CN114393468B - Edge grinding machine for edge grinding processing of semiconductor wafer - Google Patents
Edge grinding machine for edge grinding processing of semiconductor wafer Download PDFInfo
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- CN114393468B CN114393468B CN202111645669.2A CN202111645669A CN114393468B CN 114393468 B CN114393468 B CN 114393468B CN 202111645669 A CN202111645669 A CN 202111645669A CN 114393468 B CN114393468 B CN 114393468B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 235000012431 wafers Nutrition 0.000 claims abstract description 59
- 238000007789 sealing Methods 0.000 claims abstract description 23
- 238000007688 edging Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 4
- 230000006835 compression Effects 0.000 description 18
- 238000007906 compression Methods 0.000 description 18
- 230000005540 biological transmission Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000009347 mechanical transmission Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention provides an edge grinding machine for edge grinding of semiconductor wafers, which comprises an edge grinding machine body, a main shaft grinding head and a workbench, wherein the rear side of the main shaft grinding head is movably connected with the top of the edge grinding machine body, the workbench is arranged at the top inside the edge grinding machine body, one side of the top of the workbench is fixedly connected with a driving shell, the bottom of the inner wall of the driving shell is fixedly connected with a driving motor, and the top of the driving motor penetrates through the driving shell and is fixedly connected with a first sealing disc. According to the wafer edge grinding machine, the wafer can be conveniently limited and fixed through the driving motor, the vacuum holes, the pressure lever device and the rubber sucker, the wafer can be conveniently rotated, the accuracy of the wafer in processing is improved, meanwhile, the top of the wafer can be conveniently fixed through the pressure lever device, the stability of wafer fixing is improved, and the problems that an existing wafer edge grinding machine is inconvenient to fix the wafer in the using process and the wafer grinding accuracy is low are solved.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to an edge grinding machine for edge grinding of a semiconductor wafer.
Background
Semiconductor refers to a material with a conductive property between a conductor and an insulator at normal temperature, and has a wide application in radio, television and temperature measurement, for example, a diode is a device made of semiconductor, and a semiconductor refers to a material with a controllable conductive property ranging from an insulator to a conductor.
Among the prior art, the wafer is a branch of semiconductor, and wafer processing needs to use the edging machine to carry out the corner and polish to the surface of wafer, nevertheless because the edging machine head of polishing need carry out level and vertical direction and remove, and its transmission adopts mechanical transmission, consequently can cause certain mechanical clearance to cause the wafer to polish shape and circular certain deviation, lead to the wafer machining precision step-down, simultaneously because wafer thickness is little, inconvenient centre gripping processing, the result of use descends.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide an edge grinding machine for edge grinding of a semiconductor wafer, which can improve the processing precision of the wafer and facilitate the fixing processing, so as to solve the problems that the existing edge grinding machine for the wafer is inconvenient to fix the wafer in the use process and the polishing precision of the wafer is low.
In order to achieve the purpose, the invention is realized by the following technical scheme: an edge grinding machine for edge grinding processing of semiconductor wafers comprises an edge grinding machine body, a main shaft grinding head and a workbench, wherein the rear side of the main shaft grinding head is movably connected with the top of the edge grinding machine body;
the driving motor is characterized in that a second sealing disc is movably connected inside the first sealing disc, the bottom of the second sealing disc is fixedly connected with the top of the driving shell, a first vacuum tube is sleeved on the surface of the driving motor, a plurality of second vacuum tubes are fixedly communicated with the top of the first vacuum tube, the tops of the second vacuum tubes penetrate through the driving shell and extend into the second sealing disc, a vacuum connecting tube is fixedly communicated with one side of the first vacuum tube, and a vacuum connecting tube penetrates through the driving shell and extends to the surface of the driving shell;
first sealed dish top is fixed the intercommunication and is had the vacuum hole, vacuum hole quantity is a plurality of, and evenly distributed in first sealed dish top, drive shell one side top fixedly connected with depression bar device, depression bar device bottom and the cooperation in vacuum hole top are used.
