JP2005197269A - Production process of wafer and pasting device of wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To uniformly paste, even a high integration wafer to a pasting board over the entire surface thereof, while shortening the cycle time of pasting. <P>SOLUTION: A rotator 11 is unitized to turn about a support fulcrum 12. A press board 20, a pasting part 30 and a holding part 40 are provided at the forward end part of the unitized rotator 11. When the holding part 40 holds a wafer W when the rotator 11 is located at a waiting position, the rotator 11 turns about the support fulcrum 12 toward a pasting body 13. After the holding part 40 releases the wafer W and the wafer W is mounted on a pasting board, the wafer W is pasted to the pasting board, while being pressed by means of the press board 20 and the pasting part 30. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a wafer manufacturing method and a wafer sticking apparatus, and in particular, in the process of manufacturing a wafer made of a highly integrated semiconductor, the semiconductor wafer is used as a sticking plate in order to polish the surface of the wafer smoothly. It relates to the pasting technology.

In a semiconductor wafer manufacturing apparatus, it is necessary to smoothly polish a semiconductor wafer (hereinafter simply referred to as a wafer) during the manufacturing process.
In this case, since the wafer needs to be stuck to the sticking plate in the polishing process, a sticking device is used.

  In a conventional pasting device (hereinafter referred to as a first conventional example), a wafer having an adhesive layer provided on the surface opposite to the polishing surface is previously gripped by a transport chuck and transported onto a pasting plate. Then, after the mounting guide mechanism places the wafer on the sticking plate, the wafer pressing mechanism presses the wafer against the sticking plate, thereby sticking the wafer to the sticking plate entirely. ing. After the wafer is attached to the sticking plate in this way, the manufacturing apparatus performs a polishing process for polishing the upper surface of the wafer.

  Accordingly, the first conventional example includes a transport chuck mechanism for gripping and transporting a wafer, a placement guide mechanism for placing the wafer on the sticking plate, and a pressing mechanism for pressing the wafer against the sticking plate. Each is constituted by an independent driving device, and each is installed around the sticking plate.

As another pasting device (hereinafter referred to as a second conventional example), it has been proposed to use a device having an elastic body on a pressing surface of an air stamp (see, for example, Patent Document 1).
In the second conventional example, a chuck for holding and transporting a wafer, a holding frame provided so as to be movable up and down facing the sticking plate, and a wafer guide configured separately from the holding frame and surrounding the periphery of the wafer And.

Then, when the chuck holds the wafer and conveys it to a certain height on the sticking plate, by detecting it, the holding of the chuck is released and the wafer is released to drop the wafer onto the wafer guide, When the wafer is placed on the sticking plate by the operation of the wafer guide and the upper part of the wafer on the sticking plate is opened by returning the chuck to the outside to receive the next wafer, the opening portion The stamp is lowered, and the stamp presses the wafer against the sticking plate so that the wafer can be stuck on the sticking plate.
JP 2002-64072 A (page 3-4, FIGS. 1 to 6)

By the way, in the first conventional example shown above, since the pressing mechanism presses only the central portion of the wafer when the wafer is attached to the attaching plate, the entire surface of the wafer cannot be attached uniformly to the attaching plate. There was a problem. If the entire surface of the wafer cannot be applied evenly, it is not possible to polish a highly integrated wafer uniformly over the entire surface, especially as it is today, and polishing of the wafer formed by so-called nanotechnology is not possible. It becomes difficult.
In addition, the first conventional example includes a transport chuck mechanism for gripping and transporting a wafer, a placement guide mechanism for placing the wafer on the sticking plate, and a pressing mechanism for pressing the wafer against the sticking plate. Each of them is configured independently, and each mechanism is installed around the sticking plate, so that each operation distance becomes large and takes a long time. As a result, it took a long time to attach the film to the sheet. As a result, it was difficult to shorten the cycle time.

  Further, in the second conventional example, the stamp presses the wafer over the entire surface against the sticking plate, so that the wafer can be uniformly stuck to the sticking plate, but the same as in the first conventional example. Since the chuck and the wafer guide for placing the wafer on the sticking plate and the stamp for pressing the wafer against the sticking plate are provided, there is a problem that the cycle time cannot be shortened as in the first conventional example.

  The present invention has been made in consideration of such circumstances, and its purpose is to uniformly affix a wafer to a pasting plate even on a highly integrated wafer during polishing of the wafer. Another object of the present invention is to provide a semiconductor wafer manufacturing method and a pasting apparatus that can reduce the cycle time for pasting.

