201213255 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種心於壓接於脆性材料基板之狀態下 轉動而劃割脆性材料基板之劃線方法及劃線輪。 【先前技術】 玻璃基板或平板顯示器等跪性材料基板之製造時，將玻 璃基板以所期望之線劃割之後進行斷裂。劃割步驟中將脆 性材料基板载置於劃割裝置上’冑用劃線輪進行劃割而形 成劃割線。 此處’對於劃割玻璃基板時，玻璃基板上所產生之劃割 線之形成過程進行說明。於對劃線輪施加特定之壓力而使 其轉動之情形時，若沿著對劃線輪施加壓力之線而產生被 稱為肋狀紋⑽贿狀_性之破壞，料以確認於其下 方將產生特定深度為止之連續破壞^於如此之狀態下結 束劃割，則為沿著劃割線展開而對玻璃基板施加麼力，由 此可以容易地進行斷裂。因&，可以藉由肋狀紋之有無來 判斷劃割線之良否。 且說先則所使用之劃線輪係共有旋轉軸之兩個圓錐台 之底部相交而形成有圓周稜線之圓板狀之構件，將其稱為 第1刃尖。可以藉由使此劃線輪壓接於玻璃基板而轉動來形 成劃割線》 專利文獻1中提出有一種劃線輪，其可以自玻璃基板之表 面起於垂直方向相對於板厚而相對性地形成較深之垂直龜 裂。此劃線輪沿著上述先前之劃線輪之圓周稜線於圓周方 I57050.doc 201213255 向上交替地形成例如200〜3 00左右之多數之槽及突起。突起 藉由於圓周稜線上以特定之間距及深度切口而形成。以下 將此劃線輪稱為第2刀尖。 另外，亦開發有一種與專利文獻1相同之劃線輪，使槽之 數量大幅減少，例如使槽之數量為5個，且於圓周上等分地 配置之劃線輪。以下將此劃線輪稱為第3刃尖。 當使用劃割裝置將玻璃基板分斷為較小之基板之情形 時，於玻璃基板上平行地形成多數條劃割線，進而與該等 劃割線父叉而格子狀地形成劃割線，進行所謂交叉劃割。 交又劃割中，例如，如圖丨所示，使劃線輪平行地通過而形 成劃割線L1〜L5，其後使平台旋轉9〇。而形成劃割線 L6〜L10 〇 將脆性材料基板劃割之劃線方法之一，具有如劃割錦 L6〜L 1 〇般自脆性材料基板之外側起到外側為止進行劃割之 劃線方法。使劃線輪於比脆性材料基板之端稍微外側之點 :’使劃線輪之最下端下降到比脆性材料基板之上表面賴 微下方為止。然後’藉由於對靠輪施加特定之壓力之狀 態下水平移動，而自脆性材料基板之—端緣開始劃割，劃 割到另-端緣為止。以下’將此稱為外切劃割。於外切割 割之情形時，劃割線到達基板之兩端，因此劃割後之斷裂 谷易’但是存在因劃割之開始部分而基板容易產 缺點。 为外，如劃割線L1 ~L5般，1右白u , m,,、 八有自脆性材料基板之内側到 侧為止進行劃割而外側不劃割畫 量J踝方法。於比脆性材 15705〇.(J〇c 201213255 料基板之端緣稍微内側使劃線輪下降，然後，於對劃線輪 施加向下之特定壓力之狀態下向圖中右方向水平移動，由 此自脆性材料基板之内側開始劃割，劃割到另一端之内側 為止。以下，將此稱為内切劃割。 [先行技術文獻] [專利文獻] [專利文獻1]曰本專利第3,074,143號公報 【發明内容】 [發明所欲解決之問題] 先前，於使用第1刃尖進行劃割之情形時，於輪轉動之後 刀尖於基板表面滑動而未形成劃割線之現象被視為問題， 如此之狀態被稱為「切入不良」狀態。另一方面，雖然根 據第2刀尖可以回避「切入不良」狀態，但是與使用第】刀 尖進行劃割之情形時相比較，存在分斷後之玻璃之端面強 度變低之問題，根據玻璃之用途亦有時需要分斷後之端面 處理。尤其近年來，由於玻璃之用途之擴大、玻璃之薄板 化產。0製造之簡單化之要求之方面，要求一面回避「切 入不良」狀態，一面獲得與使用第丨刃尖進行劃割之情形時 同等之端面強度之技術。 ;刀入不良之情形時，較多的是即便外切劃割可能但是 無法進行内切劃m卜，若進行交又劃割，則於交點附 近劃割線不連續’存在產生所謂「交點跳動」之問題。例 如’於圖1中，若於形成劃割線L1〜L5之後，使平台旋轉而 形成劃割線L6〜L1G，則存在導致於劃割線之交點處肋狀紋 I57050.doc 201213255 結束’局部性地產生未形成劃割線之交點跳動現象之情況。 認為其原因如以下般。即，於最初形成劃割線時，隔著 劃割線而於兩側之玻璃表面附近產生内部應力。繼而，於 劃線輪垂直藉由已經形成之劃割線時，由於其附近潛在之 内部應力而自劃線輪對玻璃基板面於垂直方向上施加之力 削減。因此，認為交點附近未形成之後應形成之劃割線。 若玻璃基板上產生交點跳動，則玻璃基板不會按照預定 之劃割線分離’因此存在產生不良品，而使生產效率降低 之問題。 另外，行動電話等中所使用之玻璃基板由於輕量化而厚 度變薄。若對厚度較薄之基板進行外切劃割，則當劃線輪 跨向基板上時因對基板之端面邊緣所賦予之衝擊而邊緣產 生欠缺’或者由於基板自身破壞而產品之良率降低。 因此為使較薄之玻璃基板中不於邊緣產生欠缺，而要 求内切劃割。然而，先前之第丨刃尖中，亦存在由於切入不 良而内切無法形成劃割線之情形。 另一方面，專利文獻1中記載之第2刀尖為「切入良好之」 刃尖，可以自劃線輪轉動後立即開始形成劃割線。因此， 藉由使用第2刃尖，可以進行内切劃割，於交叉劃割時亦可 以防止交點跳動。 關於平板顯不器等中所要求之玻璃基板之端面強度，存 在第2刃尖較第1刀尖而言端面強度較差之問題。端面強度 依賴於劃線輪之周圍所形成之槽之數量，槽之數量越多強 度則越降低。因此，例如，若使槽之數量為3〇〇，則端面強 157050.doc 201213255 度大幅度降低。 另卜右使用第3刀尖進行劃割，則雖然端面強度可獲得 與先前之第1刃尖大致同f之結果，但是存在切人性能較第 2刃尖而言較差之缺點。 因此’要求與脆性材料基板之種類無關而切入良好，且 不易產生父點跳動之刀尖，即要求可以確保端面強度與第】 刀尖為同等程度之品質之刃尖。 β本發明係鑒於如此之先前之問題點而開發的，目的在於 提供當切斷脆性材料基板時，劃割開始時之切人良好，防 止交點跳動，發揮脆性材料之分斷面之品質（端面強度）良好 之劃割性能之劃線方法與實現此劃線方法之劃線輪。 [解決問題之技術手段] 為了解決此問題’本發明之劃線方法係使㈣線輪之劃 線方法，上述劃線輪具有由共有旋轉軸之2個圓錐台之底部 相交而形成圓錐稜線之外周緣部，且具有以沿著上述圓周 稜線使用劃線輪進行劃割時不會同時接觸於脆性材料基板 之間隔而設定之第丨、第2槽，且一面轉動一面劃割脆性材 料基板；且，上述劃線方法使用上述劃線輪對測試用脆性 材料基板進行測試劃割，根據m収劃割而形成之劃 割線，判別測試劃割之開始或結束時間點之劃線輪之第1、 第2槽之旋轉角度，將上述劃線輪保持與測試劃割結束時為 相同旋轉角度而開始虛設劃割’進行虛設劃割直至上述劃 線輪之第1、第2槽即將依次與上述測試用脆性材料基板接 觸為止，對於上述劃線輪保持上述虛設劃割結束之後之旋 157050.doc 201213255 轉角度而開始劃割，劃割作為對象之脆性材料基板。 此處，#可以冑上述測試劃割《長度設為上述劃線輪之 圓周長，測試劃割中之第1 12槽之旋轉角度之判別係藉 由判別自劃線輪之接觸位置到形成劃割為止之距㈣而進 行，上述虛設劃割自與上述測試劃割相同之旋轉角度開 始’且劃割與自上述測試劃割之接觸位置起到形成劃割為 止之距離相同之長度。 此處，亦可以為上述測試劃割中之第i、第2槽之旋轉角 度之判別係藉由判別測試劃割中自形成劃割起到劃割結束 為止之距離d2而進行，上述虛設劃割之長度設為自上述劃 線輪之圓周長之整數倍減去上述距離d2而得之長度。 此處，亦可以使劃割之距離為上述劃線輪之圓周之整數 倍之方式而設定上述劃線輪之直徑β 為了解決此問題，本發明之劃線輪具有由共有旋轉軸之2 個圓錐台之底部相交而形成圓錐稜線之外周緣部，且係劃 割脆性材料基板者，其具有：沿著上述圓周棱線而形成之 第1槽，以及形成於與上述第丨槽鄰接之位置之第2槽，上述 第2槽係以於使用劃線輪進行劃割時不會與上述第〗槽同時 接觸於脆性材料基板之間隔而設定。 此處，亦可以使劃割之距離為上述劃線輪之圓周之整數 倍之方式而設定上述劃線輪之直徑。 此處’亦可以將±述劃線輪之第Uf與最接近該槽而鄰接 之第2槽之間距設為100〜1〇〇〇〇μιη，較佳為1〇〇〜8〇〇gm,更 佳為 100〜400 μηι。 157050.doc -8 - 201213255 [發明之效果] 藉由使用具有如此之特徵之本 尽發明之劃線方法及劃線仏 進行劃割，可以自轉動之後形成_。另彳，可㈣^ 幻刃尖為同等程度之端面強度，且可以獲得與第2刀尖= 同專之切入性能。因此，即#灸έ*往* 丨使為較溥之脆性材料基板亦可 以進行内切劃割，另外，於推#山1 力Γ於進仃父又劃割時亦不會產生交 點跳動，可以較佳地使用。 【實施方式】 作為本發明令成為加工對象之脆性材料基板，關於形 態、材質、用途以及大小並未特別限I既可以為包含單 板之基板或將2片以上之單板貼合而成之貼合基板，亦可以 為於該等基板之表面或内部附著或含有薄膜或半導體材料 而成者。另外，作為脆性材料基板之材質，可以列舉玻璃、 陶竟、半導體⑼等）、藍寶；5等，作為其用途可以列舉液晶 顯示面板、電毁顯示面板、有機虹顯示面板、表面電場顯 不器（SED)用面板等場發射顯示器（FED)用面板等之平板顯 示器用之面板。 以下，根據圖式對本發明之實施形態進行詳細說明。圖2 係自本實施形態之劃線輪1 〇之旋轉軸觀察之正面圖，圖3 係其側面圖》本實施形態之劃線輪丨〇例如安裝於先前之劃 割裝置之劃割頭而使用。 如圖2及圖3所示’劃線輪1〇具有由共有旋轉軸12之兩個 圓錐台13之底部相交而形成圓周棱線1]t之外周緣部14，以 及沿著圓周稜線11而形成於圓周方向之複數個槽之圓板狀 157050.doc 201213255 之構件。關於槽之詳細情況將於下文敘述。劃線輪1 〇具有 供用以軸支劃線輪ίο之銷貫通之軸孔15。劃線輪1〇可以藉 由對圓板之外周緣部14自軸心朝向半徑方向實施研磨加2 而形成圓周稜線11，使收斂角為αβ劃線輪10之材質較佳為 超硬合金、燒結金剛石、陶瓷或者金屬陶瓷。 於本實施形態中，於圓周稜線u上形成第丨槽以，相對於 此槽21於相同旋轉方向上形成鄰接之第2槽22。圖4係表示 該等槽21、22之部分放大圖。該等2個槽之間隔較佳為，當 一方之槽與脆性材料基板接觸時，另一方之槽不會同時與 脆性材料基板接觸之間隔之中最小之間距P。即，設為當將 劃線輪壓接於脆性材料基板時，雖成為其圓周稜線i丨之一 部分咬入基板之狀態，但此時為劃線輪10之鄰接之2個槽 21、22不會同時接觸於脆性材料基板之間隔。