-end-face grinding machine is mostly adopted to grind and process the surfaces of blanks, during processing, certain auxiliary grinding abrasives are added into grinding cooling liquid to form free grinding abrasives, the grinding abrasives are on the surfaces of grinding discs in a free state, and when force is applied to the grinding discs, the free grinding abrasives extrude and wipe the surfaces of the blanks so as to remove materials on the two side surfaces of the blanks and obtain products with precision requirements; the precision of the cutting grinding wheel processed by the method can meet the requirement, but because the free abrasive is used for grinding the 0.1-0.5mm thin metal material or ceramic material containing diamond, the added auxiliary grinding material has fine granularity, and the speed of removing the material during grinding is low, the processing period is long, and the single processing quantity is limited, so the overall manufacturing efficiency is low; the cutting grinding wheel is very thin and the material is difficult to remove, so that the cutting grinding wheel has the characteristic of hard brittleness; therefore, the cutting grinding wheel is easy to deform and damage in the grinding process, so that the yield is low, the thinner the product is, the lower the yield is, when the thickness of the product is 0.1-0.3 mm, the yield can only reach 70%, and when the thickness is 0.05mm, the yield is less than 40%; and the sewage generated in the grinding process has adverse effects on the operating condition and the environment. Therefore, the industry is urgently needed to research a method suitable for processing the thin high-precision superhard abrasive material integral cutting grinding wheel, so that the processing level of the whole industry is improved, and the pollution to the environment is reduced.
Disclosure of Invention
The invention aims to provide a method for processing a high-precision superhard abrasive integral cutting grinding wheel, aiming at the problems of low efficiency, low yield and easy operation condition and environmental pollution when a grinding process is adopted to process a thin cutting grinding wheel in the prior art.
The purpose of the invention is realized by the following technical scheme:
a high-precision superhard abrasive integral cutting grinding wheel processing method is characterized in that the cutting grinding wheel is a sintering body formed by blending a bonding agent and a superhard abrasive, a cutting grinding wheel blank is fixed on a carrier through a thermoplastic material, then the carrier is fixed on a workbench of a grinding machine, the blank is subjected to material removal processing through a grinding wheel grinding method, a finished product with required form and position tolerance and dimensional precision is obtained, and the grinding wheel is a common abrasive grinding wheel;
the thermoplastic material is one of solid wax, rosin and thermoplastic adhesive;
the carrier is made of one or a mixture of more than two of alumina ceramic carrier, zirconia ceramic carrier and silicon carbide ceramic carrier;
grinding the two surfaces of the blank by adopting a double-surface alternate grinding method;
adopting high-precision grinding equipment, adopting micron or submicron quantitative feeding, and alternately grinding the front surface and the back surface;
the cutting grinding wheel is of an integral structure formed by sintering superhard abrasives, the integral thickness is 0.02-0.5mm, and the thickness precision is micron;
the method comprises the following steps: the method comprises the following steps: blank manufacturing: manufacturing a blank meeting the precision requirement for standby, wherein the blank is provided with two opposite surfaces, namely a surface A and a surface B, and the parallelism of the surface A and the surface B is less than or equal to 0.03 mm;
step two: fixing the blank 2 on the carrier 3 with the fixing material 1:
the fixing material 1 is made of thermoplastic material, the blank 2 to be processed is fixed on the working surface 4 of the carrier 3 in a heating, pressurizing and cooling mode, the surface B of the blank 2 is fixedly connected with the working surface of the carrier, the flatness of the working surface of the carrier is less than or equal to 0.002mm, and the parallelism of the two surfaces is less than or equal to 0.003 mm; the carrier is one of alumina ceramic carrier, zirconia ceramic carrier and silicon carbide ceramic carrier or the mixture of more than two of the alumina ceramic carrier, the zirconia ceramic carrier and the silicon carbide ceramic carrier; the thermoplastic material is one of solid wax, rosin and thermoplastic adhesive; the heating temperature is more than or equal to the melting temperature of the thermoplastic material by 30-60 ℃, the thickness of the thermoplastic material after pressurization and cooling is 0.002-0.005mm, and the parallelism is less than or equal to 0.002mm;
step three: grinding of the A surface of the blank
Fixing the carrier fixed with the blank on a grinding machine, and grinding the surface A of the blank by using a grinding wheel, wherein the grinding machine adopts a precise numerical control horizontal shaft circular table surface grinding machine, a vertical precise circular table grinding machine and a horizontal precise grinding machine; the grinding wheel adopts a white corundum grinding wheel, a green silicon carbide grinding wheel and a monocrystalline corundum grinding wheel;
the following grinding parameters were used:
the granularity of the grinding wheel is 180-400 meshes, the hardness of the grinding wheel is G-L grade, the width of the grinding wheel is 3-12 mm, and the grinding wheel is of a flat wheel structure or an annular dentate arrangement structure; the linear speed of the grinding wheel is 10-30m/s, and the feeding speed is 0.1-10 um/s;
step four: grinding the B surface of the blank
Heating the carrier to melt the thermoplastic material, unloading the blank from the carrier, fixing the surface A of the blank serving as a fixing surface on the working surface of the plate-type carrier after the thermoplastic material is heated, pressurized and cooled, and grinding the surface B of the blank according to the method in the third step;
and step five, alternately grinding the surface A and the surface B of the blank.