In order to achieve the above object, the present invention proposes the following means.
The invention according to claim 1 is a wafer sticking apparatus that is carried on a sticking plate and sticks while pressing the sticking plate while holding the wafer. And a holding part for holding and releasing the wafer, and a holding part for holding and releasing the wafer. It is provided on the front side of the sticking part so as to be able to advance and retreat.

  According to the wafer sticking apparatus of the present invention, the holding unit provided in the wafer sticking apparatus holds the wafer, conveys the wafer onto the sticking plate, and releases the holding of the wafer on the sticking plate. When the holding of the wafer is released, the pressing unit provided in the wafer sticking device sticks the wafer onto the sticking plate by pressing the upper surface of the wafer.

  According to a second aspect of the present invention, in the wafer sticking apparatus according to the first aspect, the sticking portion is made of an elastic material that can be swelled by a fluid supplied to the inside, and the pressure in the elastic material is reduced. It is characterized by having a control device that controls it constantly.

  According to the wafer sticking device of the present invention, the control device controls the internal pressure in the elastic material to be constant when the elastic material bulges and presses the upper surface of the wafer. It will receive a uniform load from the material.

  According to a third aspect of the present invention, in the wafer sticking apparatus according to the first or second aspect, the holding unit is a rotating body that rotates about the center of the pressing plate, and a direction orthogonal to the axis of the rotating body. And a guide mechanism for guiding the arm member movably supported in the moving direction.

  According to the wafer sticking device of the present invention, when the holding unit releases the holding of the wafer, the rotating body rotates, so that the arm member is retracted to the outer peripheral side of the rotating body along the guide of the guide unit. The upper surface of the wafer is opened.

  According to a fourth aspect of the present invention, in the wafer pasting apparatus according to any one of the first to third aspects, the pressing plate, the pasting portion, and the holding portion are configured as one unit, and the unit is driven to rotate around the support fulcrum. And an electropneumatic regulator for controlling the rotation speed.

  According to the wafer pasting apparatus according to the present invention, the driving unit moves the holding unit, the pasting unit, and the pressing unit integrally onto the pasting plate, so that the wafer is transported by the holding unit, and the pasting plate and the pressing plate are used. The wafer is attached almost simultaneously. Furthermore, the electropneumatic regulator controls the rotational speed of the drive unit to shorten the unit moving time.

  The invention according to claim 5 is a wafer manufacturing method comprising a polishing step of polishing the wafer by moving the polishing plate relative to the wafer when the wafer is attached to the sticking plate, In the polishing step, the wafer is attached to the attaching plate using the wafer attaching apparatus according to any one of claims 1 to 4.

  According to the method for manufacturing a wafer according to the present invention, the wafer is satisfactorily adhered to the affixing plate, so that fine unevenness is not formed in the polishing process of the wafer and good polishing is performed. become.

  According to the first aspect of the present invention, since the pressing plate, the pasting portion, and the holding portion are provided, and the holding portion is configured to be movable forward and backward on the front side of the pasting portion, holding and placing the wafer On the other hand, as a result of the fact that the entire surface of the wafer can be evenly adhered to the adhesive plate by the pressing plate and the adhesive part, it is possible to accurately attach even a highly integrated wafer. can get.

  According to the second aspect of the present invention, since the fluid pressure supplied to the sticking unit is controlled to be constant by the control unit, the pressing of the wafer against the sticking plate can be surely made uniform over the entire surface. The effect which can improve the reliability with respect to sticking is acquired.

  According to the third aspect of the present invention, the holding unit 40 can be moved forward or backward to the front side of the attaching unit 30 by the moving mechanism including the rotating body, the arm member, and the guide unit. Can be carried out quickly and continuously, thereby obtaining the effect of further shortening the cycle time.

  According to the invention which concerns on Claim 4, a press board, the sticking part, and the holding | maintenance part are provided as one unit, These all parts are comprised so that it may move to a working position collectively. For this reason, the time until the holding part retreats from the sticking plate and then the sticking part advances onto the sticking plate becomes unnecessary. Furthermore, since the sticking portion is rotated at a high speed until just before the wafer is placed on the sticking plate, the cycle time can be further shortened.

  According to the fifth aspect of the invention, the holding unit can hold and place the wafer, and the result is that the entire surface of the wafer can be uniformly attached to the sticking plate by the pressing plate and the sticking portion. Even in the case of a highly integrated wafer, the entire surface of the wafer can be reliably and uniformly attached to the sticking plate, and the effect of good sticking can be obtained.

