JP2000288926A - Adhesive pressing device and wafer adhering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive pressing device capable of heating a wafer placed on the plate surface of a carrier plate to a specified temperature and adhering it even when the heating temperature of the carrier plate is set as low as possible. SOLUTION: The head portion 38 of an adhesive pressing device 36 is provided so as to be brought into contact with/separated from the plate surface 31 of a carrier plate 30, an elastic body 40 bulged like a balloon by pressure fluids toward the plate surface is provided in the side of the head portion opposite the plate surface of the carrier plate, and to heat a wafer 34 when the head portion approaches the plate surface of the carrier plate and presses the elastic body bulged like a balloon from the rough center of the wafer 34 placed on the coated adhesive of the plate surface of the carrier plate in a peripheral edge direction, a supply means is provided to supply heated fluids between the opposite surface of the head portion and the elastic body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding press device and a bonding device for a wafer, and more particularly, to a mounting device in which a bonding surface coated with an adhesive is in contact with a plate surface of a carrier plate mounted on a polishing device. The present invention relates to a bonding press device that heat-presses a placed wafer to bond the wafer, and a bonding device for a wafer using the bonding press device.

[0002]

2. Description of the Related Art In a polishing process for finishing a polished surface of a silicon wafer or the like to a mirror surface, the wafer is usually bonded to a rigid carrier plate made of ceramic and supplied to a polishing polishing apparatus. In order to finish the polished surface of the wafer to a high flatness by polishing with such a polishing polishing apparatus, it is needless to say that the carrier plate itself has a high flatness. It is necessary to adhere with high flatness. In particular, in the polishing process of a silicon wafer, a wafer bonded to a carrier plate is pressed against a polishing surface (a surface of a polishing cloth) of a polishing platen through the plate, and the two are relatively moved. A polishing method is generally used, and a high flatness on the order of submicrons is required.

However, if there are slight bubbles between the bonding surface of the silicon wafer and the plate surface of the carrier plate, the portion of the silicon wafer corresponding to the bubbles is bonded to the carrier plate in a raised state. Since the raised portion of the silicon wafer is removed by polishing, a concave portion is formed on the polished surface of the silicon wafer, and the flatness of the polished surface is reduced. For this reason, when bonding the silicon wafer to which the adhesive has been applied to the carrier plate, the bonding press device 100 shown in FIG. 6 is used. Bonding press device 100 of FIG.
The head unit 102 is provided so as to be able to move up and down so that the head unit 102 can move toward and away from the plate surface of a carrier plate 106 placed on a receiving table 104 having a lower heater 103 built therein. In this manner, the pedestal 104 having the lower heater 103 built therein is one
The carrier plate 106 is heated to a temperature of 00 ° C. or higher, and the carrier plate 106 placed on the receiving table 104 is also heated. Further, the carrier plate 106 is provided on the head portion 102.
The elastic body 108 is provided on the side facing the plate surface. When the compressed air from the compressor 110 is supplied between the facing surface side of the head unit 102 and the elastic body 108, the elastic body 108 expands in a balloon shape toward the carrier plate 106.

[0004] Using an adhesive press apparatus 100 shown in FIG.
When bonding a silicon wafer (hereinafter, may be simply referred to as a wafer) to a carrier plate, first, the bonding surface comes into contact with the plate surface of the carrier plate 106 which is placed on the receiving table 104 and heated. The wafer 112 is placed in such a way as to perform. The wafer 112 is heated by the heat from the carrier plate 106. Next, a compressed air at room temperature is supplied between the opposing surface side of the head unit 102 and the elastic body 108 to expand the elastic body 108 in a balloon shape in the direction of the carrier plate 106, and then the head unit 102 is lowered. Elastic body 108 swelled like a balloon
Is pressed against the upper surface of the heated wafer 112. Thus, the elastic body 10 swelled in a balloon shape
By pressing the wafer 8 against the upper surface of the heated wafer 112, the wafer 112 is pressed with a uniform pressure in a direction from a substantially central portion to a peripheral edge. For this reason,
Bubbles existing between the bonding surface of the wafer 112 and the plate surface of the carrier plate 106 are also pushed out from the center of the wafer 112 toward the peripheral edge, so that the flatness of the wafer 112 bonded to the carrier plate 106 can be ensured. .