Further, the compression bar device comprises a positioning mechanism, a fixed compression bar and a vertical bar, wherein the bottom of the surface of the fixed compression bar is movably connected with one side of the driving shell through a first rotating shaft, the other side of the positioning mechanism is fixedly connected with the top of one side of the driving shell, one side of the positioning mechanism is fixedly connected with the surface of the fixed compression bar, the vertical bar is positioned inside the fixed compression bar and movably connected with the inside of the fixed compression bar, the bottom of the surface of the vertical bar is fixedly connected with a first bearing, the bottom of the first bearing is fixedly connected with a pressing plate, the bottom of the pressing plate is matched with the top of the vacuum hole, the other side of the inside of the fixed compression bar is provided with a limiting mechanism, the other side of the limiting mechanism penetrates through the fixed compression bar and extends to the other side of the fixed compression bar, and one side of the limiting mechanism is matched with the other side of the vertical bar.
Further, positioning mechanism includes location shell, locating plate and screw rod, location shell opposite side and drive shell one side top fixed connection, location shell one side and fixed depression bar surface contact, the locating plate is located location shell top, locating plate one side is connected with fixed depression bar fixed surface, the screw rod is located inside the shell of location, and with the inside swing joint of location shell, the screw rod front side runs through the location shell and extends to location shell front side, screw rod surface front side and the equal threaded connection in rear side have first fixed plate, there is the driving plate first fixed plate top through second pivot swing joint, the screw rod top is provided with the limiting plate, the limiting plate bottom is through third pivot and driving plate top swing joint, the limiting plate top runs through the location shell and uses with the cooperation of locating plate bottom.
Further, screw rod surface rear side fixedly connected with second bearing, second bearing rear side and location shell inner wall rear side fixed connection, the locating plate bottom has been seted up and has been used the spacing groove with the limiting plate cooperation.
Further, stop gear includes fixed column and draws the dish, the fixed column opposite side with draw dish one side fixed connection, fixed column one side runs through fixed depression bar and extends to inside the montant, fixed column fixed surface is connected with the second fixed plate, the inside swing joint of second fixed plate surface and fixed depression bar, the montant opposite side has been seted up and has been used the fixed slot with the fixed column cooperation.
Furthermore, the surface of the fixing column is sleeved with a return spring, one side of the return spring is fixedly connected with the other side of the second fixing plate, and the other side of the return spring is fixedly connected with the other side of the inner wall of the fixing pressure rod.
Furthermore, fixed slot quantity is a plurality of, and evenly distributed in montant opposite side, montant top fixedly connected with baffle, the baffle bottom uses with the cooperation of fixed depression bar top.
Further, vacuum hole surface cover is equipped with rubber suction cup, the cooperation of rubber suction cup top and clamp plate bottom is used, clamp plate bottom fixedly connected with rubber contact, rubber contact quantity is a plurality of, and evenly distributed in the clamp plate bottom.
The invention has the beneficial effects that: according to the wafer edge grinding machine, the wafer can be conveniently limited and fixed through the driving motor, the vacuum holes, the pressure lever device and the rubber sucker, the wafer can be conveniently rotated, the wafer processing precision is improved, meanwhile, the top of the wafer can be conveniently fixed through the pressure lever device, the wafer fixing stability is improved, and the problems that the existing wafer edge grinding machine is inconvenient to fix the wafer in the using process and the wafer grinding precision is low are solved.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is a partial schematic view of the structure;
FIG. 3 is a perspective view of a partial structure;
FIG. 4 is a perspective view of the compression bar apparatus;
FIG. 5 is a perspective view of the positioning mechanism;
FIG. 6 is an enlarged view of A in FIG. 1;
FIG. 7 is an enlarged view of B in FIG. 2;
fig. 8 is an enlarged view of C in fig. 2.
In the figure: 1. an edging machine body; 2. a main shaft grinding head; 3. a work table; 4. a drive case; 5. a drive motor; 6. a first sealing disk; 7. a second sealing disk; 8. a first vacuum tube; 9. a second vacuum tube; 10. vacuum pipe connection; 11. a vacuum hole; 12. a compression bar device; 121. a positioning mechanism; 1211. a positioning shell; 1212. positioning a plate; 1213. a screw; 1214. a first fixing plate; 1215. a drive plate; 1216. a limiting plate; 122. fixing the compression bar; 123. a vertical rod; 124. a first bearing; 125. pressing a plate; 126. a limiting mechanism; 1261. fixing the column; 1262. pulling the disc; 1263. a second fixing plate; 1264. fixing grooves; 13. a second bearing; 14. a limiting groove; 15. a return spring; 16. a baffle plate; 17. a rubber suction cup; 18. and a rubber contact.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of the present invention.