Embodiments of the present invention will be described below with reference to the drawings. 1 to 8 are views showing a wafer sticking apparatus according to an embodiment of the present invention.
A wafer sticking apparatus 10 shown in FIG. 1 is configured to press and attach a wafer W to a sticking plate 13, and is configured as a unit so that a rotating body 11 can turn around a support fulcrum 12. When viewed from above, the rotating body 11 has the shape shown in FIG. 2, the base side having the support fulcrum 12 is elongated, and the tip end portion is divided into two forks, and is formed in an arm shape as a whole. .

  As shown in FIG. 1 and FIG. 3, a pressing plate 20, an attaching portion 30, and a holding portion 40 are provided at the tip of the unitized rotating body 11, and the rotating body 11 is shown in FIG. 1. When the holding unit 40 holds the wafer W when it is in a standby position such as the chain line shown, the rotating body 11 rotates about the support fulcrum 12 toward the sticking body 13 to the solid line position, and at that position, the holding unit When the holding of the wafer W is released by the wafer 40, the wafer W is guided on the sticking plate 13 by the wafer guide unit 50, and after the wafer W is placed on the sticking plate, the pressing plate 20 and the sticking portion 30 are moved to the wafer. While W is pressed against the sticking plate, it is stuck.

  As the wafer W, for example, a semiconductor wafer manufactured with a high degree of integration is used. Such a semiconductor wafer is not shown in detail, but in the manufacturing process, after being attached to a plurality of ceramic adhesive plates 13 provided on a disk-shaped table, the semiconductor wafer is relative to a polishing plate (not shown). By moving and polishing, the upper surface is finished smoothly. In addition, the adhesive is previously apply | coated to the surface on the opposite side to the surface hold | maintained by the holding | maintenance part 40 at the time of the wafer W sticking. The affixing plate 13 is heated when the wafer W is affixed, thereby increasing the adhesion of the wafer.

  As shown in FIGS. 1, 3, and 4, the pressing plate 20 forms a disk body having a diameter substantially the same as or slightly larger than that of the wafer W attached to the attaching plate 13. It is attached to the tip of the rod 22 of the cylinder 21 installed at the tip of the rotating body 11, and moves forward when the rod 22 moves forward.

The affixing portion 30 has a bag shape that can be inflated as shown in FIG. 7, and its peripheral edge is attached to the outer periphery of the front surface of the pressing plate 20 in an airtight state as shown in FIGS. When air is supplied, it is made of an elastic material that swells like a rubber balloon.
Moreover, the sticking part 30 is provided with the control part 15 which supplies air to this. Although not shown in detail, the control unit 15 supplies air to the sticking unit 30 at a constant pressure when the pressing plate 20 presses the wafer.

  On the other hand, as shown in FIGS. 1 and 3, the holding unit 40 has a nozzle 41 attached to its tip, holds the wafer W by vacuum suction from the nozzle 41, and stops suction. The holding of the wafer W is released. Therefore, the holding part 40 is connected to a vacuum source (not shown) through the pipe 42 so that vacuum suction can be performed, and four holding parts 40 are provided at equal intervals in the circumferential direction.

The holding portion 40 is provided on the front side of the attaching portion 30 so as to be able to advance and retract in the radial direction by the moving mechanism so that the wafer W can be placed on the attaching plate 13 when the holding of the wafer W is released. Yes.
As shown in FIG. 4, the moving mechanism includes a rotating body 44, an arm member 45 supported so as to be movable in the radial direction of the rotating body 44, and a guide portion 46 that guides the movement of the arm member 45. I have.

That is, the rotator 44 is inserted through the cylinder 21 and is rotated about its central axis by being driven by the cylinder 48 as a drive source shown in FIG. Therefore, the tip of the rod 48a of the cylinder 48 is connected to the outer peripheral portion of the rotating body 44 by a pin or the like (not shown in FIG. 5), and the rotating body 44 rotates around its central axis as the rod 48a advances and retreats.
As shown in FIG. 5, below the rotating body 11, two wafer guide units 50 that hold the wafer from the side are provided.
The wafer guide unit 50 includes an arm 54 that rotates about 100 ° around a fulcrum 53, a holding frame 51 provided at the tip of the arm 54, and a wafer mounting that is mounted on the inner surface side of the holding frame 51. It comprises a guide 52.