[0005]

[0006] By using the adhesive press device 100 shown in FIG.
The flatness of the wafer 112 bonded to the substrate 06 can be ensured. By the way, the carrier plate 106 and the wafer 1
The wafer 12 is placed on a receiving table 104 heated by the lower heater 103 and heated.
The carrier plate 106 to which the carrier 12 is adhered is
After being removed from the substrate 04 and cooled, it is mounted on a polishing machine or the like. However, when the carrier plate 106 to which the wafer 112 is bonded is cooled, the wafer 11
Poor adhesion between the carrier plate 106 and the carrier plate 106 may occur. This is because the wafer 112 is made of silicon and the carrier plate 106 is made of ceramic, so that a stress caused by a difference in thermal expansion coefficient between the two acts on the bonding surface between the two.

The inventor of the present invention has proposed that the carrier plate 1 which is much thicker than the wafer
06, it is advantageous to reduce the shrinkage as much as possible, so that the heating temperature of the lower heater 103 is made as low as possible, and the wafer 10
As shown in FIG.
It was attempted to incorporate the heater unit 114 in the second embodiment. However, the elastic body 108 bulging into a balloon shape is
12 while pressing against the upper surface of the elastic body 108
Is adjusted by extracting a part of the compressed air in the inflatable body so as to keep the internal pressure in the inflated body inflated to a balloon. For this reason, since the compressed air flows into and out of the bulging body, the surface temperature of the elastic body 108 tends to be lower than the target temperature. Therefore, it is necessary to raise the heating temperature of the lower heater 104, and when the carrier plate 106 to which the wafer 112 is bonded is cooled, poor bonding between the wafer 112 and the carrier plate 106 may still occur. Was. Therefore, an object of the present invention is to provide a bonding press apparatus that can heat a wafer placed on a plate surface of a carrier plate to a predetermined temperature and bond the wafer, even if the heating temperature of the carrier plate is set as low as possible. Another object of the present invention is to provide a wafer bonding apparatus using the bonding press apparatus.

[0007]

In order to solve the above-mentioned problems, the present inventor has proposed an adhesive press which presses an elastic body bulged in a balloon shape while pressing the elastic body against an upper surface of a wafer placed on a carrier plate. As a result of considering that it is effective to heat the elastic body of the device by bringing it into direct contact with the heating fluid, the present inventors have reached the present invention. That is, the present invention is a bonding press device that heat-presses and bonds a wafer placed on a plate surface of a carrier plate mounted on a polishing device so that an adhesive surface coated with an adhesive is in contact with the polishing plate.
A head portion of the adhesive press device is provided so as to be able to move toward and away from the plate surface of the carrier plate, and is provided on a side facing the plate surface of the carrier plate of the head portion in a direction of the plate surface. An elastic body that expands in a balloon shape by a pressurized fluid is provided, and the head portion is close to the plate surface of the carrier plate, and the elastic body in a balloon-like state is placed on the carrier plate. A supply for supplying a pressurized fluid heated between an opposing surface of the head portion and an elastic body so that the wafer can be heated when pressed in a peripheral direction from a substantially central portion of the formed wafer. Means for providing an adhesive press.