An edge grinding machine for edge grinding processing of semiconductor wafers comprises an edge grinding machine body 1, a main shaft grinding head 2 and a workbench 3, wherein the rear side of the main shaft grinding head 2 is movably connected with the top of the edge grinding machine body 1, the workbench 3 is arranged at the top inside the edge grinding machine body 1, one side of the top of the workbench 3 is fixedly connected with a driving shell 4, the bottom of the inner wall of the driving shell 4 is fixedly connected with a driving motor 5, and the top of the driving motor 5 penetrates through the driving shell 4 and is fixedly connected with a first sealing disk 6;
a second sealing disc 7 is movably connected inside the first sealing disc 6, the bottom of the second sealing disc 7 is fixedly connected with the top of the driving shell 4, a first vacuum tube 8 is sleeved on the surface of the driving motor 5, a plurality of second vacuum tubes 9 are fixedly communicated with the top of the first vacuum tube 8, the top of each second vacuum tube 9 penetrates through the driving shell 4 and extends into the corresponding second sealing disc 7, a vacuum connecting tube 10 is fixedly communicated with one side of the first vacuum tube 8, and one side of the vacuum connecting tube 10 penetrates through the driving shell 4 and extends to the surface of the driving shell 4;
first sealed 6 top of dish is fixed the intercommunication has vacuum hole 11, and vacuum hole 11 quantity is a plurality of, and evenly distributed in first sealed 6 tops of dish, 4 one side top fixedly connected with depression bar device 12 of drive shell, and depression bar device 12 bottom uses with the cooperation in the 11 tops in vacuum hole.
Please refer to fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, fig. 7 and fig. 8, in which fig. 2 is a partial schematic structural diagram; FIG. 3 is a perspective view of a partial structure; FIG. 4 is a perspective view of the compression bar apparatus; FIG. 5 is a perspective view of the positioning mechanism; FIG. 6 is an enlarged view of A in FIG. 1; FIG. 7 is an enlarged view of B in FIG. 2; fig. 8 is an enlarged view of C in fig. 2.
The pressure lever device 12 comprises a positioning mechanism 121, a fixed pressure lever 122 and a vertical lever 123, the bottom of the surface of the fixed pressure lever 122 is movably connected with one side of the driving shell 4 through a first rotating shaft, the other side of the positioning mechanism 121 is fixedly connected with the top of one side of the driving shell 4, one side of the positioning mechanism 121 is fixedly connected with the surface of the fixed pressure lever 122, the vertical lever 123 is located inside the fixed pressure lever 122 and movably connected with the inside of the fixed pressure lever 122, the bottom of the surface of the vertical lever 123 is fixedly connected with a first bearing 124, the bottom of the first bearing 124 is fixedly connected with a pressure plate 125, the bottom of the pressure plate 125 is matched with the top of the vacuum hole 11, the other side of the inside of the fixed pressure lever 122 is provided with a limiting mechanism 126, the other side of the limiting mechanism 126 penetrates through the fixed pressure lever 122 and extends to the other side of the fixed pressure lever 122, one side of the limiting mechanism 126 is matched with the other side of the vertical lever 123, the fixed pressure plate 125 is fixed through rotation, the pressure plate 125 is moved to the top of the vacuum hole 11, the vertical lever 123 is adjusted by opening the limiting mechanism 126, and the wafer with different thicknesses, and the wafer can be conveniently limited and fixed.
