CN113199410A - Preparation method and application of composite material for grinding wheel - Google Patents
Preparation method and application of composite material for grinding wheel Download PDFInfo
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- CN113199410A CN113199410A CN202110591065.8A CN202110591065A CN113199410A CN 113199410 A CN113199410 A CN 113199410A CN 202110591065 A CN202110591065 A CN 202110591065A CN 113199410 A CN113199410 A CN 113199410A
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- 238000000227 grinding Methods 0.000 title claims abstract description 142
- 239000002131 composite material Substances 0.000 title claims abstract description 49
- 238000002360 preparation method Methods 0.000 title claims abstract description 23
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 106
- 239000010432 diamond Substances 0.000 claims abstract description 106
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 59
- 239000000463 material Substances 0.000 claims abstract description 51
- 238000012545 processing Methods 0.000 claims abstract description 30
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 30
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 28
- 239000010703 silicon Substances 0.000 claims abstract description 28
- 238000005520 cutting process Methods 0.000 claims abstract description 27
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 238000001029 thermal curing Methods 0.000 claims abstract description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011863 silicon-based powder Substances 0.000 claims description 31
- 230000008569 process Effects 0.000 claims description 22
- 238000003825 pressing Methods 0.000 claims description 21
- 229910002804 graphite Inorganic materials 0.000 claims description 17
- 239000010439 graphite Substances 0.000 claims description 17
- 238000005475 siliconizing Methods 0.000 claims description 16
- 239000000919 ceramic Substances 0.000 claims description 15
- 238000003756 stirring Methods 0.000 claims description 15
- 239000011812 mixed powder Substances 0.000 claims description 12
- 238000005336 cracking Methods 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 11
- 238000005245 sintering Methods 0.000 claims description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 10
- 239000007791 liquid phase Substances 0.000 claims description 10
- 238000007873 sieving Methods 0.000 claims description 10
- 238000009736 wetting Methods 0.000 claims description 10
- 230000009471 action Effects 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000012071 phase Substances 0.000 claims description 6
- 229910021431 alpha silicon carbide Inorganic materials 0.000 claims description 5
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- 238000001035 drying Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000013007 heat curing Methods 0.000 claims description 2
- 239000007767 bonding agent Substances 0.000 abstract description 30
- 238000006243 chemical reaction Methods 0.000 abstract description 7
- 239000002210 silicon-based material Substances 0.000 abstract description 4
- 230000007704 transition Effects 0.000 abstract description 3
- 239000003082 abrasive agent Substances 0.000 description 23
- 239000010410 layer Substances 0.000 description 21
- 229910052799 carbon Inorganic materials 0.000 description 10
- 239000000047 product Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
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- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 238000000643 oven drying Methods 0.000 description 6
- 238000005303 weighing Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
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- 239000002184 metal Substances 0.000 description 3
- 230000008520 organization Effects 0.000 description 3
- 239000011265 semifinished product Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 2
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
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- 230000002411 adverse Effects 0.000 description 1
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- 229910052796 boron Inorganic materials 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
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- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention provides a preparation method and application of a composite material for a grinding wheel, wherein a silicon material which is easy to chemically react with a diamond grinding material is used as a bonding agent, and the silicon material and the bonding agent are subjected to a thermal curing reaction to generate a silicon carbide transition layer on a contact interface, so that the problems of the traditional diamond material for workpiece processing are effectively solved. The composite material for the grinding wheel prepared by the invention can be used for the grinding wheel made of superhard material, including silicon wafer thinning grinding wheel, grinding wheel for wafer cutting processing and the like, can greatly improve the holding force of a bonding agent on diamond grinding materials, has low processing temperature and simple bonding agent components, can effectively improve the service life of the grinding wheel and the processing quality of workpieces, and improves the yield of products.
Description
Technical Field
The invention relates to the field of grinding tools, in particular to a preparation method and application of a composite material for a grinding wheel.
Background
Diamond is often used in the field of grinding wheel preparation due to its high hardness (mohs hardness of 10), such as in vitrified bond superhard grinding wheels, silicon wafer thinning grinding wheels and grinding wheels for wafer cutting, the working layer of the diamond grinding wheel directly participates in end face grinding or cutting, and its organization structure and mechanical properties play a critical role.
