TW201230235A - Vacuum processing apparatus and method for forming organic film - Google Patents
Vacuum processing apparatus and method for forming organic film Download PDFInfo
- Publication number
- TW201230235A TW201230235A TW100134132A TW100134132A TW201230235A TW 201230235 A TW201230235 A TW 201230235A TW 100134132 A TW100134132 A TW 100134132A TW 100134132 A TW100134132 A TW 100134132A TW 201230235 A TW201230235 A TW 201230235A
- Authority
- TW
- Taiwan
- Prior art keywords
- vapor
- substrate
- transport path
- mask
- organic
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims description 52
- 238000000034 method Methods 0.000 title claims description 47
- 239000010408 film Substances 0.000 claims abstract description 186
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 118
- 239000010409 thin film Substances 0.000 claims abstract description 106
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 76
- 238000012546 transfer Methods 0.000 claims abstract description 54
- 239000000463 material Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 183
- 238000007599 discharging Methods 0.000 claims description 11
- 238000003860 storage Methods 0.000 claims description 11
- 239000011368 organic material Substances 0.000 claims description 4
- 230000032258 transport Effects 0.000 claims 26
- 238000000059 patterning Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 3
- 238000001704 evaporation Methods 0.000 description 39
- 230000008020 evaporation Effects 0.000 description 39
- 239000012159 carrier gas Substances 0.000 description 17
- 238000005070 sampling Methods 0.000 description 16
- 238000009826 distribution Methods 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000000725 suspension Substances 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010212611 | 2010-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201230235A true TW201230235A (en) | 2012-07-16 |
Family
ID=45873870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100134132A TW201230235A (en) | 2010-09-22 | 2011-09-22 | Vacuum processing apparatus and method for forming organic film |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5634522B2 (ja) |
| TW (1) | TW201230235A (ja) |
| WO (1) | WO2012039383A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109673158A (zh) * | 2017-08-17 | 2019-04-23 | 应用材料公司 | 用于处理若干掩模的方法、用于处理基板的方法和用于涂布基板的设备 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6232272B2 (ja) * | 2013-12-06 | 2017-11-15 | 株式会社アルバック | 位置合装置、薄膜形成装置 |
| WO2019174710A1 (en) * | 2018-03-12 | 2019-09-19 | Applied Materials, Inc. | Apparatus and method for an automated optical inspection of a substrate |
| KR20210081597A (ko) * | 2019-12-24 | 2021-07-02 | 캐논 톡키 가부시키가이샤 | 성막 시스템 및 전자 디바이스 제조방법 |
| JP7162631B2 (ja) * | 2020-03-13 | 2022-10-28 | キヤノントッキ株式会社 | 基板キャリア、成膜装置、基板キャリアの搬送方法、及び成膜方法 |
| JP7159238B2 (ja) * | 2020-03-13 | 2022-10-24 | キヤノントッキ株式会社 | 基板キャリア、成膜装置、及び成膜方法 |
| CN111485218B (zh) * | 2020-04-22 | 2022-06-17 | 广东生波尔光电技术有限公司 | 特种工件辅助镀膜的自动控制系统 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3330656B2 (ja) * | 1992-12-14 | 2002-09-30 | 松下電器産業株式会社 | 合成樹脂薄膜のパターン形成方法およびその形成装置 |
| JP4366226B2 (ja) * | 2004-03-30 | 2009-11-18 | 東北パイオニア株式会社 | 有機ｅｌパネルの製造方法、有機ｅｌパネルの成膜装置 |
| JP4538650B2 (ja) * | 2004-06-18 | 2010-09-08 | 京セラ株式会社 | 蒸着装置 |
| JP4402016B2 (ja) * | 2005-06-20 | 2010-01-20 | キヤノン株式会社 | 蒸着装置及び蒸着方法 |
| WO2007099929A1 (ja) * | 2006-02-28 | 2007-09-07 | Ulvac, Inc. | 有機薄膜蒸着方法及び有機薄膜蒸着装置 |
| EP2190264A4 (en) * | 2007-09-10 | 2011-11-23 | Ulvac Inc | EXPANSION UNIT |
| JP4934619B2 (ja) * | 2008-03-17 | 2012-05-16 | 株式会社アルバック | 有機ｅｌ製造装置及び有機ｅｌ製造方法 |
| JP2009228090A (ja) * | 2008-03-25 | 2009-10-08 | Canon Inc | 蒸着装置及び蒸着源 |
| CN101667630A (zh) * | 2008-09-04 | 2010-03-10 | 株式会社日立高新技术 | 有机el设备制造装置和其制造方法以及成膜装置和成膜方法 |
| JP5277015B2 (ja) * | 2009-02-13 | 2013-08-28 | 株式会社日立ハイテクノロジーズ | 有機ｅｌデバイス製造装置及び成膜装置並びにシャドウマスク交換装置 |
| CN102639746B (zh) * | 2009-12-09 | 2014-03-12 | 株式会社爱发科 | 有机薄膜的成膜装置以及有机材料成膜方法 |
-
2011
- 2011-09-20 WO PCT/JP2011/071349 patent/WO2012039383A1/ja active Application Filing
- 2011-09-20 JP JP2012535030A patent/JP5634522B2/ja active Active
- 2011-09-22 TW TW100134132A patent/TW201230235A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109673158A (zh) * | 2017-08-17 | 2019-04-23 | 应用材料公司 | 用于处理若干掩模的方法、用于处理基板的方法和用于涂布基板的设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5634522B2 (ja) | 2014-12-03 |
| JPWO2012039383A1 (ja) | 2014-02-03 |
| WO2012039383A1 (ja) | 2012-03-29 |
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