200940231 . 九、發明說明： ^ 【發明所屬之技術領域】 本發明涉及切割與分離技術，尤其係一種採用雷射切 割製程之分離非金屬或脆性材料之方法。 【先前技術】 分離脆性材料之方法一般以配合脆性材料強烈吸收特 性之雷射，如二氧化碳（C02)雷射來加熱方形玻璃板件表 面，再以冷卻流體加以局部冷卻，從而於玻璃板件表面因 ❹急劇變化之溫度差產生熱應力並於玻璃内部形成一難以目 視察覺之盲裂紋（blind crack)，亦即於雷射之移動方向上形 成一切割線（scribing line)。之後再沿此切割線，以機械或 手動方式將方形玻璃板件分離開。 通常，為分離方形玻璃板件，需於板件上形成多條正 交之盲裂紋。此時第二方向之切割將會影響先前已完成之 第一方向之切割，造成癒合現象（healing phenomenon)，使 得先沿第一方向裂片時，容易叉開導致良率降低。 ® 為提升裂片良率，美國專利第5,826,772號提出一種分 離脆性材料之方法，其係採用於板件之正反兩面各形成正 交之盲裂紋，亦係每一面僅進行單一方向之切割。該種切 割方法可避免癒合現象產生，從而可提升裂片良率。 然而，採用上述雙面各切割一方向，則必須對板件進 行翻面操作或採用雙雷射切割方式，其於一定程度上造成 整個分離製程較為複雜。 6 200940231 • 【發明内容】200940231 . IX. INSTRUCTIONS: ^ TECHNICAL FIELD OF THE INVENTION The present invention relates to cutting and separating techniques, and more particularly to a method of separating non-metallic or brittle materials using a laser cutting process. [Prior Art] The method for separating brittle materials generally uses a laser that strongly absorbs the characteristic of a brittle material, such as a carbon dioxide (C02) laser to heat the surface of the square glass plate, and then locally cools with a cooling fluid to the surface of the glass plate. Thermal stress is generated due to a sharply varying temperature difference and a blind crack that is difficult to visually perceive is formed inside the glass, that is, a scribing line is formed in the moving direction of the laser. Then along this cutting line, the square glass sheets are separated mechanically or manually. Usually, in order to separate the square glass sheets, a plurality of orthogonal blind cracks are formed on the sheets. At this time, the cutting in the second direction will affect the cutting of the first direction which has been completed before, resulting in a healing phenomenon, so that when the film is first split in the first direction, it is easy to fork and the yield is lowered. In order to improve the yield of the split, a method for separating the brittle material is proposed in U.S. Patent No. 5,826,772, which is to form a blind crack on each of the front and back sides of the plate, and also to cut only one direction on each side. This cutting method avoids the healing phenomenon and thus increases the rate of splitting. However, in the above-mentioned double-sided cutting direction, it is necessary to perform the turning operation of the plate member or the double laser cutting mode, which causes the entire separation process to be complicated to some extent. 6 200940231 • [Summary content]
• 下面將以實施例說明一種分齙胳μ u、M 簡單且裂片良率較高。 材料之方法，製程 一種分離脆性材料之方法，其包括步驟： 提供-脆性材料，其具有一切割面； 利用雷射㈣t轉胃㈣自 線，該至少-第-切割線沿一第一方向延成伸至r 一弟-切割 利用雷射切割製程於已形成有至少一第+φ ❹割面上形成至少一第_+利Α 第—切割線之切 第一切割線，該至少一第_ 與第-方向相交之第二方向延伸； -。[線沿- 沿該至少一第二切割線分裂該脆 個子脆性材料；以及 从獍得複數 切割線分裂該複數個子脆性材料中 之 沿該至少一第一 至少一個。 相對於先前技術’該分離脆性材料之方法 ❹同-面進行雙向交叉切割形成盲裂紋(亦即，切割線)= 再以後切先裂、先切後裂方式對脆性材料進行裂片），可有 片時出現又開現象’從而可提升分離脆性材料之 裂片良率及簡化製程。 【實施方式】 明 下面將結合附圖對本發明實施例作進一步 之詳細說 參見圖1至圖7,本發明實施例提供之分離脆性材料之 方法，其包括步驟： 7 200940231 • 如圖1所示，提供一待分離之脆性材料10，其具有一 . 個切割面100。脆性材料10可為非金屬，例如陶瓷、玻璃、 石英、玻璃矽晶圓（wafer)及發光二極體晶圓等。該脆性材 料10可為一方形板件（如圖1所示），或依實際需求而定之 其他形狀工件，例如圓形件。 如圖2所示，利用雷射切割製程於脆性材料10之切割 面100上形成一條第一切割線101，第一切割線101位於 A1方向上且沿A1方向延伸。其中，雷射切割製程可包括 ❿步驟：（a)利用一個雷射產生裝置20產生一雷射光束加熱脆 性材料10之切割面100,並使雷射光束與脆性材料10產生 一沿A1方向之相對運動；以及（b)於切割面100之鄰近雷 射光束之拖曳端（Trailing edge)位置，利用一個冷卻裝置30 向脆性材料施加（例如喷射）一冷卻流體（例如，氣液混合物） 進行冷卻，以於切割面100上形成一條第一切割線101。進 一步的，於雷射光束加熱脆性材料10之切割面100之前， ©還可於第一切割線101之起始處，利用鑽石刀、刀輪或雷 射刻劃等形成一初始裂紋（initial crack)(圖中未顯示）來增 加形成第一切割線101之成功率。 