The application of diamond in the field of grinding wheels mainly comprises the following steps:
(1) ceramic bond superhard grinding wheel
Vitrified bonded superabrasive wheels are typically composed of a substrate and a working layer. The working layer is usually formed by splicing a plurality of abrasive blocks (as shown in figure 1), the abrasive blocks mainly comprise super-hard abrasives, ceramic bond and air holes, the ceramic bond plays a role in bonding and holding the abrasives and is mainly prepared by refining feldspar, clay, boron glass and the like. The abrasive block directly participates in grinding processing, so the texture structure and the mechanical performance of the abrasive block have great influence on the use of the grinding wheel. The ceramic bond superhard grinding wheel has the advantages of good self-sharpening performance, high processing precision and the like, and is widely applied to the fields of aerospace, electricians, electronics, automobiles and the like.
However, the existing grinding wheel abrasive block preparation process is complicated, a ceramic bonding agent with a reasonable formula design is generally required to be prepared, and then the grinding wheel abrasive block is prepared by the bonding agent, the abrasive and the like through the procedures of mixing, molding, thermocuring and the like, so that the process is more in links, the process stability is difficult to control, the production period is long, and the production efficiency is low.
(2) Silicon chip thinning grinding wheel
The silicon wafer production and processing procedures are more, the technological process is more complex, and the quality standard requirement is higher. After external grinding, slicing, chamfering, grinding, polishing and cleaning, the semiconductor silicon crystal bar forms a silicon wafer, wherein thickness reduction processing is a more critical process of a silicon wafer production process, and the qualification rate of subsequent process processing is directly determined. Since the silicon wafer is a siliceous material, the mohs hardness reaches 7, and the brittleness is high, the thickness reduction process adopts a diamond grinding wheel (shown in fig. 2) which is made of diamond with higher hardness (the mohs hardness is 10) as a raw material.
In view of the fact that silicon wafer materials are precious and require high machining precision, the diamond grinding wheel is generally disc-shaped, and the thickness of a working layer of the diamond grinding wheel is from several millimeters to dozens of millimeters. The working layer of the diamond grinding wheel directly participates in the end face grinding processing of the silicon wafer, and the organization structure and the mechanical performance of the diamond grinding wheel play a key role in the grinding quality of the silicon wafer. The working layer of the diamond grinding wheel is usually prepared by mixing, press forming, thermosetting and other processes of diamond grinding materials and bonding agents, and the common bonding agents comprise ceramics and resin and have the function of bonding and holding the grinding materials.
(3) Grinding wheel for cutting wafer
In the chip preparation process, the wafer cutting process is very important, and the qualification rate of the finished chip is directly determined. Since the wafer is a siliceous material, has a mohs hardness of 7 and is highly brittle, the cutting process uses a diamond wheel made of diamond having a higher hardness (mohs hardness of 10) as a raw material (as shown in fig. 3).
Since the material of the wafer is precious and the cutting slit is required to be narrow during the cutting process, the diamond grinding wheel is generally in a sheet shape, and the thickness of the working layer is often tens of microns, even several microns. The working layer of the diamond grinding wheel directly participates in the cutting processing of the wafer, and the organization structure and the mechanical performance of the working layer play a critical role in the cutting quality of the wafer.
The thickness of the working layer of the diamond grinding wheel for cutting and processing the wafer is usually only a few microns to dozens of microns, the toughness of the metal or resin bonding agent is high, but the rigidity is insufficient, and the cutting gap is deviated or inclined due to cutter back-off in the cutting process, so that the yield is reduced.
The working layer of the diamond grinding wheel is made of a composite material consisting of grinding materials and a bonding agent, and the diamond grinding materials have high hardness, strength and thermal conductivity and low density (3.52 g/cm)3) Linear expansion coefficient and strong chemical inertness, and the difference of the bonding agent materials is large, so that the prior diamond grinding wheel has the following problems in the processing and using processes:
(1) insufficient holding force of the binder to the diamond
Firstly, because diamond has strong chemical inertness and is not easy to generate chemical reaction with other materials, ceramic or resin bonding agent is usually combined with diamond in a mechanical embedding way, the ceramic or resin bonding agent and the diamond do not generate chemical reaction, a bonding interface has wide gaps (as shown in figure 2), so that the holding force of the bonding agent on the diamond is insufficient, the diamond abrasive material is easy to fall off, and the service life of the grinding wheel is shortened.