In the present invention, a heater is incorporated in the head portion of the adhesive press device to prevent heat radiation from the head portion and to apply a pressurized fluid as hot as possible to the opposing surface of the head portion and the elastic body. Can be supplied between In addition, by providing separate supply passages and discharge passages for supplying and discharging the heated pressurized fluid between the opposing surface and the elastic body to the head portion of the adhesive press device, the elastic body is a balloon. The heated pressurized fluid can be continuously flowed through the bulging portion that bulges in the shape. Furthermore, by using a pressurized liquid as the pressurized fluid, a larger amount of heat can be given to the elastic body than when a pressurized gas is used as the pressurized fluid.

Further, the present invention provides an adhesive applying means for applying a liquid adhesive onto a bonding surface of a wafer by dropping a liquid adhesive, and applying a heat treatment to the wafer to which the liquid adhesive has been applied so as to contain the adhesive. Baking means for evaporating the solvent and drying the adhesive, bonding press means for hot-pressing and bonding the wafer on which the adhesive has been applied to a carrier plate mounted on a polishing device, and the baking means In a wafer bonding apparatus including a transfer unit that transfers the wafer that has been subjected to the heat treatment to the bonding press unit, an adhesive is applied to a plate surface of the carrier plate that is used as the bonding press unit. The head portion of the bonding press device for bonding by heating and pressing the wafer placed so that the bonding surfaces are in contact with each other is a plate surface of the carrier plate. An elastic body that is provided so as to be able to be moved toward and away from the head, and that is inflated in a balloon shape by a pressurized fluid in the direction of the plate surface is provided on a surface of the head portion facing the plate surface of the carrier plate, When the head is pressed close to the plate surface of the carrier plate, and the elastic body in a balloon-shaped state is pressed in a peripheral direction from a substantially central portion of the wafer placed on the carrier plate and pressed. Supply means for supplying a heated pressurized fluid between an opposing surface of the head portion and an elastic body so that the wafer can be heated. .

In the present invention, the wafer subjected to the heat treatment by the baking means is transported to the bonding press means, and the wafer is transported by supporting the lower surface of the wafer such that the bonding surface of the wafer becomes the upper surface. Then, the heating treatment was performed by the baking means by using a transfer device having a head portion that is turned over so that the bonding surface of the wafer faces the plate surface of the carrier plate, and by providing a heater to the head portion of the transfer device. The wafer can be placed such that the bonding surface comes into contact with the plate surface of the carrier plate while preventing the temperature of the wafer from lowering as much as possible.

[0011] According to the adhesive press apparatus of the present invention, the elastic body swelled into a balloon by the heated pressurized fluid is directly heated by the heated pressurized fluid. Therefore, when the balloon-inflated elastic body is pressed against the wafer placed on the carrier plate and pressed, the wafer can be directly heated by the heated elastic body. Accordingly, the heating temperature for heating the carrier plate can be made as low as possible, and the defective bonding of the wafer due to the shrinkage of the carrier plate to which the wafer is bonded due to cooling can be substantially eliminated. Further, according to the wafer bonding apparatus provided with such a bonding press device, a series of bonding operations of wafers can be automatically performed, and a carrier plate having a good bonding state of wafers can be obtained.

[0012]

FIG. 1 is a schematic view of a wafer bonding apparatus according to the present invention. In FIG. 1, a first centering unit 14 and a spinner unit 1 as an adhesive applying unit are arranged in a direction from a wafer supply unit 12 to a carrier plate 30.
6. A baking unit 18 as a baking unit, a second centering unit 20, and a transfer device 21A as a transfer unit for transferring a wafer from the second centering unit 20 to the carrier plate 30 are sequentially arranged. In the wafer bonding apparatus shown in FIG. 1, the wafer supplied from the wafer supply unit 12 is centered by the first centering unit 14 and sent to the spinner unit 16. The spinner unit 16 is an adhesive coating device that applies a liquid adhesive onto a bonding surface of the wafer while rotating the wafer at a high speed. The wafer having the liquid adhesive applied to the bonding surface is sent to a baking unit 18 provided with an infrared lamp, and the adhesive is dried by heating with the infrared lamp. The drying of the adhesive means that the solvent contained in the adhesive is volatilized by heating.