如圖3所示，利用雷射切割製程於已形成有第一切割 線101之脆性材料10之切割面100上形成一條第二切割線 102，第二切割線102位於A2方向上且沿A2方向延伸， A1方向與A2方向相交，例如正交（夾角為90度）。其中， 雷射切割製程可包括步驟：（a)利用雷射產生裝置20產生一 雷射光束加熱脆性材料10之切割面100，並使雷射光束與 8 200940231 脆性材料Κ)產生一沿Α2方向之相對運動 面100之鄰近雷射本击她 （）於切割 脆性材料^ 1’_冷钱置30向 施加—冷卻流體進行冷卻’以於切割面⑽上形 成條弟二切割線1()2。同_，㈣ 102之成功率，可於赍射古击4α 々成*弟一切割線 H 2 熱跪性材料1()之_面_ 4等=二切割線102之起始處’利用鑽石刀、刀輪或 田射等形成一初始裂紋（圖中未顯示）。 次 一圖4為脆性材料1G之切割面i⑼上先後形成有 二：1〇1及一條第二切割線1〇2後之俯視圖。第二切 第第二：？⑽位於同一平面且為正交設置; 正交設置疋Α 了二：線1〇1與第二切割線1〇2並不限於 之^ _際應用之需要來適當設定兩者之間 如圖5所示，沿第二切割線1〇2分裂脆性材料⑴以 獲侍兩個子脆性材料11〇β從圖 ❹ 先裂之裂Κ古斗、ν 圃5中了侍知’由於採用後切 j之裂片方式’兩個子脆性材肖11〇之分裂面平齊而未 材料之^雙向㈣產生之癒合現象對分離脆性 材料1 〇所造成之裂片不良影響可被抑制，裂片正常。 所不’如果先沿第一切割線101分裂脆性材料 =:即採用先切先裂之裂片方式，則會受到同面雙向切 d產生之癒合現象之影響而於兩個子脆性材料之分裂面出 現叉開現象，導致裂片不良。 刀农囟出 如圖7所示，於沿第二切割線102裂片之後，沿第一 切割線簡對複數個子脆性材料110進行裂片，則可獲得 200940231 滿足所需尺寸之複數個子脆性材料112。從圖 由於採用先切後裂之裂片方式，子脆性材_ 112之八：， 同樣是平齊而未產生又開現象。 刀久面 另=發明實施例並不限在於切割面 ^第一切割線逝及-條第二切割線跡其還可根據= 二要二]如如圖8所示’先於脆性材料 ： 射切割製程沿AU向形成多條平行之 用： :形成有多條第一切割線之切割面上利用雷射 A2方向形成多條平行之第二切割線1〇2，多 101與多轉·箆- 士刀宝丨丨始！ 士 、 刀。J線 興多條第—切割線1G2相交，例如正交設置。之 樣疋採用先沿第二切割線1〇2裂片， °• In the following, an example will be described in which a splitting u u, M is simple and the split yield is high. A method of separating a brittle material, comprising the steps of: providing a fragile material having a cut surface; using a laser (four) t to rotate the stomach (four) from the wire, the at least-first-cut line extending along a first direction The first cutting line is formed by using a laser cutting process to form at least one _+利Α first-cut line formed on at least one +φ cut surface, the at least one _ Extending in a second direction intersecting the first direction; -. [Line edge - splitting the brittle sub-brittle material along the at least one second cutting line; and splitting the at least one first of the plurality of sub-brittle materials from the at least one of the plurality of cutting lines. Compared with the prior art, the method for separating the brittle material is subjected to bidirectional cross-cutting to form a blind crack (ie, a cutting line) = then a first crack, a first crack and a split crack to crack the brittle material, and there may be When the film is opened again, it can improve the split yield of the separated brittle material and simplify the process. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for separating a brittle material according to an embodiment of the present invention will be further described with reference to the accompanying drawings in conjunction with the accompanying drawings. The method includes the following steps: 7 200940231 • As shown in FIG. A brittle material 10 to be separated is provided having a cutting face 100. The brittle material 10 can be non-metallic, such as ceramic, glass, quartz, glass wafers, and light emitting diode wafers. The brittle material 10 can be a square plate (as shown in Figure 1) or other shaped workpiece, such as a circular member, as desired. As shown in Fig. 2, a first cutting line 101 is formed on the cutting face 100 of the brittle material 10 by a laser cutting process, and the first cutting line 101 is located in the A1 direction and extends in the A1 direction. Wherein, the laser cutting process may include the step of: (a) generating a laser beam by a laser generating device 20 to heat the cutting surface 100 of the brittle material 10, and causing the laser beam and the brittle material 10 to generate an A1 direction. Relative motion; and (b) at a trailing