CN110774180A - Reusable silicon wafer chamfering and edging grinding wheel and manufacturing method thereof - Google Patents
Reusable silicon wafer chamfering and edging grinding wheel and manufacturing method thereof Download PDFInfo
- Publication number
- CN110774180A CN110774180A CN201911127878.0A CN201911127878A CN110774180A CN 110774180 A CN110774180 A CN 110774180A CN 201911127878 A CN201911127878 A CN 201911127878A CN 110774180 A CN110774180 A CN 110774180A
- Authority
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- China
- Prior art keywords
- working layer
- powder
- silicon wafer
- grinding wheel
- base body
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 26
- 239000010703 silicon Substances 0.000 title claims abstract description 26
- 238000007688 edging Methods 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 229910000906 Bronze Inorganic materials 0.000 claims abstract description 5
- 239000010974 bronze Substances 0.000 claims abstract description 5
- 230000007704 transition Effects 0.000 claims description 14
- 229910003460 diamond Inorganic materials 0.000 claims description 12
- 239000010432 diamond Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 6
- 238000010892 electric spark Methods 0.000 claims description 6
- 238000003754 machining Methods 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 239000007767 bonding agent Substances 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 229910001651 emery Inorganic materials 0.000 claims 1
- 238000004134 energy conservation Methods 0.000 abstract description 3
- 230000009467 reduction Effects 0.000 abstract description 3
- 239000011230 binding agent Substances 0.000 abstract 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract 1
- 239000002585 base Substances 0.000 description 15
- 238000009713 electroplating Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/16—Bushings; Mountings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a reusable silicon wafer chamfering and edging grinding wheel and a manufacturing method thereof, wherein the reusable silicon wafer chamfering and edging grinding wheel comprises the following components: the device comprises a base body, a mounting hole, a working layer and a groove body; a mounting hole is formed in the center of the base body; arranging a working layer on the outer edge of the substrate; and a groove body is arranged on the working layer. The device is simple in structure and reasonable in design, is made of bronze binding agent, can be repeatedly used, achieves the purposes of energy conservation and emission reduction, and can be repeatedly used, and the use cost is reduced.
Description
Technical Field
The invention relates to the technical field of grinding wheels, in particular to a reusable silicon wafer chamfering and edging grinding wheel and a manufacturing method thereof.
Background
At present, the silicon wafer excircle chamfering (edging) grinding wheel is manufactured by an electroplating method, and has the following defects: 1. the environment is polluted, and the electroplating liquid, acid and alkali used in the electroplating process have serious pollution to the environment. 2. The working layer is thin and can be used once (within 1 mm), thereby causing great waste and high use cost. The matrix v-shaped groove is formed by machining and then electroplated with diamond, and the distribution smoothness and uniformity of diamond particles cannot be guaranteed by an electroplating process, so that the unqualified phenomena such as edge breakage and burrs can occur in the process of machining the silicon wafer by using the grinding wheel.
Disclosure of Invention
The invention aims to provide a reusable silicon wafer chamfering and edging grinding wheel and a manufacturing method thereof.
In order to achieve the above object, the present invention employs the following:
a reusable silicon wafer chamfering and edging grinding wheel comprises: the device comprises a base body, a mounting hole, a working layer and a groove body; a mounting hole is formed in the center of the base body; arranging a working layer on the outer edge of the substrate; and a groove body is arranged on the working layer.
Preferably, the groove body is a V-shaped groove; the V-shaped groove is formed by processing through electric spark equipment or laser equipment.
Preferably, the base body is made of a metal material; the working layer is made of diamond powder, copper powder, zinc powder, tin powder, nickel powder, cobalt powder or tungsten powder.
Preferably, a transition layer is also included; arranging a transition layer between the substrate and the working layer; and the working layer, the transition layer and the base body are formed by hot pressing through a die.
A manufacturing method of a reusable silicon wafer chamfering and edging grinding wheel comprises the following steps:
the working layer is formed by pressing diamond abrasive and bronze bonding agent in a die at high temperature;
then the basal body, the transition layer and the working layer are hot-pressed and molded through a mold, or the working layer and the basal body are directly hot-pressed and molded;
then, a mounting hole is formed in the center of the base body through machining, and the whole body is ground by a lathe to reach the required size;
then, slotting on the working layer through electric spark equipment or laser equipment to form a V-shaped slot;
finally, the V-shaped groove is trimmed to a depth of 0.1mm-0.8 mm.
The base body is made of a metal material; the working layer is made of diamond powder, copper powder, zinc powder, tin powder, nickel powder, cobalt powder or tungsten powder.
The invention has the following advantages:
1. the device has simple structure and reasonable design, is made of bronze bonding agent, can be repeatedly used, and achieves the purposes of energy conservation and emission reduction.