另外，該等 槽21、22藉由自平坦之圓周稜線丨〗切出深度為h之大致乂字 狀之切口而形成。如此，於劃割時使龜裂確實地持續，可 以實現一面維持第1刃尖之玻璃破壞強度一面提高切入性 能之劃線輪。此處’若與跟第i槽鄰接之第2槽之間隔較小， 且設為同時與脆性材料基板接觸之間隔，則會有用以回避 「切入不良」狀態之效果較低，且分斷後之脆性材料基板 之端面強度降低之傾向。考量到回避由槽所致之r切入不 良」狀態之效果對於槽與脆性材料基板開始接觸時之作用 有較大幫助’若為同時接觸於脆性材料基板之間隔，則於 第1槽接觸之期間第2槽便開始接觸於脆性材料基板，使得 第2槽之作用被第1槽之作用削弱，因而認為回避「切入不 157050.doc •10· 201213255 良」狀態之效果變低。另外，考量到槽之間隔較短且在同 時接觸於脆性材料基板之狀態下容易對脆性材料基板之端 面強度帶來不良影響。另一方面，若與跟第i槽鄰接之第2 槽之間隔過大，則脆性材料基板之端面強度之降低雖受到 抑制，但是無法回避「切入不良」狀態。 此處，對槽21、22之間隔之具體例進行說明。例如，若 設劃線輪之直徑為2 mm(j)，則其圓周棱線丨丨之全周為6 28 mm。而且，若將劃線輪壓接於脆性材料基板，使刃尖咬入 基板僅2 μπι，則此間隔至少為126.4 μιη。其中間距p較佳為 126.4 μηι〜400 μηι 〇 此處’對槽21、22之間隔之其他具體例進行說明。例如， 若設劃線輪之直徑為3 ηπηφ，則其圓周稜線11之全周為9 42 mm。而且’若將劃線輪壓接於脆性材料基板，使刃尖咬入 基板僅2 μηι ’則此間隔至少為135.6 μηι »其中間距p較佳為 135*6 μηι〜400 μηι 〇 劃線輪為例如輪之外徑為1〜20 mm，槽21、22之深度為 〇_5〜5 μηι，圓周稜線^之收斂角為85〜M0。。更佳之劃線輪 為輪之外徑為1~5 mm，槽21、22之深度為1〜3 μιη，圓周棱 線11之收斂角為100〜130。。一般而言，藉由使用切口之深 度較深之劃線輪，存在相對於脆性材料之切入（尤其是交又 劃割時之交點跳動較少之情況）變得良好之傾向，藉由使用 槽較淺之劃線輪，存在脆性材料之分斷面之品質（端面強度） 提高之傾向。因此，決定槽之深度以保持此平衡。具體而 呂’較佳為槽之深度為例如1〜3 μηι。 157050.doc 201213255 且說，此實施形態中，由於僅於劃線輪〗〇之全周形成工 組槽21、22，所以即便將劃線輪1〇壓接於脆性材料基板亦 存在根據其接觸位置直至槽接觸為止無法形成劃割之可能 性。因此，本實施形態中，藉由以下方法使劃割開始之後b 可以形成劃割。圖5係表示此順序之流程圖。 (1) 首先，如圖6所示，準備與成為劃割對象之基板不同 之測試基板30，使用劃線輪10進行測試劃割。測試劃割之 長度為與劃線輪1 0之圓周相等之長度。此時檢測自哪個部 分起可以形成上述肋狀紋。具體而言，使用LED光源31與 CCD相機32，藉由圖像處理裝置33使已劃割之線之形成狀 態顯示於監視器晝面34上。圖7A係表示監視器顯示晝面34 與對應於已劃割之線之劃線輪丨0之旋轉角度之一例之圖。 (2) 其次，根據圖7A所示之監視器畫面藉由圖像處理而 求出線寬變化之點。認為線寬變化之點為槽2丨、22抵接觸 於測試基板30而開始形成劃割之部分。 (3) 使劃線輪10最初接觸於測試基板3 〇之點為j>〗，使線 寬變化之點P2為開始形成劃割之點，測量”與^之距離di。 (4) 於測量距離dl之後，實際進行劃割之前，如圖巧所 示，使用劃線輪10對測試基板30進行虛設劃割距離以，或 比其稍微短之距離。由於使測試劃割之長度與劃線輪1〇之 圓周相等，所以槽21、22之旋轉角度如圖7八所示，測試劃 割開始時與結束時相同。因此，於開始虛設劃割時，關於 劃線輪10之旋轉角度，與測試劃割開始時為相同角度，所 以可以進行劃割。 157050.doc 12 201213255 (5)之後，對成為工件之脆性材料基板進行劃割。劃線 輪之旋轉角度係自虛設劃割結束之角度狀態開始的。如 此，若劃線輪10接觸並轉動，則立即槽21、22接觸於脆性 材料基板，因此可以形成劃割。 而且，於對其他脆性材料基板進行劃割之情形時，重複 上述（4)、（5)。如此，可以藉由總是使虛設劃割之長度為固 疋長度dl並自其之後進行劃割而使劃割之成立提前。此實 施形態中，由於僅於劃線輪上形成槽21、22，所以可以與 先前例之第1刃尖為同等之端面強度。另外，由於在劃割開 始之後槽接觸於脆性材料基板，所以可以為切入良好之刀 尖。 另外，此處，使測試劃割之劃割之長度與劃線輪1〇之圓 周相等’但是亦可以使測試劃割之長度為任意長度。於此 情形時’如圖_示’使測試劃割時線寬變化之點P2與結 束劃割之點P3之距離為们而加以測定。而且，如圖8B所示， 使虚設劃割之長度d3為以下之長度。 d3=kds7c-d2 此處，k為整數，ds為劃線輪1〇之直徑。另外，k亦可為ι， 當距離d2較大之情形時⑷以上之整數。如此，若進行虛 設劃割’則於虛設劃割結束之時間點，可以為槽21、辦 脆性材料基板接觸之前之相同之旋轉角度。因&，若對實 際之脆性材料基板開始劃割’則可以立即於脆性材料基板 上形成劃割。 此處，於測試劃割中測定距離以或们，相當於算出測試 157050.doc 13- 201213255 劃割之開始位置中或結束位置中之槽之旋轉角度。 且說，成為劃割之對象之脆性材料基板中，例如，如圖9 所示，存在劃割距離D總是固定之情況。於如此之情形時， 當劃割距離D時’劃線輪之旋轉數包含角度在内為固定。因 此’以使劃線輪之直徑之整數倍與距離D相等之方式而設定 直徑。 D=(n+e) · (15π 此處，η為任意之整數，e為相當於容許誤差之小數。如 此，當劃割距離D時總是進行相同旋轉數（n+e)之轉動。因 此，如圖1 〇所示，若使開始劃割時之槽之位置為圖丨〇所示 之位置，則劃割距離D而結束時亦成為與圖1〇所示之槽之位 置大致相同。如此，當劃割決定有劃割距離之脆性材料基 板時，使用具有與此距離對應之直徑之劃線輪進行劃割， 則每次劃割時無需虛設劃割。 為了將端面強度保持為與第丨刀尖同等而槽之數量較少 則較佳，本實施形態中使第〗、第2槽之數量為〗組。 [產業上之可利用性] 本發明之劃線方法及劃線輪可以使用於在劃割裝置之劃 割頭之前端使用而將脆性材料基板劃割。 【圖式簡單說明】 圖1係表示使用先前之劃線輪進行交叉劃割之狀態之平 面圖。 圖2係本發明之實施形態之劃線輪之正面圖。 圖3係本實施形態之劃割裝置之側面圖。 157050.doc 201213255 圖4係本實施形態之劃線輪 _ ± _ 之正面之部分放大圖。 圖5係表示本實施形態之劃绩 ^ 』深方法之流程圖。 圖6係表示本貫施形態之書彳结士、+ 旬線方法之測試劃割之圖。 圖7A係表示測試劃割後之的 皿視窃畫面之一例之圖。 圖7B係表示虛設劃割後之龄 皿現器晝面之一例之圖。 圖8A係表示測試劃割後之的 交 < 现視益畫面之其他例之圖。 圖8B係表示虛設劃割後之監葙 说皿視态畫面之其他例之圖。 圖9係表示測試劃割後對成a劏$|丨| & 了风馮劃割對象之脆性材料基板 進行劃割時之狀態之立體圖。 圖1〇係表示劃糾之劃割之開始與結㈣之劃線輪與其 槽之位置之圖。 【主要元件符號說明】 10 劃線輪 11 圓周稜線 12 旋轉轴 13 圓錐台 14 外周緣部 15 軸孔 21 槽 22 槽 30 測試基板 31 L E D光源 32 CCD相機 33 圖像處理裝置 157050.doc •15· 201213255 34 監視器晝面 dl PI與P2之距離 d2 P2與P3之距離 d3 虛設劃割之長度 LI 劃割線 L2 劃割線 L3 劃割線 L4 劃割線 L5 劃割線 L6 劃割線 L7 劃割線 L8 劃割線 L9 劃割線 L10 劃割線 P 間距 PI 點 P2 點 P3 點 157050.doc -16-201213255 SUMMARY OF THE INVENTION [Technical Field] The present invention relates to a scribing method and a scribing wheel for scribing a brittle material substrate while being pressed against a substrate of a brittle material. [Prior Art] In the production of an inert material substrate such as a glass substrate or a flat panel display, the glass substrate is cut by a desired line and then fractured. In the dicing step, the brittle material substrate is placed on the dicing device, and the scribe line is formed by scribing with a scribing wheel. Here, the process of forming the scribe line generated on the glass substrate when the glass substrate is diced is described. When a specific pressure is applied to the scribing wheel to rotate it, if a line of pressure is applied to the scribing wheel, a damage called a rib pattern (10) is generated, which is confirmed below it. Continuous damage to a specific depth is generated. When the scratch is completed in such a state, the glass substrate is applied with force along the scribe line, whereby