JP2021106281A - Wafer conveyance and holding device - Google Patents

Abstract

To provide a wafer conveyance and holding device capable of surely sucking and holding a wafer even with large warpage.SOLUTION: A wafer conveyance and holding device includes: first wafer pressing means 24 for pressing a semiconductor wafer W conveyed on a chuck table 11 against a chuck table 11; second wafer pressing means that is constituted of an air bag 30, comes into contact with the semiconductor wafer W carried on the chuck table 11 at a portion of an area 27b on an outer peripheral side than the first wafer pressing means 24, and presses a portion of an area 27b on an outer peripheral side of the semiconductor wafer W onto the chuck table 11; and a control unit for causing the chuck table 11 to suck and hold the semiconductor wafer W pressed against the chuck table 11 by the first wafer pressing means 24 and the second pressing means in order.SELECTED DRAWING: Figure 2

Description

The present invention relates to a wafer transfer device, and more particularly to a wafer transfer / hold device that transfers a thinly processed semiconductor wafer onto a chuck table and sucks and holds it.

A semiconductor wafer (hereinafter, simply referred to as a "wafer") used in the manufacture of a semiconductor device is an ingot of a semiconductor material cut into a thin plate shape according to the direction of the crystal axis and polished. Further, in the manufacture of semiconductor devices, in a production process such as lithography for forming a device on a wafer, it is necessary to fix the wafer, and usually a negative air pressure is applied to suck the wafer, so-called vacuum suction method suction. Various processes are performed while the wafer is sucked and held on a stage (usually referred to as a "chuck table") (see, for example, Patent Document 1).

Then, after the device on the wafer is completed, the same applies when the tester and the electrode pad of the device are connected by a prober to perform an electrical operation inspection, or when an optical inspection of a pattern formed by an inspection machine is performed. Inspecting is performed with the wafer sucked and held on the chuck table.

In recent years, in the manufacture of semiconductor devices, the diameter of a wafer has been increased to improve production efficiency, and the diameter of a wafer has been increasing more and more. Further, if the number of wafers that can be taken from one ingot is increased, the manufacturing cost of the wafer is reduced by that amount, so that the thickness of the wafer tends to be reduced accordingly.

Japanese Unexamined Patent Publication No. 2003-234392

However, the larger the diameter and the thinner the wafer, the more warpage occurs due to distortion, even if it is polished. In particular, when a semiconductor device is formed on the surface of a wafer, warpage is likely to occur. When a wafer with a large degree of warpage is placed on the chuck table, a large gap is created between the suction groove on the chuck table side and the wafer, and even if negative pressure is applied, air is formed in the groove through the gap. Flows in. Therefore, there arises a problem that the wafer cannot be sufficiently adsorbed and held. Further, in the process of transporting the wafer to the next step while the wafer adsorption failure occurs, the wafer shifts. In this state, there is a problem that it cannot be placed on the chuck table or the like in the next process with high accuracy.

In order to solve such a problem, it is conceivable to increase the driving capacity of the vacuum pump to increase the negative pressure, that is, to lower the air pressure in the air system path and the groove. However, for that purpose, it is necessary to prepare a vacuum pump having a large driving capacity, which causes various problems such as cost and cannot be dealt with when the gap is large.

Therefore, there arises a technical problem to be solved in order to provide a wafer transfer holding device capable of reliably sucking and holding even a wafer having a large warp, and the present invention solves this problem. With the goal.

The present invention has been proposed to achieve the above object, and the invention according to claim 1 comprises a chuck table for sucking and holding a semiconductor wafer and a transport mechanism for transporting the semiconductor wafer onto the chuck table. In the wafer transfer holding device provided, air is supplied to the inside by being composed of a first wafer pressing means for pressing the semiconductor wafer conveyed on the chuck table against the chuck table and a bag-shaped elastic deformable material. When pressurized, it swells and comes into contact with the semiconductor wafer conveyed on the chuck table in a region portion on the outer peripheral side of the first wafer pressing means, and the region portion on the outer peripheral side of the semiconductor wafer is brought into contact with the semiconductor wafer. A control unit that sucks and holds the semiconductor wafer pressed against the chuck table in the order of the second wafer pressing means pressed onto the chuck table, the first wafer pressing means, and the second pressing means. It is an object of the present invention to provide a wafer transfer holding device including the above.