② the linear expansion coefficient of the diamond is lower (1.0-3.5 multiplied by 10)-6K-1) In contrast, the ceramic or resin bond has a higher linear expansion coefficient, and generates more heat in the grinding or cutting area during the machining process, and the diamond abrasive and the bond have a too large difference in thermal expansion degree, so that the bonding strength between the diamond abrasive and the bond is reduced, and the diamond abrasive falls off.
And thirdly, because the hardness difference between the diamond grinding material and the binding agent material is overlarge, the binding agent material is consumed too fast compared with the diamond grinding material, the abrasion synchronism is poor, the diamond grinding material is lack of effective bonding, the grinding or cutting performance is not fully exerted, the diamond grinding material falls off and fails, and the durability of a grinding wheel working layer is reduced.
(2) High processing temperature
Although the heat conductivity of the diamond abrasive is high (600-2000 Wm)-1K-1) However, the working layer of the diamond grinding wheel is made of metal, ceramic or resin-based composite materials, so that the overall thermal conductivity is not high, and the heat in a grinding or cutting area is difficult to transfer out in time, so that the grinding or cutting temperature is high, and the processing quality of a workpiece and the service life of the grinding wheel are adversely affected.
(3) Contamination with impurity elements
Other impurity elements are easy to be introduced to pollute in the processing process, and the pollution of other non-silicon elements in metal, ceramic or resin bonding agents is easy to be introduced in the processing process of the workpiece, so that the quality of the workpiece is influenced.
Therefore, aiming at the above problems, how to simplify the structure of the abrasive blocks under the condition of maintaining the processing precision, improve the bonding strength between the bonding agent and the abrasive, reduce the hardness difference between the diamond abrasive and the bonding agent material, realize the consumption consistency between the bonding agent and the abrasive, improve the bonding strength between the bonding agent and the diamond abrasive, improve the thermal conductivity of the working layer of the diamond grinding wheel, reduce the temperature of the processing area, and how to reduce the impurity elements of the working layer of the diamond grinding wheel at the same time, thereby prolonging the service life of the diamond grinding wheel is an urgent problem to be solved.
Disclosure of Invention
In order to solve the problems, the invention provides a preparation method and application of a composite material for a grinding wheel.
In order to improve the bonding strength between the bonding agent and the superhard abrasive material, particularly diamond, a silicon material which is easy to chemically react with the diamond abrasive material is used as the bonding agent, the bonding agent and the silicon material are subjected to chemical reaction, a silicon carbide transition layer (shown in figure 5) is generated on a contact interface, the silicon carbide has high hardness (the Mohs hardness is more than 9) and low density (3.20-3.25 g/cm)3) The grinding wheel abrasive block formed by the diamond and the silicon carbide has higher strength, rigidity and thermal conductivity, and simple structure, and effectively solves the problems of complex components, low bonding strength of a bonding agent and the abrasive and overhigh grinding temperature of the traditional superhard material grinding wheel abrasive block.
The technical scheme for realizing the invention is as follows:
a preparation method of a composite material for a grinding wheel comprises the following steps:
(1) mixing materials: cleaning diamond abrasive material with ultrasonic wave for 0-60min, drying in an oven at 60 deg.C, wetting the diamond abrasive material with alcohol, adding silicon powder, stirring, sieving, and granulating;
(2) and (3) pressing and forming: placing the mixed powder in the step (1) in a mold cavity, and pressing the mixed powder into a green body under the action of a press;
(3) thermal curing: the green body is placed in a graphite crucible filled with silicon powder, and silicon and a carbon source (diamond, graphite and the like) in the green body react by adopting a vacuum liquid phase siliconizing or gas phase siliconizing sintering process to generate the silicon carbide and diamond composite material.
The mass ratio of the diamond grinding material to the silicon powder in the step (1) is (10-60) to (5-30).
Wherein, graphite powder can be added while adding the silicon powder in the step (1), and the mass ratio of the diamond grinding material to the graphite powder is (10-60): (0-30).
Preferably, in order to improve the conversion rate of the silicon carbide, the step (1) can add alpha-SiC or beta-SiC as seed crystals for selectively generating silicon carbide with different crystal structures, so as to meet different grinding processing requirements, and the addition amount is 0-20 wt%.
The molding pressure in the step (2) is 30-200 Mpa; the temperature of the vacuum liquid phase siliconizing or gas phase siliconizing sintering in the step (3) is 1350-.