Quantitatively grinding the A, B surfaces of the grinding wheel for three and four times alternately until the specified size requirement is met;
preparing a blank of the high-precision superhard abrasive material integral cutting grinding wheel in a hot-pressing sintering mode;
when the hardness of the sintered body is high or the cutting grinding wheel is thin, grinding processing is carried out by adopting the grinding wheel with small hardness and fine granularity; the hardness of the grinding wheel is soft, and the width of the grinding wheel is increased; when the cutting grinding wheel with thin thickness is processed, a vertical precise circular table grinding machine and a horizontal precise grinding machine tool are adopted for processing; solid wax and thermoplastic adhesives are preferred for machining the resin bond green cutting wheel.
The processing method of the high-precision superhard abrasive integral cutting grinding wheel provided by the invention adopts a thermoplastic material to fix a blank, a high-precision grinding machine is adopted to grind the blank, during processing, a grinding wheel of a common abrasive is used as a grinding tool, tap water is used as cooling liquid, the grinding wheel with proper width, granularity and grade and proper grinding parameters are selected to process the blank, the blank is subjected to a small amount of double-side alternate grinding, the self-sharpening property of the grinding wheel is kept during grinding, the proper contact area between the grinding wheel and the blank is kept, the deformation and damage of the cutting grinding wheel are reduced, the processing yield is improved, when the cutting grinding wheel with the thickness of 0.05-0.1mm is ground, the yield can reach over 75 percent, and the yield can be greatly improved; the single processing quantity can reach 6-15 tablets, and the single output rate is more than 25% higher than that of a grinder with the diameter of 640; the unexpected technical effect is achieved.
Drawings
FIG. 1 is a schematic view of a cutting wheel mounting system;
fig. 2 is a schematic top view of fig. 1.
Description of the reference numerals
1-fixing Material 2-blank 3-Carrier 4-working surface
Detailed Description
The invention is further described below with reference to specific examples:
the material of the high-precision integral cutting grinding wheel processed by the invention is generally a sintered body formed by blending a metal bonding agent and a superhard abrasive, a sintered body formed by blending a resin bonding agent and a superhard abrasive, and a sintered body formed by blending a ceramic bonding agent and a superhard abrasive, the thickness is generally 0.1-0.5mm, the thinnest can reach 0.05mm, and the precision is micron-sized.
The invention provides a processing method of a high-precision superhard abrasive material integral cutting grinding wheel, which comprises the following steps:
the method comprises the following steps: blank manufacturing: manufacturing a blank meeting the precision requirement for standby, wherein the blank is provided with two opposite surfaces, namely a surface A and a surface B, the tolerance of the surface A and the surface B meets a certain requirement, and the parallelism of the surface A and the surface B is less than or equal to 0.03 mm; the blank of the high-precision superhard abrasive material integral cutting grinding wheel is prepared in a hot-pressing sintering mode, so that the prepared blank has certain precision, the subsequent processing beat is saved, and the processing efficiency is improved;
step two: fixing the blank 2 on the carrier 3 with the fixing material 1:
the fixing material 1 is made of thermoplastic material, the blank 2 to be processed is fixed on the working surface 4 of the carrier 3 in a heating, pressurizing and cooling mode, the surface B of the blank 2 is fixedly connected with the working surface of the carrier, the flatness of the working surface of the carrier is less than or equal to 0.002mm, and the parallelism of the two surfaces is less than or equal to 0.003 mm; the carrier can be made of rigid material, such as metal, preferably one or a mixture of alumina ceramic carrier, zirconia ceramic carrier and silicon carbide ceramic carrier, so that the deformation of the carrier is small during processing, and the processing precision is more ideal; the thermoplastic material is solid wax, rosin, thermoplastic adhesive, etc.; the heating temperature is higher than the melting temperature of the thermoplastic material and is more than or equal to the melting point temperature of the thermoplastic material, and the thermoplastic material is thermoplastic at 30-60 ℃, and the temperature can ensure the fluidity of the thermoplastic material and certain adhesive force of the thermoplastic material, so that the thermoplastic material has good fluidity, the thermoplastic material is uniformly and smoothly spread, the blank can be stably fixed, and the optimal fixing effect is realized. The purpose of pressurization is to extrude the fixing material between the blank and the carrier, so that the fixing material is smoother and more firmly fixed, and the processing precision of the blank is prevented from being influenced by the unevenness and the infirm fixation of the fixing material. Generally, the fixing material is pressed until the thickness of the fixing material is 0.002-0.005um and the parallelism is less than or equal to 0.002 mm.