According to this configuration, the control unit presses the region portion on the center side of the wafer onto the chuck table by the first wafer pressing means to position the semiconductor wafer with respect to the chuck table. The operation of pressing the region portion on the central side of the semiconductor wafer by the first wafer pressing means and the pressing operation of the region portion on the center side of the semiconductor wafer, such that the region portion on the outer peripheral side of the semiconductor wafer is pressed onto the chuck table by the second wafer pressing means The pressing operation of the region portion on the outer peripheral side of the semiconductor wafer by the second wafer pressing means is controlled stepwise. In this way, the pressing operation of the central region portion of the semiconductor wafer by the first wafer pressing means and the pressing operation of the outer peripheral side region portion of the semiconductor wafer by the second wafer pressing means can be performed at the same time. When the semiconductor wafer is pressed onto the chuck table in a stepwise manner, the semiconductor wafer is substantially radially abutted against the chuck table from the center side to the outer peripheral side. Therefore, even if the semiconductor wafer has a large warp, the influence of the warp of the semiconductor wafer can be reduced and the entire semiconductor wafer can be placed densely on the chuck table. As a result, the negative pressure applied to the chuck table side is satisfactorily transmitted to the semiconductor wafer side, and the chuck table ensures that the semiconductor wafer is attracted and held.

According to the invention of claim 2, in the configuration of claim 1, the first wafer pressing means is surrounded by a ring-shaped V-seal having a diameter smaller than the outer diameter of the semiconductor wafer and the V-seal. The wafer suction vacuum line on the transfer mechanism side is provided with a suction port provided inside the region, and the chuck table is in a flat region for sucking and holding the semiconductor wafer conveyed on the chuck table. Provided is a wafer transfer holding device provided with a wafer suction vacuum line on the chuck table side formed by providing a suction port.

According to this configuration, the wafer suction vacuum line on the transport mechanism side generates a negative pressure in the region surrounded by the ring-shaped V-seal, and the V-seal on the center side of the semiconductor wafer. The region portion is sucked and held and transported onto the chuck table. Next, the region portion on the center side of the semiconductor wafer is pressed onto the chuck table via the V-seal, and the region portion on the center side of the semiconductor wafer and the chuck table are made close to each other. Subsequently, the region portion on the outer peripheral side of the semiconductor wafer is pressed onto the chuck table by the second wafer pressing means. In this way, the semiconductor wafer pressed onto the chuck table by the first wafer pressing means and the second wafer pressing means is densely placed on the chuck table as a whole of the semiconductor wafer. Since the negative pressure is received in this state, the negative pressure generated by the wafer suction vacuum line on the chuck table side is satisfactorily transmitted to the semiconductor wafer, and the semiconductor wafer is surely placed on the chuck table. It is sucked and held.

According to a third aspect of the present invention, in the configuration according to the first or second aspect, the first wafer pressing means is a pressure cylinder provided above the chuck table and having a rod that moves forward and backward in the vertical direction. Provided is a wafer transfer holding device.

According to this configuration, the pressing operation of the first wafer pressing means for pressing the semiconductor wafer against the chuck table can be remotely controlled via the advancing / retreating operation of the rod in the pressure cylinder.

In the present invention, the control unit performs an operation of pressing the region portion on the center side of the semiconductor wafer onto the chuck table by the first wafer pressing means and an operation of pressing the region portion on the outer peripheral side of the semiconductor wafer onto the chuck table. The semiconductor wafer is stepped onto the chuck table by pressing the region portion on the central side of the semiconductor wafer onto the chuck table and then pressing the region portion on the outer peripheral side of the semiconductor wafer onto the chuck table. Since the semiconductor wafers are pressed and brought into close contact with each other, the semiconductor wafers are substantially radially abutted against the chuck table from the center side to the outer peripheral side. As a result, even if the semiconductor wafer has a large warp, the semiconductor wafer can be sucked and held on the chuck table in a state where the influence of the warp is reduced.