the breakage can be easily performed. Because of &, it is possible to judge the quality of the scribe line by the presence or absence of ribbed lines. Further, the scribing wheel train used in the prior art has a disk-shaped member in which the bottoms of the two truncated cones of the rotating shaft intersect to form a circumferential ridge line, and this is referred to as a first cutting edge. A scribed line can be formed by pressing the scribe wheel to be pressed against a glass substrate. Patent Document 1 proposes a scribe wheel which can be relatively perpendicular to the thickness of the plate from the surface of the glass substrate. Form a deep vertical crack. The scribing wheel alternately forms a plurality of grooves and projections of, for example, about 200 to 300 00 upwards along the circumferential ridge line of the preceding scribing wheel at a circumferential direction I57050.doc 201213255. The projections are formed by a specific pitch and depth cut on the circumferential ridgeline. Hereinafter, this scribing wheel is referred to as a second cutting edge. Further, a scribing wheel similar to that of Patent Document 1 has been developed, and the number of grooves is greatly reduced. For example, the number of grooves is five, and the scribing wheels are equally divided on the circumference. Hereinafter, this scribing wheel is referred to as a third blade tip. When the glass substrate is divided into smaller substrates by using a dicing device, a plurality of scribe lines are formed in parallel on the glass substrate, and a scribe line is formed in a lattice shape with the scribe lines and the so-called crossover is performed. Scratch. In the cross-cutting, for example, as shown in Fig. ,, the scribing wheels are passed in parallel to form the scribe lines L1 to L5, and thereafter the table is rotated by 9 。. Further, one of the scribing lines L6 to L10 is formed. One of the scribing methods for scribing the brittle material substrate has a scribing method for scribing from the outer side of the brittle material substrate to the outer side as in the case of cutting the slits L6 to L1. The scribing wheel is made slightly outward of the end of the brittle material substrate: 'The lowermost end of the scribing wheel is lowered below the upper surface of the brittle material substrate. Then, by horizontally moving under the condition that a specific pressure is applied to the wheel, the edge of the brittle material substrate is cut and cut to the other end edge. The following 'this is called circumcision. In the case of external cutting, the scribe line reaches both ends of the substrate, so the rupture after the dicing is easy, but there is a disadvantage that the substrate is easily produced due to the beginning of the dicing. For the outside, as in the scribe line L1 to L5, 1 right white u, m, , and 八 are cut from the inner side to the side of the brittle material substrate and the outer side is not cut. (J〇c 201213255 The edge of the material substrate is slightly inside, the scribing wheel is lowered, and then the horizontal direction is moved to the right in the state where the specific pressure is applied downward to the scribing wheel. This is cut from the inner side of the brittle material substrate, and is cut to the inner side of the other end. Hereinafter, this is referred to as inscribed cutting. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent No. 3,074,143 [Brief Description of the Invention] [Problem to be Solved by the Invention] In the case where the first edge is used for the cutting, the phenomenon that the blade edge slides on the surface of the substrate after the rotation of the wheel without forming a scribe line is regarded as a problem. In this case, the state is called "cutting poor". On the other hand, although the "cutting poor" state can be avoided according to the second cutting edge, compared with the case where the cutting edge is used, the cutting is performed. The problem of the strength of the end face of the glass is low, and the end face treatment after the breakage is sometimes required depending on the use of the glass. In recent years, in particular, the use of glass has been expanded, and the thin sheet of glass has been produced. In terms of the simplification requirements, it is required to avoid the "cut-in" state and obtain the same technique as the end face strength when using the second