Preferably, the resin can be added in the process of preparing the composite material, and the preparation method comprises the following specific steps:
(1) mixing materials: cleaning diamond abrasive material with ultrasonic wave for 0-60min, heating and drying at 60 deg.C in oven, dissolving resin in alcohol, wetting diamond abrasive material, adding silicon powder, stirring, sieving, and granulating;
(2) and (3) pressing and forming: placing the mixed powder in the step (1) in a mold cavity, and pressing the mixed powder into a green body under the action of a press;
(3) cracking: fully cracking the resin by the green body at the temperature of 900-1200 ℃ in vacuum or protective atmosphere to form a prefabricated body;
(4) thermal curing: the prefabricated body is placed in a graphite crucible filled with silicon powder, and silicon reacts with carbon sources (diamond, graphite and the like) in the prefabricated body by adopting a vacuum liquid phase siliconizing or gas phase siliconizing sintering process to generate the silicon carbide and diamond composite material.
Preferably, the resin is added in the process of preparing the composite material, the resin plays the role of a temporary adhesive, the preform is easy to form, and a carbon source capable of reacting with silicon powder can be provided after carbonization and cracking. After the resin is added, the bonding agent is generated from the prefabricated body, and the porosity of the abrasive material block is controlled by controlling the porosity of the prefabricated body, so that the abrasive material blocks with different internal structures can be designed.
The composite material prepared by the two methods can be used in the field of superhard material grinding wheels.
Preferably, the composite material obtained by the invention and the composite material added with resin can be used in the field of ceramic bond superhard grinding wheels, and the concrete steps are as follows: preparing an abrasive block blank from the composite material (with or without resin) obtained after the thermosetting in the step (3), trimming the abrasive block blank, and processing the abrasive block blank into a designed shape and size to form an abrasive block finished product; and (3) mutually attaching the corresponding parts of the novel abrasive block and the grinding wheel base body, splicing into a grinding wheel semi-finished product, and preparing the ceramic bond superhard grinding wheel through subsequent finishing.
Preferably, the composite material obtained by the invention and the composite material added with resin can also be used for preparing a silicon wafer thinning grinding wheel, and the concrete steps are as follows: and (3) preparing a grinding wheel blank from the composite material (with or without resin) obtained after the thermosetting in the step (3), trimming the grinding wheel blank, and processing the grinding wheel blank into a designed shape and size to form a finished product.
Preferably, the composite material obtained by the invention and the composite material added with resin can also be used for preparing grinding wheels for wafer cutting processing, and the concrete steps are as follows: and (3) preparing a grinding wheel blank from the composite material (with or without resin) obtained after the thermosetting in the step (3), trimming the grinding wheel blank, and processing the grinding wheel blank into a designed shape and size to form a finished product.
The grinding wheel working layer composed of diamond and silicon carbide not only has certain toughness, but also has higher rigidity, thereby effectively reducing the cutter back-off phenomenon in the cutting or grinding process and improving the cutting or grinding precision.
The invention has the beneficial effects that:
(1) the bonding agent has high holding force on the diamond abrasive. Silicon and diamond are subjected to chemical reaction to generate a silicon carbide transition layer, so that the holding force of the bonding agent on the diamond grinding material is improved powerfully; the heat conductivity and linear expansion coefficient of the silicon carbide and the diamond are close to each other, so that the influence of the grinding temperature or the cutting temperature on the holding force is reduced; the hardness of the silicon carbide is close to that of the diamond and is higher than that of the conventional workpiece material (silicon wafer or wafer), the synchronous consumption of the bonding agent and the abrasive is basically realized, and the use efficiency of the abrasive is improved.
(2) The processing temperature is low: the thermal conductivity of the composite material composed of diamond and silicon carbide is as high as 300--1K-1Can be used forThe heat in the grinding or cutting area is transmitted in time, so that the cutting or grinding temperature is greatly reduced, the service life of the grinding wheel is prolonged, and the processing quality of workpieces is improved;
for example, in the grinding process, even if the cooling liquid cannot enter the grinding area, the purpose of reducing the grinding temperature is achieved by cooling the abrasive blocks with a large amount of grinding heat.