Step three: grinding of the A surface of the blank
Fixing the carrier fixed with the blank on a grinding machine, and grinding the surface A of the blank by using a grinding wheel, wherein the grinding machine can adopt a precise numerical control horizontal shaft circular table surface grinding machine, a vertical precise circular table grinding machine, a horizontal precise grinding machine tool and the like; the grinding wheel adopts a common abrasive grinding wheel, such as a white corundum grinding wheel, a green silicon carbide grinding wheel, a monocrystalline corundum grinding wheel and the like;
the grinding parameters are as follows:
the granularity of the grinding wheel is 180-400 meshes, the hardness of the grinding wheel is G-L grade, the width of the grinding wheel is 3-12 mm, and the grinding wheel is of a flat wheel structure or an annular dentate arrangement structure; the linear speed of the grinding wheel is 10-30m/s, the feeding speed is 0.1-10 um/s, and the best feeding speed is 0.1-2.0 um/s;
step four: grinding the B surface of the blank
Heating the carrier to melt the thermoplastic material, unloading the blank from the carrier, fixing the surface A of the blank serving as a fixing surface on the working surface of the plate-type carrier after the thermoplastic material is heated, pressurized and cooled, and grinding the surface B of the blank according to the method in the third step;
and step five, alternately grinding the surface A and the surface B of the blank.
And (4) quantitatively grinding the A, B surfaces of the grinding wheel alternately according to the steps three and four times until the specified size requirement is met.
The method of the invention adopts a flat wheel structure or an annular dentate arrangement structure grinding wheel with the width of 3mm-12mm to grind the surface of the blank, so that the grinding contact area is adapted to the adhesive force between the fixing material and the blank, the grinding force of the grinding wheel is smaller than the adhesive force between the fixing material and the blank during grinding, the blank can not loosen when bearing the grinding force of the grinding wheel, the phenomenon of unstable processing precision caused by the movement or deformation of the blank due to the grinding force larger than the adhesive force between the blank and the fixing material is prevented, and sufficient cooling liquid is further matched, so that the consumption of the common abrasive grinding wheel is reduced, the processing cost is reduced to the minimum, the production efficiency is improved, and the processing takt is shortened.
The linear velocity and the feed amount of the grinding wheel are controlled, quantitative grinding processing is carried out on the two surfaces of the grinding wheel repeatedly and alternately, stress deformation in the processing process can be effectively reduced, the deformation amount of the cutting grinding wheel is reduced, the grinding wheel can keep good self-sharpening performance by adopting a common abrasive grinding wheel with G-L grade hardness for grinding, the grinding wheel is ensured to be always in a sharp grinding state, the grinding force of the grinding wheel on the cutting grinding wheel is small, the damage and the deformation of blanks are reduced, and the grinding efficiency is improved under the condition that the small grinding force is ensured by assisting proper linear velocity and feed amount of the grinding wheel.
By comprehensively adopting the grinding method, good yield can be obtained, and in addition, too much sludge cannot appear in the grinding process, so that the environmental pollution is reduced. Of course, the method can process the cutting grinding wheel with the thickness of more than 0.3mm, and the processing difficulty is relatively low.
A plurality of blanks can be simultaneously fixed on one carrier for grinding, and the grinding efficiency is improved. The working area of the carrier required at the moment is larger, the power of the grinding equipment is also adaptive, more blanks can be machined through single grinding, and the machining efficiency is improved.
When the grinding wheel is selected, the grinding wheel is selected in such a way that when the ceramic bond sintered body is processed, the grinding processing is carried out on the wide grinding wheel with low hardness and small granularity, and the processing thickness is less than 0.25mm, so that the better yield is obtained; when the cutting grinding wheel with thin thickness is processed, a vertical precise circular table grinding machine and a horizontal precise grinding machine tool are preferably adopted; solid wax and thermoplastic adhesives are preferred for machining the resin bond green cutting wheel.