cutting edge. When the knife is in a bad situation, more is even External cutting may be possible, but it is impossible to carry out the internal cutting. If the crossing and the cutting are performed, the cutting line is discontinuous near the intersection. There is a problem of so-called "intersection jump". For example, in Figure 1, if it is formed After the scribe lines L1 to L5, the platform is rotated to form the scribe lines L6 to L1G, and there is a case where the rib pattern I57050.doc 201213255 at the intersection of the scribe line ends to locally generate a point jump phenomenon in which the scribe line is not formed. The reason is considered to be the following. That is, when the scribe line is initially formed, internal stress is generated in the vicinity of the glass surfaces on both sides across the scribe line. Then, when the scribe line is vertically formed by the already formed scribe line, The potential internal stress is reduced in the vertical direction from the scribe wheel to the glass substrate surface. Therefore, it is considered that the formation should be formed after the intersection is not formed. If the intersection of the glass substrate is generated, the glass substrate will not be separated according to the predetermined scribe line. Therefore, there is a problem that the defective product is produced and the production efficiency is lowered. In addition, the glass substrate used in the mobile phone or the like is lighter. When the thickness of the substrate is thinned, when the scribing wheel is strung across the substrate, the edge is defective due to the impact imparted to the edge of the end surface of the substrate or the product is damaged by the substrate itself. The yield is reduced. Therefore, in order to make the thin glass substrate lack the edge, the incision is required to be cut. However, in the previous third edge, there is also a cut line which cannot be formed due to poor cutting. On the other hand, the second cutting edge described in Patent Document 1 is a "cut-in good" blade edge, and the scribe line can be formed immediately after the scribe wheel is rotated. Therefore, by using the second cutting edge, it is possible to perform the inscribed cutting, and it is also possible to prevent the intersection from jumping during the cross cutting. Regarding the end face strength of the glass substrate required for a flat panel display or the like, there is a problem that the end face strength of the second blade edge is inferior to that of the first blade edge. The strength of the end face depends on the number of grooves formed around the scribing wheel, and the more the number of grooves, the lower the strength. Therefore, for example, if the number of grooves is 3 〇〇, the end face strength 157050.doc 201213255 degree is greatly reduced. On the other hand, when the third cutting edge is used for the cutting, the end face strength can be obtained as a result of substantially the same as the previous first cutting edge, but the cutting performance is inferior to that of the second cutting edge. Therefore, it is required to cut the blade tip which is not suitable for the type of the brittle material substrate, and it is difficult to produce the parent point jump, that is, it is required to ensure the edge strength of the end face strength and the same degree. The present invention has been developed in view of such a prior problem, and an object thereof is to provide a good cut at the start of the cutting when the brittle material substrate is cut, to prevent the intersection from jumping, and to exhibit the quality of the cross-section of the brittle material (end face) Strength) A scribing method with good scribing performance and a scribing wheel that implements this scribing method. [Technical means for solving the problem] In order to solve the problem, the scribing method of the present invention is a method for scribing a fourth wheel, wherein the scribing wheel has a conical ridge line formed by intersecting the bottoms of two truncated cones of a common rotating shaft. The outer peripheral edge portion has a second and second grooves which are set so as not to be in contact with the brittle material substrate at the same time when the scribing wheel is used for scribing along the circumferential ridge line, and the brittle material substrate is cut while rotating; Further, the scribing method performs