(3) The binding agent has simple components: the bonding agent is mainly silicon carbide, so that the pollution of impurity elements is effectively reduced, and the diamond working layer mainly comprises diamond and silicon carbide and mainly comprises two elements of carbon and silicon which are effectively matched with a workpiece material, so that the influence of the additional impurity elements is effectively reduced, and the yield of products is improved.
(4) The production process is simple: the preparation link of the bonding agent is omitted, the production process is less, the cycle is shorter, the cycle of the thermocuring process is shortened from 7 days to 1 day, and the production efficiency of the product is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural view of a vitrified bond superhard grinding wheel according to the present invention, wherein (a) the grinding wheel base is schematically structured, (b) the working layer abrasive block is schematically structured, (c) the vitrified bond superhard grinding wheel is schematically structured, in which 1-abrasive block is consolidated on the grinding wheel base; 2-grinding wheel base body; 3-adhesive layer.
Fig. 2 is a schematic view of the internal structure of the grinding wheel, (a) a schematic view of the internal structure of the grinding wheel, and (b) a schematic view of the bonding state of the abrasive and the bonding agent.
FIG. 3 is a schematic diagram of a grinding wheel for reducing the thickness of a silicon wafer, wherein (a) the schematic diagram of the thickness reduction of the silicon wafer and (b) the structural diagram of the grinding wheel are shown.
FIG. 4 is a schematic diagram of a grinding wheel for dicing a wafer, wherein (a) the wafer is diced, and (b) the grinding wheel is structurally schematic.
FIG. 5 is a schematic view of the internal structure of the composite material of the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
Example 1
The preparation process of the composite material for the superhard grinding wheel comprises the following specific steps:
(1) weighing 280/325-granularity diamond abrasive, 20-micrometer silicon powder and 10-micrometer graphite powder according to the mass ratio of 10:7: 3;
(2) mixing materials: cleaning diamond abrasive material with ultrasonic wave for 60min, placing in oven, heating at 60 deg.C, oven drying, wetting diamond abrasive material with alcohol, adding silicon powder, stirring, adding graphite powder, stirring, sieving, and granulating;
(3) and (3) pressing and forming: placing the mixed powder in the step (2) in a die cavity, and pressing into a green body under the action of 100MPa of a press;
(4) thermal curing: placing the green body in a graphite crucible filled with silicon powder, and sintering by vacuum liquid-phase siliconizing at vacuum degree of 5 × 10-3Keeping the temperature of Pa and 1500 ℃ for 60min to ensure that silicon reacts with a carbon source (diamond, graphite and the like) in the green body to generate a composite material of silicon carbide and diamond; the density of the composite material is 2.7g/cm3Porosity 7%;
(5) preparing an abrasive block blank from the composite material (with or without resin) obtained after thermosetting, trimming the abrasive block blank, and processing the abrasive block blank into a designed shape and size to form an abrasive block finished product; and (3) mutually attaching the corresponding parts of the novel grinding material block and the grinding wheel matrix, splicing into a grinding wheel semi-finished product, and preparing the ultra-hard material grinding wheel through subsequent finishing.
Example 2
The preparation process of the composite material for the superhard grinding wheel comprises the following specific steps:
(1) weighing 260/280-granularity diamond abrasive, 30-micrometer silicon powder, 20-micrometer graphite powder and 30-micrometer resin powder according to the mass ratio of 60: 10.5: 4.5: 25;
(2) mixing materials: cleaning diamond abrasive material with ultrasonic wave for 50min, placing in oven, heating at 50 deg.C, oven drying, wetting diamond abrasive material with alcohol, adding silicon powder, stirring, adding graphite powder and resin powder, stirring, sieving, and granulating;
(3) and (3) pressing and forming: placing the mixed powder in the step (2) in a die cavity, and pressing into a green body under the action of 100MPa of a press;
(4) cracking: pressing the green body into a green body, fully cracking the resin at 1100 ℃ under the argon protective atmosphere to form a prefabricated body, and then carrying out a heat curing process on the prefabricated body;
(5) thermal curing: placing the prefabricated body in a graphite crucible filled with silicon powder, adopting a vacuum gas phase siliconizing sintering process, and controlling the vacuum degree to be 5 x 10-3Keeping the temperature of Pa and 1600 ℃ for 30min to ensure that the silicon reacts with a carbon source (diamond, graphite and the like) in the green body to generate a composite material of silicon carbide and diamond;
in order to improve the conversion rate of the silicon carbide, a small amount of alpha-SiC or beta-SiC can be added to be used as seed crystals for selectively generating silicon carbide with different crystal structures, so that different grinding requirements are met; the density of the composite material is 3.2g/cm3Porosity 2%;
(6) the grinding block blank is prepared from the composite material (with or without resin) obtained after thermocuring, the grinding block blank is trimmed and processed into a designed shape and size to form the wafer cutting superhard material grinding wheel, and a grinding wheel working layer formed by diamond and silicon carbide not only has certain toughness but also has higher rigidity, so that the cutter back-off phenomenon in the cutting process is effectively reduced, and the cutting precision is improved.