The width of the grinding wheel is selected according to the hardness of the grinding wheel, and meanwhile, the width of the grinding wheel is selected according to the thickness of a processed product; in principle, the hardness of the grinding wheel is soft, the width of the grinding wheel can be wide, and the wear resistance of the grinding wheel is improved; the thinner the cutting wheel to be processed, the softer the structure of the wheel used and the finer the grain size.
Example 1
Manufacturing a cutting grinding wheel with the thickness of 0.3mm, wherein the material of the cutting grinding wheel is a metal bonding agent and a diamond sintering blank
A. Adopting a blank with the thickness of 0.35mm, wherein the parallelism of two surfaces of the blank AB is 0.02 mm; measuring the original thickness and the parallelism precision of the blank one by using a ratio measuring platform and a dial indicator, and making identification and record;
taking rosin as a thermoplastic material and alumina ceramic as a fixed carrier, and grinding by using a precise numerical control horizontal-shaft circular-table surface grinding machine; the grinding wheel is 180-mesh green silicon carbide, the width of the grinding wheel is 6mm, and the hardness of the grinding wheel is L-grade;
B. heating an alumina ceramic carrier on a heating platform at the heating temperature of 150-;
C. measuring the height difference between the carrier plane and the upper surface of the blank by using a ratio measuring platform, and calculating the thickness and the distribution flatness of the fixing material by combining the thickness of the original blank; the carrier with the fixed blank is placed on a workbench of a precise numerical control horizontal-axis circular truncated cone surface grinder to be fixed, grinding is carried out through a feeding grinding wheel, the linear speed of the grinding wheel is 28m/s, the feeding speed is 1.5um/s, and grinding is stopped when the feeding amount of the grinding wheel reaches 0.4 m;
D. measuring the height difference between the carrier and the grinding surface by using a measuring platform, namely the blank removal amount;
E. after the carrier is unloaded from the grinding machine, the carrier is placed on a heating platform to be heated and melted to melt rosin, the blank is taken down and turned over, the surface A is taken as a fixed surface, the surface B is ground, and the surface B is processed according to the same parameters as the surface A until the feeding amount of the grinding wheel reaches 0.4 mm;
F. alternately grinding A, B two surfaces, the feeding speed is 0.8um/s, the feeding amount of the grinding wheel is 0.1mm per surface turning, until the grinding wheel is processed to a qualified size;
the product processed by the method has the thickness of 0.3mm, the thickness uniformity of 0.01mm and the warpage deformation of less than 0.2 mmm; the yield reaches more than 80%.
Example 2.
And machining and manufacturing a cutting grinding wheel with the diameter of 0.3 mm. The material of the cutting grinding wheel is ceramic bond and diamond sintering blank;
A. a blank having a thickness of 0.35mm and an AB face parallelism of 0.03mm was used.
Solid wax as a thermoplastic material, silicon carbide ceramic as a fixing carrier: grinding by using a vertical precise circular table grinding machine; the grinding wheel is made of 240-mesh monocrystalline corundum, the hardness is G grade, and the structure is a 4mm single-ring grinding wheel;
B. heating a silicon carbide ceramic carrier by a heating platform at the heating temperature of 90-140 ℃, coating solid wax on the carrier, putting a blank on the coated solid wax, taking the surface B as a fixed surface, standing for 2 minutes, moving the carrier integrally to a pressurizing device, applying 400kgf to the carrier, a fixed material and the cutting grinding wheel blank integrally, cooling to room temperature, and removing pressure to fix the carrier and the blank firmly;
C. fixing the carrier with the blank fixed on a workbench of a vertical precise circular table grinding machine, and grinding the surface A of the blank by using a grinding wheel, wherein the linear speed of the grinding wheel is 20m/s, the feeding speed is 0.5um/s, and the feeding amount of the grinding wheel is 0.6 mm;
D. after the carrier is unloaded from the grinding machine, the carrier is placed on a heating platform, solid wax is melted, the blank is taken down, turned over and fixed again, and the surface B is processed, wherein the processing parameters are as the surface A is processed;
E. and (3) alternately processing the AB two surfaces, wherein the feeding speed is 0.3um/s, and the feeding amount of the single-surface grinding wheel is 0.2mm until the thickness reaches 0.3 mm.
By adopting the method, the thickness of the obtained ceramic bond diamond cutting grinding wheel is 0.3mm, the uniformity can reach 0.008mm, and the warping deformation is less than 0.15 mmm; the yield reaches more than 80%.