the test scribing on the brittle material substrate for testing using the scribing wheel, and the scribing line formed by the m-cutting is determined, and the first scribing wheel at the start or end time of the test scribing is determined. The rotation angle of the second groove is such that the scribing wheel is held at the same rotation angle as the end of the test scribing, and the dummy scribing is started to perform the dummy scribing until the first and second slots of the scribing wheel are sequentially Before the test brittle material substrate is contacted, the above-mentioned scribing wheel is rotated at the angle of 157050.doc 201213255 after the end of the dummy scribing, and the scribing is started as a target. Material substrate. Here, # can use the above test to cut the length of the circumference of the scribing wheel, and determine the rotation angle of the 1st 12th slot in the scribing by judging the contact position from the scribing wheel to forming the stroke The cutting distance (4) is performed, and the above-described dummy scribing starts from the same rotation angle as the above-described test scribing, and the scribing is the same length as the distance from the contact position of the test scribing to the scribing. Here, the discrimination of the rotation angles of the i-th and second grooves in the above-described test scribing may be performed by discriminating the distance d2 from the formation of the scribing to the end of the scribing in the test scribing, the above-described dummy designation. The length of the cut is set to be the length obtained by subtracting the above distance d2 from an integral multiple of the circumference of the scribing wheel. Here, the diameter of the scribing wheel may be set such that the distance of the scribing is an integral multiple of the circumference of the scribing wheel. To solve this problem, the scribing wheel of the present invention has two common axes of rotation. The bottom portion of the truncated cone intersects to form a peripheral portion of the outer portion of the conical ridge line, and the substrate for cutting the brittle material has a first groove formed along the circumferential ridge line and a position adjacent to the third groove In the second groove, the second groove is set so as not to be in contact with the brittle material substrate at the same time as the groove is formed by the scribing wheel. Here, the diameter of the scribing wheel may be set such that the distance of the scribing is an integral multiple of the circumference of the scribing wheel. Here, the distance between the Uf of the ± scribing wheel and the second groove adjacent to the groove may be set to 100 to 1 〇〇〇〇 μιη, preferably 1 〇〇 to 8 〇〇 gm, More preferably 100~400 μηι. 157050.doc -8 - 201213255 [Effect of the Invention] By performing the scribing method of the present invention and the scribing 仏 having such characteristics, it is possible to form _ after the rotation. In addition, the (4)^ magic blade tip is the same degree of end face strength, and can be obtained with the second cutting edge = the same special cutting performance. Therefore, it is also possible to perform in-cutting on the substrate of the brittle material which is more sturdy. In addition, when the #山1 force is applied to the father and the cut, there will be no intersection jump. It can be preferably used. [Embodiment] As a brittle material substrate to be processed according to the present invention, the form, material, use, and size are not particularly limited to one, and may be a substrate including a single plate or a laminate of two or more veneers. The bonded substrate may be formed by attaching or containing a film or a semiconductor material to the surface or inside of the substrate. Further, examples of the material of the brittle material substrate include glass, ceramics, semiconductors (9), etc., sapphire, and the like. Examples of the use thereof include a liquid crystal display panel, an electro-destructive display panel, an organic rainbow display panel, and a surface electric field. The device (SED) is a panel for a flat panel display such as a panel for a field emission display (FED) such as a panel. Hereinafter, embodiments of the present invention will be described in detail based on the drawings. 