The positioning mechanism 121 includes a positioning housing 1211, a positioning plate 1212 and a screw rod 1213, the other side of the positioning housing 1211 is fixedly connected to the top of one side of the driving housing 4, one side of the positioning housing 1211 is in surface contact with the fixed pressing rod 122, the positioning plate 1212 is located at the top of the positioning housing 1211, one side of the positioning plate 1212 is fixedly connected to the surface of the fixed pressing rod 122, the screw rod 1213 is located inside the positioning housing 1211 and movably connected to the inside of the positioning housing 1211, the front side of the screw rod 1213 penetrates through the positioning housing 1211 and extends to the front side of the positioning housing 1211, both the front side and the rear side of the surface of the screw rod 1213 are threadedly connected to a first fixing plate 1214, the top of the first fixing plate 1214 is movably connected to a transmission plate 1215 through a second rotating shaft, a limiting plate 1216 is disposed at the top of the screw rod 1213, the bottom of the limiting plate 1216 is movably connected to the top of the transmission plate 1215 through the third rotating shaft, the top of the limiting plate 1216 penetrates through the positioning housing 1211 and cooperates with the bottom of the positioning plate 1212, the first fixing plate 1214 can be driven by rotating the screw rod 1213, the first fixing plate 1214 to move, the first fixing plate 1215, the fixing plate 1215 through the third rotating shaft, thereby enabling the fixing plate 1215 to be clamped inside the fixing plate 1212 to reach the fixed positioning plate 1212, and facilitate the fixing plate 1216 and the fixing plate 1216 to be detached by a user.
Screw 1213 surface rear side fixedly connected with second bearing 13, second bearing 13 rear side and location shell 1211 inner wall rear side fixed connection, locating plate 1212 bottom seted up with limiting plate 1216 cooperation use spacing groove 14, through the setting of second bearing 13, can increase screw 1213 pivoted stability, reduce rocking of screw 1213, spacing groove 14 can make things convenient for limiting plate 1216 card to go into the inside of locating plate 1212.
Limiting mechanism 126 includes fixed column 1261 and drawing tray 1262, fixed column 1261 opposite side and drawing tray 1262 one side fixed connection, fixed column 1261 runs through fixed depression bar 122 and extends to inside the montant 123 in one side, fixed column 1261 fixed surface is connected with second fixed plate 1263, second fixed plate 1263 surface and the inside swing joint of fixed depression bar 122, montant 123 opposite side has been seted up and has been used fixed slot 1264 with the cooperation of fixed column 1261, through the pulling drawing tray 1262, drawing tray 1262 drives fixed column 1261 and removes, fixed column 1261 drives second fixed plate 1263 and removes, second fixed plate 1263 extrudes reset spring 15, fixed column 1261 breaks away from the inside of montant 123 simultaneously, can make things convenient for the vertical adjustment of montant 123 from top to bottom, it is convenient to fix spacingly to the wafer of different thickness.
Fixed slot 1264 quantity is a plurality of, and evenly distributed in montant 123 opposite side, montant 123 top fixedly connected with baffle 16, and the baffle 16 bottom uses with the cooperation of fixed depression bar 122 top, through the setting of fixed slot 1264, can make things convenient for the regulation of montant 123 position, and through the setting of baffle 16, the condition emergence that can avoid montant 123 to appear breaking away from fixed depression bar 122 inside can be avoided.