edge position of the adjacent laser beam at the cutting plane 100, using a cooling device 30 to apply (eg, spray) a cooling fluid (eg, a gas-liquid mixture) to the brittle material for cooling. A first cutting line 101 is formed on the cutting surface 100. Further, before the laser beam heats the cut surface 100 of the brittle material 10, an initial crack may be formed by using a diamond knife, a cutter wheel or a laser scribing at the beginning of the first cutting line 101. (not shown) to increase the success rate of forming the first cutting line 101. As shown in FIG. 3, a second cutting line 102 is formed on the cutting surface 100 of the brittle material 10 on which the first cutting line 101 has been formed by a laser cutting process. The second cutting line 102 is located in the A2 direction and along the A2 direction. Extending, the A1 direction intersects the A2 direction, for example, orthogonal (the angle is 90 degrees). Wherein, the laser cutting process may comprise the steps of: (a) generating a laser beam by the laser generating device 20 to heat the cutting surface 100 of the brittle material 10, and causing the laser beam to generate a direction along the Α2 direction with the 8200940231 brittle material. The adjacent laser surface 100 is adjacent to the laser to strike her () to cut the brittle material ^ 1 '_ cold money set 30 to apply - cooling fluid for cooling 'to form a two-cut line 1 () 2 on the cutting surface (10) . With the success rate of _, (4) 102, you can use the diamond to strike the 4α 々 * 弟 弟 弟 切割 H H H H H H H H H H H 4 4 利用 利用 利用 利用 利用 利用 利用 利用 利用 利用An initial crack is formed by a knife, a cutter wheel or a field shot (not shown). Next, Fig. 4 is a plan view of the cutting surface i (9) of the brittle material 1G, which is formed by two: 1〇1 and a second cutting line 1〇2. Second cut Second:? (10) are in the same plane and are orthogonally set; the orthogonal setting is two: the line 1〇1 and the second cutting line 1〇2 are not limited to the need of the application. As shown, the brittle material (1) is split along the second cutting line 1〇2 to obtain the two sub-brittle materials 11〇β from the figure ❹ 之 之 之 Κ Κ 、 、 ν ν 侍 侍 侍 侍 ' ' ' ' ' 由于 由于 由于The cleavage method 'the two sub-brittle materials Xiao 11〇's split surface is flush and the material is not bidirectional (four). The healing phenomenon caused by the separation of the brittle material 1 〇 can be suppressed, and the lobes are normal. If you do not split the brittle material along the first cutting line 101 first: the cleavage method using the first-cutting first crack will be affected by the healing phenomenon of the same bidirectional cutting d and the splitting surface of the two sub-brittle materials. There is a fork open phenomenon, resulting in poor lobes. As shown in Fig. 7, after sharding along the second cutting line 102, a plurality of sub-brittle materials 110 are split along the first cutting line, and a plurality of sub-brittle materials 112 satisfying the required size of 200940231 can be obtained. From the figure, due to the cleavage method of the first-cutting and post-cracking, the sub-brittle material _ 112 VIII: is also flush and does not produce reopening. The long-term surface of the knife is not limited to the cutting surface ^ the first cutting line and the second cutting line can also be according to = two to two] as shown in Figure 8 'before the brittle material: shot The cutting process is formed in a plurality of parallel directions along the AU direction: : a cutting surface formed with a plurality of first cutting lines forms a plurality of parallel second cutting lines 1〇2 by using the laser A2 direction, 101 and more turns·箆- Swordsman started!士,刀. J line Xing multi-segment-cut line 1G2 intersects, for example, orthogonal setting. The sample is first lobed along the second cutting line 1〇2, °