2 is a front view of the scribing wheel 1 of the present embodiment as viewed from a rotating shaft, and FIG. 3 is a side view thereof. The scribing rim of the present embodiment is attached to, for example, a cutting head of a previous scribing device. use. As shown in FIGS. 2 and 3, the scribing wheel 1 has a peripheral edge portion 14 formed by intersecting the bottoms of the two truncated cones 13 sharing the rotating shaft 12, and along the circumferential ridge line 11 A member of a disk-shaped plate 157050.doc 201213255 formed in a plurality of grooves in the circumferential direction. Details on the tank will be described below. The scribing wheel 1 has a shaft hole 15 for the pin for the shaft scribing wheel ίο. The scribing wheel 1〇 can form the circumferential ridge line 11 by grinding and adding 2 from the axial center toward the radial direction of the outer peripheral edge portion 14 of the circular plate, so that the convergence angle of the αβ scribing wheel 10 is preferably a superhard alloy. Sintered diamond, ceramic or cermet. In the present embodiment, the second groove 22 is formed on the circumferential ridge line u so as to form the adjacent second groove 22 in the same rotational direction with respect to the groove 21. Fig. 4 is a partial enlarged view showing the grooves 21, 22. Preferably, the spacing between the two grooves is such that when one of the grooves is in contact with the brittle material substrate, the other groove is not at the same time as the minimum distance P from the brittle material substrate. In other words, when the scribing wheel is pressure-bonded to the brittle material substrate, the portion of the circumferential ridge line i is bitten into the substrate, but in this case, the two grooves 21 and 22 adjacent to the scribing wheel 10 are not Will be in contact with the spacing of the brittle material substrate at the same time. Further, the grooves 21, 22 are formed by cutting a substantially U-shaped slit having a depth h from a flat circumferential ridge line. In this way, the crack is surely continued at the time of the cutting, and the scribing wheel which improves the cutting performance while maintaining the glass breaking strength of the first cutting edge can be realized. Here, 'if the interval between the second groove adjacent to the i-th groove is small, and the interval between the contact with the brittle material substrate is at the same time, the effect of avoiding the "cutting poor" state is low, and after the break, The tendency of the end face strength of the brittle material substrate to decrease. Considering the effect of avoiding the problem of r-cutting caused by the groove, the effect of the groove on the start of contact with the brittle material substrate is greatly helpful. 'If the gap is simultaneously contacted with the substrate of the brittle material, the contact is made during the first groove. The second groove starts to come into contact with the brittle material substrate, so that the action of the second groove is weakened by the action of the first groove. Therefore, it is considered that the effect of avoiding the "cut-in 157050.doc •10·201213255 good" state is lowered. Further, it is considered that the interval between the grooves is short and the contact with the brittle material substrate is likely to adversely affect the end surface strength of the brittle material substrate. On the other hand, if the interval between the second grooves adjacent to the i-th groove is too large, the decrease in the end surface strength of the brittle material substrate is suppressed, but the "cut-in failure" state cannot be avoided. Here, a specific example of the interval between the grooves 21 and 22 will be described. For example, if the diameter of the scribing wheel is 2 mm (j), the circumference of the circumferential ridge is 6 28 mm. Further, if the scribing wheel is pressure-bonded to the brittle material substrate so that the blade edge bites into the substrate by only 2 μm, the interval is at least 126.4 μm. The pitch p is preferably 126.4 μηι to 400 μηι 〇 Here, another specific example of the interval between the grooves 21 and 22 will be described. For example, if the diameter of the scribing wheel is 3 ηπηφ, the entire circumference of the circumferential ridge 11 is 9 42 mm. And 'If the scribing wheel is crimped to the brittle material substrate, the blade tip bites into the substrate only 2 μηι ', then the interval is at least 135.6 μηι » wherein the pitch p