Example 3.
Manufacturing a cutting grinding wheel with the thickness of 0.05mm, wherein the material of the cutting grinding wheel is a metal bonding agent and a diamond sintering blank
Adopting a blank with the thickness of 0.1mm, wherein the parallelism of two surfaces AB of the blank is 0.03 mm;
thermoplastic adhesives such as the brand JY-1 as thermoplastic material, zirconia ceramics as fixed carrier: grinding by using a horizontal precision grinding machine; the green silicon carbide with the granularity of 240 meshes has the hardness of K grade and the width of a single-ring structure grinding wheel with the width of 12 mm;
the heating temperature of the carrier is 90-140 ℃, the linear velocity of the grinding wheel is 10m/s, the feeding speed is 0.3um/s, and the feeding amount of the grinding wheel is 0.2 mm;
when the two sides are processed alternately, the feeding speed is 0.1um/s, and the feeding amount of the grinding wheel is 0.05 mm;
the cutting grinding wheel with the thickness of 0.05mm obtained by the method has the thickness uniformity of 0.01mm and the warping deformation amount of less than 0.2 mm; the yield reaches more than 75%.
Example 4.
Manufacturing a cutting grinding wheel with the thickness of 0.1 mm; the material of the cutting grinding wheel is resin bonding agent and diamond sintering blank
Adopting a blank with the thickness of 0.15mm, wherein the parallelism of two surfaces AB of the blank is 0.02 mm;
selecting a thermoplastic adhesive such as the designation JY-1 as the thermoplastic material, alumina ceramic as the fixed carrier: grinding by using a horizontal precision grinding machine; the grinding wheel has the granularity of 180 meshes, and is a single-ring-structure grinding wheel with the hardness of J grade and the width of 3 mm;
the heating temperature of the carrier is 80-150 ℃, the linear velocity of the grinding wheel is 12m/s, the feeding speed is 0.6um/s, and the feeding amount of the grinding wheel is 0.3 mm;
when the two sides are processed alternately, the feeding speed is 0.4um/s, and the feeding amount of the grinding wheel is 0.1mm until the thickness of the blank reaches 0.1 mm.
The cutting grinding wheel manufactured by the method reaches 0.1mm, the thickness uniformity reaches 0.008mm, and the warping deformation is less than 0.2 mm; the yield reaches more than 75%.
Example 5.
Manufacturing a cutting grinding wheel with the thickness of 0.15 mm; the material of the cutting grinding wheel is a metal bonding agent and a diamond sintering blank;
adopting a blank with the thickness of 0.2mm, wherein the parallelism of two surfaces AB of the blank is 0.03 mm;
selecting a thermoplastic adhesive such as a mark JY-1 as a fixing material, and silicon carbide ceramic as a fixing carrier: grinding by using a horizontal precision grinding machine; the granularity of the grinding wheel is 400 meshes of green silicon carbide, the hardness is L grade, and the width of the grinding wheel is a 6mm single-ring structure grinding wheel;
the heating temperature of the carrier is 80-150 ℃, the linear velocity of the grinding wheel is 14m/s, the feeding speed is 0.8um/s, and the feeding amount of the grinding wheel is 0.4 mm;
alternately processing two surfaces, wherein the feeding speed is 0.5um/s, and the feeding amount of the grinding wheel is 0.1 mm; until the thickness of the blank reaches 0.1 mm.
The thickness of the cutting grinding wheel manufactured by adopting the method is 0.15mm, the uniformity can reach 0.008mm, and the warping deformation is less than 0.2 mm; the yield reaches more than 90%.
Example 6.
Manufacturing a cutting grinding wheel with the thickness of 0.25 mm; the material of the cutting grinding wheel is ceramic bond and CBN sintering blank;
adopting a blank with the thickness of 0.3mm, wherein the parallelism of two surfaces AB of the blank is 0.03 mm;
selecting a thermoplastic adhesive such as a mark JY-1 as a fixing material, and alumina ceramic as a fixing carrier: grinding by using a horizontal precision grinding machine; the granularity of the grinding wheel is 240 meshes of green silicon carbide, the hardness is K grade, and the width of the grinding wheel is a single-ring structure grinding wheel of 12 mm;
the heating temperature of the carrier is 80-150 ℃, the linear velocity of the grinding wheel is 10m/s, the feeding speed is 0.5um/s, and the feeding amount of the grinding wheel is 0.6 mm;
alternately processing two surfaces, wherein the feeding speed is 0.3um/s, and the feeding amount of the grinding wheel is 0.2 mm; until the thickness of the blank reaches 0.25 mm.