Further, the wafer on which the adhesive applied to the bonding surface has been heated and dried in the baking section 18 is again centered by the second centering section 20, and then transferred to the carrier plate 30 by the transfer device 21A. Since such a transfer is performed with the bonding surface of the wafer facing upward, the wafer transferred to the carrier plate 30 is inverted by the transfer device 21A such that the bonding surface faces the plate surface of the carrier plate 30.

The carrier plate 30 shown in FIG.
As shown in the figure, the carrier plate 30 is placed on a receiving table 32 in which a lower heater 29 is built.
The wafer 34 is placed on the plate surface 31 so that the adhesive surface to which the adhesive is applied is in contact. The wafer 34 is pressed by the head portion 38 of the bonding press device 36 onto the plate surface 31 of the carrier plate 30.
Adhered to. The head section 38 shown in FIG. 2 is provided to be vertically movable so as to be able to move toward and away from the plate surface 31 of the carrier plate 30, and is vertically moved by a driving device (not shown) such as a pneumatic cylinder. Driven. The head portion 38 is provided with an elastic body 40 on a side of a facing surface 39 facing the plate surface 31 of the carrier plate 30. The elastic body 40 is mainly formed of an elastic resin such as rubber, and is reinforced by a net or the like. When a pressurized fluid such as pressurized air is supplied between the opposing surface 39 and the elastic body 40, the elastic body 40 has a plate surface 3
The balloon bulges in the direction of 1.

In the bonding press apparatus 36 shown in FIG. 2, the pressurized fluid supplied between the opposing surface 39 of the head section 38 and the elastic body 40 is a pressurized liquid, specifically, about 10
Silicone oil heated to around 0 ° C. is used. The heated pressurized liquid is supplied to a supply passage 42 and a discharge passage 44 which are provided independently of the head portion 38.
It is supplied and discharged between the facing surface 39 and the elastic body 40. As a supply unit that supplies the heated pressurized liquid to the head unit 38, a fluid supply device 50 illustrated in FIG. 2 can be used. In the fluid supply device 50, a heater 54 for heating a liquid such as silicone oil stored in the tank 52 to a predetermined temperature is provided in the tank 52. The heated liquid heated to a predetermined temperature in the tank 52 is pumped up to a predetermined pressure by a pump 56 and sent out. After passing through an electromagnetic valve 58 and passing through a feed pipe 60, the heating liquid is supplied to the head by a supply passage 42 of the head unit 38. It is supplied between the opposing surface 39 of the part 38 and the elastic body 40.

The heating liquid supplied between the opposing surface 39 of the head section 38 and the elastic body 40 and heating the elastic body 40 is discharged between the opposing surface 39 and the elastic body 40 by the discharge passage 44 of the head section 38. After returning to the tank 52 through the return valve 62, the servo valve 64 is passed. In the fluid supply device 50, the pressure of the pressurized liquid supplied between the facing surface 39 of the head portion 38 and the elastic body 40 is adjusted by adjusting the opening of the servo valve 64 provided in the return pipe 62. Can be adjusted. In addition, when the supply of the heating liquid to the head section 38 is stopped, the supply of the heating liquid can be stopped by stopping the pump 56, but can also be performed by closing the electromagnetic valve 58. At this time, it is preferable to open the electromagnetic valve 66 provided in the circulation pipe having one end connected between the pump 56 and the electromagnetic valve 58, and circulate the heated liquid stored in the tank 52. By this circulation, the heating liquid can be stirred, and the temperature of the heating liquid stored in the tank 52 can be made uniform. When the heating liquid is sent to the head section 38, the solenoid valve 58 of the feed pipe 60 is opened and the solenoid valve 66 of the circulation pipe is closed.