It is a perspective view which shows the main part structure of the wafer transfer holding apparatus to which this invention is applied. It is a figure explaining the internal structure with the cross section of the main part of the same transport holding apparatus shown in FIG. It is a figure explaining the structure of the 2nd pressing means shown in FIG. 1, (a) shows the state when air is not supplied, and (b) is the state when air is supplied and swells. It is a figure which shows. It is a block diagram which shows the system configuration in the same transport holding apparatus shown in FIG. 1 and FIG. It is a figure explaining an example of the control procedure by the control part of the system configuration shown in FIG. It is a figure explaining one operation example in the same-mentioned transfer holding apparatus, and is the figure which shows the state which the semiconductor wafer is conveyed by the transfer mechanism. It is a figure explaining one operation example in the same-mentioned transfer holding apparatus, and is the figure which shows the state which the transfer mechanism has finished transferring a semiconductor wafer on a chuck table. It is a figure explaining one operation example in the said transfer holding apparatus, and is the figure which shows the state which the 1st wafer pressing means presses a semiconductor wafer against a chuck table. It is a figure explaining one operation example in the said transfer holding apparatus, in which a 1st wafer pressing means and a 2nd wafer pressing means press a semiconductor wafer against a chuck table, and the chuck table sucks and holds a semiconductor wafer. It is a figure which shows the state. It is a figure explaining one modification of the 1st wafer pressing means in the same transport holding apparatus.

In order to achieve the object of providing a wafer transfer holding device capable of reliably sucking and holding a wafer having a large warp, the present invention has a chuck table for sucking and holding a semiconductor wafer and the chuck table for holding the semiconductor wafer. In a wafer transfer holding device including a transfer mechanism for conveying upwards, the wafer is composed of a first wafer pressing means for pressing the semiconductor wafer conveyed on the chuck table against the chuck table, and a bag-shaped elastic deformable material. When air is supplied to the inside and pressure is applied, the wafer swells and comes into contact with the semiconductor wafer conveyed on the chuck table in a region portion on the outer peripheral side of the first wafer pressing means, and the semiconductor wafer. The second wafer pressing means for pressing the region portion on the outer peripheral side onto the chuck table, and the semiconductor wafer pressed against the chuck table in the order of the first wafer pressing means and the second pressing means. This was achieved by providing a control unit that sucks and holds the chuck table.

Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same elements are designated by the same reference numerals throughout the description of the embodiment. Further, in the following description, the expressions indicating the directions such as up and down and left and right are not absolute, and are appropriate when each part of the transport holding device of the present invention is drawn, but that posture. Should be changed and interpreted according to the change in posture.

FIG. 1 is a perspective view showing a configuration of a main part of a wafer transfer holding device 10 to which the present invention is applied, and FIG. 2 is a side view showing an internal configuration of a main portion of the wafer transfer holding device 10 in FIG. Is. The wafer transfer holding device 10 can be widely used in the manufacturing process of semiconductor devices. The wafer transfer holding device 10 has a vacuum suction type chuck table 11 that applies negative air pressure (negative pressure) to suck and hold the semiconductor wafer W to perform various processes, and the semiconductor wafer W from the previous processing step. Is provided on the chuck table 11 with a transfer mechanism 12 or the like. The semiconductor wafer W is obtained by cutting an ingot of a semiconductor material into a thin plate shape according to the direction of the crystal axis and polishing it, and is formed in a substantially disk shape.

As shown in FIG. 1, the chuck table 11 is a disk-shaped table. Further, as shown in FIG. 2, the chuck table 11 has a disk-shaped holding table 11a formed with an outer diameter larger than the outer diameter of the semiconductor wafer W and the upper surface of the holding table 11a (the semiconductor wafer W is placed on the holding table 11a). It is provided with a suction portion 11b, which is also formed in a disk shape and has an outer diameter substantially the same as the outer diameter of the semiconductor wafer W, which is provided so as to be exposed on the surface to be formed.

The suction portion 11b of the chuck table 11 is provided with a plurality of suction grooves (not shown) and suction holes 13 communicating with the plurality of grooves. The wafer suction vacuum line 14 provided on the holding table 11a is communicated with the suction hole 13. Therefore, the suction hole 13 functions as a suction port of the wafer suction vacuum line 14. Although not shown, a pressure gauge, a valve, and a vacuum source are sequentially arranged in the wafer suction vacuum line 14, and the suction holes 13, the wafer suction vacuum line 14, the pressure gauge, the valve, the vacuum source, and the like are used. The first wafer vacuum suction means 15 is configured. That is, in the first wafer vacuum suction means 15, a negative pressure is applied to the suction portion 11b, and the negative pressure is applied to the semiconductor wafer W placed on the suction portion 11b of the chuck table 11. It can be sucked and held for a while.