Example 3
The preparation process of the composite material for the superhard grinding wheel comprises the following specific steps:
(1) weighing 280/325-granularity diamond abrasive and 20-micrometer silicon powder in a mass ratio of 20: 5;
(2) mixing materials: cleaning diamond abrasive material with ultrasonic wave for 30min, placing in oven, heating at 60 deg.C, oven drying, wetting diamond abrasive material with alcohol, adding silicon powder, stirring, sieving, and granulating;
(3) and (3) pressing and forming: placing the mixed powder in the step (2) in a mold cavity, and pressing into a green body under the action of 30Mpa of a press;
(4) thermal curing: placing the green body in a graphite crucible filled with silicon powder, and sintering by vacuum liquid-phase siliconizing at vacuum degree of 5 × 10-3And (3) keeping the temperature of Pa and 1350 ℃ for 60min to ensure that the silicon reacts with a carbon source (diamond, graphite and the like) in the green body to generate the silicon carbide and diamond composite material.
Preparing an abrasive block blank by using the composite material, finishing the abrasive block blank, and processing the abrasive block blank into a designed shape and size to form an abrasive block finished product; and (3) mutually attaching the corresponding parts of the novel abrasive block and the grinding wheel base body, splicing into a grinding wheel semi-finished product, and preparing the ceramic bond superhard grinding wheel through subsequent finishing.
Example 4
The preparation process of the composite material for the superhard grinding wheel comprises the following specific steps:
(1) weighing 280/325-granularity diamond abrasive, 20-micrometer silicon powder and 10-micrometer graphite powder according to the mass ratio of 30:30, of a nitrogen-containing gas;
(2) mixing materials: cleaning diamond abrasive material with ultrasonic wave for 40min, placing in oven, heating at 60 deg.C, oven drying, wetting diamond abrasive material with alcohol, adding silicon powder, stirring, adding graphite powder, stirring, sieving, and granulating;
(3) and (3) pressing and forming: placing the mixed powder in the step (2) in a mold cavity, and pressing into a green body under the action of 200Mpa of a press;
(4) thermal curing: placing the green body in a graphite crucible filled with silicon powder, and sintering by vacuum liquid-phase siliconizing at vacuum degree of 5 × 10-3Keeping the temperature of Pa and 1600 ℃ for 10minThe silicon reacts with the carbon source (diamond, graphite, etc.) in the green body to produce a composite of silicon carbide and diamond.
And preparing a grinding wheel blank by using the composite material, finishing the grinding wheel blank, and processing the grinding wheel blank into a designed shape and size to form a finished product for thinning the thickness of the silicon wafer.
Example 5
The preparation process of the composite material for the superhard grinding wheel comprises the following specific steps:
(1) weighing 280/325-granularity diamond abrasive, 20-micrometer silicon powder, 10-micrometer graphite powder and 30-micrometer resin powder according to the mass ratio of 10: 5: 5: 5;
(2) mixing materials: cleaning diamond abrasive material with ultrasonic wave for 60min, placing in an oven, heating at 60 deg.C, oven drying, wetting diamond abrasive material with alcohol, adding silicon powder, stirring, adding graphite powder and resin powder, stirring, sieving, and granulating;
(3) and (3) pressing and forming: placing the mixed powder in the step (2) in a die cavity, and pressing into a green body under the action of 150Mpa of a press;
(4) cracking: pressing the green body into a green body, and then fully cracking the resin for 12 hours at the temperature of 900 ℃ in the argon protective atmosphere to form a prefabricated body;
(5) thermal curing: placing the prefabricated body in a graphite crucible filled with silicon powder, adopting a vacuum liquid phase siliconizing sintering process, and controlling the vacuum degree to be 5 x 10-3And (3) keeping the temperature of Pa and 1350 ℃ for 30min, so that the silicon reacts with a carbon source (diamond, graphite and the like) in the preform to generate the silicon carbide and diamond composite material.