2. The device can be repeatedly used, and the use cost is reduced.
3. The trimmed V-shaped groove has good flatness and no large bulge, and the processed silicon wafer has no edge breakage and no burr.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
FIG. 1 is a schematic structural diagram of a reusable silicon wafer chamfering and edging grinding wheel according to the present invention.
FIG. 2 is a front view of a reusable silicon wafer bevel edge grinding wheel of the present invention.
In the figures, the various reference numbers are:
1-basal body, 2-mounting hole, 3-transition layer, 4-working layer and 5-groove body.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below in connection with preferred embodiments. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
As shown in fig. 1 and 2, a reusable silicon wafer chamfering and edging wheel comprises: the device comprises a base body 1, a mounting hole 2, a working layer 4 and a groove body 5; a mounting hole 2 is formed in the center of the base body 1; the outer edge of the substrate 1 is provided with a working layer 4, and the thickness of the working layer 4 is 3-20 mm; the working layer 4 is provided with a groove body 5.
Further, the groove body 5 is a V-shaped groove, and the V-shaped groove is formed by machining through electric spark equipment or laser equipment so as to meet the requirements of the silicon wafer chamfering size.
Further, the base body 1 is made of a metal material, and can be made of steel, iron, stainless steel or other materials; the working layer 4 is made of diamond powder, copper powder, zinc powder, tin powder, nickel powder, cobalt powder or tungsten powder.
Further, the device also comprises a transition layer; a transition layer 3 is arranged between the substrate 1 and the working layer 4; the working layer 4, the transition layer 3 and the substrate 1 are formed by hot pressing through a die; the transition layer 3 is arranged, so that the working layer 4 and the base body 1 are convenient to bridge; meanwhile, the working layer 4 and the base body 1 can be directly hot-pressed and molded together without using the transition layer 3 according to the situation.
A manufacturing method of a reusable silicon wafer chamfering and edging grinding wheel comprises the following steps:
the diamond abrasive and the bronze bonding agent are pressed and formed into the working layer 4 in a mould at high temperature, and the thickness of the working layer 4 is 3-20mm, so that the condition of repeated use is achieved; meanwhile, no pollutant is discharged in the processing process, so that the aims of energy conservation and emission reduction can be fulfilled;
then, the base body 1, the transition layer 3 and the working layer 4 are hot-pressed and molded through a mold, or the working layer 4 and the base body 1 can be directly hot-pressed and molded according to the situation;
a mounting hole 2 is formed in the center of a base body 1 through machining, and then the whole body is grinded to reach the required size;
then, a groove body 5 is formed in the working layer 4 through electric spark equipment or laser equipment, and the groove body 5 is in a V-shaped groove, so that the requirement on the chamfering size of the silicon wafer is met;
and finally, the V-shaped groove is trimmed to a depth of 0.1-0.8 mm, so that the groove is flat, and the diamond has no protrusion, thereby achieving the purpose of stable processing.
Further, the base body 1 is made of a metal material; the working layer 4 is made of diamond powder, copper powder, zinc powder, tin powder, nickel powder, cobalt powder or tungsten powder; the used grinding wheel is trimmed and recycled, and the use times are the finishing of the working layer 4 and the end.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (8)
1. The utility model provides a repeatedly usable's silicon chip chamfer edging emery wheel which characterized in that includes: the device comprises a base body, a mounting hole, a working layer and a groove body; a mounting hole is formed in the center of the base body; arranging a working layer on the outer edge of the substrate; and a groove body is arranged on the working layer.
2. The reusable silicon wafer chamfering and edging grinding wheel according to claim 1, wherein the groove body is a V-shaped groove; the V-shaped groove is formed by processing through electric spark equipment or laser equipment.
3. The reusable silicon wafer bevel and edging grinding wheel according to claim 1, wherein said base body is made of a metallic material; the working layer is made of diamond powder, copper powder, zinc powder, tin powder, nickel powder, cobalt powder or tungsten powder.
4. The reusable silicon wafer bevel and edging grinding wheel according to claim 3, further comprising a transition layer; arranging a transition layer between the substrate and the working layer; and the working layer, the transition layer and the base body are formed by hot pressing through a die.
5. The reusable silicon wafer bevel and edging grinding wheel according to claim 4, wherein the thickness of the working layer is 3-20 mm.