In the bonding press device 36 shown in FIG. 2, when the wafer 34 is placed on the plate surface 31 of the carrier plate 30 so that the bonding surface coated with the adhesive is in contact with the plate surface 31, it is positioned above the wafer 34. The head 38 starts descending. During this lowering, pressurized liquid heated to a predetermined temperature and pressurized to a predetermined pressure is supplied from the fluid supply device 50 to the head unit 38 via the supply passage 42 of the head unit 38. The pressurized liquid supplied to the head portion 38 is supplied by a supply passage 42 between the opposing surface 39 and the elastic body 40, and expands the elastic body 40 in a balloon shape in the direction of the wafer 34 while heating the elastic body 40. Further, the pressurized liquid that has heated the elastic body 40 flows from the discharge passage 44 to the facing surface 39 and the elastic body 4.
A new pressurized fluid discharged from between 0 and heated to a predetermined temperature is supplied from the supply passage 42. For this reason, it is possible to expand the elastic body 40 into a balloon while continuously heating it.

The elastic body 40 bulged into a balloon while being heated can be pressed with a uniform pressure from the substantially central portion of the wafer 34 toward the peripheral edge as the head portion 38 further descends. In addition, the wafer 34 can be heated at the same time. For this reason, bubbles existing between the bonding surface of the wafer 34 and the plate surface 31 of the carrier plate 30 are also pushed out from the center of the wafer 34 toward the peripheral edge, and as a result, the flatness of the wafer 34 bonded to the carrier plate 30 is reduced. Nature can be secured. As described above, the inner pressure of the elastic body 40 is increased by pressing the elastic body 40 bulged in a balloon shape against the wafer 34, but the internal pressure of the elastic body 40 is adjusted to a constant pressure by adjusting the opening of the servo valve 64. It can be.

In the bonding press device 36 shown in FIG. 2, the elastic body 4 which has been balloon-expanded while being heated.
By setting 0, the wafer 34 can be heated, so that the heating temperature of the cradle 32 by the lower heater 29 can be made as low as possible. For this reason, the carrier plate 30, which is placed on the pedestal 32 whose heating temperature is maintained at a low temperature of about 40 ° C. and to which the wafer 34 is bonded, minimizes the degree of shrinkage due to its cooling. As a result, it is possible to prevent poor adhesion between the wafer 34 and the carrier plate 30 caused by a difference in contraction between the carrier plate 30 and the wafer 34. By the way, when the heated wafer 34 is cooled, stress accompanying the shrinkage is applied to the bonding surface. However, since the thickness of the wafer 34 is much thinner than the carrier plate 30, the stress accompanying the shrinkage of the wafer 34 is increased. A stress level does not cause poor bonding. Further, in the bonding press device 36 shown in FIG. 2, it is preferable that the heater 48 is built in the head portion 38. Even before the supply of the heated pressurized liquid is started, the fact that the head section 38 is heated to the predetermined temperature means that the opposing surface 39 and the elastic body 40 can be prevented from lowering the temperature of the pressurized liquid as much as possible. This is because the pressurized liquid can be supplied during this time.

As described above, the bonding press device 36 shown in FIG.
According to the method, even if the heating temperature of the receiving table 32 is set as low as possible, the wafer 3 placed on the carrier plate 30
4 can be bonded while being heated to a predetermined temperature. On the other hand, in the wafer bonding apparatus shown in FIG.
Is heated by the baking unit 18, the heated wafer 34 can be placed on the carrier plate 30 without cooling as much as possible.
This is preferable because the amount of heating applied to the wafer 34 can be reduced, and the bonding time and the like can be reduced. Therefore, it is preferable to use the transfer device 21 shown in FIGS. 3 and 4 as the transfer device 21A that transfers the wafer 34 from the baking unit 18 to the carrier plate 30. This transport device 2
In 1, a base plate 72 is provided so as to be movable along guide rails 70, 70 arranged in parallel with the feeding direction of the wafer 34. The rotating shaft 7 is provided on the base plate 72.
4 is rotatably provided by an actuator 76, and an arm 76 having an axis parallel to the axis of the rotating shaft 74 is connected to the tip of the rotating shaft 74. This arm 76
A suction head 78 capable of sucking the wafer 34 is provided at a tip end of the suction head 78. Therefore, the suction head 78
It can be rotated by the actuator 76.