  As shown in FIG. 4, the arm member 45 is slidably provided on the guide portion 46. One end portion of the arm member 45 is connected to the outer peripheral portion of the rotating body 44 via a link 49 and the other end portion. 3 supports the pipe 42 of the holding portion 40 as shown in FIG. One end of the link 49 is connected to the outer peripheral portion of the rotating body 44 with a pin or the like, and the other end is connected to one end portion of the arm member 45 with a pin or the like.

  When the rotating body 44 rotates in one direction, the link 49 operates accordingly and the arm member 45 slides on the guide portion 46, thereby moving the arm member 45 in the centripetal direction of the rotating body 44. When the rotating body 44 rotates in the reverse direction, the link 49 moves the arm member 45 outward from the rotating body 44 accordingly. Accordingly, the arm member 45 moves in the radial direction along with the rotation of the rotating body 44, so that the nozzle 41 of the holding unit 40 is moved to the front side of the affixing unit or moved sideways from the position to be retracted. It is supposed to let you. Therefore, the guide part 46 is provided along the radial direction on the outer peripheral side of the rotating body 44 as shown in FIG.

  On the other hand, the rotating body 11 stands by, for example, in the state of the chain line shown in FIG. 1 when the wafer W is attached. When the holding unit 40 holds the wafer W in this state, the rotating body 11 will be described later. The electropneumatic regulator 16 is rotated about the support fulcrum 12 to convey the wafer W to the sticking plate 13 side.

  As shown in FIG. 6, the electropneumatic regulator 16 is installed on a pipe line 84 connected to an air source 80 via an air filter 81, a relief valve 82, and a pressure switch 83. When the direction switching valve 85 on the pipe 84 is switched to the position a or the position b, air is supplied to or discharged from the sliding portion 86 and the sliding portion 86 is driven, whereby the rotating body 11 is stuck. It is rotated between the position and the standby position.

  At this time, the electropneumatic regulator 16 rotates the rotating body 11 by driving the sliding portion 86 when the rotating body 11 is in the standby position. In order to control the turning operation of the rotating body 11 by adjusting the amount of air supplied to the sliding portion so that the rotating speed gradually decreases as the rotating body 11 approaches the sticking plate 13 side. It is configured. In FIG. 6, reference numeral 87 is a relief valve, 88 is a pressure gauge, and 89 is an exhaust part. In FIG. 2, reference numeral 19 is a guide for guiding the movement of the pressing plate 20, and in this example, three guides are provided at substantially equal intervals in the circumferential direction.

Since the sticking device 10 of this embodiment is configured as described above, the wafer manufacturing method of the present invention will be described next in relation to its operation.
In this method of manufacturing the wafer W, after the wafer W is attached to the sticking plate 13, the wafer W is moved by moving a polishing plate (not shown) relative to the wafer W relative to the sticking plate 13 in the wafer polishing apparatus. A polishing step for polishing is performed.

Since it is necessary to affix the wafer W to the affixing plate during the polishing process, when the rotating body 11 is waiting in advance in the state of the chain line shown in FIG. When supplied, when the holding unit 40 holds the wafer W by vacuum suction, the rotating body 11 rotates toward the sticking plate 13 around the support fulcrum 12 in that state, On the other hand, when approaching a preset position, the rotating body 11 stops.
When the rotating body 11 shown in FIG. 5 approaches the preset position of the sticking plate 13, the guide unit 50 also turns and stops to the preset position on the sticking plate 13.
When the rotating body 11 stops at a predetermined position, when the holding unit 40 stops the vacuum suction with respect to the wafer W and releases the holding, the wafer W is guided onto the sticking plate 13 by the wafer guide unit 50, and Placed at the set position.
When the wafer W is placed on the sticking plate 13, the wafer mounting guide 52 of the wafer guide unit 50 supports the wafer W from the side, and therefore when the wafer W is placed on the sticking plate 13. The wafer W is not displaced in the lateral direction and is satisfactorily arranged on the sticking plate 13.
When the wafer W is placed on the sticking plate 13, the rotating body 44 rotates in FIG. 4, and the arm member 45 is displaced outward while being guided by the guide portion 46.
When the arm portion 45 is displaced outward, the holding portion 40 and the nozzle 41 are displaced outward. Thus, when the holding part 40 and the nozzle 41 are displaced outward, the upper surface of the wafer W is opened as shown by the two-dot chain line in FIG.