is preferably 135*6 μηι~400 μηι 〇 For example, the outer diameter of the wheel is 1 to 20 mm, the depth of the grooves 21 and 22 is 〇_5 to 5 μηι, and the convergence angle of the circumferential ridge line is 85 to M0. . A better scribing wheel has an outer diameter of 1 to 5 mm, a groove 21, 22 having a depth of 1 to 3 μm, and a circumferential ridge 11 having a convergence angle of 100 to 130. . In general, by using a scribing wheel having a deeper depth of the slit, there is a tendency to become good with respect to the cutting of the brittle material (especially when the intersection point is less when the cross-cutting is performed), by using the groove In the shallower scribing wheel, there is a tendency that the quality of the cross-section of the brittle material (end face strength) is improved. Therefore, the depth of the groove is determined to maintain this balance. Specifically, it is preferable that the depth of the groove is, for example, 1 to 3 μηι. 157050.doc 201213255 In addition, in this embodiment, since the stack grooves 21 and 22 are formed only over the entire circumference of the scribing wheel, even if the scribing wheel 1 is crimped to the brittle material substrate, there is a contact position according to the contact position. The possibility of scratching cannot be formed until the groove is in contact. Therefore, in the present embodiment, the scribing can be performed after the start of the scribing by the following method. Figure 5 is a flow chart showing this sequence. (1) First, as shown in Fig. 6, a test substrate 30 different from the substrate to be diced is prepared, and test scribing is performed using the scribing wheel 10. The length of the test scribing is the same length as the circumference of the scribing wheel 10. At this time, it is detected from which part the rib pattern can be formed. Specifically, the LED light source 31 and the CCD camera 32 are used to display the formed line of the cut line on the monitor face 34 by the image processing device 33. Fig. 7A is a view showing an example of a rotation angle of the monitor display pupil 34 and the scribing rim 0 corresponding to the cut line. (2) Next, the point at which the line width changes is obtained by image processing based on the monitor screen shown in Fig. 7A. It is considered that the point at which the line width changes is that the grooves 2, 22 are in contact with the test substrate 30 to start forming the cut portion. (3) The point at which the scribing wheel 10 is initially in contact with the test substrate 3 is j>, and the point P2 at which the line width is changed is the point at which the scribing is started, and the distance "di" is measured. (4) For measurement After the distance d1, before the actual dicing, as shown in the figure, the dummy scribe line 30 is used to make a dummy scribe distance of the test substrate 30, or a shorter distance than the scribe line 10, because the length of the test scribe and the scribe line are made. The circumference of the wheel 1 is equal, so the rotation angle of the grooves 21, 22 is as shown in Fig. 7-8, and the test is started at the same time as the end of the cutting. Therefore, when the dummy cutting is started, regarding the rotation angle of the scribing wheel 10, It is the same angle as the start of the test scratching, so it can be cut. 157050.doc 12 201213255 (5) After that, the substrate of the brittle material to be the workpiece is cut. The rotation angle of the scribing wheel is ended by the dummy cutting. The angle state is started. Thus, if the scribing wheel 10 is in contact with and rotated, the grooves 21, 22 are immediately in contact with the brittle material substrate, so that scribing can be formed. Moreover, in the case of scribing other brittle material substrates, repeating Above (4), (5) In this way, the formation of the scratch can be advanced by always making the length of the dummy cut into the solid length dl and cutting it from the rear. In this embodiment, since the grooves 21, 22 are formed only on the scribing wheel. Therefore, it is possible to have the same end face strength as the first blade tip of the prior art. Further, since the groove contacts the brittle material substrate after the start of the cutting, it is possible to cut the blade tip. In addition, here, the test is cut. The length of the scribing is equal to the circumference of the scribing wheel 