The thickness of the cutting grinding wheel manufactured by adopting the method is 0.25mm, the uniformity can reach 0.007mm, and the warpage deformation is less than 0.15 mm; the yield reaches more than 75%.
Example 7.
Manufacturing a cutting grinding wheel with the thickness of 0.2 mm; the material of the cutting grinding wheel is resin bonding agent and CBN sintering blank;
adopting a blank with the thickness of 0.25mm, wherein the parallelism of two surfaces AB of the blank is 0.03 mm;
selecting solid wax as a fixing material, and taking silicon carbide ceramic as a fixing carrier: grinding by using a horizontal precision grinding machine; the granularity of the grinding wheel is 400 meshes of green silicon carbide, the hardness is L grade, and the width of the grinding wheel is a 6mm single-ring structure grinding wheel;
the heating temperature of the carrier is 90-140 ℃, the linear velocity of the grinding wheel is 14m/s, the feeding speed is 1um/s, and the feeding amount of the grinding wheel is 0.4 mm;
alternately processing two surfaces, wherein the feeding speed is 0.6um/s, and the feeding amount of the grinding wheel is 0.1 mm; until the thickness of the blank reaches 0.2 mm.
The thickness of the cutting grinding wheel manufactured by adopting the method is 0.2mm, the uniformity can reach 0.007mm, and the warpage deformation is less than 0.2 mm; the yield reaches more than 90%.
Example 8.
Manufacturing a cutting grinding wheel with the thickness of 0.05 mm; the material of the cutting grinding wheel is resin bonding agent and CBN sintering blank;
adopting a blank with the thickness of 0.11mm, wherein the parallelism of two surfaces AB of the blank is 0.03 mm;
selecting a thermoplastic adhesive such as a mark JY-1 as a fixing material, and alumina ceramic as a fixing carrier: grinding by using a horizontal precision grinding machine; the granularity of the grinding wheel is 240 meshes of green silicon carbide, the hardness is K grade, and the width of the grinding wheel is a single-ring structure grinding wheel of 12 mm;
the heating temperature of the carrier is 80-150 ℃, the linear velocity of the grinding wheel is 10m/s, the feeding speed is 0.3um/s, and the feeding amount of the grinding wheel is 0.2 mm;
alternately processing two surfaces, wherein the feeding speed is 0.1um/s, and the feeding amount of the grinding wheel is 0.05 mm; until the thickness of the blank reaches 0.05 mm.
The thickness of the prepared abrasive cutting wheel is 0.05mm, the uniformity can reach 0.01mm, and the warpage deformation is less than 0.2 mm; the yield reaches more than 75%.
Example 9.
Manufacturing a cutting grinding wheel with the thickness of 0.3 mm; the material of the cutting grinding wheel is resin bonding agent and diamond sintering blank;
adopting a blank with the thickness of 0.35mm, wherein the parallelism of two surfaces AB of the blank is 0.02 mm;
selecting solid wax as a fixing material, and taking silicon carbide ceramic as a fixing carrier: grinding by using a vertical precise circular table grinding machine; the granularity of the grinding wheel is 240 meshes of single crystal corundum, the hardness is G grade, and the width of the grinding wheel is a 4mm single ring structure grinding wheel;
the heating temperature of the carrier is 90-140 ℃, the linear velocity of the grinding wheel is 20m/s, the feeding speed is 0.6um/s, and the feeding amount of the grinding wheel is 0.3 mm;
alternately processing two surfaces, wherein the feeding speed is 0.4um/s, and the feeding amount of the grinding wheel is 0.1 mm; until the thickness of the blank reaches 0.3 mm.
The thickness of the prepared abrasive cutting wheel is 0.3mm, the uniformity can reach 0.01mm, and the warpage deformation is less than 0.2 mm; the yield reaches more than 85 percent.
Example 10.
Manufacturing a cutting grinding wheel with the thickness of 0.2 mm; the material of the cutting grinding wheel is metal bond and CBN sintering blank;
adopting a blank with the thickness of 0.25mm, wherein the parallelism of two surfaces AB of the blank is 0.03 mm;
selecting solid wax as a fixing material, and taking alumina ceramic as a fixing carrier: grinding by using a vertical precise circular table grinding machine; the granularity of the grinding wheel is 240 meshes of green silicon carbide, the hardness is K grade, and the width of the grinding wheel is a single-ring structure grinding wheel of 12 mm;
the heating temperature of the carrier is 90-140 ℃, the linear velocity of the grinding wheel is 20m/s, the feeding speed is 0.8um/s, and the feeding amount of the grinding wheel is 0.4 mm;
alternately processing two surfaces, wherein the feeding speed is 0.5um/s, and the feeding amount of the grinding wheel is 0.1 mm; until the thickness of the blank reaches 0.2 mm.