In addition to the transfer plate (also referred to as “convey pad”) 21 and transfer arm 22 shown in FIGS. 1 and 2, the transfer mechanism 12 includes a second wafer vacuum suction means 23 and a first wafer pressing means shown in FIG. 24 and a second wafer pressing means 25 are provided.

As shown in FIG. 1, the transport plate 21 is a disk-shaped plate. As shown in FIG. 2, the transport plate 21 is formed to have substantially the same outer diameter as the outer diameter of the semiconductor wafer W. Similarly, as shown in FIG. 2, a second wafer vacuum suction means 23 and a second wafer pressing means 25 are provided on the lower surface side (the surface side facing the semiconductor wafer W) of the transport plate 21. .. Further, a transport arm 22 is rotatably attached to a surface on the opposite side of the transport plate 21, that is, a substantially central portion on the upper surface side via a pivot 26.

One end side (base end side) of the transfer arm 22 is fixed to, for example, a robot arm, and the transfer plate 21 is attached to the other end side via the pivot 26. The transfer arm 22 holds the semiconductor wafer W from a required position (previous process position) to a required position (main process position), or can move the transfer plate 21 independently. That is, by moving the transfer arm 22, the semiconductor wafer W before the processing is moved from the previous process position onto the chuck table 11, and the semiconductor wafer W after the processing is provided at a required position from the chuck table 11. It can be moved to the process position.

As shown in FIG. 2, the second wafer vacuum suction means 23 provided on the transport plate 21 is arranged so as to have the same axis as the axis (axis of the pivot 26) O1 of the transfer plate 21. A V-seal 23a for holding a vacuum is provided. The V-seal 23a has a diameter smaller than the outer diameter of the semiconductor wafer W, and is formed of a rubber, a soft resin material, or the like in a ring shape. The V-seal 23a is attached so that the entire circumference on one side is tightly fixed to the lower surface of the transport plate 21. On the contrary, the other surface side of the V-seal 23a is formed as a flexible lip portion 23b as a free end whose entire circumference extends toward the chuck table side in a tapered cross section, and the other end side is a transport plate. It is arranged so as to hang down from the lower surface of 21. The lip portion 23b can be brought into close contact with the upper surface of the semiconductor wafer W. Further, the transfer plate 21 includes a wafer suction vacuum line 28 on the transfer mechanism side, which is provided with a suction port 28a inside the region 27a surrounded by the V seal 23a. Although not shown, the wafer suction vacuum line 28 is provided with a pressure gauge, a valve, and a vacuum source in this order.

The first wafer pressing means 24 provided in the transfer mechanism 12 includes a pressure cylinder 29 arranged above the chuck table 11 so that the axis is the same as the axis O1 of the transfer plate 21. .. The pressure cylinder 29 has a rod 29a that moves forward and backward in the vertical direction. When the rod 29a is lowered in a state where the axis O1 of the transfer plate 21 and the axis O2 of the chuck table 11 of the pressure cylinder 29 are substantially aligned with each other, the lower end of the rod 29a hits the transfer arm 22. When they are in contact with each other, the transfer arm 22 is pushed downward, and the transfer arm 22 and the transfer plate 21 can be integrally moved downward. The transfer arm 22 is spring-urged upward by a spring (not shown), and when the rod 29a of the pressure cylinder 29 rises and is released from being pressed, the transfer arm 22 also moves upward again together with the transfer plate 21. It is designed to move and return.

As shown in FIGS. 2 and 3, the second wafer pressing means 25 provided on the lower surface side of the transport plate 21 has substantially the same size as the outer diameter of the semiconductor wafer W and moves forward and backward with respect to the semiconductor wafer W. The airbag 30 is provided as a possible pressing means, and the air supply line 31 is provided as an air supply means for supplying air into the airbag 30.