As shown in FIG. 4, the suction head 78 has heaters 80 and 80 built therein so that the suction surface 79 can be heated. A suction hole 82 is opened at the center of the suction surface 79 of the suction head 78, and the wafer 34 can be suctioned to the suction surface 79 by a suction device connected to the suction hole 82. Further, in the transfer device 21, the base 72 provided with the guide rails 70, 70 is provided.
Are cylinder devices 86, 8 fixed to a fixed base 84.
6, the suction head 78 can be moved up and down by the base 7.
2 can be moved up and down simultaneously. Thus, the suction head 7
8 can be rotated by the actuator 76 while the wafer 34 is being sucked to the suction surface 79 by the suction hole 82, and can be moved up and down by the cylinder device 86.

In the wafer bonding apparatus using the transfer apparatus 21 shown in FIGS. 3 and 4 as the transfer apparatus 21A shown in FIG. 1, the adhesive applied to the bonding surface is baked by the baking unit 18.
The wafer heated and dried (heated and volatilized) is again centered by the second centering unit 20 and then transferred by the transfer device 21 to a position short of the carrier plate 30. In the transfer device 21, the actuator 76 is driven so that the suction surface 79 faces upward, and the suction head 78 is moved.
Is rotated, the surface opposite to the adhesive surface of the wafer 34 is sucked and supported on the suction surface 79 of the suction head 78, and is conveyed to the carrier plate 30 substantially horizontally. When the wafer 34 is transported to a position just above the carrier plate 30,
By driving the actuator 76, the suction head 78 is rotated while the wafer 34 is suctioned on the suction surface 79 so that the suction surface 79 of the suction head 78 faces downward. The wafer 34 sucked on the suction surface 79 of the suction head 78 in this state can have its bonding surface facing the plate surface 31 of the carrier plate 30. Next, the suction head 78
Is transferred to the wafer bonding position of the carrier plate 30 by the transfer device 21, and then the cylinder device 86 is driven,
By lowering the suction head 78, the wafer 34
At a predetermined position on the carrier plate 30.

In the transfer device 21, the heaters 80 and 80 are built in the suction head 78, and the suction surface 7
9 can be heated to a predetermined temperature. For this reason, while transferring the wafer 34 from the baking part 18 to the carrier plate 30 using the transfer device 21, it is possible to prevent a decrease in temperature due to heat radiation of the wafer 34. As a result, the bonding press device 3
6, the amount of heating applied to the wafer 34 can be reduced, and the bonding time and the like can be shortened. As described above, in the bonding press device 36 illustrated in FIG. 2, the heated pressurized liquid is used as the heated pressurized fluid, but the heated pressurized air may be used. The elastic body 40 provided on the head portion 38 of the bonding press device 36 shown in FIG. 2 may also incorporate the planar heater 49 shown in FIG. Such a planar heater 4
Adhesive press device 3 having an elastic body 40 with a built-in 9
In 6, the planar heater 49 can be used as a heating source of the elastic body 40, and the temperature of the heating fluid can be reduced.

[0024]

According to the present invention, since the wafer placed on the carrier plate can be heated by the bonding press device, the heating temperature for heating the carrier plate can be as low as possible. As a result, defective bonding of the wafer due to shrinkage of the carrier plate to which the wafer is bonded due to cooling can be substantially eliminated, and a carrier plate with a good bonded state of the wafer can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic diagram for explaining an outline of a wafer bonding apparatus according to the present invention.