The working principle is as follows: when a user needs to process a wafer, a vacuum connecting pipe 10 is connected into a vacuum pipeline, vacuum air enters between a first sealing disk 6 and a second sealing disk 7 through the vacuum connecting pipe 10, a first vacuum pipe 8 and a second vacuum pipe 9, vacuum between the first sealing disk 6 and the second sealing disk 7 is sucked through a vacuum hole 11 and a rubber sucker 17, the wafer to be polished is placed at the top of the rubber sucker 17 and can be stably adsorbed at the top of the rubber sucker 17, meanwhile, a fixing compression rod 122 is rotated to enable the fixing compression rod 122 to rotate around a first rotating shaft, the fixing compression rod 122 drives a vertical rod 123 to move, the vertical rod 123 drives a first bearing 124 to move, the first bearing 124 drives a pressure plate 125 to move, when the fixing compression rod 122 moves to a proper position, the screw 1213 is rotated, the screw 1213 drives a first fixing plate 1214 to move, the first fixing plate 1214 drives a transmission plate 1215 to move through a second rotating shaft, the transmission plate 1215 drives the limit plate 1216 to move upwards through the third rotating shaft, so that the limit plate 1216 is clamped inside the locating plate 1212, the locating plate 1212 is limited and fixed, and the purpose of fixing the fixing compression bar 122 is achieved, then the pull disc 1262 is pulled leftwards, the pull disc 1262 drives the fixing column 1261 to move, the fixing column 1261 drives the second fixing plate 1263 to move, the second fixing plate 1263 extrudes the return spring 15, the return spring 15 contracts, the fixing column 1261 is separated from the inside of the vertical rod 123, the vertical rod 123 moves upwards and downwards, the vertical rod 123 drives the first bearing 124 to move upwards and downwards, the first bearing 124 drives the pressing plate 125 to move upwards and downwards, so that the rubber contact 18 on the pressing plate 125 is pressed on the surface of the wafer, a certain force is applied to the wafer, when the rubber contact 18 on the pressing plate 125 applies a force to the wafer, the pull disc 1262 is loosened, the return spring 15 rebounds the second fixing plate 1263, second fixed plate 1263 drives fixed column 1261 and removes, make fixed column 1261 card go into the inside of montant 123 and fix, the completion is fixed to the wafer, add man-hour as needs, move suitable position with main shaft bistrique 2, start driving motor 5, driving motor 5 drives first sealed dish 6 and rotates at the surperficial of second sealed dish 7, first sealed dish 6 drives vacuum hole 11 and rubber suction cup 17 and rotates, rubber suction cup 17 drives the wafer and rotates, the wafer drives rubber contact 18 and clamp plate 125 and rotates around first bearing 124, when guaranteeing to have vacuum between first sealed dish 6 and the second sealed dish 7 all the time, can also rotate the wafer, simultaneously can also guarantee that the wafer is compressed tightly fixedly by clamp plate 125 and rubber contact 18, increase the precision of circular processing.
While there have been shown and described what are at present considered to be the basic principles and essential features of the invention and advantages thereof, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. The utility model provides an edging machine is used in processing of semiconductor wafer edging, includes edging organism (1), main shaft bistrique (2) and workstation (3), its characterized in that: the rear side of the spindle grinding head (2) is movably connected with the top of the edge grinding machine body (1), the workbench (3) is arranged at the top inside the edge grinding machine body (1), one side of the top of the workbench (3) is fixedly connected with a driving shell (4), the bottom of the inner wall of the driving shell (4) is fixedly connected with a driving motor (5), and the top of the driving motor (5) penetrates through the driving shell (4) and is fixedly connected with a first sealing disc (6); the driving device is characterized in that a second sealing disc (7) is movably connected inside the first sealing disc (6), the bottom of the second sealing disc (7) is fixedly connected to the top of the driving shell (4), a first vacuum tube (8) is sleeved on the surface of the driving motor (5), a plurality of second vacuum tubes (9) are fixedly communicated with the top of the first vacuum tube (8), the top of each second vacuum tube (9) penetrates through the driving shell (4) and extends into the corresponding second sealing disc (7), a vacuum connecting tube (10) is fixedly communicated with one side of the first vacuum tube (8), and one side of the vacuum connecting tube (10) penetrates through the driving shell (4) and extends to the surface of the driving shell (4); the top of the first sealing disc (6) is fixedly communicated with a plurality of vacuum holes (11), the vacuum holes (11) are uniformly distributed in the top of the first sealing disc (6), the top of one side of the driving shell (4) is fixedly connected with a pressure lever device (12), and the bottom of the pressure lever device (12) is matched with the top of the vacuum holes (11) for use;
the pressure bar device (12) comprises a positioning mechanism (121), a fixed pressure bar (122) and a vertical bar (123), the bottom of the surface of the fixed pressure bar (122) is movably connected with one side of a driving shell (4) through a first rotating shaft, the other side of the positioning mechanism (121) is fixedly connected with the top of one side of the driving shell (4), one side of the positioning mechanism (121) is fixedly connected with the surface of the fixed pressure bar (122), the vertical bar (123) is positioned inside the fixed pressure bar (122) and is movably connected with the inside of the fixed pressure bar (122), the bottom of the surface of the vertical bar (123) is fixedly connected with a first bearing (124), the bottom of the first bearing (124) is fixedly connected with a pressure plate (125), the bottom of the pressure plate (125) is matched with the top of a vacuum hole (11) for use, the other side of the inside of the fixed pressure bar (122) is provided with a limiting mechanism (126), the other side of the limiting mechanism (126) penetrates through the fixed pressure bar (122) and extends to the other side of the fixed pressure bar (122), and one side of the limiting mechanism (126) is matched with the other side of the vertical bar (123) for use.