1〇', but the length of the test scribing can also be any length. In this case, the figure P2 and the line width change when the test is cut are shown in the figure. The distance from the point P3 at which the dicing is completed is measured. Further, as shown in Fig. 8B, the length d3 of the imaginary dicing is set to the following length: d3 = kds7c - d2 Here, k is an integer, ds is a stroke The diameter of the reel 1 。. In addition, k may also be ι, when the distance d2 is larger, the integer is greater than (4). Thus, if the dummy slashing is performed, the slot 21 may be at the time of the end of the dummy dicing. The same rotation angle before the brittle material substrate is contacted Because &, if the actual brittle material substrate begins to be cut, then the scratch can be formed on the brittle material substrate. Here, the distance is measured in the test and is equivalent to the calculation test 157050.doc 13 - 201213255 The rotation angle of the groove in the start position or the end position of the dicing. In the case of the brittle material substrate to be diced, for example, as shown in Fig. 9, the dicing distance D is always fixed. In such a case, when the distance D is cut, the number of rotations of the scribing wheel is fixed including the angle. Therefore, the diameter is set such that the integral multiple of the diameter of the scribing wheel is equal to the distance D. D = (n+e) · (15π where η is an arbitrary integer and e is a fraction corresponding to the tolerance. Thus, the rotation of the same number of rotations (n + e) is always performed when the distance D is cut. Therefore, as shown in FIG. 1A, if the position of the groove at the start of the dicing is the position shown in FIG. 则, the dicing distance D and the end are also substantially the same as the position of the groove shown in FIG. . Thus, when the scribing material substrate having the cutting distance is determined by the scribing, the scribing wheel having the diameter corresponding to the distance is used for scribing, and no dummy scribing is required for each scribing. In order to keep the end face strength equal to the first cutting edge and the number of grooves is small, it is preferable that the number of the first and second grooves is set in the present embodiment. [Industrial Applicability] The scribing method and scribing wheel of the present invention can be used to cut a brittle material substrate before use at the front end of the cutting head of the scribing device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a state in which cross-cutting is performed using a previous scribing wheel. Fig. 2 is a front elevational view showing a scribing wheel according to an embodiment of the present invention. Fig. 3 is a side view showing the dicing apparatus of the embodiment. 157050.doc 201213255 Fig. 4 is a partially enlarged view showing the front side of the scribing wheel _ ± _ of the present embodiment. Fig. 5 is a flow chart showing the method of the method of the present embodiment. Fig. 6 is a view showing the test and cutting of the book of the present embodiment and the method of the +-line method. Fig. 7A is a view showing an example of the screen of the dish after the test is cut. Fig. 7B is a view showing an example of the face of the present invention after the dummy cutting. Fig. 8A is a view showing another example of the image of the intersection after the test is cut. Fig. 8B is a view showing another example of the visual state screen after the dummy cut. Fig. 9 is a perspective view showing a state in which the brittle material substrate of the wind slashing object is cut after the test is cut. Fig. 1 is a view showing the position of the scribing wheel and the groove of the start of the scribing and the knot (4). [Description of main component symbols] 10 Scribe wheel 11 Circumferential ridge 12 Rotary shaft 13 Conical table 14 External peripheral portion 15 Axle hole 21 Slot 22 Slot 30 Test substrate 31 LED light source 32 CCD camera 33 Image processing device 157050.doc •15· 201213255 34 Monitor face dl Distance between PI and P2 d2 Distance between P2 and P3 d3 Length of virtual cut line LI Line of cut line L2 Line of cut line L3 Line of cut line L5 Line of cut line L6 Line of cut line L7 Line of cut line L8 Line of cut line L9 Line of cut line L9 Secant L10 Scribe line P Spacing PI Point P2 Point P3 Point 157050.doc -16-