The thickness of the prepared abrasive cutting wheel is 0.2mm, the uniformity can reach 0.01mm, and the warpage deformation is less than 0.2 mm; the yield reaches more than 95 percent.
Example and yield comparison Table I
| Example number | Example 1 | 2 | 3 | 4 | 5 |
| Thickness mm of cutting grinding wheel | 0.3 | 0.3 | 0.05 | 0.1 | 0.15 |
| Material of abrasive cutting wheel | Metal diamond | Ceramic diamond | Metal diamond | Resin diamond | Metal diamond |
| Carrier material | Alumina ceramics | Silicon carbide ceramic | Zirconia ceramics | Alumina ceramics | Silicon carbide ceramic |
| Thermoplastic material | Rosin | Solid wax | Thermoplastic adhesive | Thermoplastic adhesive | Thermoplastic adhesive |
| Grinding machine | Precision numerical control horizontal shaft round table surface grinding machine | Vertical precision round table grinding machine | Horizontal precision grinding machine tool | Horizontal precision grinding machine tool | Horizontal precision grinding machine tool |
| Abrasive grain size and material | 180 mesh green silicon carbide | 240 mesh single crystal corundum | 240 mesh silicon carbide | 180 mesh white corundum | 400 mesh green silicon carbide |
| Width of grinding wheel | 6mm wide | 4mm ring shape | 12mm ring shape | 3mm ring shape | 6mm ring shape |
| Hardness grade of grinding wheel | Class L | Class G | Class k | Grade J | Class L |
| Linear velocity of grinding wheel | 28m/s | 20m/s | 10m/s | 12m/s | 14m/s |
| Feed rate in first processing | 1.5um/s | 0.5um/s | 0.3um/s | 0.6um/s | 0.8um/s |
| Feed rate of grinding wheel in first machining | 0.4mm | 0.6mm | 0.2mm | 0.3mm | 0.4mm |
| Feed rate in two-sided alternating machining | 0.8um/s | 0.3um/s | 0.1um/s | 0.4um/s | 0.5um/s |
| Single side grinding wheel feed amount when two sides are alternatively added | 0.1mm | 0.2mm | 0.05mm | 0.1mm | 0.1mm |
| Yield of finished products | 80% | 80% | 75% | 75% | 90% |
Continuation table 1
| Example number | Example 6 | 7 | 8 | 9 | 10 |
| Thickness of abrasive cutting wheel | 0.25mm | 0.2mm | 0.05mm | 0.3mm | 0.2mm |
| Material of abrasive cutting wheel | Ceramic CBN | Resin CBN | Resin CBN | Resin diamond | Metal CBN |
| Carrier material | Alumina ceramics | Silicon carbide ceramic | Zirconia ceramics | Silicon carbide ceramic | Alumina ceramics |
| Thermoplastic material | Thermoplastic adhesive | Solid wax | Thermoplastic adhesive | Solid wax | Solid wax |
| Grinding machine | Horizontal precision grinding machine tool | Horizontal precision grinding machine tool | Horizontal precision grinding machine tool | Vertical precision round table grinding machine | Vertical precision round table grinding machine |
| Grinding wheel granularity | 240 mesh silicon carbide | 400 mesh green silicon carbide | 240 mesh green silicon carbide | 240 mesh single crystal corundum | 240 mesh green silicon carbide |
| Width of grinding wheel | 12mm ring shape | 6mm ring shape | 12mm ring shape | 4mm ring shape | 12mm ring shape |
| Hardness of grinding wheel | Class k | Class L | Class k | Class G | Class k |
| Feed rate in first processing | 0.5um/s | 1um/s | 0.3um/s | 0.6um/s | 0.8um/s |
| Feed amount of grinding wheel at first machining | 0.6mm | 0.4mm | 0.2mm | 0.3mm | 0.4mm |
| Feed rate in two-sided alternating machining | 0.3um/s | 0.6um/s | 0.1um/s | 0.4um/s | 0.5um/s |
| Single side grinding wheel feed amount when two sides are alternatively added | 0.2mm | 0.1mm | 0.05mm | 0.1mm | 0.1mm |
| Linear velocity of grinding wheel | 10m/s | 14m/s | 10m/s | 20m/s | 20m/s |
| Yield of finished products | 75% | 90% | 75% | 85% | 95% |
Claims (5)
1. A high-precision superhard abrasive integral cutting grinding wheel processing method is characterized in that a cutting grinding wheel blank is fixed on a carrier through a thermoplastic material, then the carrier is fixed on a workbench of a grinding machine, the blank is subjected to material removal processing through a grinding wheel grinding method to obtain a finished product with required form and position tolerance and dimensional precision, and the grinding wheel is a common abrasive grinding wheel; grinding the two surfaces of the blank by adopting a double-surface alternate grinding method, adopting high-precision grinding equipment, adopting micron or submicron quantitative feeding, and alternately grinding the front surface and the back surface; the cutting grinding wheel is of an integral structure formed by sintering superhard abrasives, the integral thickness is 0.02-0.5mm, and the thickness precision is micron;