On the other hand, as shown in FIG. 7, when the upper surface of the wafer W is opened, air is gradually expanded as shown in FIG. 7 by supplying air to the sticking portion 30 at a constant pressure. The central part of the sticking part 30 comes into contact with the central part of the wafer W and starts to press this part.
When the central portion of the attaching portion 30 starts to press the central portion of the wafer W, the wafer guide unit 50 is retracted from the wafer W, so that the wafer mounting guide 52 and the attaching portion 30 do not interfere with each other, and the attaching portion 30. Presses the upper surface of the wafer W without being interfered by the wafer guide unit 50.

  At this time, the pressing plate 20 is lowered by the driving of the cylinder 21 and the supply of air to the pasting portion 30 is continued, so that the contact of the pasting portion 30 with respect to the wafer W gradually expands in the radial direction from the center portion, Finally, as shown in FIG. 8, the outer periphery of the wafer W is reached, so that the attaching portion 30 can come into contact with the entire surface of the wafer W. And since the air supplied to the sticking part 30 becomes a fixed pressure, the sticking part 30 can give a fixed surface pressure with respect to the wafer W toward a peripheral part from a center part.

In addition, since the holding device 40 is provided with the holding unit 40 and the sticking unit 30, the sticking unit 30 can press the wafer W substantially simultaneously when the holding unit 40 releases the wafer W.
For this reason, after the holding unit 40 drops the wafer W onto the bonding plate 13, the retraction time of the holding unit 40 that retreats from the wafer W and the advancement time of the bonding unit 30 after which the bonding unit 30 advances onto the wafer W. And the cycle time can be shortened.
Furthermore, since the rotating body 11 is rotated at high speed until the holding unit 40 moves to the attaching position of the attaching plate 13 after adsorbing the wafer W, the cycle time can be further shortened.

Thus, in the sticking method of the present invention, when the holding unit 40 moves to the top of the sticking plate 13 while holding the wafer W, the holding is released, and the wafer mounting guide 52 shown in FIG. By holding W, the wafer W is satisfactorily placed on the sticking plate 13 without being laterally displaced. After that, the wafer mounting guide 52 is retracted from the wafer W, and the affixing portion 30 shown in FIG. 7 is brought into contact with the pressing plate 20 over the entire upper surface of the wafer W at a constant pressure. W can be uniformly pressed against the entire surface of the sticking plate 13.
As shown in FIG. 8, the bonding part 30 and the pressing plate 20 are uniformly pressed over the entire upper surface of the wafer W, so that the adhesive that bonds the wafer W and the bonding plate 13 is bonded to the wafer W. It spreads uniformly between the sticking plates 13. When the adhesive spreads evenly between the sticking plate 13 and the wafer W without any deviation, the wafer W is placed flat on the sticking plate 13. For this reason, in the subsequent polishing process, when the upper surface of the wafer W is polished, the wafer W is polished well without forming an uneven portion.

In addition, the wafer W is transferred when the rotating body 11 is rotated toward the attaching plate 13 at the time of bonding. During the transfer, the electropneumatic regulator 16 controls the rotation speed of the rotating body 11. In other words, at first, speed control for rotating the rotating body 11 at high speed is performed, and speed control is performed to gradually decrease the speed as the wafer W approaches the sticking plate 13, so that the wafer W can be transported quickly. Thus, the cycle time required for attaching the wafer W can be shortened.
In addition, when the moving speed of the rotating body 11 gradually decreases as it approaches the sticking plate, not only can the wafer W be accurately positioned with respect to the sticking plate 13, but also the wafer W can collide with the sticking plate 13. This can be prevented, and there is no fear that the wafer W will be damaged.

  Therefore, according to the sticking device 10 of this embodiment, since the holding part 40 is configured to be movable forward and backward on the front side of the sticking part 30, the wafer W can be held and placed. As a result of the pressing plate 20 and the attaching portion 30 being able to uniformly attach the entire surface of the wafer W to the attaching plate 13, the attaching method can be performed satisfactorily, and even a highly integrated wafer is good. Can be accurately applied.

  Further, the sticking unit 30 is made of an elastic material that can be swelled by the air supplied to the inside, and the supplied air pressure is controlled by the control unit 15 so that the wafer W with respect to the sticking plate 13 is fixed. Since the pressing can be made uniform over the entire surface, the reliability with respect to attachment can be improved.