The airbag 30 is made in a bag shape using, for example, an elastically deformable material such as rubber or soft plastic, has substantially the same size as the outer diameter of the semiconductor wafer W, and is larger than the outer diameter of the V-seal 23a. Is also formed as a balloon body which is a ring-shaped bag-shaped portion having a large outer diameter. Further, as shown in FIGS. 2 and 3, the airbag 30 is provided with a gap S between the airbag 30 and the V-seal 23a over the entire circumference, and the entire outer circumference of the V-seal 23a is provided on the lower surface side of the transport plate 21. It is arranged in an enclosed state. Further, as shown in FIG. 3, the airbag 30 is provided with a supply port 30a for supplying and discharging air inside. The supply port 30a is connected to the air supply line 31. The air supply line 31 has a function of supplying and pressurizing air into the airbag 30 through the supply port 30a and a function of discharging air. Although not shown, the air supply line 31 is provided with a pressure gauge, a valve, and an air pump in this order. When the air is not supplied or pressurized inside the airbag 30, the airbag 30 is shrunk to a state of being retracted to the transport plate side from the V seal 23a as shown in FIG. 3A. When air is supplied to the inside and pressurized, it swells as shown in FIG. 3B, and can swell toward the outside (semiconductor wafer W side).

FIG. 4 is a block diagram showing a system configuration in the wafer transfer holding device 10 shown in FIGS. 1 and 2. In FIG. 4, this system configuration includes a control unit 32.

The control unit 32 has a central processing function of controlling the overall operation of the wafer transfer holding device 10, and is, for example, a computer. The control unit 32 incorporates a program that controls the wafer transfer holding device 10 according to a predetermined procedure. Further, the control unit 32 includes a first wafer vacuum suction means 15, a transfer mechanism 12, a second wafer vacuum suction means 23, a first wafer pressing means 24, and a second wafer pressing means 25. , Are connected in a controllable manner.

FIG. 5 is a flowchart showing an example of a processing procedure in which the control unit 32 controls the overall operation of the wafer transfer holding device 10. Further, FIGS. 6 to 9 are diagrams showing states of the transport holding operation at each operation in the processing process shown in FIG. Therefore, an operation example of the wafer transfer holding device 10 will be described below according to the flowchart shown in FIG. 5 and using the operation state diagrams of FIGS. 6 to 9. The processing procedure shown in FIG. 5 is merely an example, and the processing procedure of the present invention is not limited to this example.

First, as shown in FIG. 6, the semiconductor wafer W before the processing is sucked and held by the transport plate 21 and transported from the previous process position toward the chuck table 11. Then, as shown in FIG. 7, the semiconductor wafer W is brought into contact with the chuck table 11 in a state where the axial center O2 of the chuck table 11 and the center of the semiconductor wafer W are substantially aligned with each other. In the transfer of the semiconductor wafer W by the transfer plate 21 shown in FIG. 6, the control unit 32 turns on the first wafer vacuum suction means 15, that is, the wafer suction vacuum line 28 is turned on, and the V-seal 23a is used. The air in the enclosed region 27a is sucked through the wafer suction vacuum line 28, and a negative pressure is applied in the region 27a (step 1). Then, due to the negative pressure, the portion of the region 27a on the central side of the semiconductor wafer W is suction-held by the second wafer vacuum suction means 23, that is, the V-seal 23a. In this way, the semiconductor wafer W is conveyed from the previous process position toward the chuck table 11 by the movement of the transfer arm 22 in a state where the semiconductor wafer W is attracted and held by the transfer plate 21 of the second wafer vacuum suction means 23.

Further, as shown in FIG. 7, when the semiconductor wafer W is conveyed onto the chuck table 11, the control unit 32 controls the rod 29a of the pressure cylinder 29 in the first wafer pressing means 24 as shown in FIG. (Step 2). Further, by pressing the first wafer pressing means 24, the region 27a (the region surrounded by the V seal 23a) on the center side of the semiconductor wafer W is closely abutted and arranged on the suction portion 11b of the chuck table 11. ..

Next, the control unit 32 turns on the air supply line 31 of the second wafer pressing means 25, blows air into the airbag 30 through the air supply line 31, and as shown in FIGS. 3 (b) and 9 , Inflate the airbag 30. When the airbag 30 is inflated, the airbag 30 abuts on the outer peripheral portion of the semiconductor wafer W on the chuck table 11 over the entire circumference thereof, and the outer peripheral portion of the semiconductor wafer W, that is, the outer peripheral portion of the semiconductor wafer W. The portion of the side region 27b is pressed onto the chuck table 11 (step 3). Therefore, in the inflated state of the airbag 30, the central portion side of the semiconductor wafer W is densely pressed onto the chuck table 11 by the pressing of the first wafer pressing means 24, and the outer peripheral portion side of the semiconductor wafer W is the second. By pressing the wafer pressing means 25 of the above, the wafer is densely pressed onto the chuck table 11. That is, the semiconductor wafer W here is substantially radially abutted against the chuck table 11 from the center side toward the outer peripheral side. As a result, the entire semiconductor wafer W is placed on the chuck table 11 in a substantially intimate state.