the method comprises the following steps: the method comprises the following steps: blank manufacturing: manufacturing a blank meeting the precision requirement for standby, wherein the blank is provided with two opposite surfaces, namely a surface A and a surface B, and the parallelism of the surface A and the surface B is less than or equal to 0.03 mm;
step two: fixing the blank (2) on the carrier (3) with a fixing material (1):
the fixing material (1) is made of thermoplastic material, the blank (2) to be processed is fixed on the working surface (4) of the carrier (3) in a heating, pressurizing and cooling mode, the surface B of the blank (2) is fixedly connected with the working surface of the carrier, the flatness of the working surface of the carrier is less than or equal to 0.002mm, and the parallelism of two surfaces is less than or equal to 0.003 mm; the heating temperature is more than or equal to the melting temperature of the thermoplastic material at 30-60 ℃, the thickness of the thermoplastic material after pressurization and cooling is 0.002-0.005mm, and the parallelism is less than or equal to 0.002mm;
step three: grinding of the A surface of the blank
Fixing the carrier fixed with the blank on a grinding machine, and grinding the surface A of the blank by using a grinding wheel, wherein the grinding machine adopts a precise numerical control horizontal shaft circular table surface grinding machine, a vertical precise circular table grinding machine and a horizontal precise grinding machine; the grinding wheel adopts a white corundum grinding wheel, a green silicon carbide grinding wheel and a monocrystalline corundum grinding wheel;
the following grinding parameters were used:
the granularity of the grinding wheel is 180-400 meshes, the hardness of the grinding wheel is G-L grade, the width of the grinding wheel is 3-12 mm, and the grinding wheel is of a flat wheel structure or an annular dentate arrangement structure; the linear speed of the grinding wheel is 10-30m/s, and the feeding speed is 0.1-10 um/s;
step four: grinding the B surface of the blank
Heating the carrier to melt the thermoplastic material, unloading the blank from the carrier, fixing the surface A of the blank serving as a fixing surface on the working surface of the plate-type carrier after the thermoplastic material is heated, pressurized and cooled, and grinding the surface B of the blank according to the method in the third step;
step five, alternately grinding the surface A and the surface B of the blank;
and (4) quantitatively grinding the A, B surfaces of the grinding wheel alternately according to the steps three and four times until the specified size requirement is met.
2. A method as claimed in claim 1, wherein said thermoplastic material is one of solid wax, rosin, and thermoplastic adhesive.
3. A method as claimed in claim 1, wherein the carrier is made of a mixture of one or more of alumina ceramic carrier, zirconia ceramic carrier, and silicon carbide ceramic carrier.
4. The method for machining a high-precision superabrasive one-piece abrasive cutoff wheel according to claim 1, characterized in that the blank of the high-precision superabrasive one-piece abrasive cutoff wheel is prepared by hot press sintering.
5. The method for processing a high-precision superabrasive one-piece abrasive cutoff wheel according to claim 1, characterized in that when the sintered body has a high hardness or the cutoff wheel is thin, a grinding process is performed using a wheel having a small hardness and a fine grain size; the hardness of the grinding wheel is soft, and the width of the grinding wheel is increased; when the cutting grinding wheel with thin thickness is processed, a vertical precise circular table grinding machine tool and a horizontal precise grinding machine tool are adopted for processing; solid wax and thermoplastic adhesive are used in the process of processing the cutting grinding wheel of the resin binder blank.
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| US9238207B2 (en) * | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| CN201192797Y (en) * | 2008-05-20 | 2009-02-11 | 上海大学 | Ceramic material lapping device of metallographical polish-grinding machine |
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| CN102039562A (en) * | 2009-10-09 | 2011-05-04 | 韦星野 | Manufacturing process for high-intensity diamond grinding bar for loosening hole |
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