  In the transport device 10, the pressing plate 20, the pasting unit 30, and the holding unit 40 that are main components are provided as one unit on the rotating body 11, and each unit 20, 30, 40 is operated by the operation of the rotating body 11. Are all moved to the work position in a lump, so that each part can be arranged at the shortest distance possible in performing a predetermined work. Therefore, the operating distance is not increased by being arranged around the sticking plate as in the conventional example, the cycle time required for sticking can be surely shortened, and the sticking device 10 itself It is also possible to reduce the size.

  Furthermore, the holding part 40 includes a moving mechanism including a rotating body 44, an arm member 45, and a guide part 46. By this moving mechanism, the holding part 40 can be moved forward or backward to the front side of the sticking part 30, The holding operation of the wafer W and the placing operation on the sticking plate 13 can be performed quickly and continuously. As a result, the cycle time can be further shortened.

  Moreover, the rotating body 11 includes an electropneumatic regulator 16 that controls the rotating speed, and the electropneumatic regulator 16 increases the speed when the rotating body 11 rotates toward the sticking plate 13 while approaching the sticking plate 13. As the speed is gradually reduced, the three members of the pressing plate 20, the attaching part 30, and the holding part 40 can be moved to the attaching plate 13 side at high speed and accurately, and the wafer held by the holding part 40 It is possible to avoid the collision of W with the sticking plate 13. Thereby, the cycle time can be greatly shortened and the wafer W can be reliably prevented from being damaged.

  In the above embodiment, the example in which the rotating body 11 receives and holds the wafer W when the rotating body 11 is in the standby state shown by the chain line in FIG. 1 has been shown. Can receive. In addition, the pressing plate 20, the sticking portion 30, and the rotating body 11 are all operated by the supplied air, so that the equipment can be simplified accordingly, but other fluids such as hydraulic pressure, for example. May be used. And the specific structure of the press plate of a sticking apparatus, a sticking part, and a holding | maintenance part is not limited to the example of illustration.

  In the field of a wafer manufacturing method and a wafer attaching apparatus, the present invention can accurately attach even a highly integrated wafer, and can reduce the cycle time. Industrial applicability is recognized to provide a manufacturing method and a wafer sticking device.

It is explanatory drawing of the principal part cross section which shows the sticking apparatus of the wafer which concerns on one embodiment of this invention. It is the schematic plan view which looked at the wafer sticking apparatus of FIG. 1 from the top. It is explanatory drawing equivalent to the longitudinal cross-section of FIG. It is an explanatory top view which shows the moving mechanism which moves a holding | maintenance part. It is explanatory drawing which shows the relationship between a rotary body and its drive source seen from the back side of FIG. It is a circuit diagram which shows the speed control part of a rotary body. It is explanatory drawing which shows the state which the sticking part started to swell. It is explanatory drawing which shows the state which affixed the wafer on the affixing board with the affixing part and the press board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sticking device 11 Rotating body 12 Supporting fulcrum 13 Sticking plate 15 Control part 16 Electropneumatic regulator 20 Pressing plate 30 Sticking part 40 Holding part 44 Rotating plate 45 Arm member body 46 Guide part W Wafer

Claims (5)

In the state of holding the wafer, in the wafer sticking device to stick on the sticking plate while transporting it on the sticking plate,
A pressing plate that is supported so as to be able to advance and retreat, a sticking portion that is attached to the front surface of the pressing plate, presses the wafer in cooperation with the pressing plate, and sticks to the sticking plate, and holds or releases the wafer A wafer sticking apparatus, comprising: a holding part that is attached to the front part of the sticking part so as to be movable forward and backward. In the wafer sticking apparatus according to claim 1,
The affixing unit is composed of an elastic material that can be swelled by a fluid supplied to the inside, and includes a control device that controls the pressure in the elastic material to be constant. . In the wafer sticking apparatus according to claim 1 or 2,
The holding portion includes a rotating body that rotates about the center of the pressing plate as an axis, and a moving mechanism that guides an arm member supported so as to be movable in a direction orthogonal to the axis of the rotating body in the moving direction. A wafer sticking apparatus comprising: In the wafer sticking apparatus according to any one of claims 1 to 3,
The pressing plate, the affixing portion, and the holding portion are configured as a unit, and include a drive source that rotates the unit with a support point of the unit as a fulcrum, and an electropneumatic regulator that controls the rotation speed. A wafer sticking device characterized by the above. A wafer manufacturing method comprising a polishing step of polishing the wafer by moving the polishing plate relative to the wafer when the wafer is attached to a sticking plate,
A method for manufacturing a wafer, wherein the wafer is attached to the attaching plate using the wafer attaching apparatus according to any one of claims 1 to 4 in the polishing step.

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