Next, the control unit 32 turns on the wafer suction vacuum line 14 of the first wafer vacuum suction means 15, applies a negative pressure to the suction unit 11b of the chuck table 11, and is placed on the suction unit 11b. The semiconductor wafer W is suction-held while the negative pressure is applied (step 4). In the suction holding of the semiconductor wafer W, the entire semiconductor wafer W is placed on the suction portion 11b in a state of being substantially adhered and held by the first wafer pressing means 24 and the second wafer pressing means 25, and then the suction portion is held. Since the entire semiconductor wafer W is sucked and held by 11b, even if the semiconductor wafer W has a large warp, the influence of the warp by the chuck table 11 can be reduced and the semiconductor wafer W can be sucked and held. The negative pressure applied to the chuck table 11 side is also satisfactorily transmitted to the semiconductor wafer W side, so that the chuck table 11 can reliably attract and hold the semiconductor wafer W.

Next, the control unit 32 is for wafer suction in a state where the wafer suction vacuum line 14 of the first wafer vacuum suction means 15 is kept on, that is, in a state where the chuck table 11 is sucking and holding the semiconductor wafer W. Air is supplied to the vacuum line 28 and the air supply line 31, respectively. Then, the pressure cylinder 29 in the first wafer pressing means 24 is controlled in a state where the transfer plate 21 and the semiconductor wafer W are easily separated by the supply of air, and the rod 29a of the pressure cylinder 29 is pressed. Raise it (step 5). Along with this, the transport plate 21 also rises to the return position together with the transport arm 22. Then, only the semiconductor wafer W remains on the chuck table 11. After that, the semiconductor wafer W on the chuck table 11 is subjected to a predetermined processing process or the like. The semiconductor wafer W that has been subjected to the predetermined treatment on the chuck table 11 is moved to the next post-treatment step by the transfer plate 21 and the transfer arm 22 after the suction holding on the chuck table 11 is released. ..

Therefore, according to the wafer transfer holding device 10 according to the embodiment of the present invention, the control unit 32 presses the portion of the region 27a on the center side of the semiconductor wafer W by the first wafer pressing means 24 onto the chuck table 11. The operation and the operation of pressing the region 27b on the outer peripheral side of the semiconductor wafer W onto the chuck table 11 are not performed at the same time, but after pressing the region 27a on the center side of the semiconductor wafer W onto the chuck table 11, the semiconductor wafer Since the portion of the region 27b on the outer peripheral side of W is pressed onto the chuck table 11 and the semiconductor wafer W is pressed stepwise onto the chuck table 11 to bring them into close contact with each other, the semiconductor wafer W is on the center side with respect to the chuck table 11. The wafers are abutted substantially radially toward the outer peripheral side. As a result, even if the semiconductor wafer W has a large warp, the semiconductor wafer W can be sucked and held on the chuck table 11 in a state where the influence of the warp is reduced.

Further, the first wafer pressing means 24 is formed by providing a ring-shaped V-seal 23a having a diameter smaller than the outer diameter of the semiconductor wafer W and a suction port 28a inside the region 27a surrounded by the V-seal 23a. The second wafer pressing means 25 is provided with a wafer suction vacuum line 28 on the transfer mechanism 12 side, and has substantially the same size as the outer diameter of the semiconductor wafer W and can move forward and backward with respect to the semiconductor wafer W. A pressure cylinder 29 is provided as a means, and the chuck table 11 sucks and holds the semiconductor wafer W conveyed on the chuck table 11 in a plane region having a diameter smaller than the outer diameter of the semiconductor wafer W. It is provided with a wafer suction vacuum line 14 on the chuck table 11 side formed by providing the port) 13. Therefore, the negative pressure generated by the wafer suction vacuum line 28 on the chuck table 11 side is satisfactorily transmitted to the semiconductor wafer W placed on the chuck table 11, and the semiconductor wafer W is reliably transmitted on the chuck table. It is sucked and held.