2. The edge grinding machine for edge grinding of semiconductor wafers as claimed in claim 1, wherein: positioning mechanism (121) is including location shell (1211), locating plate (1212) and screw rod (1213), location shell (1211) opposite side and drive shell (4) one side top fixed connection, location shell (1211) one side and fixed depression bar (122) surface contact, locating plate (1212) is located location shell (1211) top, locating plate (1212) one side and fixed depression bar (122) surface fixed connection, screw rod (1213) are located inside location shell (1211), and with the inside swing joint of location shell (1211), screw rod (1213) front side runs through location shell (1211) and extends to location shell (1211) front side, screw rod (1213) surface front side and rear side all threaded connection have first fixed plate (1214), first fixed plate (1214) top has driving plate (1215) through second pivot swing joint, screw rod (1213) top is provided with limiting plate (1216), limiting plate (1216) bottom passes through third pivot and driving plate (1211) top swing joint, locating plate (1212) top runs through location shell (1216) and uses with location shell (1215) bottom cooperation.
3. The edge grinding machine for edge grinding of semiconductor wafers as claimed in claim 2, wherein: the screw rod (1213) surface rear side fixedly connected with second bearing (13), second bearing (13) rear side and location shell (1211) inner wall rear side fixed connection, locating plate (1212) bottom seted up with limiting plate (1216) cooperation use spacing groove (14).
4. The edge grinding machine for edge grinding of semiconductor wafers as claimed in claim 1, wherein: the limiting mechanism (126) comprises a fixing column (1261) and a pull disc (1262), the other side of the fixing column (1261) is fixedly connected with one side of the pull disc (1262), one side of the fixing column (1261) penetrates through a fixing pressure lever (122) and extends to the inside of a vertical rod (123), a second fixing plate (1263) is fixedly connected to the surface of the fixing column (1261), the surface of the second fixing plate (1263) is movably connected with the inside of the fixing pressure lever (122), and a fixing groove (1264) matched with the fixing column (1261) is formed in the other side of the vertical rod (123).
5. The edge grinding machine for edge grinding of semiconductor wafers as claimed in claim 4, wherein: the surface of the fixing column (1261) is sleeved with a return spring (15), one side of the return spring (15) is fixedly connected with the other side of the second fixing plate (1263), and the other side of the return spring (15) is fixedly connected with the other side of the inner wall of the fixing pressing rod (122).
6. The edge grinding machine for edge grinding of semiconductor wafers as claimed in claim 4, wherein: the quantity of fixed slot (1264) is a plurality of, and evenly distributed in montant (123) opposite side, montant (123) top fixedly connected with baffle (16), baffle (16) bottom and fixed depression bar (122) top cooperation are used.
7. The edge grinding machine for edge grinding of semiconductor wafers as claimed in claim 1, wherein: vacuum hole (11) surface cover is equipped with rubber suction cup (17), rubber suction cup (17) top and clamp plate (125) bottom cooperation are used, clamp plate (125) bottom fixedly connected with rubber contact (18), rubber contact (18) quantity is a plurality of, and evenly distributed in clamp plate (125) bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111645669.2A CN114393468B (en) | 2021-12-29 | 2021-12-29 | Edge grinding machine for edge grinding processing of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111645669.2A CN114393468B (en) | 2021-12-29 | 2021-12-29 | Edge grinding machine for edge grinding processing of semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114393468A CN114393468A (en) | 2022-04-26 |
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Application publication date: 20220426 Assignee: YANCHENG XIRUN SEMICONDUCTOR Co.,Ltd. Assignor: Jiangsu weisenmei Microelectronics Co.,Ltd. Contract record no.: X2023980052834 Denomination of invention: A semiconductor wafer edge grinding machine Granted publication date: 20230310 License type: Exclusive License Record date: 20231219 |