裂片。 农a丹/0第一切割線1(H 綜上所述，本發明實施例提供之分離脆性材料之 吏切先裂、先切後裂之裂片方式’可有效抑制因同面 雙向刀割產生之癒合現象所造成之裂片 〇 =施例提供之切割脆性材料之方法可同時具備同面^ 刀：：有之製程簡單以及後切先裂、先切後裂 式所具有之高裂片良率等雙重優勢。 ，本發明確已符合發明專利之要件，遂依法 ，出專利申mx上所述者僅為本發明之較佳實施方 =自不能以此限制本案之申請翻範圍。舉凡熟悉本案 技孩之人士援依本發明之精神所作之等效修掷或變化，比 應涵蓋於以下申請專利範圍内。 白 【圖式簡單說明】 200940231 • 目1係本發明實_提供之—職材料之立體示衰圈。 . 目2係彻雷射切割製程於® 1所干μ … 一條第―切割線之-狀態示意圖。&脆性材料上形成 -條用雷射㈣製程於圖2所示脆性材料上形成 條第一切割線之一狀態示意圖。 ㈣上开^成 圖4係圖3所示脆性材料上形成有第 切割線之俯視圖。 d線及第一 圖5係圖4所示脆性材料沿第二 β數子脆性材料之示4圖。 後形成複 圓6係圖4所示脆性材料沿第 意圖。 U線裂片不良之示 之示意圖 圖7係圖5所示複數子脆性材料 意圖。 第一切割線裂片後 圖8係本發明另一實施例提供之一 程於其上先後形成多條第—㈣線及多2用雷射切割製 性材料之示意圖。 术第二切割線之脆 主要元件符號說明 脆性材料 切割面 10 100 第一切割線 101 第二切割線 102 雷射產生裝置 20 冷卻裴置 30 子脆性材料 110 、 112 11 200940231 • 方向 A1、A2Sliver. Nong Adan / 0 first cutting line 1 (H in summary, the splitting of the brittle material provided by the embodiment of the present invention, the first splitting and the first splitting after the splitting method can effectively suppress the occurrence of the same side two-way cutting The rupture caused by the healing phenomenon = the method of cutting brittle material provided by the application can simultaneously have the same surface knife:: the simple process and the high crack rate of the first cut and the first split and the first split Double advantage. The present invention has indeed met the requirements of the invention patent. According to the law, the patent application is only the preferred implementer of the present invention = it is not possible to limit the scope of the application in this case. The equivalent of the person who has made the equivalent of the invention in the spirit of the present invention shall be covered by the following patent application. White [Simple Description] 200940231 • Item 1 is the actual material provided by the present invention Stereoscopic aging ring. 目2 is a laser cutting process in о 1 dry μ ... a first - cutting line - state diagram. & brittle material formed - strip laser (four) process shown in Figure 2 brittleness Forming a first cut on the material Schematic diagram of one of the lines. (4) Upper opening and forming Figure 4 is a top view of the cutting line formed on the brittle material shown in Fig. 3. The d line and the first figure 5 are the brittleness of the brittle material along the second β number as shown in Fig. 4. Figure 4 shows the material. The formation of the complex circle 6 is shown in Figure 4. The schematic diagram of the U-shaped lobes is shown in Figure 7. Figure 7 is the intention of the complex brittle material shown in Figure 5. 8 is another schematic diagram of a process in which a plurality of first-fourth lines and two more types of laser-cutting materials are formed. The second main line of the brittle material indicates the brittle material cutting. Face 10 100 first cutting line 101 second cutting line 102 laser generating device 20 cooling device 30 sub-brittle material 110, 112 11 200940231 • direction A1, A2
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