6. A method for manufacturing a reusable silicon wafer chamfering and edging grinding wheel, which is used for processing the reusable silicon wafer chamfering and edging grinding wheel according to any one of claims 1 to 4, and comprises the following steps:
the working layer is formed by pressing diamond abrasive and bronze bonding agent in a die at high temperature;
then the basal body, the transition layer and the working layer are hot-pressed and molded through a mold, or the working layer and the basal body are directly hot-pressed and molded;
then, a mounting hole is formed in the center of the base body through machining, and the whole body is ground by a lathe to reach the required size;
then, slotting on the working layer through electric spark equipment or laser equipment to form a V-shaped slot;
finally, the V-shaped groove is trimmed to a depth of 0.1mm-0.8 mm.
7. The method for manufacturing the reusable silicon wafer chamfering and edging grinding wheel according to claim 6, wherein the base body is made of a metal material; the working layer is made of diamond powder, copper powder, zinc powder, tin powder, nickel powder, cobalt powder or tungsten powder.
8. The method for manufacturing the reusable silicon wafer chamfering and edging grinding wheel according to claim 6, wherein the thickness of the working layer is 3-20 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911127878.0A CN110774180A (en) | 2019-11-18 | 2019-11-18 | Reusable silicon wafer chamfering and edging grinding wheel and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911127878.0A CN110774180A (en) | 2019-11-18 | 2019-11-18 | Reusable silicon wafer chamfering and edging grinding wheel and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110774180A true CN110774180A (en) | 2020-02-11 |
Family
ID=69392006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911127878.0A Pending CN110774180A (en) | 2019-11-18 | 2019-11-18 | Reusable silicon wafer chamfering and edging grinding wheel and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110774180A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111230761A (en) * | 2020-03-03 | 2020-06-05 | 沈阳工业大学 | A kind of grinding wheel manufacturing method and manufacturing device for silicon wafer chamfering |
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|---|---|---|---|---|
| CN203125337U (en) * | 2013-02-05 | 2013-08-14 | 江西冠亿砂轮有限公司 | Silicon carbide ceramic grinding wheel for grinding excavator glasses-like plate |
| CN205799271U (en) * | 2016-07-07 | 2016-12-14 | 李游 | An electroplated diamond grinding wheel |
| CN106695579A (en) * | 2016-12-21 | 2017-05-24 | 江苏索力德机电科技股份有限公司 | Superhard abrasive grinding wheel |
| CN106944941A (en) * | 2017-03-23 | 2017-07-14 | 镇江丰成特种工具有限公司 | A kind of 15 groove diamond disks |
| CN207788688U (en) * | 2017-12-29 | 2018-08-31 | 佛山市南海区新维科技有限公司 | A kind of metal anchoring agent diamond wheel for chamfering under Ceramic Tiles |
| CN108527174A (en) * | 2018-04-27 | 2018-09-14 | 郑州磨料磨具磨削研究所有限公司 | A kind of silicon carbide substrates chamfering grinding wheel and preparation method thereof |
| CN108747877A (en) * | 2018-06-15 | 2018-11-06 | 江苏赛扬精工科技有限责任公司 | A kind of self-sharpening hard alloy cutter buffing wheel and preparation method thereof |
| CN211163563U (en) * | 2019-11-18 | 2020-08-04 | 杨金全 | Reusable silicon wafer chamfering and edging grinding wheel |
-
2019
- 2019-11-18 CN CN201911127878.0A patent/CN110774180A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203125337U (en) * | 2013-02-05 | 2013-08-14 | 江西冠亿砂轮有限公司 | Silicon carbide ceramic grinding wheel for grinding excavator glasses-like plate |
| CN205799271U (en) * | 2016-07-07 | 2016-12-14 | 李游 | An electroplated diamond grinding wheel |
| CN106695579A (en) * | 2016-12-21 | 2017-05-24 | 江苏索力德机电科技股份有限公司 | Superhard abrasive grinding wheel |
| CN106944941A (en) * | 2017-03-23 | 2017-07-14 | 镇江丰成特种工具有限公司 | A kind of 15 groove diamond disks |
| CN207788688U (en) * | 2017-12-29 | 2018-08-31 | 佛山市南海区新维科技有限公司 | A kind of metal anchoring agent diamond wheel for chamfering under Ceramic Tiles |
| CN108527174A (en) * | 2018-04-27 | 2018-09-14 | 郑州磨料磨具磨削研究所有限公司 | A kind of silicon carbide substrates chamfering grinding wheel and preparation method thereof |
| CN108747877A (en) * | 2018-06-15 | 2018-11-06 | 江苏赛扬精工科技有限责任公司 | A kind of self-sharpening hard alloy cutter buffing wheel and preparation method thereof |
| CN211163563U (en) * | 2019-11-18 | 2020-08-04 | 杨金全 | Reusable silicon wafer chamfering and edging grinding wheel |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111230761A (en) * | 2020-03-03 | 2020-06-05 | 沈阳工业大学 | A kind of grinding wheel manufacturing method and manufacturing device for silicon wafer chamfering |
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