Since the first wafer pressing means 24 includes a pressure cylinder 29 having a rod 29a that moves forward and backward in the vertical direction, the operation of pressing the semiconductor wafer W against the chuck table 11 is performed by pressing the rod 29a on the pressure cylinder 29. Remote control becomes possible through the advance / exit operation.

Further, the airbag 30 forms the pressing means in the second wafer pressing means 25 that presses the region on the outer peripheral side of the semiconductor wafer W against the chuck table 11. Therefore, even if there is a positional deviation between the axial center O1 of the first wafer pressing means 24 and the axial center O2 of the chuck table 11, the region 27b on the outer peripheral side of the semiconductor wafer W is sucked by the chuck table 11. The force for pressing onto the portions 11b is evenly obtained through the airbag 30, and the region on the outer peripheral side of the semiconductor wafer W can be pressed densely onto the chuck table 11. Further, by adjusting the amount of air supplied into the airbag 30 and pressurized, the strength with which the semiconductor wafer W is pressed against the chuck table 11 can be easily adjusted.

In the above embodiment, as the first wafer pressing means 24, a structure provided with a pressure cylinder 29 in which the rod 29a advances and retreats is disclosed. For example, as shown in FIG. 10, a linear actuator 33 is used. It may be a structure. The linear actuator 33 has a motor 33a and a ball screw 33b rotated by the motor 33a, and when the ball screw 33b is rotated by the motor 33a, the transport plate 21 moves upward or downward. By moving the transfer plate 21 up and down, the region portion on the center side of the semiconductor wafer W is pressed onto the chuck table 11.

Further, the present invention can be modified in various ways other than the above as long as it does not deviate from the spirit of the present invention, and it is natural that the present invention extends to the modified ones.

As described above, the present invention has been described when it is used as a transfer holding device for a semiconductor wafer, but it can also be applied to other similar devices.

10 Wafer transfer holding device 11 Chuck table 11a Holding table 11b Suction unit 12 Transfer mechanism 13 Suction hole (suction port)
14 Wafer suction vacuum line 15 First wafer vacuum suction means 21 Conveying plate 22 Conveying arm 23 Second wafer vacuum suction means 23a V seal 23b Lip portion 24 First wafer pressing means 25 Second wafer pressing means 26 Axis 27a Area surrounded by V seal 27b Area surrounded by airbag 28 Vacuum line for wafer suction 28a Suction port 29 Pressurizing cylinder 29a Rod 30 Air bag (pressing means)
30a Supply port 31 Air supply line (air supply means)
32 Control unit 33 Straight actuator 33a Motor 33b Ball screw S Gap O1 Axial center of transport plate O2 Axial center of chuck table

Claims (3)

In a wafer transfer holding device including a chuck table for sucking and holding a semiconductor wafer and a transfer mechanism for transporting the semiconductor wafer onto the chuck table.
A first wafer pressing means for pressing the semiconductor wafer conveyed on the chuck table against the chuck table, and
It is made of a bag-shaped elastic deformable material and swells when air is supplied to the inside and is pressurized, and is on the outer peripheral side of the first wafer pressing means on the semiconductor wafer conveyed on the chuck table. A second wafer pressing means that comes into contact with the region portion and presses the region portion on the outer peripheral side of the semiconductor wafer onto the chuck table.
A control unit that sucks and holds the semiconductor wafer pressed against the chuck table in the order of the first wafer pressing means and the second pressing means, and the chuck table.
A wafer transfer and holding device, which comprises. The first wafer pressing means is a ring-shaped V-seal having a diameter smaller than the outer diameter of the semiconductor wafer, and the transport mechanism formed by providing a suction port inside a region surrounded by the V-seal. Equipped with a vacuum line for wafer suction on the side,
The chuck table is characterized by comprising a wafer suction vacuum line on the chuck table side formed by providing a suction port in a plane region for sucking and holding the semiconductor wafer conveyed on the chuck table. Item 2. The wafer transfer holding device according to Item 1. The wafer transfer holding according to claim 1 or 2, wherein the first wafer pressing means is provided above the chuck table and includes a pressure cylinder having a rod that moves forward and backward in the vertical direction. Device.

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