Example 6
The preparation process of the composite material for the superhard grinding wheel comprises the following specific steps:
(1) weighing a diamond grinding material with the granularity of 280/325, silicon powder with the granularity of 20 microns and resin powder with the granularity of 30 microns, wherein the mass ratio of the diamond grinding material to the silicon powder to the resin powder is 30: 20;
(2) mixing materials: cleaning diamond abrasive material with ultrasonic wave for 50min, placing in oven, heating at 60 deg.C, oven drying, wetting diamond abrasive material with alcohol, adding silicon powder, stirring, adding resin powder, stirring, sieving, and granulating;
(3) and (3) pressing and forming: placing the mixed powder in the step (2) in a mold cavity, and pressing into a green body under the action of 120Mpa of a press;
(4) cracking: pressing the green body into a green body, and then fully cracking the resin for 2 hours at 1200 ℃ in the argon protective atmosphere to form a prefabricated body;
(5) thermal curing: placing the prefabricated body in a graphite crucible filled with silicon powder, adopting a vacuum liquid phase siliconizing sintering process, and controlling the vacuum degree to be 5 x 10-3And (3) keeping the temperature of Pa and 1400 ℃ for 30min, so that the silicon reacts with a carbon source (diamond, graphite and the like) in the prefabricated body to generate the silicon carbide and diamond composite material.
Example 7
The preparation process of the composite material for the superhard grinding wheel comprises the following specific steps:
the preparation steps are the same as example 1, except that alpha-SiC is also added in the step (1), and the mass ratio of the diamond abrasive to the alpha-SiC is 10: 5.
example 8
The preparation process of the composite material for the superhard grinding wheel comprises the following specific steps:
the preparation steps are the same as example 1, except that beta-SiC is also added in the step (1), and the mass ratio of the diamond abrasive to the beta-SiC is 60: 20.
the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. The preparation method of the composite material for the grinding wheel is characterized by comprising the following steps of:
(1) mixing materials: cleaning and drying the diamond grinding material, wetting the diamond grinding material by alcohol, adding silicon powder, stirring uniformly, sieving and granulating;
(2) and (3) pressing and forming: placing the mixed powder in the step (1) in a mold cavity, and pressing the mixed powder into a green body under the action of a press;
(3) thermal curing: and placing the green body into a graphite crucible filled with silicon powder, and reacting by adopting a vacuum liquid phase siliconizing or gas phase siliconizing sintering process to generate the silicon carbide and diamond composite material.
2. The method of claim 1, wherein: in the step (1), the mass ratio of the diamond grinding material to the silicon powder is (10-60) to (5-30).
3. The method of claim 1, wherein: and (2) adding graphite powder after adding the silicon powder in the step (1), wherein the mass ratio of the diamond grinding material to the graphite powder is (10-60): (0-30).
4. The method of claim 1, wherein: the step (1) can be added with alpha-SiC or beta-SiC, and the addition amount is 0-20 wt%.
5. The production method according to any one of claims 1 to 4, characterized in that: the molding pressure in the step (2) is 30-200 Mpa; the temperature of the vacuum liquid phase siliconizing or gas phase siliconizing sintering in the step (3) is 1350-.
6. The method of claim 5, wherein: dissolving resin in alcohol, wetting diamond grinding materials, adding silicon powder, uniformly stirring, sieving and granulating, wherein the mass ratio of the diamond grinding materials to the resin is (10-60) to (5-30); a cracking step is added between the step (2) and the step (3).
7. The method of claim 6, wherein: and (3) cracking the green body in the step (2) for 2-12h at the temperature of 900-1200 ℃ in vacuum or protective atmosphere to form a prefabricated body, and then carrying out a heat curing process on the prefabricated body.
8. The use of the composite material prepared by the method of claim 5 in the field of superhard material grinding wheels.
9. The use of the composite material prepared by the method of claim 7 in the field of superhard material grinding wheels.
10. Use according to claim 8 or 9, characterized in that: the composite material is applied to the preparation of silicon wafer thinning grinding wheels, ceramic bond superhard grinding wheels or grinding wheels for circular cutting processing.
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