FIG. 2 is an explanatory diagram for explaining an outline of an adhesive press device used in the wafer adhesive device shown in FIG. 1;

FIG. 3 is an explanatory diagram for explaining an outline of a transfer device used in the wafer bonding device shown in FIG. 1;

4 is a partial cross-sectional view of a suction head in the transfer device shown in FIG.

FIG. 5 is an explanatory diagram for explaining another example of a head section constituting the wafer bonding apparatus according to the present invention.

FIG. 6 is an explanatory diagram for explaining an outline of a conventional bonding press device.

[Explanation of symbols]

 Reference Signs List 12 Wafer supply unit 16 Spinner unit (adhesive application unit) 18 Baking unit 21, 21A Transfer device 29 Lower heater 30 Carrier plate 31 Plate surface 32 Receiving stand 34 Wafer 36 Adhesive press device 38 Head unit 39 Opposing surface 40 Elastic body 42 supply passage 44 discharge passage 48, 80 heater 50 fluid supply device 78 suction head 79 suction surface

Claims (6)

[Claims] 1. A bonding press device for heating and bonding a wafer placed on a carrier plate mounted on a polishing device such that a bonding surface coated with an adhesive is in contact with a plate surface of a carrier plate, the bonding press comprising: A head portion of the device is provided so as to be able to move toward and away from the plate surface of the carrier plate, and a pressurized fluid in the direction of the plate surface is provided on a side of the head portion facing the plate surface of the carrier plate. An elastic body that swells like a balloon is provided, and the head portion is close to the plate surface of the carrier plate, and the elastic body that is swelled like a balloon is placed on the carrier plate. When pressing the wafer from the substantially central portion in the peripheral direction to press the wafer, an additional space is provided between the opposing surface of the head portion and the elastic body so that the wafer can be heated. Bonding press apparatus, wherein a supply means for supplying a pressurized fluid which is provided is. 2. The bonding press device according to claim 1, wherein a heater is built in a head portion of the bonding press device. 3. A head portion of the bonding press device, wherein a supply passage and a discharge passage for supplying and discharging heated pressurized fluid are provided independently between the opposing surface and the elastic body. 3. The adhesive press device according to claim 1 or 2. 4. The pressurized fluid is a pressurized liquid.
4. The bonding press device according to claim 3. 5. An adhesive applying means for applying a liquid adhesive by dropping a liquid adhesive on an adhesive surface of a wafer; and performing a heat treatment on the wafer to which the liquid adhesive has been applied to form a solvent contained therein. Baking means for evaporating the adhesive and drying the adhesive; bonding press means for hot-pressing and bonding the wafer on which the adhesive has been applied to a carrier plate to be mounted on a polishing device; and heat treatment by the baking means. The applied wafer is
In a wafer bonding apparatus having a transfer unit that transfers the wafer to the bonding press unit, the wafer is placed such that the bonding surface coated with an adhesive is in contact with the plate surface of the carrier plate used as the bonding press unit. A head portion of an adhesive press device for heating and bonding the wafer by heating is provided on the plate surface of the carrier plate so as to be able to move toward and away from the plate surface, and on the side of the head portion facing the plate surface of the carrier plate. An elastic body that expands in a balloon shape by a pressurized fluid in the direction of the plate surface is provided, and the head portion is close to the plate surface of the carrier plate, and the elastic body in a balloon-like state is removed. When pressing the wafer placed on the carrier plate from the substantially central portion in the peripheral direction and pressing, heating the wafer As you get
A supply device for supplying heated pressurized fluid between an opposing surface of the head portion and the elastic body is provided. 6. A transfer means for transferring the wafer, which has been subjected to the heat treatment by the baking means, to the bonding press means, by supporting the lower surface of the wafer such that the bonding surface of the wafer is the upper surface, and transferring the wafer. The wafer bonding apparatus according to claim 5, wherein a transfer unit having a head unit that is turned over so that the bonding surface of the wafer faces the plate surface of the carrier plate, and a heater is built in the head unit of the transfer device.